US20150050871A1

US20150050871A1 - Chemical Mechanical Polishing Conditioner Made From Woven Preform

Info

Publication number: US20150050871A1
Application number: US14/148,632
Authority: US
Inventors: Chia Chun Wang; Chia-Feng CHIU; Wen-Jen Liao; Chung-Yi Cheng
Original assignee: Kinik Co
Current assignee: Kinik Co
Priority date: 2013-08-16
Filing date: 2014-01-06
Publication date: 2015-02-19
Also published as: TW201507807A

Abstract

The present invention relates to a chemical mechanical polishing conditioner made from a woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer; wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to the woven preform in advance. Therefore, the present invention can provide the bonding layer with a better flexibility by the woven preform, and solve the conventional problem of resin residue in a powder-form bonding layer, or thermal cracking or thermal deformation of a sheet-form bonding layer during the heating and curing process, and thus improve the polishing performance and service time of the chemical mechanical polishing conditioner.

Description

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefits of the Taiwan Patent Application Serial Number 102129453, filed on Aug. 16, 2013, the subject matter of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a chemical mechanical polishing conditioner, and more particularly to a chemical mechanical polishing conditioner made from woven preform.
2. Description of Related Art
Chemical mechanical polishing (CMP) is a common polishing process in various industries, which can be used to grind surfaces of various articles, including ceramics, silicon, glass, quartz, or a metal chip. In addition, with the rapid development of integrated circuits, chemical mechanical polishing has become one of the most common techniques for wafer planarization due to its goal of an extensive planarization ability.
During the chemical mechanical polishing process of semiconductor, impurities or uneven structure on the wafer surface is removed by contacting the wafer (or the other semiconductor element) with a polishing pad and using a polishing liquid if necessary, through the chemical reaction and physical mechanical force. When the polishing pad has been used for a certain period of time, the polishing performance and efficiency are reduced because the debris produced in the polishing process may accumulate on the surface of the polishing pad. Therefore, a conditioner can be used to condition the surface of the polishing pad, such that the surface of the polishing pad is re-roughened and maintained at an optimum condition for polishing. In the process for manufacturing a conditioner, it is necessary to dispose an abrasive layer by mixing abrasive particles and a bonding layer on the substrate surface, and to fix the abrasive layer to the substrate surface by brazing or sintering methods.
The current method for manufacturing the chemical mechanical polishing conditioner mainly uses a powder-form bonding layer (i.e. using metal powders or brazing alloy powders as the bonding layer) or a sheet-form bonding layer (i.e. vacuum compressing metal powders or brazing powders to form a binding sheet). However, during curing of the bonding layer (or abrasive layer), the powder-form bonding layer often needs additional adhesives (e.g., an organic resin) to form a semi-cured sheet-form preform. Moreover, the adhesive often remains in the bonding layer during the heat-curing process, and the binding strength between the bonding layer and the abrasive particles or the substrate is reduced; thereby impairing the quality and performance of the chemical mechanical polishing conditioner. Furthermore, since the sheet-form bonding layer is formed by vacuum compression treatment, the flexibility of the sheet-form bonding layer is poor, and a thermal cracking often occurs during the heat-curing process, thereby adversely affecting the polishing efficiency and service life of the chemical mechanical polishing conditioner.
In the known technology, it discloses a two-sided emery cloth structure with chip discharging function, more particularly, relates to an innovative structure which addresses the problems of conventional single-sided emery polishing cloth, such as deceasing rapidly polishing efficiency, accelerating deterioration, and shortening service life. The two-sided emery cloth structure comprises a web layer with a mesh formed by weaving vertical and horizontal lines, and an emery layer is combined with both the front and rear surfaces of the web layer to provide a two-sided emery cloth with chip discharging function. Then, a fixed piece of fiber fabrics is combined with one side surface of the web layer with a mesh, to construct a two-sided emery cloth in which front and rear sides thereof can be combined with a grinding wheel in turn by the fixed piece. As such, not only the service life can be extended twice, but also grinding debris can be discharged smoothly by a discharging mesh to avoid block of the gap between the emery particles to maintain better polishing sharpness and polishing efficiency. Also, the emery cloth deterioration due to the increased polishing temperature can be avoided to prolong the durability of the emery cloth.
