US20100126700A1 - Heat-radiating base plate and heat sink using the same - Google Patents

Heat-radiating base plate and heat sink using the same Download PDF

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Publication number
US20100126700A1
US20100126700A1 US12/276,636 US27663608A US2010126700A1 US 20100126700 A1 US20100126700 A1 US 20100126700A1 US 27663608 A US27663608 A US 27663608A US 2010126700 A1 US2010126700 A1 US 2010126700A1
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Prior art keywords
heat
base plate
face
radiating
upper base
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Abandoned
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US12/276,636
Inventor
Li-Ling Chen
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Asia Vital Components Co Ltd
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Individual
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Priority to US12/276,636 priority Critical patent/US20100126700A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, LI-LING
Publication of US20100126700A1 publication Critical patent/US20100126700A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/22—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-radiating base plate, and more particularly to a weight-reduced heat-radiating base plate including an aluminum-made upper base plate formed of a slotted pattern for a heat pipe unit to set therein, and a copper-made lower base plate corresponding to and attached to the upper base plate without losing its flatness.
  • the present invention also relates to a heat sink including a radiating fin assembly mounted to a top of the heat-radiating base plate.
  • heat pipes and heat spreaders have been widely applied in various electronic products as heat conducting elements.
  • Either the heat pipe or the heat spreader is a closed and vacuumed hollow copper member with a capillary layer sintered on inner wall surfaces thereof. A working fluid is filled in the hollow member.
  • the working fluid at a vaporizing end of the heat pipe or heat spreader absorbs heat produced by a heat-producing source, such as a CPU, and is vaporized.
  • the vapor formed at the heated end is cooled by, for example, radiating fins and cooling fan to condense into liquid at a condensing end.
  • the liquid then flows back to the vaporizing end due to an effect of the capillary force of the capillary layer.
  • the working fluid continuously circulates in the closed heat pipe or heat spreader.
  • Taiwanese Patent Application No. 097202791 discloses a heat sink 1 as shown in FIG. 1 .
  • the heat sink 1 includes a base 11 , an S-shaped heat pipe 12 , and a plurality of radiating fins 13 .
  • the base 11 has a first face and a second face opposite to the first face.
  • An S-shaped channel 111 is formed on the first face of the base 11 .
  • the S-shaped heat pipe 12 is correspondingly set in the S-shaped channel 111 .
  • the plurality of radiating fins 13 is arranged on the first face of the base 11 .
  • the heat sink 1 is characterized in that at least one U-shaped channel 112 is further formed on the first face of the base 11 with an open side of the U-shaped channel 112 oriented toward one of two open sides of the S-shaped channel 111 to thereby partially block that open side of the S-shaped channel 111 .
  • the heat sink 1 further includes at least one U-shaped heat pipe 121 correspondingly set in the U-shaped channel 112 .
  • the S-shaped heat pipe 12 and the U-shaped heat pipe 121 enable quick conducting of heat from a central area of the base 11 to other peripheral areas thereof.
  • the above-described conventional heat sink 1 has the following shortcomings: (1) being too heavy; (2) consuming too much copper material; (3) having size errors in the channels formed thereon; and (4) having poor levelness at areas immediately behind the formed channels.
  • a primary object of the present invention is to provide a heat-radiating base plate that can be more easily manufactured without detriment to the flatness behind areas having been machined to form needed slotted pattern and can therefore ensure good contact of heat pipes set on the heat-radiating base plate with a heat-producing unit and radiating fins.
  • Another object of the present invention is to provide a heat-radiating base plate that includes an upper base plate made of an aluminum material to reduce an overall weight of the heat-radiating base plate and the use of copper material in forming the heat-radiating base plate.
  • a further object of the present invention is to provide a heat sink being formed by mounting a radiating fin assembly to a top of the heat-radiating base plate provided by the present invention, so as to enable good heat dissipation.
  • the heat-radiating base plate includes a copper-made lower base plate, at least one aluminum-made upper base plate, and a heat pipe unit.
  • the upper base plate has a first face, a second face opposite to the first face, and at least one slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face.
  • the heat pipe unit is set in the slotted pattern, and has a first heat-conducting face and a second heat-conducting face corresponding to and flush with the first and the second face of the upper base plate, respectively.
