US20130011599A1 - Encapsulation for an organic electronic component, its production process and its use - Google Patents

Encapsulation for an organic electronic component, its production process and its use Download PDF

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Publication number
US20130011599A1
US20130011599A1 US13/617,569 US201213617569A US2013011599A1 US 20130011599 A1 US20130011599 A1 US 20130011599A1 US 201213617569 A US201213617569 A US 201213617569A US 2013011599 A1 US2013011599 A1 US 2013011599A1
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Prior art keywords
protective film
encapsulation
component
capsule
organic electronic
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US13/617,569
Inventor
Dirk Buchhauser
Debora Henseler
Karsten Heuser
Arvid Hunze
Ralph Paetzold
Wiebke Sarfert
Carsten Tschamber
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Priority to US13/617,569 priority Critical patent/US20130011599A1/en
Assigned to OSRAM OPTO SEMICONDUCTORS GMBH reassignment OSRAM OPTO SEMICONDUCTORS GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BUCHHAUSER, DIRK, HUNZE, ARVID, SARFERT, WIEBKE, TSCHAMBER, CARSTEN, HEUSER, KARSTEN, PAETZOLD, RALPH, HENSELER, DEBORA
Publication of US20130011599A1 publication Critical patent/US20130011599A1/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/23Sheet including cover or casing
    • Y10T428/239Complete cover or casing

