Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUS2474988 A
Publication typeGrant
Publication dateJul 5, 1949
Filing dateAug 16, 1944
Priority dateAug 30, 1943
Publication numberUS 2474988 A, US 2474988A, US-A-2474988, US2474988 A, US2474988A
InventorsSargrove John Adolph
Original AssigneeSargrove John Adolph
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Method of manufacturing electrical network circuits
US 2474988 A
Abstract  available in
Images(14)
Previous page
Next page
Claims  available in
Description  (OCR text may contain errors)

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS Filed Aug. 16

14 Sheets-Sheet l F/GJ.

J.. A. sARGRovE 474,988

NETHCD oF MANUFACTURING ELECTRICAL NETwoEx CIRCUITS July 5, 1949.

14 Sheets-Sheet 2 Filed Aug. 1G, 1944 Hor/1c ys.

July 5, 1949. J. A. sARGRovE 2,474,988

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS Filed Aug. 16, 1944.

14 Sheets-Sheet 5 .July 5, 1949. J. A. sARGRovE METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS 1'4 sheets-sheet 4 Filed Aug. 16, 1944 Al 'neyx July 5, 1949. J. A. sARGRovE 2,474,988

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS Filed Aug. 16, 1944 14 Sheets-Sheet 5 July 5, 1949. J. A. sARGRovE 2,474,988

METHOD oF MANUFACTURING ELECTRICAL NETwoRx CIRCUITS Filed Aug. 16, 1944 14 sheets-sheet 6 G 9 /Iymlmy H)- j j @me 1g/wu,

Olney;

July 5, 1949. J. A. sARGRovE 2,474,988

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS Filed Aug. 1'6, 1944 14 sheets-sheet v .July 5, 1949. J. A. sARGRovE METHOD 0F MANUFACTURING ELECTRICAL NETWORK CIRCUITS 14 Sheets-Sheet 8 Filed Aug. 16

rneyJ.

July v5, 1949. J. A. sARGRovE 2,474,988

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS July 5, 1949. J. A. sARGRovE 2,474,988

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS Filed Aug. 16, 1944 14 Sheets-Sheet 10 F/G23A.,

A HurneyJ.

July 5, 1949. .1. A. sARGRovE 2,474,988

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS 14 Sheets-Sheet 11 F/GBOB.

y m. F

A Harney;

July 5, 1949. J. A. SARGROVE 2,474,988

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS Filed Aug. 16, 1944 14 Sheets-Sheet l2 F/G33A.

A Ilorneys,

July 5, 1949. J. A. sARGRovE 2,474,988

METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS Filed Aug. 16. 1944 14 sheets-Sheet 15 6 la. 6 M a m k 4J 4 fwn n. 0% 2 5 3 l u 8 G v 1 2 2 F 2 -2 9 3 G 2 O F n .n )l k H L Y l@ MW K F 8 .d w 4 mu July 5, 1949.

J. A. SARGROVE METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS Filed Aug. 16. 1944 14 Sheets-Sheet 14 2/0 ZImwnmr;

Patented July 5, 1949 METHOD OF MANUFACTURING ELECTRICAL NETWORK CIRCUITS John Adolph Sargrove,

Shepperton-on-Thames, land Application August 16, 1944, Serial No. 549,770 In Great Britain August 30, 1943 Claims. (Cl. Ztl-155.5)

The invention relates to electrical apparatus and in particular to apparatus or instruments such as are used in -connection with telegraphic, telephonie, television reception and transmission and the like, in which a circuit system has to be arranged consisting of interrelated components such as resistive, capacitative and inductive circuit elements as well as ampliiier and reprodueing means such as valves, cathode-ray tubes, loudspeakers, and the like.

The invention is Ialso applicable to other electrical apparatus such as low current switch and instrument boards and the like.

The principal object of the invention is to provide an improved. and more economical method of manufacture.

The normal method of manufacturing electrical apparatus such, for example, as a radio receiver-for which my invention is specially applicable-is to mount the various individually made component elements on a supporting base or chassis-as it is usually calledand then connect them up in their proper mechanical relation by means of conductor wires soldered to the terminals of the various components.

It has, however, been suggested to provide insulating panels with conductor paths by electrodeposition, the conductor paths leading to, and being connected to. sockets into which specially made components such as transformers, condensers, resistors and the like provided with contact pins could be plugged in.

This proposal has not to my knowledge ever beencarried out in practice.

The present invention, which has already been carried out by me experimentally, differs from these prior proposals in that accordingl to my invention not only are Ithe conductor paths applied directly to the panel or chassis but components themselves of correct predetermined electrical values are applied to the panel or chassis and interrelated together with their conductor connections. It will, of course, be understood that such components as valves and loud speakers cannot be applied in this way but both the breadth and limitations of the'method comprising the invention will be made clear hereinafter, when the practical application of the invention to the construction of a radio receiving instrument is fully described. The invention can, however, be broadly stated as consisting of a method of manufacturing electrical apparatus consisting of interrelated component elements connected in circuit according to which electrical components or parts thereof of predetermined electrical `values and the conducting paths connecting the components in circuit are applied to and form integral parts of an insulating supporting panel.

It is to be noted that the term panel used herein is not to be regarded as limiting to flat constructions as the invention can be applied to curved surfaces and in particular to the walls of cabinets containing parts of the apparatus as will hereafter appear.