  • the first and second heat-conducting faces are flat faces.
  • the heat sink according to the present invention includes a radiating fin assembly mounted to a top of the first face of the heat-radiating base plate of the present invention.
  • the radiating fin assembly includes a plurality of stacked and spaced radiating fins.
  • the present invention has the following advantages: (1) less copper material is used to manufacture the heat-radiating base plate; (2) the problem of overweight heat-radiating base plate caused by using too much copper material is solved; (3) no second-time machining is needed in forming the slotted pattern; and (4) flatness at areas of the lower base plate behind the slotted pattern can be maintained.
  • FIG. 1 is an exploded perspective view of a conventional heat sink
  • FIG. 2 is an exploded top perspective view of a heat sink according to a preferred embodiment of the present invention.
  • FIG. 3 is an exploded bottom perspective view of the heat sink of FIG. 2 ;
  • FIG. 4 is an assembled perspective view of the heat sink of FIG. 2 ;
  • FIGS. 5A , 5 B, and 5 C show different designs for the slotted pattern formed on the upper base plate of the heat-radiating base plate of the present invention.
  • a heat-radiating base plate 2 includes an upper base plate 21 , a lower base plate 22 , and a heat pipe unit 23 .
  • the upper base plate 21 has a first face 211 , a second face 212 opposite to the first face 211 , and a slotted pattern 213 .
  • the slotted pattern 213 is extended through the upper base plate 21 in a thickness direction to communicate the first face 211 with the second face 212 .
  • the upper base plate 21 can be made of an aluminum material.
  • the heat pipe unit 23 is set in the slotted pattern 213 .
  • the heat pipe unit 23 includes at least one heat pipe, which is set in the slotted pattern 213 .
  • the heat pipe unit 23 has a thickness equal to a depth of the slotted pattern 213 , and has a flat first heat-conducting face 231 and a flat second heat-conducting face 232 corresponding to and flush with the first face 211 and the second face 212 of the upper base plate 21 , respectively.
  • the second face 212 of the upper base plate 21 and the second heat-conducting face 232 of the heat pipe unit 23 are attached to the lower base plate 22 .
  • the lower base plate 22 can be made of a copper material.
  • the heat-radiating base plate 2 can be combined with a radiating fin assembly 24 to form a heat sink.
  • the lower base plate 22 has a contact face 221 being attached to at least one heat-producing unit (not shown), and a heat-transferring face 222 being attached to the second face 212 and the second heat-conducting face 232 .
  • the heat sink can be manufactured with reduced copper material to eliminate the problem of overweight caused by containing too much copper material.
  • the heat pipe unit 23 can be located in the slotted pattern 213 at one time. Moreover, portions of the copper-made lower base plate 22 corresponding to the slotted pattern 213 would not lose their flatness due to machining of the slotted pattern 213 on the upper base plate 21 .
  • the radiating fin assembly 24 is formed from a plurality of stacked and spaced radiating fins and mounted to the first face 211 of the upper base plate 21 and the first heat-conducting face 231 of the heat pipe unit 23 .
  • the second face 212 of the upper base plate 21 and the second heat-conducting face 232 of the heat pipe unit 23 are attached to the heat-transferring face 222 of the lower base plate 22 .
  • the contact face 221 of the lower base plate 22 is in contact with the heat-producing unit (not shown).
  • the slotted pattern 213 can include a plurality of straightly extended and parallelly spaced slots as shown in FIG. 5A , or a plurality of obliquely extended arid parallelly spaced slots, as shown in FIG. 5B , or a plurality of curved and spaced slots, as shown in FIG. 5C .
  • the heat pipe unit 23 can always in direct contact with the lower base plate 22 and the radiating fin assembly 24 to transfer the heat produced by the heat-producing unit to the radiating fin assembly 24 to achieve the purpose of heat dissipation.