Definitions

  • the invention relates to an encapsulation for an organic electronic component based on a technique that is improved with respect to imperviousness, and a production method and uses therefore.
  • Organic electronic components such as, for example, polymer chips, organic photovoltaic elements and/or organic light-emitting diodes are known. All of these organic electronic components include at least one organic active layer; the material of such a layer or the additional materials present in the layer structure are usually sensitive to oxidation and/or moisture, and the electronic component as a whole therefore usually has to be protected against environmental influences.
  • a disadvantage of the encapsulation-based method is that the material boundary between the substrate, the connecting glue and the capsule is subject to the diffusion of atmospheric moisture and oxygen, which then severely affect the imperviousness of the structure, in particular sharply reducing the life of the component.
  • rim coating an encapsulation provided with a dual adhesive bond (“rim coating”) has recently been proposed, as in US 2003/0143423, in which the capsule is attached to the substrate as well as possible by means of a first, preferably inner adhesive bond, while a second, preferably outer adhesive bond prevents the ingress of moisture and oxygen insofar as possible.
  • a disadvantage of these encapsulations is that a diffusion pathway forms along the material boundaries of the various materials (substrate, glue, encapsulation), so that ultimately the imperviousness of the encapsulation is not ideal and the component instead is still damaged by environmental influences.
  • the barrier effect of the structure as a whole may be determined by the diffusion along the material boundaries, and may therefore be higher than the diffusion through the volume of the adhesive.
  • the object of the present invention is, therefore, to make available an encapsulation for an organic electronic component that offers mechanical protection and optimal imperviousness against harmful environmental influences such as atmospheric moisture and/or oxygen.
  • the invention is therefore directed to an encapsulation for an organic electronic component, characterized in that the encapsulated component is at least partially covered with a protective film.
  • the invention is further directed to a method for producing an encapsulation covered with a protective film, and finally to the use of an encapsulation according to one of the preceding claims to protect organic electronic components, such as organic LEDs, polymer chips and/or organic photovoltaic and/or electrochromic elements and/or display applications that are organically based.
  • the effect achieved by means of the encapsulation is that the component is protected against mechanical damage, while increased imperviousness to moisture and oxygen is obtained by the at least partial covering with a protective film.
  • the term “encapsulation” denotes a dimensionally stable covering over the organic electronic component, which dimensionally stable covering is inverted over the component as a finished capsule, for example of metal and/or glass, usually rests on or terminates flush with the substrate, and is then glued thereto.
  • a version of the capsule that is made of crosslinking plastic may also be contemplated, the plastic being applied in a plastically deformable modification and being rendered dimensionally stable by subsequent curing.
  • various properties such as thermal conductivity (to dissipate evolved heat), absorbency, etc. can be incorporated into the capsule by the addition of suitable fillers.
  • the encapsulation is mechanically stable within given limits and is made of a material that is impermeable to environmental influences such as moisture and/or oxygen.
  • the encapsulation is preferably glued to the substrate at least once, resulting in an essentially ready-encapsulated organic electronic component, which is then additionally protected and sealed according to the invention by applying a protective film for example at weak points of the encapsulation, such as the transition from the encapsulation to the substrate.
  • the additional sealing by covering with a protective film can be done either solely at the weak points of the encapsulation or, preferably, over the entire exterior of the component, so that the encapsulated component is additionally completely covered with a thin-barrier film protective film.
  • the protective film preferably comprises a thin-barrier film of the kind known from sealing technology. These films are distinguished above all by extremely low permeation rates, thereby dramatically reducing the ingress of environmental influences such as moisture and/or oxygen.
  • the protective film can be made of organic or inorganic material, and its material therefore is not firmly established. Where appropriate, a specific property profile (thermal conductivity, color, absorptive properties, etc.) can also be imparted to the protective covering through the addition of a suitable filler, as in the case of the encapsulation.
  • the thin-barrier films group includes both inorganic materials and organic materials. These are characterized by low permeation rates for their class, even when implemented as thin layers (layer thicknesses of less than 1 mm).
