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Publication numberUS2451295 A
Publication typeGrant
Publication dateOct 12, 1948
Filing dateNov 8, 1944
Priority dateNov 8, 1944
Publication numberUS 2451295 A, US 2451295A, US-A-2451295, US2451295 A, US2451295A
InventorsFantozzi Vincent J, Metzger Leopold H
Original AssigneeSuper Cut
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Abrasive wheel
US 2451295 A
Abstract  available in
Images(1)
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Claims  available in
Description  (OCR text may contain errors)

Oct. l2, 1948. L. H. Ml-:TzGER ETAL l2,451,295

ABRAsIvE WHEEL Patented ct. 12, l 1948 ABRASIVE WHEEL Leopold H. Metzger and Vincent J. Fantozzi, Chicago, Ill., assignors, by mesne assignments, to Super-Cut, Inc., Chicago, Ill., a corporation of Illinois Application November 8, 1944, Serial No. 562,435

1 Claim. 1`

The present invention relates generally to diamond abrasive wheels. More particularly the invention relates to that type of abrasive wheel which is primarily adapted to grind the tips of cutting tools, embodies means whereby it may be attached to one end of a power driven shaft and in addition embodies on one side thereof an annular band consisting of diamond particles and a matrix for the particles.

In grinding a cutting tool of the variety that embodies a tip of tungsten carbide or like material it has heretofore been standard practice first to rough grind the tip by a silicon carbide abrasive wheel, then to grind the tip to a finished dimension by an abrasive wheel having diamonds of coarse mesh and finally to provide the tip with a final or so-called mirror finish by way of an abrasive wheel having diamonds of fine mesh. In carrying out this practice it is necessary either to mount two of the abrasive wheels on the ends of one power driven shaft and to mount the third wheel on the end of a second power driven shaft or to mount one of the wheels on one end of a power driven shaft and then successively to mount the other wheels on the other end of the shaft. If two power driven shafts are employed the equipment for grinding the tip of the cutting tool is expensive and time is consumed in moving the tool from one of the wheels on one of the shafts to the wheel on the second shaft. If but a single power driven shaft is utilized time is consumed in removing one of the abrasive wheels from the shaft and attaching the third wheel and hence the labor that is involved is essentially costly.

One object of the invention is to simplify the labor and reduce the cost of grinding the tips of cutting tools as heretofore practiced. This object is attained by providing an abrasive wheel having on the outer side thereof an outer annular band with diamond particles of coarse mesh and a concentric inner annular band with diamond particles of a fine mesh. By employing a single wheel having bands with diamonds of different mesh a single power driven shaft only need be employed and it is unnecessary to move or relocate the tool in connection with grinding the tip to a finished dimension and providing the tip with a final or mirror finish.

Another object of the invention is to provide a diamond abrasive wheel of the last mentioned character in which the cutting faces of the two diamond carrying bands are arranged so that they are not in the same plane and hence in connection with use of the inner band to provide a nal or mirror finish on the tip of the tool being ground there is substantially no likelihood of the tip being inadvertently brought into contact with the outer annular band having diamond particles of coarse mesh.

A further object of the invention is to provide an abrasive wheel of the type and'character last mentioned in which the inner annular band with diamond particles of fine mesh is spaced from the outer annular band with diamond particles of coarse mesh in order further to eliminate the possibility of the tool tip being moved into contact with the outer band while it is being given its final or mirror polish by the inner band.

A still further object of the invention is to provide a diamond abrasive wheel which is generally of new and improved construction, serves the purpose of two wheels and is characterized by high efficiency and comparatively low cost. Other objects of the invention and the Various advantages and characteristics of the present diamond abrasive wheel will be apparent from a consideration of the following detailed description.

The invention consists in the several novel features which are hereinafter set forth and are more particularly defined by the claim at the conclusion hereof.

In the drawing which accompanies and forms a part of this specification or disclosure and in which like letters and numerals of reference denote corresponding parts throughout the several views:

Figure l is an outer side view of a diamond abrasive wheel embodying the invention; and

Figure 2 is a section taken on the line 2-2 of Figure 1 and illustrating in detail the arrangement and design of the outer and inner annular diamond carrying bands,

The abrasive wheel which is shown in the drawing constitutes the preferred form or embodiment of the invention. It is adapted for use in grinding tips of cutting tools and is shown in the drawing as being mounted on one end of a horizontally extending power driven shaft s. As its component parts the wheel comprises a circular or disclike rigid body 3, an outer annular. band 4 and an inner annular band 5.