Abstract

A heat-radiating base plate includes an aluminum-made upper base plate, a copper-made lower base plate, and a heat pipe unit. The upper base plate has a first face, an opposite second face, and a slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face. The heat pipe unit is set in the slotted pattern, and has a thickness equal to a depth of the slotted pattern. The heat pipe unit has a first and a second heat-conducting flat face flush with the first and the second face of the upper base plate, respectively. The second face and the second heat-conducting face are attached to the lower base plate, which has another flat face in contact with a heat-producing unit. A radiating fin assembly can be mounted to a top of the heat-radiating base plate to provide a heat sink.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat-radiating base plate, and more particularly to a weight-reduced heat-radiating base plate including an aluminum-made upper base plate formed of a slotted pattern for a heat pipe unit to set therein, and a copper-made lower base plate corresponding to and attached to the upper base plate without losing its flatness. The present invention also relates to a heat sink including a radiating fin assembly mounted to a top of the heat-radiating base plate.
    • BACKGROUND OF THE INVENTION
  • With the rapidly developed information, communication, and photoelectric industries, various highly advanced, lightweight and compact electronic products have been introduced into the market. Due to the demands for high operating speed and miniaturized volume, the electronic elements in the various electronic products produce more heat during the operation thereof to thereby have constantly increased heat density. Therefore, heat dissipation efficiency has become a critical factor in determining the stable operation of the electronic products. Due to the high-efficient heat conducting property thereof, heat pipes and heat spreaders have been widely applied in various electronic products as heat conducting elements. Either the heat pipe or the heat spreader is a closed and vacuumed hollow copper member with a capillary layer sintered on inner wall surfaces thereof. A working fluid is filled in the hollow member. The working fluid at a vaporizing end of the heat pipe or heat spreader absorbs heat produced by a heat-producing source, such as a CPU, and is vaporized. The vapor formed at the heated end is cooled by, for example, radiating fins and cooling fan to condense into liquid at a condensing end. The liquid then flows back to the vaporizing end due to an effect of the capillary force of the capillary layer. Thus, the working fluid continuously circulates in the closed heat pipe or heat spreader.
  • Taiwanese Patent Application No. 097202791 discloses a heat sink 1 as shown in FIG. 1. The heat sink 1 includes a base 11, an S-shaped heat pipe 12, and a plurality of radiating fins 13. The base 11 has a first face and a second face opposite to the first face. An S-shaped channel 111 is formed on the first face of the base 11. The S-shaped heat pipe 12 is correspondingly set in the S-shaped channel 111. The plurality of radiating fins 13 is arranged on the first face of the base 11. The heat sink 1 is characterized in that at least one U-shaped channel 112 is further formed on the first face of the base 11 with an open side of the U-shaped channel 112 oriented toward one of two open sides of the S-shaped channel 111 to thereby partially block that open side of the S-shaped channel 111. The heat sink 1 further includes at least one U-shaped heat pipe 121 correspondingly set in the U-shaped channel 112. The S-shaped heat pipe 12 and the U-shaped heat pipe 121 enable quick conducting of heat from a central area of the base 11 to other peripheral areas thereof.
  • In the prior art, when forming the S-shaped channel 111 and the U-shaped channel 112 on the base 11, it is uneasy to control the depth of the S-shaped channel 111 and the U-shaped channel 112 and therefore frequently results in the problem of error in size. Moreover, when machining the first face of the base 11 to form the S-shaped channel 111 and the U-shaped channel 112, stress released therefrom will lead to poor levelness at the second face of the base 11, especially at areas right behind the S-shaped channel 111 and the U-shaped channel 112. As a result, areas on the first face and the second face of the base 11 corresponding to the S-shaped and U-shaped channels 111, 112 fail to flatly bear on the radiating fins 13 and the heat-producing unit, respectively. Furthermore, since a large quantity of copper material is used to manufacture the base 11, the base 11 is usually overweight.
  • In conclusion, the above-described conventional heat sink 1 has the following shortcomings: (1) being too heavy; (2) consuming too much copper material; (3) having size errors in the channels formed thereon; and (4) having poor levelness at areas immediately behind the formed channels.
  • It is therefore tried by the inventor to develop an improved heat-radiating base plate to overcome the drawbacks in the conventional heat-radiating base for a heat sink.
    • SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide a heat-radiating base plate that can be more easily manufactured without detriment to the flatness behind areas having been machined to form needed slotted pattern and can therefore ensure good contact of heat pipes set on the heat-radiating base plate with a heat-producing unit and radiating fins.