In addition, in another known technology, it discloses a cutting-off wheel, more particularly, a resin abrasive cut-off wheel for cutting metallic materials and with solid-shaped integrity. The utility model is disk-shaped, and the center of the wheel is provided with an opening. The cutting-off wheel is composed of abrasive particles, organic resin, a fiberglass netting cloth, and short glass fiber wires. The abrasive particles and the short glass fiber wires are homogenously distributed inside the organic resin. The glass fiber netting cloth is parallel to two end surfaces and evenly and axially distributed inside the organic resin, and the abrasive particles are exposed on the two end surfaces. Formaldehyde-phenol resin is chosen as the organic resin. The abrasive particles are particles of brown fused alumina, white alumina, rubbing grain, zirconium-corundum, didymium alumina, black silicon carbide, green silicon carbide, boron carbide, boron nitride, diamond grain or diamond. The utility model has the advantages of large size, high intensity, and hot cutting, being suitable for high speed cutting of large size metal, and long service life.
However, in the above emery cloth structure or cutting-off wheel, the abrasive particles or diamond particles are mainly fixed on the surface of a fabric cloth or fabric web by a binding agent (e.g., organic resin), but the fabric cloth or fabric web still has a porous network structure after heat-curing. Therefore, when the fabric cloth or fabric web is directly used as a bonding layer of the chemical mechanical polishing conditioner, the overall mechanical strength of the chemical mechanical polishing conditioner is still insufficient, thus decreasing the polishing performance.
Therefore, there is an urgent need to develop a flexible chemical mechanical polishing conditioner, which can solve the problem of residue glue or thermal cracking during the curing of the chemical mechanical polishing conditioner, and can enhance the binding strength and polishing performance of the chemical mechanical polishing conditioner.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a chemical mechanical polishing conditioner made from woven preform, which can effectively solve the problem of residue glue or thermal cracking in the chemical mechanical polishing conditioner during curing, so as to achieve the desirable surface binding strength of the chemical mechanical polishing conditioner. Furthermore, in the present invention, since the bonding layer is formed by heat-curing the woven preform, a more excellent flexibility can be provided by the woven preform, while the chemical mechanical polishing conditioner with a more excellent binding strength and polishing performance can be provided.
To achieve the above object, the present invention provides a chemical mechanical polishing conditioner made from woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer; wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to woven preform through an adhesive or an extrusion method in advance. Furthermore, in the above chemical mechanical polishing conditioner made from woven preform of the present invention, the melting point of the woven preform is below the heat-curing temperature, and therefore, the woven preform is transformed from the original porous network structure into a bonding layer with a dense structure after the heat-curing process, thereby providing the flexibility of the network structure and the binding strength of the dense structure.
In the chemical mechanical polishing conditioner made from woven preform of the present invention, the woven preform may have a first directional woven matrix and a second directional woven matrix, wherein a woven space may be formed between the first directional woven matrix and the second directional woven matrix adjacent thereto. Furthermore, in the above chemical mechanical polishing conditioner made from woven preform of the present invention, the maximum diameter of the woven space may be 0.1 to 5 times the diameter of the abrasive particles, that is, the number of the abrasive particles in the woven space may be varied based on the user's requirements or the polishing conditions, wherein 1 to 5 of the abrasive particles may be included in the woven space. In an aspect of the present invention, one abrasive particle may be included in the woven space. In a preferred aspect of the present invention, three abrasive particles may be included in the woven space.
In the chemical mechanical polishing conditioner made from woven preform of the present invention, the abrasive particles may be disposed on the surface of the woven preform, or the abrasive particles may be disposed in the woven space of the woven preform, that is, the abrasive particles and the woven space may have the same or different arrangement. Additionally, the abrasive particles may be controlled to be disposed on the surface of the woven preform or in the woven space by adjusting the maximum diameter of the woven space and the diameter of the abrasive particles. Furthermore, in the above chemical mechanical polishing conditioner made from woven preform of the present invention, the arrangement of the abrasive particles may be varied based on the user's requirements or the polishing conditions, wherein the abrasive particles may have a patterned arrangement or an irregular arrangement.
