US20110026218A1 - Thermal management of batteries using synthetic jets - Google Patents
Thermal management of batteries using synthetic jets Download PDFInfo
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- US20110026218A1 US20110026218A1 US12/904,444 US90444410A US2011026218A1 US 20110026218 A1 US20110026218 A1 US 20110026218A1 US 90444410 A US90444410 A US 90444410A US 2011026218 A1 US2011026218 A1 US 2011026218A1
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- power source
- synthetic jet
- battery module
- synthetic
- channels
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/4207—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells for several batteries or cells simultaneously or sequentially
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/623—Portable devices, e.g. mobile telephones, cameras or pacemakers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6556—Solid parts with flow channel passages or pipes for heat exchange
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
- H01M10/6561—Gases
- H01M10/6566—Means within the gas flow to guide the flow around one or more cells, e.g. manifolds, baffles or other barriers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/651—Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
- H01M10/6569—Fluids undergoing a liquid-gas phase change or transition, e.g. evaporation or condensation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present disclosure relates generally to thermal management systems, and more specifically to thermal management systems adapted for use in cooling battery modules disposed in laptop computers and other portable or handheld electronic devices.
- thermal management of laptop computers and other portable or handheld electronic devices has become increasingly challenging as these devices have become more powerful, while at the same time decreasing in size and weight.
- acceptable thermal management solutions for these devices are subject to stringent size and weight constraints, and yet must dissipate a sufficient amount of thermal energy to maintain the components and external surfaces of the device within suitable operating and ergonomic temperature ranges, respectively.
- Battery modules have emerged as a particularly challenging component of electronic devices from a thermal management perspective. As portable and hand-held devices have become more powerful, battery modules are required to provide increasing power loads, and have also become more compact. Consequently, battery modules have evolved into increasingly intense hot spots within such devices.
- fan-based systems are a common global thermal management solution for desk top computers and other large electronic devices.
- the use of fans is precluded in many portable or handheld electronic devices due to the size and weight constraints noted above, and is also unfavorable from an acoustical perspective.
- these units generally provide insufficient heat dissipation for battery modules and other intense hotspots within the device.
- FIG. 1 is an illustration of a prior art thermal management system based on the use of synthetic jet ejectors
- FIG. 2 is a front view of a battery module equipped with a thermal management system of the type described herein;
- FIG. 3 is a side view of the device of FIG. 2 ;
- FIG. 4 is an illustration of a case having two channels defined therein
- FIG. 5 is an illustration of a case having four channels defined therein;
- FIG. 6 is an illustration of a case having eight channels defined therein
- FIG. 7 is an illustration of a case having sixteen channels defined therein
- FIG. 8 is a graph of case temperature as a function of channel width
- FIG. 9 is a graph of flow rate (CFM) as a function of heat transfer coefficient
- FIG. 10 is a graph of pressure drop as a function of channel width
- FIG. 11 is a graph of case weight as a function of channel width
- FIG. 12 is a graph of case temperature as a function of conductivity
- FIG. 13 is a graph of case weight as a function of material
- FIG. 14 is an illustration of a battery module equipped with a thermal management system of the type described herein;
- FIG. 15 is an illustration of an assembly of battery modules of the type depicted in FIG. 14 ;
- FIG. 16 is an illustration of a battery module equipped with a thermal management system of the type described herein;
- FIG. 17 is an illustration of a battery module equipped with a thermal management system of the type described herein.
- FIG. 18 is an illustration of a battery charger equipped with a thermal management system of the type depicted herein.
- a thermally managed power source comprises a first battery module, and a first synthetic jet ejector adapted to direct a plurality of synthetic jets along a surface of said first battery module.
- a battery charger which comprises (a) a base having a synthetic jet ejector disposed therein; (b) a platform supported on said base; and (c) a charging station incorporated into said platform, said charging station having a first major surface which is adapted to receive and charge at least one battery; wherein said charging station is powered by electrical circuitry disposed in said base, and wherein said synthetic jet ejector is adapted to direct a plurality of synthetic jets along a surface of said base.
- thermal management systems which are based on synthetic jet ejectors. These systems are more energy efficient than comparable fan-based systems, and have the ability to provide localized spot cooling.
- Systems of this type an example of which is depicted in FIG. 1 , are described in greater detail in U.S. Pat. No. 6,588,497 (Glezer et al.).
- the system depicted in FIG. 1 utilizes an air-cooled heat transfer module 101 which is based on a ducted heat ejector (DHE) concept.
- the module utilizes a thermally conductive, high aspect ratio duct 103 that is thermally coupled to one or more IC packages 105 . Heat is removed from the IC packages 105 by thermal conduction into the duct shell 107 , where it is subsequently transferred to the air moving through the duct.
- the air flow within the duct 103 is induced through internal forced convection by a pair of low form factor synthetic jet ejectors 109 which are integrated into the duct shell 107 .
- the turbulent jet produced by the synthetic jet ejector 109 enables highly efficient convective heat transfer and heat transport at low volume flow rates through small scale motions near the heated surfaces, while also inducing vigorous mixing of the core flow within the duct.
- the synthetic jet ejectors may be utilized in combination with various channeling techniques that ensure adequate heat dissipation, a low form factor, and acceptable mass, while maintaining the external surfaces of a device incorporating the battery module within an ergonomically acceptable range.
- the use of synthetic ejectors in combination with various channeling techniques may be used to further ensure that the components of the battery module are maintained at a proper operating temperature. The means by which these objectives may be accomplished are described in greater detail below.
- FIGS. 2-3 illustrate a first particular, non-limiting embodiment of a thermal management system in accordance with the teachings herein which is suitable for use in dissipating heat from a battery module.
- the system 201 depicted therein comprises a battery module 203 which contains one or more batteries 205 .
- a heat exchanger 207 is provided which is adjacent to the batteries 205 and/or battery module 203 and which contains one or more conduits 209 for the flow of a fluid therethrough.
- the heat exchanger 207 may form part of the battery module 203 , or may be a component of a device which incorporates the battery module 203 .
- the heat exchanger 207 may be a portion of (or may be embedded into) the casing of a laptop computer or handheld electronic device which is adjacent to the battery module 203 .
- the heat exchanger 207 comprises an interior component 211 which is thermally conductive and which is in thermal contact with the battery module 203 and/or the batteries 205 , and an exterior component 213 which is thermally non-conductive.
- the interior component 211 may comprise, for example, aluminum, copper, graphite, or other materials (including various metal alloys and metal filled polymeric compositions) having suitable thermal conductivity, while the exterior surface may comprise, for example, various thermally insulating plastics and other thermally non-conductive materials as are known to the art.
- the heat exchanger 207 is preferably constructed with a plurality of segregated conduits 209 or channels that are in fluidic communication with a synthetic jet ejector 215 .
- the synthetic jet ejector 215 is preferably adapted to direct at least one synthetic jet into each channel 209 .
- the use of focused synthetic jets in this application is found to have several advantages.
- the flow rates of fluid achievable through the channels 209 with conventional global circulation systems is typically much lower than the rates achievable through the use of synthetic jets, due to the pressure drop created by the channel walls.
- This problem worsens as the cross-sectional channel dimensions become increasingly smaller. Indeed, at the dimensions typically imposed on thermal management systems by size constraints in portable or handheld electronic devices, the pressure drop is severe enough that these systems typically cannot provide adequate heat dissipation.
- the use of focused jets to direct a stream of fluid into the channels overcomes this problem by reducing this pressure drop, and hence facilitates increased entrainment of the flow of fluid into the channels.
- the use of focused jets in the thermal management systems described herein also significantly improves the efficiency of the heat transfer process.
- the flow augmentation provided by the use of synthetic jet ejectors increases the rate of local heat transfer in the channel structure, thus resulting in higher heat removal.
- these jets induce the rapid ejection of vapor bubbles formed during the boiling process. This rapid ejection dissipates the insulating vapor layer that would otherwise form along the surfaces of the channels, and hence delays the onset of critical heat flux.
- the synthetic jets may also be utilized to create beneficial nucleation sites to enhance the boiling process.
- the channels 209 in the devices of FIGS. 2-3 may take a variety of forms.
- the channels 209 may be elliptical, circular, square, hexagonal, polygonal, or irregular in cross-section.
- the channels may be formed as an open-celled material.
- the channels may also be convoluted to increase the residence time of fluid in the channels.
- the number of channels in the heat exchanger 207 may also vary. The optimal choice for a particular application may depend, for example, on such factors as the space available, the amount of heat to be dissipated, and other such factors. Some possible examples are depicted in FIGS. 4-7 .
