|Publication number||US20100067194 A1|
|Application number||US 12/211,957|
|Publication date||Mar 18, 2010|
|Priority date||Sep 17, 2008|
|Also published as||US7684187|
|Publication number||12211957, 211957, US 2010/0067194 A1, US 2010/067194 A1, US 20100067194 A1, US 20100067194A1, US 2010067194 A1, US 2010067194A1, US-A1-20100067194, US-A1-2010067194, US2010/0067194A1, US2010/067194A1, US20100067194 A1, US20100067194A1, US2010067194 A1, US2010067194A1|
|Inventors||George Anthony Meyer, IV, Chien-Hung Sun|
|Original Assignee||Meyer Iv George Anthony, Chien-Hung Sun|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (2), Classifications (7), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates to a heat dissipation device, and particularly to a heat dissipation device with a bent vapor chamber.
With enhancement of the calculating capability of the central processing unit (CPU), the heat generates from the CPU is becoming greater than before. A conventional heat dissipation device composed of heat dissipating fins and a fan could not meet the heat dissipating requirement of the CPU. A vapor chamber with higher heat conducting efficiency is developed. The vapor chamber is combined with the heat dissipating fins to effectively resolve the heat dissipating problems. The vapor chamber could contact the heat generating electronic element in a large area directly, and these advantages could draw more development on the merit.
A conventional heat dissipaton device includes a vapor chamber, a heat dissipating fins assembly and a fan. The vapor chamber is configured to a flat shape, and the vapor chamber is adhered to a surface of a heat generating element. The vapor chamber is also adhered to a surface of the heat dissipating fins assembly. The fan is attached to the heat dissipating fins assembly to dissipate heat from both the heat dissipating fins assembly and the vapor chamber. Therefore, heat from the heat generating element can be removed rapidly.
However, the conventional heat dissipation device has following disadvantage in practice use: when the fan dissipating heat from the heat dissipating fins assembly and the vapor chamber, the airflow can not be centralized effectively causing insufficient heat dissipation. Thus, the heat dissipating efficiency could be affected. Additionally, the vapor chamber is made in flat shape, however the outer surface thereof is adhered to the heat generating element completely, and further the heat conducting area is limited to the outer surface of the heat generating element. Thus, the heat dissipating efficiency can not be further improved efficiently. If the vapor chamber is broaden to enlarge the outer surface thereof, the other electronic elements on the circuit board may be intervened accordingly to cause the heat dissipation device not be appropriately installed and not be used therefore.
The present invention relates to a heat dissipation device, the heat dissipation device includes a cover covering on a heat dissipating fins assembly and a fan. The airflow from the fan can be centralized to dissipate heat from the heat dissipating fins assembly and a vapor chamber directly to enhance the efficiency of the heat dissipation.
The present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber to enhance a heat conducting area thereof to enhance the efficiency of the heat dissipation.
The present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber on opposite sides thereof to avoid interference with the other electronic elements of the mainboard to achieve a better applicability of installation.
The present invention relates to a heat dissipation device, the heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber.
These and other features and advantages of the various embodiments disclosed herein will be better understood with respect to the following description and drawings, in which like numbers refer to like parts throughout, and in which:
The vapor chamber 10 is made in a strip structure and is configured to a bent shape. The vapor chamber 10 includes a heat absorbing portion 11 and two heat emitting portion 12 deformedly extending from opposite sides of the absorbing portion 11. The absorbing portion 11 protrudes from the surface of the emitting portions 12. The absorbing portion 11 is adhered to a surface of a heat generating element 62 (as shown in
The heat dissipating fins assembly 20 is adhered to a partial surface of the vapor chamber 10, preferrably, the heat dissipating fins 20 is adhered to the surface of the emitting portions 12 tightly. The heat dissipating fins assembly 20 is configured with a plurality of heat dissipating fins 21 aligned in regular space. The heat disspating fins 21 are made from aluminum extrusion. The cover 30 is attached to the vapor chamber 10. A flow passage 32 is defined between the cover 30 and the vapor chamber 10. The heat dissipating fins assembly 20 is positioned in the flow passage 32. An opening 33 is defined in the cover 30 in communication with the flow passage 32, and a receiving space 31 is defined within the cover 30 communicating with the opening 33. A plurality of through holes 34 communicating with the opening 33 is defined in the surface of the cover 30. The holes 34 are defined adjacent to the opening 33. A hook 35 is formed at each lateral side of the cover 30. The two hooks 35 are buckled to the two opposite sides of the heat emitting portion 12 of the vapor chamber 10.
The fan 40 is assembled within the receiving space 31, and facing to the opening 33 and a top surface of the vapor chamber 10. The fan 40 includes a bracket 41. A plurality of screw holes 42 is defined in the bracket 41 corresponding to the through holes 34. A screw 50 can be fastened through each screw hole 42 and the corresponding through hole 34. The fan 40 can be an axial fan or a centrifugal fan.
Referring also to
The heat emitting portions 12 extending from the heat absorbing portion 11 can enhance the conducting area of the vapor camber 10 to improve the heat dissipating efficiently.
The heat emitting portions 12 are higher than the heat absorbing portion 11. The heat emitting portions 12 can not only enhance the heat conducting area but also avoid interference with the electronic elements 63 of the mainboard 61. The heat dissipation device can be used in anyone of the heat generating elements 62 on the mainboard 61, regardless of the positions of electronic elements 63 around the heat generating element 62 which can lead to an incapable of the installation. Therefore, the heat dissipation device of the exemplary of the present invention has a better applicability of installation.
The heat dissipation device of the exemplary of the present invention may be used in the electronic product 60 with a thin thickness, such as notebook computers, personal digital assitants (PDAs), and so on.
The above description is given by way of example, and not limitation. Given the above disclosure, one skilled in the art could devise variations that are within the scope and spirit of the invention disclosed herein, including configurations ways of the recessed portions and materials and/or designs of the attaching structures. Further, the various features of the embodiments disclosed herein can be used alone, or in varying combinations with each other and are not intended to be limited to the specific combination described herein. Thus, the scope of the claims is not to be limited by the illustrated embodiments.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|DE202012000325U1||Jan 13, 2012||Mar 5, 2012||Osram Ag||LED-Modul mit verbesserter Kühlung|
|EP2384108A2 *||Apr 27, 2010||Nov 2, 2011||Giga-Byte Technology Co., Ltd.||Dust-disposal heat-dissipation device with double cooling fans|
|Cooperative Classification||H01L23/467, F28D15/0233, H01L2924/0002|
|European Classification||H01L23/467, F28D15/02E|
|Sep 17, 2008||AS||Assignment|
Owner name: CELSIA TECHNOLOGIES TAIWAN, INC.,TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEYER IV, GEORGE ANTHONY;SUN, CHIEN-HUNG;REEL/FRAME:021541/0783
Effective date: 20080905
|Aug 23, 2013||FPAY||Fee payment|
Year of fee payment: 4