In the chemical mechanical polishing conditioner made from woven preform of the present invention, the woven preform may have a first directional woven matrix and a second directional woven matrix, wherein the included angle between the first directional woven matrix and the second directional woven matrix may be 10 to 90 degrees. In an aspect of the present invention, the angle between the first directional woven matrix and the second directional woven matrix is 90 degrees. In another aspect of the present invention, the included angle between the first directional woven matrix and the second directional woven matrix is 60 degrees. In yet another aspect of the present invention, the included angle between the first directional woven matrix and the second directional woven matrix is 45 degrees.
In the chemical mechanical polishing conditioner made from woven preform of the present invention, in addition to the first directional woven matrix and the second directional woven matrix, the woven preform may further comprise a third directional woven matrix and a fourth directional woven matrix, wherein each of the above woven matrixes may be disposed in a different direction, and may form an included angle with each other or form a woven space by the woven matrixes with different directions. In an aspect of the present invention, the woven preform may have the first directional woven matrix and the second directional woven matrix. In another aspect of the present invention, the woven preform may have the first directional woven matrix, the second directional woven matrix and the third directional woven matrix. In yet another aspect of the present invention, the woven preform may have the first directional woven matrix, the second directional woven matrix, the third directional woven matrix and the fourth directional woven matrix. Furthermore, in the above chemical mechanical polishing conditioner made from woven preform of the present invention, the number of the laminated layers of the woven preform may be varied based on the user's requirements or the polishing conditions, wherein the woven preform may be a single-layer woven structure or a multilayer woven structure. In an aspect of the present invention, the woven preform may be a single-layer woven structure, and the thickness of the woven preform may be varied based on the size of the abrasive particles.
In the chemical mechanical polishing conditioner made from woven preform of the present invention, the abrasive particles may be artificial diamond, nature diamond, polycrystalline diamond or cubic boron nitride. In a preferred aspect of the present invention, the abrasive particles may be diamond. Furthermore, in the chemical mechanical polishing conditioner made from woven preform of the present invention, the abrasive particles may have a particle size of 30 to 600 μm. In a preferred aspect of the present invention, the abrasive particles may have a particle size of 200 μm.
In the chemical mechanical polishing conditioner made from woven preform of the present invention, the composition of the bonding layer or the woven preform may be varied based on the user's requirements or the polishing conditions, which includes: a ceramic material, a brazing material, an electroplating material, a metallic material, or a polymer material, but the present invention is not limited thereto. In another aspect of the present invention, the woven preform is made of a ceramic material, and for example, the glass fiber cloth or the carbon fiber cloth formed of a glass fiber or carbon fiber is used as the woven preform. In another aspect of the present invention, the woven preform is made of a brazing material, and for example, the brazing woven preform is formed of a nickel-based brazing material by compression molding, wherein the brazing material is at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and combinations thereof. In yet another aspect of the present invention, the woven preform may be made of a polymer material, and for example, the polymeric woven preform is formed by injection molding or extrusion molding of a polymer material; wherein the polymer material such as epoxy resin, polyester resin, polyacrylic resin, or phenolic resin.
In the chemical mechanical polishing conditioner made from woven preform of the present invention, the substrate may be made of stainless steel to provide the chemical mechanical polishing conditioner with excellent mechanical strength and chemical resistance. Furthermore, in the above chemical mechanical polishing conditioner made from woven preform of the present invention, the surface shape of the substrate may be varied based on the user′ requirements or the polishing conditions, wherein the substrate surface may be a planar surface, a convex surface, or a concave surface. In an aspect of the present invention, the substrate surface may be planar. In another aspect of the present invention, the substrate surface may be a concave surface.
In summary, according to the chemical mechanical polishing conditioner made from woven preform of the present invention, the chemical mechanical polishing conditioner can effectively solve the problem of residue glue or thermal cracking during curing. Moreover, the woven preform has a more excellent flexibility, and provides the chemical mechanical polishing conditioner with a more excellent binding strength and polishing performance.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIGS. 1A to 1C show a flow diagram for manufacturing a conventional chemical mechanical polishing conditioner according to Comparative Example 1.