- the heat exchanger is segregated into 2 channels 303 , each having a width of about 45 mm.
- the heat exchanger is segregated into 4 channels 323 , each having a width of about 22 mm.
- the heat exchanger is segregated into 8 channels 343 , each having a width of about 11 mm.
- the heat exchanger is segregated into 16 channels 363 , each having a width of about 5 mm.
- the channels have a height of about 3 mm, though one skilled in the art will appreciate that this dimension may vary from one embodiment to another and may be application specific.
- FIG. 8 The effect of channel width (and therefore the number of channels) on heat dissipation is illustrated in FIG. 8 .
- the graph shown therein is based on the results of mathematical modeling studies performed on cases for laptop computers, with the cases having the structures depicted in FIGS. 4-7 .
- the model assumed a fixed heat transfer coefficient of 25 W/m 2 K, and that the total power to be dissipated was 18 W, which corresponds to a typical device operation of about 90 W.
- case temperature drops significantly with an increase in the number of channels, and a corresponding decrease in channel width.
- the exterior case temperature reached about 80° C.
- Increasing the number of channels to 4 (and correspondingly decreasing the channel width to about 22 mm) lowered the exterior case temperature to about 74° C.
- increasing the number of channels to 8 (and correspondingly decreasing the channel width to about 11 mm) lowered the exterior case temperature to about 70° C.
- increasing the number of channels to 16 (and correspondingly decreasing the channel width to about 5 mm) lowered the exterior case temperature to about 66° C.
- FIG. 9 is a graph of flow rate (in cubic feet per minute (CFM)) as a function of heat transfer coefficient for a heat exchanger of the type depicted in FIGS. 2-3 .
- CFM cubic feet per minute
- FIG. 10 is a graph of pressure drop as a function of channel width for a heat exchanger of the type depicted in FIGS. 2-3 . As seen therein, pressure decreases significantly with channel width. Thus, for a device of the type depicted in FIG. 4 which has two channels (each having a width of about 45 mm), the channel pressure is about 10 N/m 2 . For a device of the type depicted in FIG. 5 which has four channels (each having a width of about 22 mm), the channel pressure is about 60 N/m 2 . For a device of the type depicted in FIG. 6 which has eight channels (each having a width of about 11 mm), the channel pressure is about 70 N/m 2 .
- the channel pressure is about 60 N/m 2 .
- the need for flow augmentation of the type provided by synthetic jets becomes more critical as the number of channels increases and channel width decreases.
- the optimum channel dimensions for a particular application may thus be chosen with consideration of the amount of heat to be dissipated, the flow augmentation available with the synthetic jet ejector, the heat transfer coefficient of the material of the heat exchanger, and other such factors.
- FIG. 11 illustrates the effect of channel width on the weight of a device for a particular embodiment of the heat exchanger of the type depicted in FIGS. 2-3 .
- the weight of the device is about 20 g.
- the weight of the device is about 22 g.
- the weight of the device is about 24 g.
- the weight of the device is about 30 g. It is thus seen that, with respect to the device depicted in FIGS. 2-3 , there is a weight penalty associated with increasing the number of channels, due in part to the increased number of channel partitions. In designing a heat exchanger for a particular application, this weight penalty must be considered in light of the other benefits and drawbacks attendant to an increase in the number of channels.
- FIG. 12 illustrates the effect of thermal conductivity of the case material on the case temperature.
- case materials such as aluminum, copper or graphite in the interior component 211 (see FIG. 2 ) of the case allows the exterior case temperature to be maintained at about 70° C. (assuming a 4-channel heat exchanger of the type depicted in FIG. 5 ), which is well within ergonomically acceptable ranges for many applications.
- thermally insulating materials such as non-thermally conductive plastics increases the exterior case temperature about two-fold to 140° C.
- FIG. 13 illustrates the effect of materials choice on the weight of the case.
- plastics i.e., ABS
- graphite increases the weight of the casing to about 17 g
- aluminum increases the weight to about 20 g.
- a copper construction would yield a casing that weighs about 70 g.
- thermal conductivity and the previously noted reduction in exterior casing temperatures
- lighter weight casings can be achieved by making the casing with a two-component or multi-component construction of the type depicted in FIGS. 2-3 . In such a construction, only the interior component 211 is required to be thermally conductive, thus significantly reducing the weight penalty associated with the use of heavier, thermally conductive materials.
- FIG. 14 illustrates a second, non-limiting embodiment of a thermal management system of the type disclosed herein which is suitable for use in dissipating heat from a battery module.
- the system 401 comprises a battery module 403 which contains one or more batteries.
- a synthetic jet ejector 405 is mounted on one end of the battery module 403 and is adapted to direct a plurality of synthetic jets along one or more surfaces of the battery module 403 , as indicated by the first set of arrows 407 .
- a series of apertures 409 or nozzles are provided on a surface of the synthetic jet ejector 405 adjacent to each major surface of the battery module 403 for this purpose.
- the synthetic jets created by the synthetic jet ejector 405 cause entrainment of the ambient fluid, thus improving the efficiency of heat transfer from the surfaces of the battery module 403 to the ambient environment.
- battery modules 403 of the type depicted in FIG. 14 may be assembled in parallel.
- One advantage of this type of arrangement is that the resulting entrainment of the ambient fluid, indicated in FIG. 15 by arrows 413 , results in a turbulent flow of the fluid medium through the space between adjacent battery modules 403 , thus resulting in a more efficient transfer of heat between the surfaces of the battery modules 403 and the ambient environment.
- FIG. 16 illustrates another possible, non-limiting embodiment of a thermally managed battery module made in accordance with the teachings herein.
- the device 501 depicted therein comprises a casing 503 which contains a battery module 505 and associated circuitry 507 .
- the battery module 505 has a synthetic jet actuator 509 mounted on a surface thereof.
- the casing 503 may contain one or more vents to permit fluid flow between the interior and exterior of the casing 503 .
- FIG. 17 illustrates yet another possible, non-limiting embodiment of a thermally managed battery module made in accordance with the teachings herein.
- the device 531 depicted therein which is similar in many respects to the device depicted in FIG. 16 , comprises a casing 533 which contains a battery module 535 and associated circuitry 537 .
- the device depicted in FIG. 17 utilizes a channeling scheme 539 similar to that depicted in FIGS. 2-3 , in conjunction with a surface mounted synthetic jet actuator 541 , to create a flow of fluid over the surfaces of the battery module 535 , thereby maintaining the battery modules within a desired temperature range.
- FIG. 18 illustrates one particular, non-limiting embodiment of the application of a synthetic jet ejector of the type disclosed herein to a battery charger 601 .
- the battery charger 601 comprises a platform 603 which has an upper surface 605 that has a series of ports therein (not shown), each of which is adapted to accept a battery 607 or battery pack for charging.
- the base 609 of the battery charger 601 contains a power supply which is in electrical communication with the ports defined in the upper surface 605 of the platform 603 .
- the base 609 is equipped with a planar surface for supporting the battery charger on a substrate.
- the platform 603 is preferably supported at an angle to the planar surface. Preferably, this angle is within the range of about 15° to about 75°, and more preferably, this angle is within the range of about 30° to about 60°.
- the temperature of the (typically aluminum) front surface 611 of the base 609 is about 68° C., which is well above the critical limit of 55° C. dictated by end-user ergonomics.
- the device is found to lose capacity when the temperature of this component exceeds 65° C.
- the base 609 of the device includes a base plate 613 .
- the base plate contains a synthetic jet ejector that is adapted to eject a plurality of synthetic jets (indicated by the larger arrows) along the front surface 611 of the base 609 .
- the formation of the synthetic jets causes entrainment of the ambient fluid (indicated by the smaller arrows). Operation of the synthetic jet ejector is found to reduce the temperature of the front surface 611 of the base 609 such that it is in an ergonomically acceptable range.
Abstract
Description
- This application claims the benefit of priority from U.S. application Ser. No. 11/641,473, filed Dec. 19, 2006, now pending, having the same title, and having the same inventors, and which is incorporated herein by reference in its entirety; which claims priority to U.S. Provisional Application No. 60/753,074, filed Dec. 21, 2005, having the same title and having the same inventors, and which is incorporated herein by reference in its entirety.
- The present disclosure relates generally to thermal management systems, and more specifically to thermal management systems adapted for use in cooling battery modules disposed in laptop computers and other portable or handheld electronic devices.
