|Publication number||US20090305527 A1|
|Application number||US 12/157,372|
|Publication date||Dec 10, 2009|
|Priority date||Jun 9, 2008|
|Also published as||CN201436705U, US7619895|
|Publication number||12157372, 157372, US 2009/0305527 A1, US 2009/305527 A1, US 20090305527 A1, US 20090305527A1, US 2009305527 A1, US 2009305527A1, US-A1-20090305527, US-A1-2009305527, US2009/0305527A1, US2009/305527A1, US20090305527 A1, US20090305527A1, US2009305527 A1, US2009305527A1|
|Inventors||Darrell Wertz, David Gregory Howell, Albert Terhune, Ming-Lun Szu|
|Original Assignee||Hon Hai Precision Ind. Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (1), Classifications (11), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. Field of the Invention
The present invention relates to a socket connector which is used for connecting an electronic package, such as a central processing unit (CPU), with a circuit substrate, such as a printed circuit board (PCB).
2. Description of the Prior Art
U.S. Pat. No. 7,008,239, issued on Mar. 7, 2006, discloses a socket connector mounted on a printed circuit board (PCB). The socket includes an insulative housing, a plurality of contacts, four screw nuts and four screws, a lid and a heat guide pipe. The insulative housing has a plurality of slots for receiving the contacts and a border projecting therefrom and around the slots for orientating an electronic component, such as an IC module. The screw nuts connect the insulative housing to the PCB from a bottom side of the PCB, the screws engage with the screw nuts from a top side of the PCB. The lid is arranged between the screws and the insulative housing. A head of each screw presses the lid to urge the top surface of the IC module for positioning the IC module in the insulative housing. The heat guide pipe is assembled on a top surface of the lid and connects with a heat dissipation device for further heat dissipation. However, since the lid which is assembled with the heat guide pipe is firmly retained to the insulative housing, an extending direction of the heat guide pipe is determinate once the lid is assembled to the insulative housing. So a field on the printed circuit board for a heat dissipation which connects the heat pipe is limited.
Accordingly, a new socket connector that solves the above problems is desirable.
Accordingly, an object of the present invention is to provide a socket connector which has flexibly orientated heat pipes.
To fulfill the above object, a socket connector for electrically connecting an IC package and a printed circuit board, comprises an insulative housing defining a space for the IC package, a heat pipe retainer assembled with at least one heat pipe and seated on the IC package received in the insulative housing; and a cover plate located upon the heat pipe retainer and retained to the printed circuit board. One of the cover plate and the heat pipe retainer has a post, and the other defines a hole rotatably receiving the post to flexibly orientate the heat pipe retainer with the heat pipe.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Reference is now made to the drawings to describe the invention in detail.
The socket connector 3 comprises an insulative housing 30, a metal substrate frame 31, a cover plate 32, a heat pipe retainer 33, two heat pipes 34, a backplane 35, and a plurality of fastening members. The insulative housing 30 is located in and surround by the metal substrate frame 31. The heat pipe retainer 33 with the heat pipes 34 are seated on the IC package 1 received in the insulative housing 30. The cover plate 32 is covered on the heat pipe retainer 33. The fastening member comprises an upper screw nut 36 and a lower screw 37 and fastens the frame 31, the cover plate 32 and the backplane 35 together and to the printed circuit board 2.
The insulative housing 30 defines a space 301 for the IC package 2 and receives a plurality of terminals (not shown). The frame 31 is stamped from a metal piece and in a rectangle shape, the frame 31 is formed with a bottom plate 311 and four sidewalls 312. The bottom plate 311 comprises an opening 313 and four pieces 314 connecting bottom edges of two adjacent sidewalls 311 and located in four corners of the opening 313. The insulative housing 30 is located in the opening 313 of the frame 31. The frame 31 further has a plurality of spring fingers 315, which upwardly and inwardly extend from the pieces 314 into the opening 313 to press and retain the insulative housing 30 in the opening 313. Each piece 314 defines a mounting hole 316.
The cover plate 32 is located upon the heat pipe retainer 33 and covers the insulating housing 30. The cover plate 32 is piece-like and has four retaining holes 320 in four corners thereof corresponding to the mounting holes 316 and a hole 321 in a center thereof covers the insulative housing 30 and located. The heat pipe retainer 33 is a metal clump and is formed with two grooves 331 for accommodating the heat pipes 34 and a post 332 in a center thereof for engaging with the hole 321 of the cover plate 32. The printed circuit board 2 defines four assembling holes 20 corresponding to the mounting holes 316.
The backplane 35 is rectangle piece-like and has four through holes 351 corresponding to the mounting holes 316. The backplane 35 is located on an inverse side of the printed circuit board 2.
When assembly, firstly put the frame 31 on the printed circuit board 2 with the mounting holes 316 aligning with the assembling holes 20 of the printed circuit board 2, and put the insulative housing 30 into the opening 313 of the frame 31 and the IC package 2 into the space 301 of the insulative housing 30. Then, locate the heat pipe retainer 33 assembled with the heat pipes 34 on the IC package 2, and put the cover plate 32 upon the heat pipe retainer 33 with the post 332 inserting into the hole 321 and the retaining holes 320 aligning with the mounting holes 316. Finally, put the backplane 35 below the printed circuit board 2 and make the screws 37 pass through the through holes 351 of the backplane 35, the assembling holes 20 of the printed circuit board 2, the mounting holes 316 of the frame 31, in turn, and make the screw nuts 36 pass through the retaining holes 320 of the cover plate 32 and engage with the screws 37 from a top side of the printed circuit board 2, so the socket connector 3 is mounted on the printed circuit board 2.
What we should emphasize is that the heat pipe retainer 33 is pivotally assembled to the cover plate 32 by the hole 321 rotatably receiving the post 332, so the heat pipe retainer 33 with the heat pipes 34 is flexibly orientated and can rotate around the post 332, even the socket connector 3 is mounted on the printed circuit board 2. Since the heat pipe 34 is located between two adjacent screws 37 (referring to
Furthermore, although the present invention has been described with reference to particular embodiments, it is not to be construed as being limited thereto. Various alterations and modifications can be made to the embodiments without in any way departing from the scope or spirit of the present invention as defined in the appended claims.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|WO2014116925A1 *||Jan 24, 2014||Jul 31, 2014||Kla-Tencor Corporation||Methods of attaching a module on wafer substrate|
|International Classification||H01R12/00, H05K1/00|
|Cooperative Classification||H01L23/427, H01L23/4006, H01L2023/4087, H01L2023/405, H01L2023/4062, H01L2924/0002|
|European Classification||H01L23/427, H01L23/40B|
|Jun 9, 2008||AS||Assignment|
Owner name: HON HAI PRECISION IND. CO., LTD., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WERTZ, DARRELL;HOWELL, DAVID GREGORY;TERHUNE, ALBERT;ANDOTHERS;REEL/FRAME:021117/0155
Effective date: 20080520
|Mar 15, 2013||FPAY||Fee payment|
Year of fee payment: 4