  • Another object of the present invention is to provide a heat-radiating base plate that includes an upper base plate made of an aluminum material to reduce an overall weight of the heat-radiating base plate and the use of copper material in forming the heat-radiating base plate.
  • A further object of the present invention is to provide a heat sink being formed by mounting a radiating fin assembly to a top of the heat-radiating base plate provided by the present invention, so as to enable good heat dissipation.
  • To achieve the above and other objects, the heat-radiating base plate according to the present invention includes a copper-made lower base plate, at least one aluminum-made upper base plate, and a heat pipe unit. The upper base plate has a first face, a second face opposite to the first face, and at least one slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face. The heat pipe unit is set in the slotted pattern, and has a first heat-conducting face and a second heat-conducting face corresponding to and flush with the first and the second face of the upper base plate, respectively. Preferably, the first and second heat-conducting faces are flat faces.
  • And, the heat sink according to the present invention includes a radiating fin assembly mounted to a top of the first face of the heat-radiating base plate of the present invention. The radiating fin assembly includes a plurality of stacked and spaced radiating fins. With the heat pipe unit set in the slotted pattern, the first face of the aluminum-made upper base plate attached to the radiating fin assembly, and the second face of the upper base plate attached to the copper-made lower base plate, the heat sink of the present invention can provide enhanced heat dissipation effect.
  • In brief, with the above arrangements, the present invention has the following advantages: (1) less copper material is used to manufacture the heat-radiating base plate; (2) the problem of overweight heat-radiating base plate caused by using too much copper material is solved; (3) no second-time machining is needed in forming the slotted pattern; and (4) flatness at areas of the lower base plate behind the slotted pattern can be maintained.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
  • FIG. 1 is an exploded perspective view of a conventional heat sink;
  • FIG. 2 is an exploded top perspective view of a heat sink according to a preferred embodiment of the present invention;
  • FIG. 3 is an exploded bottom perspective view of the heat sink of FIG. 2;
  • FIG. 4 is an assembled perspective view of the heat sink of FIG. 2; and
  • FIGS. 5A, 5B, and 5C show different designs for the slotted pattern formed on the upper base plate of the heat-radiating base plate of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 2, 3 and 4. A heat-radiating base plate 2 according to a preferred embodiment of the present invention includes an upper base plate 21, a lower base plate 22, and a heat pipe unit 23. The upper base plate 21 has a first face 211, a second face 212 opposite to the first face 211, and a slotted pattern 213. The slotted pattern 213 is extended through the upper base plate 21 in a thickness direction to communicate the first face 211 with the second face 212. The upper base plate 21 can be made of an aluminum material. The heat pipe unit 23 is set in the slotted pattern 213. The heat pipe unit 23 includes at least one heat pipe, which is set in the slotted pattern 213. The heat pipe unit 23 has a thickness equal to a depth of the slotted pattern 213, and has a flat first heat-conducting face 231 and a flat second heat-conducting face 232 corresponding to and flush with the first face 211 and the second face 212 of the upper base plate 21, respectively. The second face 212 of the upper base plate 21 and the second heat-conducting face 232 of the heat pipe unit 23 are attached to the lower base plate 22. The lower base plate 22 can be made of a copper material. The heat-radiating base plate 2 can be combined with a radiating fin assembly 24 to form a heat sink. The lower base plate 22 has a contact face 221 being attached to at least one heat-producing unit (not shown), and a heat-transferring face 222 being attached to the second face 212 and the second heat-conducting face 232. According to the above arrangements, the heat sink can be manufactured with reduced copper material to eliminate the problem of overweight caused by containing too much copper material. Also, the heat pipe unit 23 can be located in the slotted pattern 213 at one time. Moreover, portions of the copper-made lower base plate 22 corresponding to the slotted pattern 213 would not lose their flatness due to machining of the slotted pattern 213 on the upper base plate 21.