- The thermal management of laptop computers and other portable or handheld electronic devices has become increasingly challenging as these devices have become more powerful, while at the same time decreasing in size and weight. In particular, acceptable thermal management solutions for these devices are subject to stringent size and weight constraints, and yet must dissipate a sufficient amount of thermal energy to maintain the components and external surfaces of the device within suitable operating and ergonomic temperature ranges, respectively.
- Battery modules have emerged as a particularly challenging component of electronic devices from a thermal management perspective. As portable and hand-held devices have become more powerful, battery modules are required to provide increasing power loads, and have also become more compact. Consequently, battery modules have evolved into increasingly intense hot spots within such devices.
- Unfortunately, the placement of battery modules in laptops and handheld devices frequently makes them inaccessible to conventional thermal management schemes that rely on global forced air flow through the device. In particular, the battery module is often sealed off from other components of the device to protect those components in the event of battery leakage. Moreover, since the operation of batteries is typically exothermic, it is necessary to shield the components of a device from the heat generated by the battery module. On the other hand, conventional thermal management systems that rely on convection currents generally provide an insufficient level of heat dissipation to be suitable for this application.
- The use of fan-based systems is a common global thermal management solution for desk top computers and other large electronic devices. However, the use of fans is precluded in many portable or handheld electronic devices due to the size and weight constraints noted above, and is also unfavorable from an acoustical perspective. Moreover, even in larger portable electronic devices such as laptops where these constraints are less stringent and where small fan units can be utilized to provide global cooling, these units generally provide insufficient heat dissipation for battery modules and other intense hotspots within the device.
-
FIG. 1 is an illustration of a prior art thermal management system based on the use of synthetic jet ejectors; -
FIG. 2 is a front view of a battery module equipped with a thermal management system of the type described herein; -
FIG. 3 is a side view of the device ofFIG. 2 ; -
FIG. 4 is an illustration of a case having two channels defined therein; -
FIG. 5 is an illustration of a case having four channels defined therein; -
FIG. 6 is an illustration of a case having eight channels defined therein; -
FIG. 7 is an illustration of a case having sixteen channels defined therein; -
FIG. 8 is a graph of case temperature as a function of channel width; -
FIG. 9 is a graph of flow rate (CFM) as a function of heat transfer coefficient; -
FIG. 10 is a graph of pressure drop as a function of channel width; -
FIG. 11 is a graph of case weight as a function of channel width; -
FIG. 12 is a graph of case temperature as a function of conductivity; -
FIG. 13 is a graph of case weight as a function of material; -
FIG. 14 is an illustration of a battery module equipped with a thermal management system of the type described herein; -
FIG. 15 is an illustration of an assembly of battery modules of the type depicted inFIG. 14 ; -
FIG. 16 is an illustration of a battery module equipped with a thermal management system of the type described herein; -
FIG. 17 is an illustration of a battery module equipped with a thermal management system of the type described herein; and -
FIG. 18 is an illustration of a battery charger equipped with a thermal management system of the type depicted herein. - In one aspect, a thermally managed power source is provided herein. The power source comprises a first battery module, and a first synthetic jet ejector adapted to direct a plurality of synthetic jets along a surface of said first battery module.
- In another aspect, a battery charger is provided which comprises (a) a base having a synthetic jet ejector disposed therein; (b) a platform supported on said base; and (c) a charging station incorporated into said platform, said charging station having a first major surface which is adapted to receive and charge at least one battery; wherein said charging station is powered by electrical circuitry disposed in said base, and wherein said synthetic jet ejector is adapted to direct a plurality of synthetic jets along a surface of said base.
- These and other aspects of the present disclosure are described in greater detail below.
- More recently, thermal management systems have been developed which are based on synthetic jet ejectors. These systems are more energy efficient than comparable fan-based systems, and have the ability to provide localized spot cooling. Systems of this type, an example of which is depicted in
FIG. 1 , are described in greater detail in U.S. Pat. No. 6,588,497 (Glezer et al.). - The system depicted in
FIG. 1 utilizes an air-cooledheat transfer module 101 which is based on a ducted heat ejector (DHE) concept. The module utilizes a thermally conductive, highaspect ratio duct 103 that is thermally coupled to one ormore IC packages 105. Heat is removed from theIC packages 105 by thermal conduction into theduct shell 107, where it is subsequently transferred to the air moving through the duct. The air flow within theduct 103 is induced through internal forced convection by a pair of low form factorsynthetic jet ejectors 109 which are integrated into theduct shell 107. In addition to inducing air flow, the turbulent jet produced by thesynthetic jet ejector 109 enables highly efficient convective heat transfer and heat transport at low volume flow rates through small scale motions near the heated surfaces, while also inducing vigorous mixing of the core flow within the duct. - While systems of the type depicted in
FIG. 1 have many unique advantages, there is nonetheless a need in the art for thermal management systems that are adapted to address the particular needs of battery modules. These and other needs are met by the devices and methodologies disclosed herein. - It has now been found that the aforementioned needs can be met through the provision of one or more synthetic jet ejectors in combination with a battery module. The synthetic jet ejectors may be utilized in combination with various channeling techniques that ensure adequate heat dissipation, a low form factor, and acceptable mass, while maintaining the external surfaces of a device incorporating the battery module within an ergonomically acceptable range. The use of synthetic ejectors in combination with various channeling techniques may be used to further ensure that the components of the battery module are maintained at a proper operating temperature. The means by which these objectives may be accomplished are described in greater detail below.
-
FIGS. 2-3 illustrate a first particular, non-limiting embodiment of a thermal management system in accordance with the teachings herein which is suitable for use in dissipating heat from a battery module. Thesystem 201 depicted therein comprises abattery module 203 which contains one ormore batteries 205. Aheat exchanger 207 is provided which is adjacent to thebatteries 205 and/orbattery module 203 and which contains one ormore conduits 209 for the flow of a fluid therethrough. Theheat exchanger 207 may form part of thebattery module 203, or may be a component of a device which incorporates thebattery module 203. Thus, for example, theheat exchanger 207 may be a portion of (or may be embedded into) the casing of a laptop computer or handheld electronic device which is adjacent to thebattery module 203. - Preferably, the
heat exchanger 207 comprises aninterior component 211 which is thermally conductive and which is in thermal contact with thebattery module 203 and/or thebatteries 205, and anexterior component 213 which is thermally non-conductive. Theinterior component 211 may comprise, for example, aluminum, copper, graphite, or other materials (including various metal alloys and metal filled polymeric compositions) having suitable thermal conductivity, while the exterior surface may comprise, for example, various thermally insulating plastics and other thermally non-conductive materials as are known to the art. - As seen in
FIG. 3 , theheat exchanger 207 is preferably constructed with a plurality ofsegregated conduits 209 or channels that are in fluidic communication with asynthetic jet ejector 215. Thesynthetic jet ejector 215 is preferably adapted to direct at least one synthetic jet into eachchannel 209. The use of focused synthetic jets in this application is found to have several advantages. - First of all, the flow rates of fluid achievable through the
channels 209 with conventional global circulation systems is typically much lower than the rates achievable through the use of synthetic jets, due to the pressure drop created by the channel walls. This problem worsens as the cross-sectional channel dimensions become increasingly smaller. Indeed, at the dimensions typically imposed on thermal management systems by size constraints in portable or handheld electronic devices, the pressure drop is severe enough that these systems typically cannot provide adequate heat dissipation. The use of focused jets to direct a stream of fluid into the channels overcomes this problem by reducing this pressure drop, and hence facilitates increased entrainment of the flow of fluid into the channels. - The use of focused jets in the thermal management systems described herein also significantly improves the efficiency of the heat transfer process. Under conditions in which the fluid is in a non-boiling state, the flow augmentation provided by the use of synthetic jet ejectors increases the rate of local heat transfer in the channel structure, thus resulting in higher heat removal. Under conditions in which the fluid is in a boiling state (as may be the case, for example, if low boiling liquid coolants are utilized in the channels 209), these jets induce the rapid ejection of vapor bubbles formed during the boiling process. This rapid ejection dissipates the insulating vapor layer that would otherwise form along the surfaces of the channels, and hence delays the onset of critical heat flux. In some applications, the synthetic jets may also be utilized to create beneficial nucleation sites to enhance the boiling process.