  • These films can include more than one layer, but need not necessarily do so.
  • the inorganic layers class includes, non-exclusively, the materials to be made from metal oxides, metal nitrides, metal oxynitrides, silicon compounds and any other type of ceramic compound.
  • the organic materials class includes in this sense, but non-exclusively, organic compounds, preferably polymer compounds, such as, inter alia, parylenes, hydrofluorocarbons, acrylates, polyester compounds and the like.
  • the protective film includes plural layers or plies, organic and inorganic layers can be arranged in any desired order.
  • the organic and/or inorganic plies can be deposited on or laminated onto one another by known techniques or, in other methods, disposed as stand-alone films on the areas to be covered.
  • the material used for the protective film is preferably one that offers better insulating action against moisture and/or oxygen than the glues (even if filled with absorbent) conventionally used with the encapsulation.
  • the thickness of a protective film can vary from approximately 1 nm to 500 ⁇ m.
  • the thickness of the protective film is preferably within a range of 1 nm to 10 ⁇ m, particularly 5 nm to 1 ⁇ m, and in the case of organic films in the range of 500 nm to 100 ⁇ m, particularly 1 ⁇ m to 50 ⁇ m.
  • the protective film can be applied or deposited by various techniques, among which the following methods may be cited: chemical vapor deposition, physical vapor deposition, wet chemical deposition, such as spin coating, dip coating, drop coating, printing techniques such as stencil printing, squeegee printing, screen printing, ink jet processes, spraying, plasma coating methods, plasma polymerization methods, laminating processes, hot sealing, transfer techniques (such as thermotransfer), welding methods and injection molding.
  • chemical vapor deposition physical vapor deposition
  • wet chemical deposition such as spin coating, dip coating, drop coating
  • printing techniques such as stencil printing, squeegee printing, screen printing, ink jet processes, spraying, plasma coating methods, plasma polymerization methods, laminating processes, hot sealing, transfer techniques (such as thermotransfer), welding methods and injection molding.
  • the component is in a high-vacuum chamber during deposition.
  • the component is under reduced pressure but not in a high vacuum during deposition.
  • the material of the thin-barrier film protective film is selected so that it can be applied by chemical vapor deposition (CVD). Due to the low degree of molecular alignment in CVD, this method makes it possible to produce a three-dimensional protective film covering of almost any desired shape, i.e. including one that is completely adapted to the encapsulated component to be covered.
  • CVD chemical vapor deposition
  • a further preferred configuration of the method is designed to minimize thermal stress on the component.
  • a material for at least one inorganic layer of the protective film is selected so that CVD coating, for example plasma-assisted, can be performed at such low temperatures, for example less than 300° C., particularly less than 100° C., that the functionality of the component is not impaired and the effects of thermal expansion are minimized.
  • CVD coating for example plasma-assisted
  • One suitable material for this purpose is silicon nitride.
  • the organic material for layer formation in a thin-barrier film protective film is selected so that CVD coating or plasma polymerization can be performed.
  • a suitable material for this purpose is parylene.
  • the parylene group includes, inter alia, the modifications parylene N, C, D and F. All of these differ in terms of the substituents on a six-member carbon ring that is bound on both sides to a CH 2 group. No substituents are present in the N; C has one chlorine, D two chlorines and F one fluorine. Coating with parylene C seems to be particularly preferable since it is known to result in the best moisture barrier.
  • the thin-barrier film protective film with which the encapsulated component is covered includes at least one layer made of organic and/or one made of inorganic material. These organic and inorganic layers are for example applied in alternation.
  • the contacting of the component by means of, inter alia, a connecting cable bringing the organic electronic component into contact with external drive or playback electronics or another type of connection (grounding) takes place prior to the application of the thin-barrier film protective film.
  • the FIGURE shows a cross section through an encapsulated organic electronic component covered according to the present invention with protective film.
  • the substrate 1 on which the component is disposed. Visible thereon are the component 3 , comprising various active layers, and the encapsulation 5 , which is attached to the substrate 1 by means of glue 4 . Disposed over the encapsulation 5 is the protective film 2 , which covers parts of the substrate 1 as well.
  • the invention discloses for the first time a high-density encapsulation that far outperforms the known encapsulation technologies, since a weak point of the encapsulation, such as for example the transition from the capsule to the substrate or the electronic component as a whole, is covered with a protective film.

