US20130306275A1

US20130306275A1 - Heat dissipation structure for heat dissipation device

Info

Publication number: US20130306275A1
Application number: US13/472,147
Authority: US
Inventors: Hsiu-Wei Yang; Chih-Yeh Lin
Original assignee: Individual
Current assignee: Asia Vital Components Co Ltd
Priority date: 2012-05-15
Filing date: 2012-05-15
Publication date: 2013-11-21

Abstract

A heat dissipation structure for heat dissipation device includes a heat dissipation device main body that internally defines a chamber, and the chamber is internally provided with at least a whisker layer and a working fluid. The whisker layer is provided on an inner wall surface of the chamber. By providing the whisker layer in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation device, enabling the latter to have upgraded heat transfer performance.

Description

FIELD OF THE INVENTION

The present invention relates to a heat dissipation structure for heat dissipation device, and more particularly to a heat dissipation structure that enables a working fluid in a heat dissipation device to have upgraded vapor/liquid cycling efficiency.

BACKGROUND OF THE INVENTION

It is known that various heat transfer components, such as heat pipes, vapor chambers, loop heat pipes and heat exchangers, are currently widely employed in electronic apparatuses for transferring and dissipating heat at high efficiency.
Such heat transfer components have excellent heat transfer rate several times to several tens times as high as that of copper, aluminum and the like, and are therefore used in various electronic apparatuses as cooling components. Regarding heat pipes, they can be divided according to their shapes into circular heat pipes, flat heat pipes and D-shaped heat pipes. For cooling an electronic component in an electronic apparatus that produces heat during operation or working, such as a CPU or an executing component, it is preferable to use a vapor chamber, a flat heat pipe or a thin-type heat exchanger as the heat transfer or cooling component in view of the easy installation and large contact area thereof. Meanwhile, due to the demands for a miniaturized cooling mechanism, heat pipes therefor must also be extremely thin to adapt to the very limited internal space in the cooling mechanism.
Further, for a working fluid provided in the above-mentioned heat transfer components to cyclically convert between vapor phase and liquid phase, capillary structures with capillary force, such as grooved structures, metal mesh structures or sintered structures, are also provided in the heat transfer components to help the working fluid to carry on the vapor/liquid cycling smoothly.
For using in a narrow space, the heat transfer components must be manufactured to be very thin. However, other than the thickness of the heat transfer component, the capillary structures inside the heat transfer component form another major obstacle in further thinning the heat transfer component.
Moreover, the capillary force of the thinned capillary structures will degrade to adversely affect the vapor/liquid cycling efficiency of the working fluid to thereby largely reduce the heat transfer efficiency of the heat transfer component. Therefore, the conventional heat transfer components have the following disadvantages: (1) poor heat transfer efficiency; and (2) unable to be effectively thinned.

SUMMARY OF THE INVENTION

To overcome the above-mentioned drawbacks in the prior art heat transfer components, it is a primary object of the present invention to provide a heat dissipation structure for heat dissipation device that enables upgraded heat transfer and heat dissipation efficiency.
Another object of the present invention is to provide a heat dissipation structure for heat dissipation device that enables a working fluid in a thin-type heat dissipation device to have enhanced vapor/liquid cycling efficiency.
To achieve the above and other objects, the heat dissipation structure for heat dissipation device according to the present invention includes a heat dissipation device main body that internally defines a chamber. The chamber is internally provided with at least a whisker layer and a working fluid, and the whisker layer is continuously provided on an inner wall surface of the chamber.
According to the present invention, the heat dissipation device main body can be any one of a heat pipe, a loop heat pipe, a flat heat pipe, a vapor chamber, and a heat exchanger.
The whisker layer is able to largely upgrade the vapor/liquid cycling efficiency of the working fluid in the heat dissipation device main body because it has a dense structure to maintain a capillary force even in a thin-type heat dissipation device, and can therefore help the working fluid to carry on vapor/liquid cycling smoothly.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein

FIG. 1 is a perspective view of a heat dissipation structure for heat dissipation device according to a first embodiment of the present invention;

FIG. 2 is a sectional view taken along line A-A of FIG. 1;

FIG. 2A is an enlarged view of the circled area of FIG. 2;

FIG. 3 is a sectional view of a heat dissipation structure for heat dissipation device according to a second embodiment of the present invention;

FIG. 4 is a sectional view of a heat dissipation structure for heat dissipation device according to a third embodiment of the present invention;

FIG. 5 is a sectional view of a heat dissipation structure for heat dissipation device according to a fourth embodiment of the present invention;