FIGS. 2A to 2B show another flow diagram for manufacturing a conventional chemical mechanical polishing conditioner according to Comparative Example 2.

FIGS. 3A to 3C show a flow diagram for manufacturing the chemical mechanical polishing conditioner made from woven preform according to Example 1 of the present invention.

FIG. 4 shows a schematic diagram of the woven preform according to Example 1 of the present invention.

FIG. 5 shows a schematic diagram of the woven preform according to Example 2 of the present invention.

FIG. 6 shows a schematic diagram of the woven preform according to Example 3 of the present invention.

FIGS. 7 and 8 show schematic diagrams of the chemical mechanical polishing conditioner made from woven preform according to Examples 4 and 5 of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, the actions and the effects of the present invention will be explained in more detail via specific examples of the invention. However, these examples are merely illustrative of the present invention and the scope of the invention should not be construed to be defined thereby.

Comparative Example 1

With refer to FIGS. 1A to 1C, there is shown a flow diagram for manufacturing a conventional chemical mechanical polishing conditioner having a sheet-form bonding layer. First, as shown in FIGS. 1A and 1B, a plurality of abrasive particles 12 are disposed on a bonding layer 11 and the bonding layer 11 is disposed on a substrate 10. The bonding layer 11 is a sheet-form bonding layer formed of a nickel-based metallic brazing material by vacuum compression molding. The substrate 10 is made of stainless steel, and the abrasive particles 12 is formed of a typical artificial diamond and embedded on the bonding layer 11 by using a known diamond distribution technique (for example, template distribution). The spacing and arrangement of the abrasive particles 12 are controlled by the template (not shown).
Then, as shown in FIG. 1C, a heat-curing process is performed to fix the abrasive particles 12 to the surface of the substrate 10 by the bonding layer 11, along with a plurality of cracks 13 formed on the bonding layer 11. Thus, since the sheet-form bonding layer is formed by vacuum compression molding, the flexibility of the sheet-form bonding layer is poor, and thermal cracking often occurs during heat-curing process, thereby disadvantageously affecting the polishing efficiency and service life of the chemical mechanical polishing conditioner.

Comparative Example 2

With refer to FIGS. 2A to 2B, there is shown another flow diagram for manufacturing a conventional chemical mechanical polishing conditioner having a powder-form bonding layer. First, as shown in FIG. 2A, a bonding layer 21 is disposed on a substrate 20, and a plurality of abrasive particles 22 are disposed on a bonding layer 21. The bonding layer 21 is a power-form bonding layer formed of a nickel-based metallic brazing material. The substrate 20 is made of stainless steel, and the abrasive particles 22 is formed of a typical artificial diamond and embedded on the bonding layer 21 by using the known diamond distribution technique. The spacing and arrangement of the abrasive particles 22 are controlled by the template (not shown).
Then, as shown in FIG. 2B, a heat-curing process is performed to fix the abrasive particles 22 to the surface of the substrate 20 by the bonding layer 21, along with a plurality of cracks 23 formed on the bonding layer 21. Thus, since the power-form bonding layer usually needs additional adhesives (such as organic resins) to form a semi-cured sheet-form preform, the adhesive often remains in the bonding layer during the heat-curing process, resulting in a decreased binding strength between the bonding layer and the abrasive particles or the substrate, thereby damaging the quality and performance of the chemical mechanical polishing conditioner.