Abstract

An encapsulation for an organic electronic component, characterized in that the component, encapsulated in a dimensionally stable capsule, is at least partially covered with a protective film.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is a divisional of U.S. application Ser. No. 10/599,939, filed Sep. 18, 2007, which is the National Stage of International Application No. PCT/EP2005/051623, filed Apr. 13, 2005, which claims priority to German Patent Application Serial No. 10 2004 019 643.5, filed Apr. 22, 2004. The disclosure of the prior applications are hereby incorporated by reference in their entirety.
  • FIELD OF INVENTION
  • The invention relates to an encapsulation for an organic electronic component based on a technique that is improved with respect to imperviousness, and a production method and uses therefore.
  • BACKGROUND OF THE INVENTION
  • Organic electronic components such as, for example, polymer chips, organic photovoltaic elements and/or organic light-emitting diodes are known. All of these organic electronic components include at least one organic active layer; the material of such a layer or the additional materials present in the layer structure are usually sensitive to oxidation and/or moisture, and the electronic component as a whole therefore usually has to be protected against environmental influences.
  • One of the most decisive factors in the commercial exploitation of any organic electronic device is the life of the component, which is determined by the stability of the organic active layer(s). The problem here is that no technique has yet been developed by which an organic light-emitting diode (LED) could be protected for example against environmental influences to such an extent that its functionality remains stable for three years or more.
  • At present, it is standard practice to protect organic electronic components against air and moisture by means of an encapsulation created by inverting a glass or metal cap over the component and attaching it to the substrate. The encapsulation also simultaneously protects the component against mechanical damage, and drying agents/antioxidants, etc., can additionally be fixed to the inside of the capsule.
  • A disadvantage of the encapsulation-based method, however, is that the material boundary between the substrate, the connecting glue and the capsule is subject to the diffusion of atmospheric moisture and oxygen, which then severely affect the imperviousness of the structure, in particular sharply reducing the life of the component.
  • For this reason, an encapsulation provided with a dual adhesive bond (“rim coating”) has recently been proposed, as in US 2003/0143423, in which the capsule is attached to the substrate as well as possible by means of a first, preferably inner adhesive bond, while a second, preferably outer adhesive bond prevents the ingress of moisture and oxygen insofar as possible. Here again, a disadvantage of these encapsulations is that a diffusion pathway forms along the material boundaries of the various materials (substrate, glue, encapsulation), so that ultimately the imperviousness of the encapsulation is not ideal and the component instead is still damaged by environmental influences. In particular, the barrier effect of the structure as a whole may be determined by the diffusion along the material boundaries, and may therefore be higher than the diffusion through the volume of the adhesive.
  • SUMMARY OF THE INVENTION
  • The object of the present invention is, therefore, to make available an encapsulation for an organic electronic component that offers mechanical protection and optimal imperviousness against harmful environmental influences such as atmospheric moisture and/or oxygen.
  • The invention is therefore directed to an encapsulation for an organic electronic component, characterized in that the encapsulated component is at least partially covered with a protective film. The invention is further directed to a method for producing an encapsulation covered with a protective film, and finally to the use of an encapsulation according to one of the preceding claims to protect organic electronic components, such as organic LEDs, polymer chips and/or organic photovoltaic and/or electrochromic elements and/or display applications that are organically based.
  • The effect achieved by means of the encapsulation is that the component is protected against mechanical damage, while increased imperviousness to moisture and oxygen is obtained by the at least partial covering with a protective film.
  • The term “encapsulation” denotes a dimensionally stable covering over the organic electronic component, which dimensionally stable covering is inverted over the component as a finished capsule, for example of metal and/or glass, usually rests on or terminates flush with the substrate, and is then glued thereto. A version of the capsule that is made of crosslinking plastic may also be contemplated, the plastic being applied in a plastically deformable modification and being rendered dimensionally stable by subsequent curing. In cases where the capsule is made of a plastic, various properties, such as thermal conductivity (to dissipate evolved heat), absorbency, etc. can be incorporated into the capsule by the addition of suitable fillers.
  • In any event, the encapsulation is mechanically stable within given limits and is made of a material that is impermeable to environmental influences such as moisture and/or oxygen.
  • The encapsulation is preferably glued to the substrate at least once, resulting in an essentially ready-encapsulated organic electronic component, which is then additionally protected and sealed according to the invention by applying a protective film for example at weak points of the encapsulation, such as the transition from the encapsulation to the substrate.
  • The additional sealing by covering with a protective film can be done either solely at the weak points of the encapsulation or, preferably, over the entire exterior of the component, so that the encapsulated component is additionally completely covered with a thin-barrier film protective film.
