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Publication numberUS2124589 A
Publication typeGrant
Publication dateJul 26, 1938
Filing dateJun 17, 1936
Priority dateJun 17, 1936
Publication numberUS 2124589 A, US 2124589A, US-A-2124589, US2124589 A, US2124589A
InventorsJohn V O Palm, Carl E Swartz
Original AssigneeCleveland Graphite Bronze Co
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
US 2124589 A
Abstract  available in
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Claims  available in
Description  (OCR text may contain errors)

Patented July 26, 1938 UNITED STATES PA 'lENT- orrlcs ALLOY John v. 0. Palm and Carl E. Swartz, Cleveland,


Ohio, assignors to The Cleveland Graphite Bronze Company, Cleveland, Ohio,

a corporation of Ohio No Drawing. Application June 17, 1936,

Serial No. 85,734

1' Claim. (Cl. -115) purposes,: and environment wherein tin metal" such as pure or commercial tin has heretofore been used in the art. a

Due to the improvement of such physical properties of tin metal, such as fatigue resistance, toughness, creep and corrosion resistance and fluidity, resulting from our invention, it is particularly applicable to the manufactureof tin,

tubing, pipes, collapsible tubes, coils and tin plate.

We have found that the addition of relatively small and minute amounts of tellurium to tin metal, either in its pure or several available commercial forms, substantially increases the fatigue resistance and fatigue limit of the metal, in some cases as high as 300%. The amount of tellurium added to the tin metal may range from '.0l% to 3%. Addition of such amount of tellurium to. tin metal also increases the resistance to corrosion, creep resistance and toughness. The improvement in these latter, properties and characteristics is particularly desirable where the tin metal is used for tin pipe, tubing and tin plate.

Pure tin of course theoretically is composed of 100% pure tin metal. But the tin metal available on the market in commercial form contains small amounts of such inclusions and impurities such as lead, arsenic, antimony, copper, bismuthand iron. The amount of pure tin present in such commercially available form will vary from 4 to slightly less than depending upon its I ness as compared to source and degree of reflnement.- The addition or alldying of up to 3%. of tellurium to tin metal also results in marked increase in the fluidity of the metal during melting and pouring. Such improvement in fluidity is of particular advantage 5 in the manufacture of tin plate and in the extrusion-of tin pipes and tubing. The increased I fluidity of the alloy embodying the principle of our invention produces a better coating of tin plate on a base metal due to the fact that better 1 coverage and distribution of the tin alloy are obtained. The increased fluidity of our tin metal alloy permits the more rapid escape of entrapped and occluded gases and flotation particles, during the molten state, and therefore results in decreasing the porosity and occlusion in the metal in its solidified state.

Selenium may be substituted for tellurium as an equivalent element in the alloy embodying the principle of our invention. The resultant properties and characteristics of the tin: alloy in which selenium has beensubstituted for tellurium will be substantially the same as those hereinabove described. Other modes of applying the principle of our invention may be employed instead of the one explained, change being made as regards the materials employed, provided the ingredients stated by any of the following claims or the equivalent of such stated ingredients, be employed.

We therefore particularly point'out' and disa tinctly claim as our inventiom- An alloy containing from .0l% to 3% of tellurium and the remainder tin, said alloy being characterized by increased resistance to corrosion, increased creep resistance, and increased toughthe corresponding properties oftinalone.


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Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US2692836 *Jun 14, 1951Oct 26, 1954Libbey Owens Ford Glass CoMethod of increasing the electrical conductivity of tin oxide films
US4357162 *Dec 8, 1980Nov 2, 1982Motorola, Inc.Solder composition
US5102748 *Sep 19, 1991Apr 7, 1992Taracorp, Inc.Non-leaded solders
US8491774 *Dec 19, 2005Jul 23, 2013Rohm And Haas Electronic Materials LlcWhisker free tin plated layer
US20060090819 *Dec 19, 2005May 4, 2006Shipley Company, L.L.C.Tin plating method
U.S. Classification420/557
International ClassificationC22C13/00
Cooperative ClassificationC22C13/00
European ClassificationC22C13/00