The body 3 is formed of any suitable material such, for example, as bronze or brass and has in the center thereof a circular hole 6 in which said one end of the shaft s fits. The shaft is provided inwards of said one end with a fixed collar s1 having at its outer end an annular outwardly extending flange s2. The inner side of the body is flat and fits flatly against the flange s2 of the co1- matrix. If desired the diamond Yparticles in the;

band 4 may have a mesh of approximately `100. The matrix of the outer annular band is preferably an alloy but it may be resin or any other type of bonding material. The outer band vis adapted to be used to grind the tips of cutting tools to a finished dimension after they have been rough ground by a silicon carbide or other.

abrasive wheel on the other end of the shaft s. In utilizing the band for tip grinding purposes the tip of the cutting tool to be ground is placed against the outer side surface of the band awhile the wheel is being rotated in responseto drive of the shaft s. The outer side face of the outer annular band d is frusto-conical andextends at an angle of approximately 7 with respect to a plane at right angles to the axis of the-wheel. The band il is of uniform thicknessthroughout. The surface of the wheel 3 that dei-lues the bottom of the groove l is in parallel relation with the outer side face of the band li; as shown in Figure 2.v

The inner annular band is positioned in concentric relation with the outer annular bandv i and is ixedly mounted in an annular groove Il in the front or outer side of the body 3 of. lthe wheel. It consists ofdiamond particles off fine mesh together with a matrix and is adapted to be used to provide a nal or mirror nish to the tips of cutting tools after they have been ground, to a nished dimension by way of the outer annular band Il. If desired the diamond particles in thel band .5- may have a mesh of approximately 400'; The vmatrix of the band 5 is preferably the same` as that of the outer band It. posed inwards of the groove liland is separated from the latter by a circular rib I2. In utilizing the inner band 5'the tips of the cutting tools to be ground are placed against the outer side -surface'of said band while the wheel is being rotated inA response to drive of the shaft s. The outer side face of the inner annular band Eris; fiat and extends at truly right angles to the axis oftheA Wheel body 3. As shown in Figure 2, the inner edge of the outer annular'band #l andthe outer side face of the inner band are coplanar. The band 5 is of uniform thickness throughout and'is ixedly retained within the groove as a result of` the matrix thereof being bonded to the portion ofv the Wheel body that denes the annular groove il. The fine mesh diamond particles are-pro vided in the inner annular bandY 5 inasmuch asv such particles will produce-the desired final or mirror nish without the necessity of beingvrotated at a surface speed as great asthat of.y the coarse mesh diamond particles.

The groove l l is .disf- In utilizing the wheel for grinding the tip of a cutting tool the tip of the tool, after being rough ground by way of a silicon carbide grinding wheel at the other end of the shaft s, is placed against the outer side face of the outer annular band 4 while the Wheel is being driven by the shaft. The tip of the toolis-held'inplacevagainstjfthe outer band until' it is ground to a nisheda: dimension. After the tip of the tool is ground by the outer band 4 it is placedY against the outer side face 0f the inner band 5 in order to provide it with a final orv mirror nish. By reason of the fact that the outer side face of the outer band is not in the sameplane as the outer side face of the inner band and the ltwo bands are separated by the .f circular rib l2 there is no likelihood of the tip Y of. the tool being ground by the inner band being brought into engagement with the outer band.

The herein described abrasive wheel serves the purpose of two wheels by reason of the fact that it; includesthe outer-handhaving diamondsof coarse mesh and Vthefinner band havingdiamonds of ne mesh. It is highly eflicient and maybe produced.' ata.- low' cost.