- One skilled in the art will also appreciate that the
channels 209 in the devices ofFIGS. 2-3 may take a variety of forms. For example, although thechannels 209 are depicted as being essentially rectangular in cross-section in the embodiment shown therein, in other embodiments, they may be elliptical, circular, square, hexagonal, polygonal, or irregular in cross-section. Also, in some embodiments, the channels may be formed as an open-celled material. In various embodiments, the channels may also be convoluted to increase the residence time of fluid in the channels. - The number of channels in the
heat exchanger 207 may also vary. The optimal choice for a particular application may depend, for example, on such factors as the space available, the amount of heat to be dissipated, and other such factors. Some possible examples are depicted inFIGS. 4-7 . Thus, in the device 301 depicted inFIG. 4 , the heat exchanger is segregated into 2 channels 303, each having a width of about 45 mm. In the device 321 depicted inFIG. 5 , the heat exchanger is segregated into 4 channels 323, each having a width of about 22 mm. In the device 341 depicted inFIG. 6 , the heat exchanger is segregated into 8 channels 343, each having a width of about 11 mm. In the device 361 depicted inFIG. 7 , the heat exchanger is segregated into 16 channels 363, each having a width of about 5 mm. In each of the particular embodiments depicted inFIGS. 4-7 , the channels have a height of about 3 mm, though one skilled in the art will appreciate that this dimension may vary from one embodiment to another and may be application specific. - The effect of channel width (and therefore the number of channels) on heat dissipation is illustrated in
FIG. 8 . The graph shown therein is based on the results of mathematical modeling studies performed on cases for laptop computers, with the cases having the structures depicted inFIGS. 4-7 . The model assumed a fixed heat transfer coefficient of 25 W/m2K, and that the total power to be dissipated was 18 W, which corresponds to a typical device operation of about 90 W. - As seen therein, case temperature drops significantly with an increase in the number of channels, and a corresponding decrease in channel width. Thus, with two channels (each having a width of about 45 mm), the exterior case temperature reached about 80° C. Increasing the number of channels to 4 (and correspondingly decreasing the channel width to about 22 mm) lowered the exterior case temperature to about 74° C. Further increasing the number of channels to 8 (and correspondingly decreasing the channel width to about 11 mm) lowered the exterior case temperature to about 70° C. Finally, increasing the number of channels to 16 (and correspondingly decreasing the channel width to about 5 mm) lowered the exterior case temperature to about 66° C. It is to be noted here that these results are achievable, in part, by the unique ability of synthetic jets to compensate for the increase in flow resistance that would otherwise attend a reduction in channel dimensions.
-
FIG. 9 is a graph of flow rate (in cubic feet per minute (CFM)) as a function of heat transfer coefficient for a heat exchanger of the type depicted inFIGS. 2-3 . As seen therein, in order to attain a desired thermal objective, the flow rate of fluid through the heat exchanger will typically have to increase as the heat transfer coefficient increases. It is thus desirable in many applications to use materials such as metals and graphite which have high thermal conductivities for the interior segment 211 (seeFIG. 2 ) of the heat exchanger. -
FIG. 10 is a graph of pressure drop as a function of channel width for a heat exchanger of the type depicted inFIGS. 2-3 . As seen therein, pressure decreases significantly with channel width. Thus, for a device of the type depicted inFIG. 4 which has two channels (each having a width of about 45 mm), the channel pressure is about 10 N/m2. For a device of the type depicted inFIG. 5 which has four channels (each having a width of about 22 mm), the channel pressure is about 60 N/m2. For a device of the type depicted inFIG. 6 which has eight channels (each having a width of about 11 mm), the channel pressure is about 70 N/m2. For a device of the type depicted inFIG. 7 which has sixteen channels (each having a width of about 5 mm), the channel pressure is about 60 N/m2. Hence, the need for flow augmentation of the type provided by synthetic jets becomes more critical as the number of channels increases and channel width decreases. One skilled in the art will appreciate that the optimum channel dimensions for a particular application may thus be chosen with consideration of the amount of heat to be dissipated, the flow augmentation available with the synthetic jet ejector, the heat transfer coefficient of the material of the heat exchanger, and other such factors. -
FIG. 11 illustrates the effect of channel width on the weight of a device for a particular embodiment of the heat exchanger of the type depicted inFIGS. 2-3 . Thus, for en exemplary heat exchanger having the configuration depicted inFIG. 4 (which has two channels, each having a width of about 45 mm), the weight of the device is about 20 g. For an exemplary heat exchanger of the type depicted inFIG. 5 (which has four channels, each having a width of about 22 mm), the weight of the device is about 22 g. For en exemplary heat exchanger of the type depicted inFIG. 6 (which has eight channels, each having a width of about 11 mm), the weight of the device is about 24 g. For an exemplary heat exchanger of the type depicted inFIG. 7 (which has sixteen channels, each having a width of about 5 mm), the weight of the device is about 30 g. It is thus seen that, with respect to the device depicted inFIGS. 2-3 , there is a weight penalty associated with increasing the number of channels, due in part to the increased number of channel partitions. In designing a heat exchanger for a particular application, this weight penalty must be considered in light of the other benefits and drawbacks attendant to an increase in the number of channels. -
FIG. 12 illustrates the effect of thermal conductivity of the case material on the case temperature. As seen therein, the use of case materials such as aluminum, copper or graphite in the interior component 211 (seeFIG. 2 ) of the case allows the exterior case temperature to be maintained at about 70° C. (assuming a 4-channel heat exchanger of the type depicted inFIG. 5 ), which is well within ergonomically acceptable ranges for many applications. By contrast, the use of thermally insulating materials such as non-thermally conductive plastics increases the exterior case temperature about two-fold to 140° C. -
FIG. 13 illustrates the effect of materials choice on the weight of the case. As seen therein, plastics (i.e., ABS) provide the most light-weight construction at about 8 grams. The use of graphite increases the weight of the casing to about 17 g, while the use of aluminum increases the weight to about 20 g. For comparison, a copper construction would yield a casing that weighs about 70 g. It should be noted that the foregoing assumes that the entire casing is made of the noted material. However, one skilled in the art will appreciate that the advantages of thermal conductivity (and the previously noted reduction in exterior casing temperatures) and lighter weight casings can be achieved by making the casing with a two-component or multi-component construction of the type depicted inFIGS. 2-3 . In such a construction, only theinterior component 211 is required to be thermally conductive, thus significantly reducing the weight penalty associated with the use of heavier, thermally conductive materials. -
FIG. 14 illustrates a second, non-limiting embodiment of a thermal management system of the type disclosed herein which is suitable for use in dissipating heat from a battery module. Thesystem 401 comprises abattery module 403 which contains one or more batteries. Rather than utilizing a channeling scheme as is the case with the device ofFIGS. 2-3 , in this embodiment, asynthetic jet ejector 405 is mounted on one end of thebattery module 403 and is adapted to direct a plurality of synthetic jets along one or more surfaces of thebattery module 403, as indicated by the first set ofarrows 407. A series ofapertures 409 or nozzles are provided on a surface of thesynthetic jet ejector 405 adjacent to each major surface of thebattery module 403 for this purpose. As indicated by the second set ofarrows 411 inFIG. 14 , the synthetic jets created by thesynthetic jet ejector 405 cause entrainment of the ambient fluid, thus improving the efficiency of heat transfer from the surfaces of thebattery module 403 to the ambient environment. - As shown in
FIG. 15 ,battery modules 403 of the type depicted inFIG. 14 may be assembled in parallel. One advantage of this type of arrangement is that the resulting entrainment of the ambient fluid, indicated inFIG. 15 byarrows 413, results in a turbulent flow of the fluid medium through the space betweenadjacent battery modules 403, thus resulting in a more efficient transfer of heat between the surfaces of thebattery modules 403 and the ambient environment. -
FIG. 16 illustrates another possible, non-limiting embodiment of a thermally managed battery module made in accordance with the teachings herein. Thedevice 501 depicted therein comprises acasing 503 which contains abattery module 505 and associatedcircuitry 507. Thebattery module 505 has asynthetic jet actuator 509 mounted on a surface thereof. Thecasing 503 may contain one or more vents to permit fluid flow between the interior and exterior of thecasing 503. -
FIG. 17 illustrates yet another possible, non-limiting embodiment of a thermally managed battery module made in accordance with the teachings herein. Thedevice 531 depicted therein, which is similar in many respects to the device depicted inFIG. 16 , comprises acasing 533 which contains abattery module 535 and associatedcircuitry 537. In contrast to the device depicted inFIG. 16 , however, the device depicted inFIG. 17 utilizes a channelingscheme 539 similar to that depicted inFIGS. 2-3 , in conjunction with a surface mountedsynthetic jet actuator 541, to create a flow of fluid over the surfaces of thebattery module 535, thereby maintaining the battery modules within a desired temperature range. - While much of the discussion above has focused on the thermal management of battery modules, one skilled in the art will appreciate that the teachings disclosed herein are not limited to battery modules, but are applicable to the thermal management of a wide variety of devices. Thus, for example,
FIG. 18 illustrates one particular, non-limiting embodiment of the application of a synthetic jet ejector of the type disclosed herein to abattery charger 601. Thebattery charger 601 comprises aplatform 603 which has anupper surface 605 that has a series of ports therein (not shown), each of which is adapted to accept abattery 607 or battery pack for charging. Thebase 609 of thebattery charger 601 contains a power supply which is in electrical communication with the ports defined in theupper surface 605 of theplatform 603. - The
base 609 is equipped with a planar surface for supporting the battery charger on a substrate. Theplatform 603 is preferably supported at an angle to the planar surface. Preferably, this angle is within the range of about 15° to about 75°, and more preferably, this angle is within the range of about 30° to about 60°. - In the particular embodiment of the battery charger depicted in
FIG. 18 , significant heating occurs during the normal charge and discharge cycles attendant to the operation of the device such that, if no thermal management measures are taken, the temperature of the (typically aluminum)front surface 611 of thebase 609 is about 68° C., which is well above the critical limit of 55° C. dictated by end-user ergonomics. Moreover, the device is found to lose capacity when the temperature of this component exceeds 65° C. - The
base 609 of the device includes abase plate 613. The base plate contains a synthetic jet ejector that is adapted to eject a plurality of synthetic jets (indicated by the larger arrows) along thefront surface 611 of thebase 609. The formation of the synthetic jets causes entrainment of the ambient fluid (indicated by the smaller arrows). Operation of the synthetic jet ejector is found to reduce the temperature of thefront surface 611 of the base 609 such that it is in an ergonomically acceptable range. - The above description of the present invention is illustrative, and is not intended to be limiting. It will thus be appreciated that various additions, substitutions and modifications may be made to the above described embodiments without departing from the scope of the present invention. Accordingly, the scope of the present invention should be construed in reference to the appended claims.