Example 1

With refer to FIGS. 3A to 3C, there is shown the flow diagram for manufacturing the chemical mechanical polishing conditioner according to Example 1 of the present invention. First, as shown in FIGS. 3A and 3B, a plurality of abrasive particles 32 are disposed on a woven preform 310 in advance, and the woven preform 310 is disposed on a substrate 30, wherein the woven preform 310 is a porous network structure formed of a glass fiber cloth, the substrate 30 is made of stainless steel, and the abrasive particles 32 is formed of a typical artificial diamond and fixed on the woven preform 310 by using the known diamond distribution technique.
Then, as shown in FIG. 3C, a heat-curing process is performed, such that the woven preform 310 is formed into the bonding layer 31, wherein the melting point of the woven preform 310 is below the heat-curing temperature. For example, the heat-curing temperature is raised to 2,000° C. or more, to transform the woven preform 310 formed of the glass fiber cloth from a solid state into a molten state, and the woven preform 310 is transformed from the original porous network structure into a bonding layer 31 with a dense structure after the heat-curing process, which makes the woven preform 310 with the flexibility of the network structure and the binding strength of the dense structure. Therefore, the chemical mechanical polishing conditioner made from woven preform of the present invention can effectively solve the problem of residue glue or thermal cracking the chemical mechanical polishing conditioner during the curing process. Moreover, the woven perform has a more excellent flexibility, while the chemical mechanical polishing conditioner with a more excellent binding strength and polishing performance can be provided.
With refer to FIG. 4, there is shown a schematic diagram of the woven preform according to Example 1 of the present invention. As shown in FIG. 4, the woven preform 41 (corresponding to the woven preform 310 of FIG. 3A) has a first directional woven matrix 411 and a second directional woven matrix 412, and a woven space (not shown) is formed between the first directional woven matrix 411 and the second directional woven matrix 412 adjacent thereto, wherein the abrasive particles 42 may be disposed in the woven space of the woven preform 41 to be arranged in an array-type pattern. In addition, the maximum diameter of the woven space is almost identical with the diameter of the abrasive particles 42 such that each woven space is filled with a single abrasive particles 42.
Furthermore, an included angle A is formed between the first directional woven matrix 411 and the second directional woven matrix 412, which may be varied based on the user's requirements or the polishing conditions. In Example 1, the first directional woven matrix 411 and the second directional woven matrix 412 are arranged to be perpendicular to each other, that is, the included angle A is 90 degrees, such that the abrasive particles 42 is fixed to the woven space having the included angle of 90 degrees in advance.

Example 2

With refer to FIG. 5, there is shown a schematic diagram of the woven preform according to Example 2 of the present invention. The manufacturing process of Example 2 is substantially the same as the Example 1, except that an angle of the included angle A between the first directional woven matrix and the second directional woven matrix is different. In Example 2, the woven preform 51 has a first directional woven matrix 511 and a second directional woven matrix 512, and a woven space (not shown) is formed between the first directional woven matrix 511 and the second directional woven matrix 512 adjacent thereto, wherein the abrasive particles 52 may be disposed in the woven space of the woven preform 51 to achieve an equally spaced patterned arrangement. In addition, the maximum diameter of the woven space is almost identical with the diameter of the abrasive particles 52 such that each woven space is filled with a single abrasive particles 52.
Furthermore, an included angle B is formed between the first directional woven matrix 511 and the second directional woven matrix 512, which may be varied based on the user's requirements or the polishing conditions. In Example 2, the first directional woven matrix 511 and the second directional woven matrix 512 are arranged to form an included angle B of 45 degrees, such that the abrasive particles 52 is fixed to the woven space having the angle of 45 degrees in advance.

Example 3

With refer to FIG. 6, there is shown a schematic diagram of the woven preform according to Example 3 of the present invention. The manufacturing process of Example 3 is substantially the same as the Example 1, except that the positions of the abrasive particles in the woven preform are different. In Example 3, the woven preform 61 has a first directional woven matrix 611 and a second directional woven matrix 612, and a woven space (not shown) is formed between the first directional woven matrix 611 and the second directional woven matrix 612 adjacent thereto. Unlike Example 1, in which the abrasive particles are disposed in the woven space of the woven preform, in Example 3, the abrasive particles 62 are disposed on the surface of the woven preform 31, and the abrasive particles 62 may be fixed on the first directional woven matrix 611 or the second directional woven matrix 612 of the woven preform 61 by a known diamond distribution technique in advance to be arranged in an array-type pattern.