  • The radiating fin assembly 24 is formed from a plurality of stacked and spaced radiating fins and mounted to the first face 211 of the upper base plate 21 and the first heat-conducting face 231 of the heat pipe unit 23. The second face 212 of the upper base plate 21 and the second heat-conducting face 232 of the heat pipe unit 23 are attached to the heat-transferring face 222 of the lower base plate 22. The contact face 221 of the lower base plate 22 is in contact with the heat-producing unit (not shown).
  • A plurality of different designs is available for the slotted pattern 213 extended through the upper base plate 21 in the thickness direction to communicate the first face 211 with the second face 212. For example, the slotted pattern 213 can include a plurality of straightly extended and parallelly spaced slots as shown in FIG. 5A, or a plurality of obliquely extended arid parallelly spaced slots, as shown in FIG. 5B, or a plurality of curved and spaced slots, as shown in FIG. 5C. No matter what design the slotted pattern is, the heat pipe unit 23 can always in direct contact with the lower base plate 22 and the radiating fin assembly 24 to transfer the heat produced by the heat-producing unit to the radiating fin assembly 24 to achieve the purpose of heat dissipation.
  • The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (9)

1. A heat-radiating base plate, comprising:
a lower base plate;
at least one upper base plate being corresponding to and attached to the lower base plate, the upper base plate having a first face, an opposite second face, and a slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second faces; and
a heat pipe unit having at least one heat pipe and being set in the slotted pattern on the upper base plate.
2. The heat-radiating base plate as claimed in claim 1, wherein the heat pipe unit has a first heat-conducting face and a second heat-conducting face corresponding to and flush with the first face and the second face of the upper base plate, respectively.
3. The heat-radiating base plate as claimed in claim 1, wherein the first and the second heat-conducting face of the heat pipe unit are flat faces.
4. The heat-radiating base plate as claimed in claim 1, wherein the slotted pattern is selected from the group consisting of a plurality of straightly extended and parallelly spaced slots, a plurality of obliquely extended and parallelly spaced slots, and a plurality of curved and spaced slots.
5. The heat-radiating base plate as claimed in claim 1, wherein the lower base plate has a contact face for bearing on a heat-producing unit.
6. A heat sink with heat-radiating base plate, comprising:
a heat-radiating base plate including:
a lower base plate;
at least one upper base plate being corresponding to and attached to the lower base plate, the upper base plate having a first face, an opposite second face, and a slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face; and
a heat pipe unit having at least one heat pipe and being set in the slotted pattern; and
a radiating fin assembly formed from a plurality of stacked and spaced radiating fins, and the radiating fin assembly being mounted to the first face of the upper base plate.
7. The heat sink with heat-radiating base plate as claimed in claim 6, wherein the heat pipe unit has a first heat-conducting face and a second heat-conducting face, which are corresponding to and flush with the first face and the second face of the upper base plate, respectively.
8. The heat sink with heat-radiating base plate as claimed in claim 6, wherein the slotted pattern is selected from the group consisting of a plurality of straightly extended and parallelly spaced slots, a plurality of obliquely extended and parallelly spaced slots, and a plurality of curved and spaced slots.
9. The heat sink with heat-radiating base plate as claimed in claim 6, wherein the lower base plate has a contact face for bearing on a heat-producing unit.
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US20130020052A1 (en) * 2011-07-20 2013-01-24 Hon Hai Precision Industry Co., Ltd. Heat dissipation device with heat pipe within base
US9132519B2 (en) 2011-10-28 2015-09-15 Interntional Business Machines Corporation Directly connected heat exchanger tube section and coolant-cooled structure
US9185830B2 (en) 2011-05-06 2015-11-10 International Business Machines Corporation Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
EP2439774A3 (en) * 2010-10-08 2016-01-20 Congatec AG Heat distributor with flexible heat tube
CN106275524A (en) * 2016-08-08 2017-01-04 北京航天试验技术研究所 The low temperature of a kind of big adsorption area is heat sink
US20170082377A1 (en) * 2015-09-17 2017-03-23 Asia Vital Components Co., Ltd. Heat dissipation device
JP2018509582A (en) * 2015-02-27 2018-04-05 レアード テクノロジーズ インコーポレイテッドＬａｉｒｄ Ｔｅｃｈｎｏｌｏｇｉｅｓ，Ｉｎｃ． Heat sink including heat pipe and associated method
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
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