Claims (21)
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130235520A1 (en) * | 2012-03-09 | 2013-09-12 | Cheng Yu Huang | Notebook computer cooling pad capable of temperature detection and fan-speed adjustment |
US9184109B2 (en) | 2013-03-01 | 2015-11-10 | Nuventix, Inc. | Synthetic jet actuator equipped with entrainment features |
US9452463B2 (en) | 2010-02-13 | 2016-09-27 | Nuventix, Inc. | Synthetic jet ejector and design thereof to facilitate mass production |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US8290724B2 (en) * | 2007-11-06 | 2012-10-16 | Nuventix, Inc. | Method and apparatus for controlling diaphragm displacement in synthetic jet actuators |
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US7990705B2 (en) * | 2008-05-09 | 2011-08-02 | General Electric Company | Systems and methods for synthetic jet enhanced natural cooling |
US8486552B2 (en) | 2008-06-30 | 2013-07-16 | Lg Chem, Ltd. | Battery module having cooling manifold with ported screws and method for cooling the battery module |
US9759495B2 (en) | 2008-06-30 | 2017-09-12 | Lg Chem, Ltd. | Battery cell assembly having heat exchanger with serpentine flow path |
US8777456B2 (en) | 2008-07-15 | 2014-07-15 | Nuventix, Inc. | Thermal management of LED-based illumination devices with synthetic jet ejectors |
US8240885B2 (en) * | 2008-11-18 | 2012-08-14 | Abl Ip Holding Llc | Thermal management of LED lighting systems |
US9615482B2 (en) | 2009-12-11 | 2017-04-04 | General Electric Company | Shaped heat sinks to optimize flow |
US10274263B2 (en) | 2009-04-09 | 2019-04-30 | General Electric Company | Method and apparatus for improved cooling of a heat sink using a synthetic jet |
US8852778B2 (en) * | 2009-04-30 | 2014-10-07 | Lg Chem, Ltd. | Battery systems, battery modules, and method for cooling a battery module |
US8663829B2 (en) | 2009-04-30 | 2014-03-04 | Lg Chem, Ltd. | Battery systems, battery modules, and method for cooling a battery module |
US8403030B2 (en) | 2009-04-30 | 2013-03-26 | Lg Chem, Ltd. | Cooling manifold |
US8399118B2 (en) | 2009-07-29 | 2013-03-19 | Lg Chem, Ltd. | Battery module and method for cooling the battery module |
US8490419B2 (en) * | 2009-08-20 | 2013-07-23 | United States Thermoelectric Consortium | Interlocked jets cooling method and apparatus |
US8399119B2 (en) | 2009-08-28 | 2013-03-19 | Lg Chem, Ltd. | Battery module and method for cooling the battery module |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
US8776871B2 (en) * | 2009-11-19 | 2014-07-15 | General Electric Company | Chassis with distributed jet cooling |
US8808898B2 (en) * | 2010-01-29 | 2014-08-19 | Renault S.A.S. | Battery pack for an electric powertrain vehicle |
EP2355201B1 (en) * | 2010-01-29 | 2018-12-26 | Renault S.A.S. | Battery pack for an electric powertrain vehicle |
US9780421B2 (en) * | 2010-02-02 | 2017-10-03 | Dana Canada Corporation | Conformal heat exchanger for battery cell stack |
EP2609338A4 (en) | 2010-08-25 | 2017-02-15 | Aavid Thermalloy, LLC | Cantilever fan |
US8662153B2 (en) | 2010-10-04 | 2014-03-04 | Lg Chem, Ltd. | Battery cell assembly, heat exchanger, and method for manufacturing the heat exchanger |
US8602607B2 (en) | 2010-10-21 | 2013-12-10 | General Electric Company | Lighting system with thermal management system having point contact synthetic jets |
US8529097B2 (en) | 2010-10-21 | 2013-09-10 | General Electric Company | Lighting system with heat distribution face plate |
US9379420B2 (en) | 2012-03-29 | 2016-06-28 | Lg Chem, Ltd. | Battery system and method for cooling the battery system |
US9605914B2 (en) | 2012-03-29 | 2017-03-28 | Lg Chem, Ltd. | Battery system and method of assembling the battery system |
US9105950B2 (en) | 2012-03-29 | 2015-08-11 | Lg Chem, Ltd. | Battery system having an evaporative cooling member with a plate portion and a method for cooling the battery system |
US9587820B2 (en) | 2012-05-04 | 2017-03-07 | GE Lighting Solutions, LLC | Active cooling device |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
US8852781B2 (en) | 2012-05-19 | 2014-10-07 | Lg Chem, Ltd. | Battery cell assembly and method for manufacturing a cooling fin for the battery cell assembly |
US9194575B2 (en) | 2012-06-29 | 2015-11-24 | General Electric Company | Thermal management in optical and electronic devices |
JP2015524997A (en) * | 2012-07-06 | 2015-08-27 | ジェンサーム インコーポレイテッドGentherm Incorporated | System and method for cooling an inductive charging assembly |
US8976525B2 (en) * | 2012-07-31 | 2015-03-10 | General Electric Company | Systems and methods for dissipating heat in an enclosure |
US9306199B2 (en) | 2012-08-16 | 2016-04-05 | Lg Chem, Ltd. | Battery module and method for assembling the battery module |
US9276300B2 (en) * | 2012-11-27 | 2016-03-01 | Covidien Lp | Surgical instruments |
US9083066B2 (en) | 2012-11-27 | 2015-07-14 | Lg Chem, Ltd. | Battery system and method for cooling a battery cell assembly |
US8852783B2 (en) | 2013-02-13 | 2014-10-07 | Lg Chem, Ltd. | Battery cell assembly and method for manufacturing the battery cell assembly |
US9647292B2 (en) | 2013-04-12 | 2017-05-09 | Lg Chem, Ltd. | Battery cell assembly and method for manufacturing a cooling fin for the battery cell assembly |
US9184424B2 (en) | 2013-07-08 | 2015-11-10 | Lg Chem, Ltd. | Battery assembly |
US9257732B2 (en) | 2013-10-22 | 2016-02-09 | Lg Chem, Ltd. | Battery cell assembly |
US9570643B2 (en) | 2013-10-28 | 2017-02-14 | General Electric Company | System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices |
US9444124B2 (en) | 2014-01-23 | 2016-09-13 | Lg Chem, Ltd. | Battery cell assembly and method for coupling a cooling fin to first and second cooling manifolds |
US9368845B2 (en) * | 2014-02-25 | 2016-06-14 | Ford Global Technologies, Llc | Traction battery thermal plate with multi pass channel configuration |
US10396411B2 (en) | 2014-02-25 | 2019-08-27 | Ford Global Technologies, Llc | Traction battery thermal plate with transverse channel configuration |
US9452683B2 (en) | 2014-02-25 | 2016-09-27 | Ford Global Technologies, Llc | Traction battery thermal plate with longitudinal channel configuration |
US10084218B2 (en) * | 2014-05-09 | 2018-09-25 | Lg Chem, Ltd. | Battery pack and method of assembling the battery pack |
US10770762B2 (en) | 2014-05-09 | 2020-09-08 | Lg Chem, Ltd. | Battery module and method of assembling the battery module |
US9891677B2 (en) * | 2014-09-11 | 2018-02-13 | Dell Products L.P. | Skin based system cooling using internal system fan |
US9484559B2 (en) | 2014-10-10 | 2016-11-01 | Lg Chem, Ltd. | Battery cell assembly |
US9412980B2 (en) | 2014-10-17 | 2016-08-09 | Lg Chem, Ltd. | Battery cell assembly |
US9786894B2 (en) | 2014-11-03 | 2017-10-10 | Lg Chem, Ltd. | Battery pack |
US9627724B2 (en) | 2014-12-04 | 2017-04-18 | Lg Chem, Ltd. | Battery pack having a cooling plate assembly |