  • The protective film preferably comprises a thin-barrier film of the kind known from sealing technology. These films are distinguished above all by extremely low permeation rates, thereby dramatically reducing the ingress of environmental influences such as moisture and/or oxygen. The protective film can be made of organic or inorganic material, and its material therefore is not firmly established. Where appropriate, a specific property profile (thermal conductivity, color, absorptive properties, etc.) can also be imparted to the protective covering through the addition of a suitable filler, as in the case of the encapsulation.
  • The thin-barrier films group includes both inorganic materials and organic materials. These are characterized by low permeation rates for their class, even when implemented as thin layers (layer thicknesses of less than 1 mm).
  • These films can include more than one layer, but need not necessarily do so.
  • The inorganic layers class includes, non-exclusively, the materials to be made from metal oxides, metal nitrides, metal oxynitrides, silicon compounds and any other type of ceramic compound.
  • The organic materials class includes in this sense, but non-exclusively, organic compounds, preferably polymer compounds, such as, inter alia, parylenes, hydrofluorocarbons, acrylates, polyester compounds and the like.
  • If the protective film includes plural layers or plies, organic and inorganic layers can be arranged in any desired order. The organic and/or inorganic plies can be deposited on or laminated onto one another by known techniques or, in other methods, disposed as stand-alone films on the areas to be covered. The material used for the protective film is preferably one that offers better insulating action against moisture and/or oxygen than the glues (even if filled with absorbent) conventionally used with the encapsulation.
  • The thickness of a protective film can vary from approximately 1 nm to 500 μm. In the case of inorganic films, the thickness of the protective film is preferably within a range of 1 nm to 10 μm, particularly 5 nm to 1 μm, and in the case of organic films in the range of 500 nm to 100 μm, particularly 1 μm to 50 μm.
  • The protective film can be applied or deposited by various techniques, among which the following methods may be cited: chemical vapor deposition, physical vapor deposition, wet chemical deposition, such as spin coating, dip coating, drop coating, printing techniques such as stencil printing, squeegee printing, screen printing, ink jet processes, spraying, plasma coating methods, plasma polymerization methods, laminating processes, hot sealing, transfer techniques (such as thermotransfer), welding methods and injection molding.
  • According to one embodiment of the method, the component is in a high-vacuum chamber during deposition.
  • According to another embodiment, the component is under reduced pressure but not in a high vacuum during deposition.
  • According to a preferred embodiment, the material of the thin-barrier film protective film is selected so that it can be applied by chemical vapor deposition (CVD). Due to the low degree of molecular alignment in CVD, this method makes it possible to produce a three-dimensional protective film covering of almost any desired shape, i.e. including one that is completely adapted to the encapsulated component to be covered.
  • A further preferred configuration of the method is designed to minimize thermal stress on the component. To this end, a material for at least one inorganic layer of the protective film is selected so that CVD coating, for example plasma-assisted, can be performed at such low temperatures, for example less than 300° C., particularly less than 100° C., that the functionality of the component is not impaired and the effects of thermal expansion are minimized. One suitable material for this purpose is silicon nitride.
  • In a further advantageous configuration of the method, the organic material for layer formation in a thin-barrier film protective film is selected so that CVD coating or plasma polymerization can be performed. This is particularly advantageous because the film is completed quickly and provides conformal coating of the object. A suitable material for this purpose is parylene. The parylene group includes, inter alia, the modifications parylene N, C, D and F. All of these differ in terms of the substituents on a six-member carbon ring that is bound on both sides to a CH2 group. No substituents are present in the N; C has one chlorine, D two chlorines and F one fluorine. Coating with parylene C seems to be particularly preferable since it is known to result in the best moisture barrier.
  • In a further preferred configuration of the invention, the thin-barrier film protective film with which the encapsulated component is covered includes at least one layer made of organic and/or one made of inorganic material. These organic and inorganic layers are for example applied in alternation.
  • According to one embodiment, the contacting of the component by means of, inter alia, a connecting cable bringing the organic electronic component into contact with external drive or playback electronics or another type of connection (grounding) takes place prior to the application of the thin-barrier film protective film.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention is described further below with reference to an exemplary embodiment:
  • The FIGURE shows a cross section through an encapsulated organic electronic component covered according to the present invention with protective film.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • In the FIGURE there may be recognized the substrate 1, on which the component is disposed. Visible thereon are the component 3, comprising various active layers, and the encapsulation 5, which is attached to the substrate 1 by means of glue 4. Disposed over the encapsulation 5 is the protective film 2, which covers parts of the substrate 1 as well.
  • The invention discloses for the first time a high-density encapsulation that far outperforms the known encapsulation technologies, since a weak point of the encapsulation, such as for example the transition from the capsule to the substrate or the electronic component as a whole, is covered with a protective film.