Examples 4 and 5

With refer to FIGS. 7 and 8, there are shown schematic diagrams of the chemical mechanical polishing conditioner made from woven preform according to Examples 4 and 5 of the present invention. The manufacturing processes of Examples 4 and 5 are substantially the same as the Example 1, except that the surface contour of the substrate is different. Unlike Example 1, in which the substrate surface has a planar contour and the working surface (i.e. the abrasive surface formed by the abrasive particles) of the chemical mechanical polishing conditioner has a planar contour, substrate or the working surface of the chemical mechanical polishing conditioner in Example 4 and Example 5 has a non-planar contour.
As shown in FIG. 7, the chemical mechanical polishing conditioner includes a substrate 70, a bonding layer 71 and a plurality of abrasive particles 72. The abrasive particles 72 are fixed on the substrate 70 by the bonding layer 71, and the substrate 70 and the tips (i.e. the working surface) of the abrasive particles 72 have a convex contour, such that the center of the substrate 70 has a height higher than the outer edge of the substrate 70, or the center abrasive particles 72 has a height higher than the outer edge abrasive particles 72.
In addition, as shown in FIG. 8, the chemical mechanical polishing conditioner includes a substrate 80, a bonding layer 81 and a plurality of abrasive particles 82. The abrasive particles 82 are fixed on the substrate 80 by the bonding layer 81, and the substrate 80 and the tips (i.e. the working surface) of the abrasive particles 82 have a concave contour, such that the center of the substrate 80 has a height lower than the outer edge of the substrate 80, or the center abrasive particles 82 has a height lower than the outer edge abrasive particles 82.
It should be understood that these examples are merely illustrative of the present invention and the scope of the invention should not be construed to be defined thereby, and the scope of the present invention will be limited only by the appended claims.

Claims

What is claimed is:

1. A chemical mechanical polishing conditioner made from a woven preform, comprising:

a substrate;

a bonding layer disposed on the substrate; and

a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer;

wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to the woven preform in advance.

2. The chemical mechanical polishing conditioner of claim 1, wherein the melting point of the woven preform is below the heat-curing temperature.

3. The chemical mechanical polishing conditioner of claim 1, wherein the woven preform has a first directional woven matrix and a second directional woven matrix.

4. The chemical mechanical polishing conditioner of claim 3, wherein a woven space is formed between the first directional woven matrix and the second directional woven matrix adjacent thereto.

5. The chemical mechanical polishing conditioner of claim 4, wherein a maximum diameter of the woven space is 0.1 to 5 times a diameter of the abrasive particles.

6. The chemical mechanical polishing conditioner of claim 4, wherein the woven space contains one to five of the abrasive particles.

7. The chemical mechanical polishing conditioner of claim 4, wherein the abrasive particles are disposed on a surface of the woven preform, or the abrasive particles are disposed in the woven space of the woven preform.

8. The chemical mechanical polishing conditioner of claim 7, wherein the abrasive particles have a patterned arrangement or an irregular arrangement.

9. The chemical mechanical polishing conditioner of claim 3, wherein an included angle between the first directional woven matrix and the second directional woven matrix is 10 to 90 degrees.

10. The chemical mechanical polishing conditioner of claim 9, wherein an included angle between the first directional woven matrix and the second directional woven matrix is 90 degrees.

11. The chemical mechanical polishing conditioner of claim 3, wherein the woven preform further comprises a third directional woven matrix and a fourth directional woven matrix.

12. The chemical mechanical polishing conditioner of claim 1, wherein the woven preform is a single-layer woven structure or a multilayer woven structure.

13. The chemical mechanical polishing conditioner of claim 1, wherein the abrasive particles are artificial diamond, nature diamond, polycrystalline diamond or cubic boron nitride.

14. The chemical mechanical polishing conditioner of claim 1, wherein the abrasive particles have a particle size of 30 to 600 μm.

15. The chemical mechanical polishing conditioner of claim 1, wherein a composition of the bonding layer or the woven preform is made of a ceramic material, a brazing material, an electroplating material, a metallic material, or a polymer material.

16. The chemical mechanical polishing conditioner of claim 15, wherein the ceramic material is a glass fiber, or a carbon fiber.

17. The chemical mechanical polishing conditioner of claim 15, wherein the brazing material is at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and combinations thereof.

18. The chemical mechanical polishing conditioner of claim 15, wherein the polymer material is epoxy resin, polyester resin, polyacrylic resin, phenolic resin.

19. The chemical mechanical polishing conditioner of claim 1, wherein the substrate is made of stainless steel.

20. The chemical mechanical polishing conditioner of claim 1, wherein the substrate surface is a planar surface, a convex surface, or a concave surface.