US9960465B2 (en) | 2015-07-30 | 2018-05-01 | Lg Chem, Ltd. | Battery pack |
WO2021061813A1 (en) * | 2019-09-23 | 2021-04-01 | Georgia Tech Research Corporation | Reed-type thermal technologies |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4520085A (en) * | 1983-01-07 | 1985-05-28 | Sonval S.A. | Gas-tight primary battery |
US5114807A (en) * | 1990-04-30 | 1992-05-19 | California Institute Of Technology | Lightweight bipolar storage battery |
US5580677A (en) * | 1993-09-17 | 1996-12-03 | Matsushita Electric Industrial Co., Ltd. | Unit battery of sealed alkaline storage battery and battery system |
US6033800A (en) * | 1996-01-17 | 2000-03-07 | Matsushita Electric Industrial Co., Ltd. | Battery container, battery and layer-built battery |
US6588497B1 (en) * | 2002-04-19 | 2003-07-08 | Georgia Tech Research Corporation | System and method for thermal management by synthetic jet ejector channel cooling techniques |
US20040180257A1 (en) * | 2003-03-11 | 2004-09-16 | Panasonic Ev Energy Co., Ltd. | Cooling device for battery pack |
Family Cites Families (144)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3464672A (en) | 1966-10-26 | 1969-09-02 | Dynamics Corp America | Sonic processing transducer |
US4031171A (en) | 1974-12-25 | 1977-06-21 | Mikuni Kogyo Kabushiki Kaisha | Ultrasonic air humidifying apparatus |
IL52613A (en) | 1977-07-28 | 1980-11-30 | Univ Ramot | Method and apparatus for controlling the mixing of two fluids |
US4170244A (en) | 1977-11-15 | 1979-10-09 | Bernaerts Henry J | Pressure tight valve seat for valves consisting of two opposing tubes |
USRE33448E (en) | 1977-12-09 | 1990-11-20 | Fluidic oscillator and spray-forming output chamber | |
JPS5550437U (en) | 1978-09-28 | 1980-04-02 | ||
US4501319A (en) | 1979-04-17 | 1985-02-26 | The United States Of America As Represented By The Secretary Of The Army | Piezoelectric polymer heat exchanger |
US4498851A (en) | 1980-05-02 | 1985-02-12 | Piezo Electric Products, Inc. | Solid state blower |
US4350838A (en) | 1980-06-27 | 1982-09-21 | Electric Power Research Institute, Inc. | Ultrasonic fluid-atomizing cooled power transformer |
US4941398A (en) | 1981-06-03 | 1990-07-17 | Bowles Fluidics Corporation | Oscillating reed and method |
US4727930A (en) | 1981-08-17 | 1988-03-01 | The Board Of Regents Of The University Of Washington | Heat transfer and storage system |
AU553251B2 (en) | 1981-10-15 | 1986-07-10 | Matsushita Electric Industrial Co., Ltd. | Arrangement for ejecting liquid |
JPS58119217A (en) | 1982-01-07 | 1983-07-15 | Murata Mfg Co Ltd | Piezoelectric tuning fork |
US4406323A (en) | 1982-01-25 | 1983-09-27 | Seymour Edelman | Piezoelectric heat exchanger |
US4590970A (en) | 1983-09-22 | 1986-05-27 | Honeywell Inc. | Pulse width modulated pressure source |
US4595338A (en) | 1983-11-17 | 1986-06-17 | Piezo Electric Products, Inc. | Non-vibrational oscillating blade piezoelectric blower |
DE3342421A1 (en) | 1983-11-24 | 1985-06-05 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | METHOD FOR THE STABILIZING INFLUENCE OF DETACHED LAMINARY BORDER LAYERS |
SU1274165A1 (en) | 1984-01-25 | 1986-11-30 | Казанский Ордена Трудового Красного Знамени И Ордена Дружбы Народов Авиационный Институт Им.А.Н.Туполева | Case assembly for electronic equipment |
US4590399A (en) | 1984-02-28 | 1986-05-20 | Exxon Research And Engineering Co. | Superlattice piezoelectric devices |
US4697769A (en) | 1984-04-23 | 1987-10-06 | Flow Industries, Inc. | Method and apparatus for controlling bound vortices in the vicinity of lifting surfaces |
GB2188397B (en) | 1984-09-13 | 1988-12-29 | Rolls Royce | A low drag surface construction |
US4667877A (en) | 1985-08-15 | 1987-05-26 | Carnegie-Mellon University | Multi-orifice impulsed spray generator |
EP0213426A1 (en) | 1985-08-30 | 1987-03-11 | Siemens Aktiengesellschaft | Casing with a lower and an upper cap for an electrical circuit element |
US4780062A (en) | 1985-10-09 | 1988-10-25 | Murata Manufacturing Co., Ltd. | Piezoelectric fan |
US4708600A (en) | 1986-02-24 | 1987-11-24 | Abujudom Ii David N | Piezoelectric fluid pumping apparatus |
US4932610A (en) | 1986-03-11 | 1990-06-12 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Active control of boundary layer transition and turbulence |
US4802642A (en) | 1986-10-14 | 1989-02-07 | The Boeing Company | Control of laminar flow in fluids by means of acoustic energy |
US4930701A (en) | 1987-09-08 | 1990-06-05 | Mcdonnell Douglas Corporation | Confluent nozzle |
DE3738366A1 (en) | 1987-11-12 | 1989-05-24 | Deutsche Forsch Luft Raumfahrt | METHOD AND DEVICE FOR GENERATING A LAMINAR-TURBULENT BORDER LAYER TRANSITION IN A FLOWED BODY |
JPH01174278A (en) | 1987-12-28 | 1989-07-10 | Misuzu Erii:Kk | Inverter |
US5008582A (en) | 1988-01-29 | 1991-04-16 | Kabushiki Kaisha Toshiba | Electronic device having a cooling element |
US4938742A (en) | 1988-02-04 | 1990-07-03 | Smits Johannes G | Piezoelectric micropump with microvalves |
US4938279A (en) | 1988-02-05 | 1990-07-03 | Hughes Aircraft Company | Flexible membrane heat sink |
FR2631165B1 (en) | 1988-05-05 | 1992-02-21 | Moulene Daniel | TEMPERATURE CONDITIONING MEDIUM FOR SMALL OBJECTS SUCH AS SEMICONDUCTOR COMPONENTS AND THERMAL REGULATION METHOD USING THE SAME |
US5209438A (en) | 1988-06-20 | 1993-05-11 | Israel Wygnanski | Method and apparatus for delaying the separation of flow from a solid surface |
US4976311A (en) | 1988-11-18 | 1990-12-11 | University Of Florida | Heat exchanger employing fluid oscillation |
US4930705A (en) | 1989-02-14 | 1990-06-05 | Vortec Corporation | Air flow apparatus |
US5199856A (en) | 1989-03-01 | 1993-04-06 | Massachusetts Institute Of Technology | Passive structural and aerodynamic control of compressor surge |
US4923000A (en) | 1989-03-03 | 1990-05-08 | Microelectronics And Computer Technology Corporation | Heat exchanger having piezoelectric fan means |
US5183104A (en) | 1989-06-16 | 1993-02-02 | Digital Equipment Corporation | Closed-cycle expansion-valve impingement cooling system |
US4969802A (en) | 1989-12-27 | 1990-11-13 | United States Department Of Energy | Vibratory pumping of a free fluid stream |
GB9000223D0 (en) | 1990-01-05 | 1990-03-07 | Gen Electric Co Plc | Fluid dispenser |
US5083194A (en) | 1990-01-16 | 1992-01-21 | Cray Research, Inc. | Air jet impingement on miniature pin-fin heat sinks for cooling electronic components |
GB2240169B (en) | 1990-01-17 | 1993-06-02 | Ferranti Int Plc | Closed circuit cooling system |
US5107398A (en) | 1990-05-30 | 1992-04-21 | Digital Equipment Corporation | Cooling system for computers |
US5040560A (en) | 1990-12-05 | 1991-08-20 | Ari Glezer | Method and apparatus for controlled modification of fluid flow |
CA2035702C (en) | 1991-02-05 | 1996-10-01 | Mohan Vijay | Ultrasonically generated cavitating or interrupted jet |