Claims (13)

1. An encapsulation for an organic electronic component, characterized in that the component, encapsulated in a dimensionally stable capsule, is at least partially covered with a protective film, wherein said protective film includes a layer made of parylene C.
2. The encapsulation as in claim 1, wherein said dimensionally stable capsule is glued to the substrate.
3. The encapsulation as in claim 1, wherein the entire exterior of the component is covered with a protective film.
4. The encapsulation as in claim 1, wherein said protective film includes at least one thin-barrier film.
5. The encapsulation as in clam 1, wherein said protective film has a thickness in the range of 1 nm to 500 μm.
6. A method for producing an encapsulation, wherein an organic electronic component on a substrate is first covered with a capsule, the capsule is then fixed to the substrate, and the encapsulated component is thereafter covered at least in part with a protective film.
7. The method as in claim 6, wherein said capsule is glued to said substrate.
8. The method as in claim 6, wherein said protective film is applied to said encapsulated component by a method selected from the group including the following methods:
chemical vapor deposition, physical vapor deposition, wet chemical deposition, such as spin coating, dip coating, drop coating, printing techniques such as stencil printing, squeegee printing, screen printing, ink jet processes, spraying, plasma coating methods, plasma polymerization methods, laminating processes, hot sealing, transfer techniques (such as thermotransfer), welding methods and injection molding.
9. The method as in claim 6, wherein the application of the protective film takes place at least in part under reduced pressure.
10. The method as in claim 6, wherein the application of the protective film takes place at least in part in a high vacuum.
11. The method as in claim 6, wherein the protective film takes place at least in part via chemical vapor deposition.
12. The method as in claim 11, wherein said chemical vapor deposition is plasma-assisted.
13. The method as in claim 6, wherein the contracting of the component by means of, inter alia, a connection cable bringing said organic electronic component into contact with an external drive or playback electronics and/or another type of connection (grounding) takes place prior to the application of said thin-barrier film protective film.
US13/617,569 2004-04-22 2012-09-14 Encapsulation for an organic electronic component, its production process and its use Abandoned US20130011599A1 (en)

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DE102004019643.5 2004-04-22
DE102004019643 2004-04-22
PCT/EP2005/051623 WO2005104259A2 (en) 2004-04-22 2005-04-13 Encapsulation for an organic electronic component, its production process and its use
WOPCTEP2005051623 2005-04-13
US59993907A 2007-09-18 2007-09-18
US13/617,569 US20130011599A1 (en) 2004-04-22 2012-09-14 Encapsulation for an organic electronic component, its production process and its use

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150091045A1 (en) * 2013-09-27 2015-04-02 Boe Technology Group Co., Ltd. Display panel, display device and method of manufacturing display panel

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673765B1 (en) * 2006-01-20 2007-01-24 삼성에스디아이 주식회사 Organic light-emitting display device and the preparing method of the same
JP4624309B2 (en) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 Organic electroluminescent display device and manufacturing method thereof
KR100685853B1 (en) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 Organic electroluminescence device and method for fabricating of the same
US20090263581A1 (en) * 2008-04-16 2009-10-22 Northeast Maritime Institute, Inc. Method and apparatus to coat objects with parylene and boron nitride
US20090263641A1 (en) * 2008-04-16 2009-10-22 Northeast Maritime Institute, Inc. Method and apparatus to coat objects with parylene
CN105400269A (en) * 2008-04-16 2016-03-16 Hzo股份有限公司 Metal and electronic device coating process for marine use and other environments
DE102008033017A1 (en) * 2008-07-14 2010-01-21 Osram Opto Semiconductors Gmbh Encapsulated optoelectronic component and method for its production
TWI462978B (en) * 2009-03-05 2014-12-01 Hzo Inc Metal and electronic device coating process for marine use and other environments
FR2938375A1 (en) * 2009-03-16 2010-05-14 Commissariat Energie Atomique Flexible, transparent and self-supporting multi-layer film for e.g. organic LED device, has organic and inorganic layers whose thicknesses are chosen such that total thickness of film is greater than or equal to ten micrometers
EP2476149B1 (en) * 2009-09-11 2018-11-14 Koninklijke Philips N.V. Oled devices with protection cover
KR101125689B1 (en) 2010-03-12 2012-03-27 주식회사 프로텍 Led wafer de-bonder
JP5412634B2 (en) * 2010-09-14 2014-02-12 後藤電子 株式会社 Organic EL display device and organic EL lighting device
US9761830B1 (en) * 2012-05-14 2017-09-12 Eclipse Energy Systems, Inc. Environmental protection film for thin film devices
JP6081585B2 (en) 2012-06-18 2017-02-15 エイチズィーオー・インコーポレーテッド Moisture resistant energy storage device and related methods
US9565793B2 (en) * 2012-10-31 2017-02-07 Industrial Technology Research Institute Environmental sensitive electronic device package
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
EP2938500B1 (en) 2012-12-27 2018-11-14 Kateeva, Inc. Techniques for print ink volume control to deposit fluids within precise tolerances
CN103500800A (en) * 2013-09-27 2014-01-08 京东方科技集团股份有限公司 Display panel, display device and manufacturing method for display panel
KR102541161B1 (en) 2013-12-12 2023-06-08 카티바, 인크. Ink-based layer fabrication using halftoning to control thickness
AT516194B1 (en) * 2014-08-20 2017-11-15 Joanneum Res Forschungsgmbh Photovoltaic module with integrated light-directing structure based on total internal reflection
CN104465607A (en) * 2014-12-15 2015-03-25 贵州振华风光半导体有限公司 Leadless plane surface-mounted type microwave thin film hybrid integrated circuit and integration method thereof
EP3072582A1 (en) * 2015-03-27 2016-09-28 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Method for encapsulating a nanostructure, coated nanostructure and use of a coated nanostructure
US20190010074A1 (en) * 2015-08-21 2019-01-10 Corning Incorporated Methods of processing a glass web
CN105304618A (en) * 2015-12-04 2016-02-03 贵州振华风光半导体有限公司 Integration method of anti-interference and anti-corrosion semiconductor integrated circuit
US11065960B2 (en) 2017-09-13 2021-07-20 Corning Incorporated Curved vehicle displays
US11056625B2 (en) * 2018-02-19 2021-07-06 Creeled, Inc. Clear coating for light emitting device exterior having chemical resistance and related methods