FIG. 6 is a sectional view of a heat dissipation structure for heat dissipation device according to a fifth embodiment of the present invention;

FIG. 7 is a sectional view of a heat dissipation structure for heat dissipation device according to a sixth embodiment of the present invention;

FIG. 8 is a sectional view of a heat dissipation structure for heat dissipation device according to a seventh embodiment of the present invention;

FIG. 9 is a sectional view of a heat dissipation structure for heat dissipation device according to an eighth embodiment of the present invention;

FIG. 10 is a sectional view of a heat dissipation structure for heat dissipation device according to a ninth embodiment of the present invention; and

FIGS. 10A-10D are SEM images of the whisker layer in the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to FIG. 1 that is a perspective view of a heat dissipation structure for heat dissipation device according to a first embodiment of the present invention, and to FIGS. 2 and 2A that are respectively a sectional view taken along line A-A of FIG. 1 and an enlarged view of the circled area of FIG. 2. As shown, in the first embodiment thereof, the heat dissipation structure for heat dissipation device includes a heat dissipation device main body 1 that internally defines a chamber 11, in which at least a whisker layer 111 and a working fluid 112 are provided. The whisker layer 111 is continuously provided on a whole or part of the inner wall surface of the chamber 11, and is formed of a plurality of individual whiskers. The individual whiskers respectively have an end fixedly located on the inner wall surface of the chamber 11 and referred to as a fixed connecting end herein, and another opposite end extending toward an interior of the chamber 11 and being a free end. As can be seen from some SEM (scanning electron microscope) images of the whisker layer 111 shown in the FIGS. 10A-10D, the individual whiskers have sharp free ends.
The main body 1 can be any one of a vapor chamber, a flat heat pipe, a loop heat pipe, and a heat exchanger. In the illustrated first embodiment of the present invention, the main body 1 is a flat heat pipe without being limited thereto. Further, the chamber 11 has a smooth inner wall surface.
Please refer to FIG. 3 that is a sectional view of a heat dissipation structure for heat dissipation device according to a second embodiment of the present invention. As shown, in the second embodiment, the heat dissipation device main body 1 is also illustrated as a heat pipe but not necessarily limited thereto, and the whisker layer 111 axially extends along the inner surface of the chamber 11 of the heat pipe.
FIG. 4 is a sectional view of a heat dissipation structure for heat dissipation device according to a third embodiment of the present invention. As shown, in the third embodiment, the heat dissipation device main body 1 is also illustrated as a heat pipe but not necessarily limited thereto, and the chamber 11 includes at least a first section 113, a second section 114 and a third section 115 connected to and communicable with one another. The whisker layer 111 can be selectively provided in any one of the first, the second and the third section 113, 114, 115. In the illustrated third embodiment, the whisker layer 111 is provided only in the second section 114 but not necessarily restricted thereto.
FIG. 5 is a sectional view of a heat dissipation structure for heat dissipation device according to a fourth embodiment of the present invention. As shown, the fourth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the fourth embodiment is further internally provided with a coating 2, which has both super-hydrophilic and super-hydrophobic properties. The coating 2 is selectively provided in any one of the first, the second and the third section 113, 114, 115. In the illustrated fourth embodiment, the coating 2 is provided in the third section 115.
Please refer to FIG. 6 that is a sectional view of a heat dissipation structure for heat dissipation device according to a fifth embodiment of the present invention. As shown, the fifth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the fifth embodiment is further internally provided with a coating 2, and the coating 2 is provided in the first and the third section 113, 115 of the chamber 11.
Please refer to FIG. 7 that is a sectional view of a heat dissipation structure for heat dissipation device according to a sixth embodiment of the present invention. As shown, the sixth embodiment is generally structurally similar to the second embodiment, except that, in the sixth embodiment, a wick structure 3 is further provided between the inner wall surface of the chamber 11 and the whisker layer 111. The wick structure 3 can be any one of a sintered powder structure, a mesh structure, a fibrous structure, a porous structure, a grooved structure, and any combinations thereof. In the sixth embodiment, the wick structure is illustrated as a grooved structure without being limited thereto. The grooved structure includes a plurality of grooves formed on and sunken from the inner wall surface of the chamber 11, and the whisker layer 111 covers both the grooves and the inner wall surface of the chamber 11.
FIG. 8 is a sectional view of a heat dissipation structure for heat dissipation device according to a seventh embodiment of the present invention. As shown, the seventh embodiment is generally structurally similar to the second embodiment, except that, in the seventh embodiment, a coating 2 is further provided between the inner wall surface of the chamber 11 and the whisker layer 111.
FIG. 9 is a sectional view of a heat dissipation structure for heat dissipation device according to an eighth embodiment of the present invention. As shown, the eighth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the eighth embodiment further includes at least a first section 113, a second section 114 and a third section 115 that are connected to and communicable with one another, and a portion of the whisker layer 111 provided in the second section 114 has a density higher than that of other portions of the whisker layer 111 provided in the first and the third section.
FIG. 10 is a sectional view of a heat dissipation structure for heat dissipation device according to a ninth embodiment of the present invention. As shown, the ninth embodiment is generally structurally similar to the third embodiment, except that the chamber 11 in the ninth embodiment further includes at least a first section 113, a second section 114 and a third section 115 that are connected to and communicable with one another, and a portion of the whisker layer 111 provided in the second section 114 has a density lower than that of other portions of the whisker layer 111 provided in the first and the third section.
In brief, by providing the whisker layer 111 in the heat pipe, the vapor chamber, the flat heat pipe and the loop heat pipe, the whisker layer 111 is able to change the surface tension of the working fluid 112 in the chamber 11, so that the working fluid 112 can flow back at an increased speed to provide excellent vapor/liquid cycling efficiency for the heat dissipation device to have largely upgraded heat transfer performance.
The FIG. 10A-10D shows some SEM images of the whisker layer 111, which can be covered over a wick structure.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims

What is claimed is:

1. A heat dissipation structure for heat dissipation device, comprising a heat dissipation device main body internally defining a chamber, the chamber being internally provided with at least a whisker layer and a working fluid, and the whisker layer being continuously provided on an inner wall surface of the chamber.

2. The heat dissipation structure for heat dissipation device as claimed in claim 1, wherein the heat dissipation device main body is a heat pipe, and the chamber includes at least a first, a second and a third section, which are connected to and communicable with one another; and the whisker layer being provided in one of or each of the first, the second, and the third section.

3. The heat dissipation structure for heat dissipation device as claimed in claim 1, wherein the inner wall surface of the chamber is a smooth wall surface.

4. The heat dissipation structure for heat dissipation device as claimed in claim 2, wherein the chamber is further internally provided with a coating, and the coating being selectively provided in any one of the first, the second, and the third section.

5. The heat dissipation structure for heat dissipation device as claimed in claim 1, wherein the heat dissipation device main body is selected from the group consisting of a vapor chamber, a heat pipe, a loop heat pipe, and a heat exchanger.

6. The heat dissipation structure for heat dissipation device as claimed in claim 1, wherein the chamber is further internally provided between the inner wall surface and the whisker layer with a wick structure.

7. The heat dissipation structure for heat dissipation device as claimed in claim 6, wherein the wick structure is selected from the group consisting of a sintered powder structure, a mesh structure, a fibrous structure, a porous structure, and a grooved structure.

8. The heat dissipation structure for heat dissipation device as claimed in claim 1, wherein the heat dissipation device main body is a heat pipe, and the whisker layer being axially extended over the inner wall surface of the chamber of the heat pipe.

9. The heat dissipation structure for heat dissipation device as claimed in claim 2, wherein a portion of the whisker layer provided in the second section of the chamber has a density higher than that of other portions of the whisker layer provided in the first and the third section.

10. The heat dissipation structure for heat dissipation device as claimed in claim 2, wherein a portion of the whisker layer provided in the second section of the chamber has a density lower than that of other portions of the whisker layer provided in the first and the third section.

11. The heat dissipation structure for heat dissipation device as claimed in claim 1, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

12. The heat dissipation structure for heat dissipation device as claimed in claim 2, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

13. The heat dissipation structure for heat dissipation device as claimed in claim 3, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

14. The heat dissipation structure for heat dissipation device as claimed in claim 4, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

15. The heat dissipation structure for heat dissipation device as claimed in claim 5, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

16. The heat dissipation structure for heat dissipation device as claimed in claim 6, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

17. The heat dissipation structure for heat dissipation device as claimed in claim 7, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

18. The heat dissipation structure for heat dissipation device as claimed in claim 8, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

19. The heat dissipation structure for heat dissipation device as claimed in claim 9, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.

20. The heat dissipation structure for heat dissipation device as claimed in claim 10, wherein the whisker layer is formed of a plurality of individual whiskers; the individual whiskers respectively having a fixed connecting end located on the inner wall surface of the chamber and another opposite end extending toward an interior of the chamber to form a free end; and the free ends of the individual whiskers being sharp ends.