US5142260A (en) | 1991-03-08 | 1992-08-25 | Harman International Industries, Incorporated | Transducer motor assembly |
US5190099A (en) | 1991-05-01 | 1993-03-02 | The United States Of The America As Represented By The Secretary Of The Army | Pulsatile impinging cooling system for electronic IC modules and systems using fluidic oscillators |
US5165243A (en) | 1991-06-04 | 1992-11-24 | The United States Of America As Represented By The United States Department Of Energy | Compact acoustic refrigerator |
JPH05102688A (en) | 1991-06-21 | 1993-04-23 | Toshiba Corp | Electronic device apparatus |
US5199640A (en) | 1991-09-16 | 1993-04-06 | Ursic Thomas A | Shock mounted high pressure fluid jet orifice assembly and method of mounting fluid jet orifice member |
US5251817A (en) | 1991-09-16 | 1993-10-12 | Ursic Thomas A | Orifice assembly and method providing highly cohesive fluid jet |
US5226597A (en) | 1991-09-16 | 1993-07-13 | Ursic Thomas A | Orifice assembly and method providing highly cohesive fluid jet |
US5242110A (en) | 1991-12-02 | 1993-09-07 | Praxair Technology, Inc. | Method for changing the direction of an atomized flow |
US5437421A (en) | 1992-06-26 | 1995-08-01 | British Technology Group Usa, Inc. | Multiple electromagnetic tiles for boundary layer control |
FR2694215B1 (en) | 1992-07-30 | 1994-10-21 | Dp Medical | Apparatus for generating a mist from a liquid, especially a drug. |
US5303555A (en) | 1992-10-29 | 1994-04-19 | International Business Machines Corp. | Electronics package with improved thermal management by thermoacoustic heat pumping |
US5316075A (en) | 1992-12-22 | 1994-05-31 | Hughes Aircraft Company | Liquid jet cold plate for impingement cooling |
SE501139C2 (en) | 1993-04-08 | 1994-11-21 | Sem Ab | Membrane type fluid pump device |
DK48993D0 (en) | 1993-04-30 | 1993-04-30 | Steen Erik Holm | NON-TREATMENT FOR WATERABLE LUNG MEDICINE |
US5429302A (en) | 1993-05-19 | 1995-07-04 | Fisons Corporation | Nebulizing element and device |
US5493615A (en) | 1993-05-26 | 1996-02-20 | Noise Cancellation Technologies | Piezoelectric driven flow modulator |
US5346745A (en) | 1993-06-01 | 1994-09-13 | The United States Of America As Represented By The Secretary Of The Navy | Elastic micro-fabricated surface layer for reducing turbulence and drag on an object while it moves through a fluid medium |
US5335143A (en) | 1993-08-05 | 1994-08-02 | International Business Machines Corporation | Disk augmented heat transfer system |
US5395592A (en) | 1993-10-04 | 1995-03-07 | Bolleman; Brent | Acoustic liquid processing device |
US5627903A (en) | 1993-10-06 | 1997-05-06 | Chain Reactions, Inc. | Variable geometry electromagnetic transducer |
CA2112093C (en) | 1993-12-21 | 1995-02-21 | John A. Burgener | Parallel path induction nebulizer |
US5558156A (en) | 1994-01-21 | 1996-09-24 | Honda Giken Kogyo Kabushiki | Heat exchanger |
US5419780A (en) | 1994-04-29 | 1995-05-30 | Ast Research, Inc. | Method and apparatus for recovering power from semiconductor circuit using thermoelectric device |
CA2150628A1 (en) | 1994-06-02 | 1995-12-03 | Lawrence Sirovich | Method of and apparatus for controlling turbulence in boundary layer and other wall-bounded fluid flow fields |
US5516043A (en) | 1994-06-30 | 1996-05-14 | Misonix Inc. | Ultrasonic atomizing device |
JP3471447B2 (en) | 1994-11-16 | 2003-12-02 | 日本碍子株式会社 | Ceramic diaphragm structure and method of manufacturing the same |
CA2169230A1 (en) | 1995-02-13 | 1996-08-14 | Lawrence Sirovich | Method of and apparatus for controlling turbulence in boundary layer and other wall-bounded fluid flow fields |
US5876187A (en) | 1995-03-09 | 1999-03-02 | University Of Washington | Micropumps with fixed valves |
DE59510549D1 (en) | 1995-03-14 | 2003-03-13 | Sulzer Markets & Technology Ag | Method for actively damping global flow oscillations in separated unstable flows and device for applying the method |
US5758823A (en) | 1995-06-12 | 1998-06-02 | Georgia Tech Research Corporation | Synthetic jet actuator and applications thereof |
US6457654B1 (en) | 1995-06-12 | 2002-10-01 | Georgia Tech Research Corporation | Micromachined synthetic jet actuators and applications thereof |
US6123145A (en) | 1995-06-12 | 2000-09-26 | Georgia Tech Research Corporation | Synthetic jet actuators for cooling heated bodies and environments |
EP0844027B1 (en) | 1995-08-07 | 2005-09-21 | Omron Healthcare Co., Ltd. | Atomization apparatus and method utilizing surface acoustic waves |
US5791601A (en) | 1995-08-22 | 1998-08-11 | Dancila; D. Stefan | Apparatus and method for aerodynamic blowing control using smart materials |
US6053424A (en) | 1995-12-21 | 2000-04-25 | Kimberly-Clark Worldwide, Inc. | Apparatus and method for ultrasonically producing a spray of liquid |
FR2747938B1 (en) | 1996-04-24 | 1998-10-02 | Naphtachimie Sa | METHOD AND DEVICE FOR HEAT TREATING PRODUCTS FLOWING IN A DUCT |
JPH09321360A (en) | 1996-05-27 | 1997-12-12 | Honda Motor Co Ltd | Piezoelectric fan |
US5860602A (en) | 1996-12-06 | 1999-01-19 | Tilton; Charles L | Laminated array of pressure swirl atomizers |
US6059020A (en) | 1997-01-16 | 2000-05-09 | Ford Global Technologies, Inc. | Apparatus for acoustic cooling automotive electronics |
DE19802367C1 (en) | 1997-02-19 | 1999-09-23 | Hahn Schickard Ges | Microdosing device array and method for operating the same |
US6247525B1 (en) | 1997-03-20 | 2001-06-19 | Georgia Tech Research Corporation | Vibration induced atomizers |
US5861703A (en) | 1997-05-30 | 1999-01-19 | Motorola Inc. | Low-profile axial-flow single-blade piezoelectric fan |
US5901037A (en) | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
US5857619A (en) | 1997-08-08 | 1999-01-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for breaking up bubbles in a liquid flow |
US6109222A (en) | 1997-11-24 | 2000-08-29 | Georgia Tech Research Corporation | Miniature reciprocating combustion-driven machinery |
US6455186B1 (en) * | 1998-03-05 | 2002-09-24 | Black & Decker Inc. | Battery cooling system |
US5983944A (en) | 1998-03-20 | 1999-11-16 | Niv; Shaul E. | Apparatus for active fluid control |
WO1999063316A1 (en) | 1998-06-05 | 1999-12-09 | Georgia Tech Research Corporation | Robust substrate-based micromachining of sensors and actuators |
JP3154329B2 (en) | 1998-07-21 | 2001-04-09 | 川崎重工業株式会社 | Axial piston pump |
JP3569152B2 (en) * | 1998-10-15 | 2004-09-22 | 株式会社マキタ | battery pack |
US6475658B1 (en) | 1998-12-18 | 2002-11-05 | Aer Energy Resources, Inc. | Air manager systems for batteries utilizing a diaphragm or bellows |
US6032464A (en) | 1999-01-20 | 2000-03-07 | Regents Of The University Of California | Traveling-wave device with mass flux suppression |
US6405794B1 (en) | 1999-03-07 | 2002-06-18 | Korea Institute Of Science And Technology | Acoustic convection apparatus |
US6412732B1 (en) | 1999-07-06 | 2002-07-02 | Georgia Tech Research Corporation | Apparatus and method for enhancement of aerodynamic performance by using pulse excitation control |