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051275A (en) * 1989-11-09 1991-09-24 At&T Bell Laboratories Silicone resin electronic device encapsulant
US6614057B2 (en) * 2001-02-07 2003-09-02 Universal Display Corporation Sealed organic optoelectronic structures
US7486020B2 (en) * 2002-09-11 2009-02-03 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US7811903B2 (en) * 2000-12-06 2010-10-12 Micron Technology, Inc. Thin flip-chip method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07169567A (en) * 1993-12-16 1995-07-04 Idemitsu Kosan Co Ltd Organic el element
US6548912B1 (en) 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6605826B2 (en) 2000-08-18 2003-08-12 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and display device
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
DE10134541A1 (en) * 2001-07-16 2003-02-13 Siemens Ag Computer system and method for ordering a product, in particular a food or beverage
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
GB2383683B (en) * 2001-12-28 2004-04-07 Delta Optoelectronics Inc Housing structure with multiple sealing layers
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
JP4154898B2 (en) * 2002-02-21 2008-09-24 コニカミノルタホールディングス株式会社 Organic electroluminescence display device and organic electroluminescence display element sealing method
US6710542B2 (en) * 2002-08-03 2004-03-23 Agilent Technologies, Inc. Organic light emitting device with improved moisture seal
DE10238799A1 (en) * 2002-08-23 2004-03-11 Siemens Ag Organic light emitting diode (OLED) and / or display, sealing process and use thereof
US7279063B2 (en) * 2004-01-16 2007-10-09 Eastman Kodak Company Method of making an OLED display device with enhanced optical and mechanical properties
US7642642B2 (en) * 2004-03-23 2010-01-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Microcap wafer bonding apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051275A (en) * 1989-11-09 1991-09-24 At&T Bell Laboratories Silicone resin electronic device encapsulant
US7811903B2 (en) * 2000-12-06 2010-10-12 Micron Technology, Inc. Thin flip-chip method
US6614057B2 (en) * 2001-02-07 2003-09-02 Universal Display Corporation Sealed organic optoelectronic structures
US7486020B2 (en) * 2002-09-11 2009-02-03 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150091045A1 (en) * 2013-09-27 2015-04-02 Boe Technology Group Co., Ltd. Display panel, display device and method of manufacturing display panel
US10008689B2 (en) * 2013-09-27 2018-06-26 Boe Technology Group Co., Ltd. Display panel, display device and method of manufacturing display panel

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CN1947278B (en) 2010-10-13
US8288861B2 (en) 2012-10-16

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