The invention is not to be restricted tothe details set forth since thesemaybe. modified within the scopexof the. appended claimrwithoutl departingfrom the spiritandVK scope of the invention. Y Havingthus described the invention, what-we claim; as vnew and desirev to.- secureI byLetters Patent is: y

Asa new articlev offmanufacture, an abrasive wheel adapted to-grind the tips. ofcutting tools andcomprising a-rigiddisc-like body adapted for connection to apower drivenshaft, an outer an nular band mounted xedly on one Vside face of the bodyandy havingfdiamondfparticles of. certain mesh;andvan1inner annular bandrnounted xedly. on said one side face of thebody and-having diamond particles of different mesh,.th'e outerv side, face of one `ofthe twozbands being frustoeconical and disposed at anY acute'angle tothe outer. side faceof the other band, andgthelouter: edge of the outerside face of the inner band being spaced inwards a smallsdis-tance from theinnen edgeof the outer sidefacey of the-outer band-1.

LEOPOLD H. METZGE'R. VINCENlI-f J. FAN'IOZZI.

REFERENCES CITED ThefolloW-ing references areof record" in the.

nie of this patent.:

UNITED STATES, PATENTS Germany June 12, .1998

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US2137201 *Jun 28, 1937Nov 15, 1938Carborundum CoAbrasive article and its manufacture
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Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US2600815 *Apr 20, 1949Jun 17, 1952Eastman Kodak CoApparatus for rough and fine grinding of spherical surfaces
US2764543 *Sep 20, 1952Sep 25, 1956Norton CoElectrolytic grinding apparatus
US3255555 *Dec 24, 1963Jun 14, 1966Albert A HeymanApparatus for forming surfaces of optical elements
US3426486 *Nov 16, 1964Feb 11, 1969Landis Tool CoAbrasive disc
US3471975 *Jan 12, 1967Oct 14, 1969Engelhard Hanovia IncSurfacing wheel
US3805456 *Aug 17, 1971Apr 23, 1974Ces Grinding Machines LtdGrinding machine
US4986035 *Mar 3, 1989Jan 22, 1991Diamant Boart Societe AnonymeGrinding wheel for the smoothing and polishing of glasses
US5399116 *Aug 27, 1993Mar 21, 1995Kennametal Inc.Grinding wheel assembly for grinding and sizing an elastomeric belt
US5529528 *Aug 26, 1994Jun 25, 1996Vaporless Manufacturing, Inc.Saw blade with sanding surface
US5704828 *Apr 2, 1996Jan 6, 1998Vaporless Manufacturing, Inc.Saw blade with sanding surface
US5842910 *Mar 10, 1997Dec 1, 1998International Business Machines CorporationOff-center grooved polish pad for CMP
US5944583 *Mar 17, 1997Aug 31, 1999International Business Machines CorporationFor polishing a semiconductor wafer
US5989114 *Oct 21, 1997Nov 23, 1999Unova Ip Corp.Composite grinding and buffing disc with flexible rim
US6062958 *Apr 4, 1997May 16, 2000Micron Technology, Inc.Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
US6213856 *Apr 19, 1999Apr 10, 2001Samsung Electronics Co., Ltd.Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
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US6494927Feb 6, 2001Dec 17, 2002Samsung Electronics Co., Ltd.Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
US6596087Feb 6, 2001Jul 22, 2003Samsung Electronics Co., Ltd.Method of cleaning conditioning disk
US6740169Jun 4, 2003May 25, 2004Samsung Electronics Co., Ltd.Immersing the conditioning disk which has been used in a cmp process in sulfuric acid in order to dissolve adhesive film and remove abrasive grains; new adhesive layers and abrasive grains are then applied
US7004823 *Apr 30, 2001Feb 28, 2006Struers A/SMulti-zone grinding and/or polishing sheet
US20110189927 *Jan 31, 2011Aug 4, 2011Ronald LipsonComposite pads for buffing and polishing painted vehicle body surfaces and other applications
US20110275288 *Feb 24, 2011Nov 10, 2011Chien-Min SungCmp pad dressers with hybridized conditioning and related methods
EP0115329A2 *Jan 25, 1984Aug 8, 1984Vollmer Werke Maschinenfabrik GmbHSaw teeth grinding machine
Classifications
U.S. Classification451/548, 451/461, D15/138, D15/126
International ClassificationB24D7/00, B24D7/14
Cooperative ClassificationB24D7/14
European ClassificationB24D7/14