US6554607B1 (en) | 1999-09-01 | 2003-04-29 | Georgia Tech Research Corporation | Combustion-driven jet actuator |
JP3814132B2 (en) | 1999-10-27 | 2006-08-23 | セイコーインスツル株式会社 | Pump and driving method thereof |
US6440212B1 (en) | 2000-02-28 | 2002-08-27 | Microfab Technologies, Inc. | Low cost method for making thermoelectric coolers |
US6824915B1 (en) | 2000-06-12 | 2004-11-30 | The Gillette Company | Air managing systems and methods for gas depolarized power supplies utilizing a diaphragm |
JP2001355574A (en) | 2000-06-13 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Piezoelectric pump and cooling device using same |
US6759159B1 (en) | 2000-06-14 | 2004-07-06 | The Gillette Company | Synthetic jet for admitting and expelling reactant air |
SG105459A1 (en) | 2000-07-24 | 2004-08-27 | Micron Technology Inc | Mems heat pumps for integrated circuit heat dissipation |
US6451175B1 (en) | 2000-08-15 | 2002-09-17 | Wisconsin Alumni Research Foundation | Method and apparatus for carbon nanotube production |
DE20015931U1 (en) | 2000-09-14 | 2001-01-04 | Lin Liken | CPU cooling device |
US20020098097A1 (en) | 2001-01-22 | 2002-07-25 | Angad Singh | Magnetically-actuated micropump |
US6644058B2 (en) | 2001-02-22 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Modular sprayjet cooling system |
AU2002255688A1 (en) | 2001-03-10 | 2002-09-24 | Georgia Tech Research Corporation | Modification of fluid flow about bodies and surfaces through virtual aero-shaping of airfoils with synthetic jet actuators |
US6628522B2 (en) | 2001-08-29 | 2003-09-30 | Intel Corporation | Thermal performance enhancement of heat sinks using active surface features for boundary layer manipulations |
US6722581B2 (en) | 2001-10-24 | 2004-04-20 | General Electric Company | Synthetic jet actuators |
US7032392B2 (en) | 2001-12-19 | 2006-04-25 | Intel Corporation | Method and apparatus for cooling an integrated circuit package using a cooling fluid |
US7039213B2 (en) | 2002-01-16 | 2006-05-02 | Hyre David E | Speaker driver |
US6848631B2 (en) | 2002-01-23 | 2005-02-01 | Robert James Monson | Flat fan device |
US6669115B2 (en) | 2002-02-07 | 2003-12-30 | Tai-Yen Sun | Vortex twin-fluid nozzle with self-cleaning pintle |
US6631077B2 (en) | 2002-02-11 | 2003-10-07 | Thermal Corp. | Heat spreader with oscillating flow |
US6725670B2 (en) | 2002-04-10 | 2004-04-27 | The Penn State Research Foundation | Thermoacoustic device |
US6668911B2 (en) | 2002-05-08 | 2003-12-30 | Itt Manufacturing Enterprises, Inc. | Pump system for use in a heat exchange application |
EP1381134B1 (en) * | 2002-07-12 | 2011-11-16 | HILTI Aktiengesellschaft | Battery charging station |
US6809928B2 (en) | 2002-12-27 | 2004-10-26 | Intel Corporation | Sealed and pressurized liquid cooling system for microprocessor |
US7177440B2 (en) | 2002-12-31 | 2007-02-13 | Step Technologies Inc. | Electromagnetic transducer with asymmetric diaphragm |
US6650542B1 (en) | 2003-01-06 | 2003-11-18 | Intel Corporation | Piezoelectric actuated jet impingement cooling |
CN100399556C (en) | 2003-02-20 | 2008-07-02 | 皇家飞利浦电子股份有限公司 | Cooling assembly comprising micro-jets |
US7263837B2 (en) | 2003-03-25 | 2007-09-04 | Utah State University | Thermoacoustic cooling device |
US7055329B2 (en) | 2003-03-31 | 2006-06-06 | General Electric Company | Method and apparatus for noise attenuation for gas turbine engines using at least one synthetic jet actuator for injecting air |
US6710577B1 (en) * | 2003-05-06 | 2004-03-23 | Jeckson Electric Company Limited | Battery charger |
US6801430B1 (en) | 2003-05-09 | 2004-10-05 | Intel Corporation | Actuation membrane to reduce an ambient temperature of heat generating device |
US6937472B2 (en) | 2003-05-09 | 2005-08-30 | Intel Corporation | Apparatus for cooling heat generating components within a computer system enclosure |
JP2006507188A (en) | 2003-06-11 | 2006-03-02 | ビ−エイイ− システムズ パブリック リミテッド カンパニ− | How to control vortex rupture |
US20050031137A1 (en) | 2003-08-07 | 2005-02-10 | Tymphany Corporation | Calibration of an actuator |
KR100519970B1 (en) | 2003-10-07 | 2005-10-13 | 삼성전자주식회사 | Valveless Micro Air Delivery Device |
US7251139B2 (en) | 2003-11-26 | 2007-07-31 | Intel Corporation | Thermal management arrangement for standardized peripherals |
US6988706B2 (en) | 2003-12-17 | 2006-01-24 | General Electric Company | Piezoelectric microvalve |
JP3963173B2 (en) | 2004-01-06 | 2007-08-22 | ソニー株式会社 | Speaker |
US6843310B1 (en) | 2004-03-03 | 2005-01-18 | Chin-Ping Chen | Semi-closed air cooling type radiator |
JP4572548B2 (en) | 2004-03-18 | 2010-11-04 | ソニー株式会社 | Gas ejection device |
US20050284612A1 (en) | 2004-06-22 | 2005-12-29 | Machiroutu Sridhar V | Piezo pumped heat pipe |
US7527086B2 (en) | 2004-07-20 | 2009-05-05 | National Taiwan University | Double-acting device for generating synthetic jets |
US7510149B2 (en) | 2004-08-02 | 2009-03-31 | Lockheed Martin Corporation | System and method to control flowfield vortices with micro-jet arrays |
US7092254B1 (en) | 2004-08-06 | 2006-08-15 | Apple Computer, Inc. | Cooling system for electronic devices utilizing fluid flow and agitation |
-
2006
- 2006-12-19 US US11/641,473 patent/US8030886B2/en not_active Expired - Fee Related
-
2010
- 2010-10-14 US US12/904,444 patent/US20110026218A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4520085A (en) * | 1983-01-07 | 1985-05-28 | Sonval S.A. | Gas-tight primary battery |
US5114807A (en) * | 1990-04-30 | 1992-05-19 | California Institute Of Technology | Lightweight bipolar storage battery |
US5580677A (en) * | 1993-09-17 | 1996-12-03 | Matsushita Electric Industrial Co., Ltd. | Unit battery of sealed alkaline storage battery and battery system |
US6033800A (en) * | 1996-01-17 | 2000-03-07 | Matsushita Electric Industrial Co., Ltd. | Battery container, battery and layer-built battery |
US6588497B1 (en) * | 2002-04-19 | 2003-07-08 | Georgia Tech Research Corporation | System and method for thermal management by synthetic jet ejector channel cooling techniques |
US20040180257A1 (en) * | 2003-03-11 | 2004-09-16 | Panasonic Ev Energy Co., Ltd. | Cooling device for battery pack |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9452463B2 (en) | 2010-02-13 | 2016-09-27 | Nuventix, Inc. | Synthetic jet ejector and design thereof to facilitate mass production |
US20130235520A1 (en) * | 2012-03-09 | 2013-09-12 | Cheng Yu Huang | Notebook computer cooling pad capable of temperature detection and fan-speed adjustment |
US8699221B2 (en) * | 2012-03-09 | 2014-04-15 | Cheng Yu Huang | Notebook computer cooling pad capable of temperature detection and fan-speed adjustment |
US9184109B2 (en) | 2013-03-01 | 2015-11-10 | Nuventix, Inc. | Synthetic jet actuator equipped with entrainment features |
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