Moreover, the term insulating is not to be taken as implying that the panel is wholly of insulating material as in some cases conductive material may be incorporated in the body of the panel.

In order that the invention may be readily understood and'carried into practice reference is made to the accompanying diagrammatic drawings throughout which similar letters and numerals of reference are used for corresponding parts wherever occurring.

1n these drawings:

Figure 1 is a fragmentary plan view of a part of f a panel or chassis showing interrelated components and circuit elements or connections applied thereto in accordance with the general principles of the invention; and Figure 2 is a cross section thereof on the line X-X of Figure 1.

These two figures are solely for the purpose of a general description of the invention.

Figures 3 to 22 are for the purpose of explaining the manufacture of a complete two-valve radio receiver;

Figure 3 being a perspective view of one side of a panel moulded from insulating material upon which a two-valve all mains amplier is to -be built up in accordance with the invention;

Figure 4 is the same side of this panel after the grooves and indentations thereon have been i'llled with conducting material;

Figure 5 is the circuit diagram of the complete ampliiier but so drawn that only those parts in existence at the stage of production represented by -Figure 4 are shown in full lines. (The full thick lines showing the parts visible in Figure 4 whilst the fulldouble thin lines show the parts on the invisible side in Figure 4. The dotted lines are parts not yet present) Figure 6 shows the same side of this panel after resistors have been deposited, whilst Figure 7 shows the other side of this panel at -this stage of production;

Figure 8 is again the same circuit as Figure 5, but with many more parts shown in full lines, and represents the stage of production arrived at in Figures 6 and 7;

aavgoaa Figure 9 is the same as Figure 7, except that the eyelets, sockets and the like have been applied;

Figure 10 is the same as Figures 7 and 9 but with parts which cannot be made by this process such as valves, loud speakers and electrolytic condensers plugged into placecompleting the amplifier; g

Figure 11 is the circuit diagram (similar to Figures and 8) of the complete amplifier shown in Figure Y Figures 12 and 13 are perspective views of both sides of another moulded panel adapted to become the regenerative tuned circuit and associated aerial feed circuit of a radio receiver when it is combined with the Figure ,11 amplifier. (The panels shown in Figures 12 and'xl''have the same stage of the method of production as shown in Fig. 4)

Figure 14 shows the circuit of the above two figures; -1

Figure 15 is a fragmentary view of the panel in Figure 13 but afterrthe resistors have been depos- Figure 16 is the same panel with sockets, springs, variable condenser plates, assembly studs and the like inserted;

Figure 17 is the completed circuit of this panel shown in Figure 16;

Figure 18 shows a complete all mains (110 volt) broadcast receiver made in accordance with the invention by the continuation of the completed panels shown in Figure 10 and Figure 16:

Figure 19 is a view in perspective showing the interior of a moulded cabinet adapted to house the apparatus depicted in Figure 18 which has been processed in accordance with the inventions enabling the above broadcast receiver to function at various voltages up to 250 volts (it also shows part of the external mains connection attached thereto) Figure 20A is a fragmentary view of the underside of the cabinet (Figure 19) showing a tapping link provided to cut out various parts of the series resistor deposited inside the cabinet and thus adapt the broadcast receiver to the desired mains supply voltage;

Figure 20B depicts a similar fragmentary bottom view of an alternative cabinet arranged to have a mains switch included, which can be operated from the front of the receiver (shown here on top) Figure 20C is the inside fragmentary view of .e-:uch a cabinet showing two deposited conductor circuits both of which are adapted to be switched on or oi by the insertion of two metallic springs into lugs and a moulding insert;

Figures 20D, 20E and 20F show diagrammatically the action of such a switch in co-operation with the deposited conductors (shown black);

Figure 21 shows the circuit diagram of the electrical parts of such a cabinet made in accordance with the invention;

Figure 22 is the complete circuit of such a regional broadcast receiver made by the combinations of three basic parts, made in accordance with the invention shown in full black lines (the vertical dot-dash lines showing the conjointing place) which, with the iive parts (otherwise made) shown in dotted lines form the complete radio receiver (made up of the parts shown by Figures 11, 17 and 21);

Figure 23A shows in a plan view a method of designing part of a supersonic-heterodyne receiver.' the circuit diagram 0f this ment lle- 4 ing shown in Figure 23B. Figure 23A also shows a method of reducing leakage between adjacent deposits;

Figure 23C is a cross section of the above, showing also one method of transconnecting the circuit portions on either side of a panel with each other;

Figure 24 shows some of the alternative methods also in cross section:

Figure 25 is a cross sectional view of an example of reversing the sequence of production operations from first metallising and then graphitizing to the opposite;

Figure 26 shows a method of increasing the inductance of the coil in Figure 23C by making the Vplastic moulded 'panel from a substance having a'high permeability such as powdered iron core material; it also shows a manner in which the dielectric of a condenser from the same material can be improved;

Figure 27 shows an alternative to the previous one showing the powdered iron core material.

moulded into the normal panel, which has a keyed cavity preformed to takeit (theinterrelated metal deposits being applied in the normal manner into the communicating grooves) Figure 28 shows another alternative to the separation-of conducting and insulating parts of the panel, in this case the metal is deposited on to raised lportions as in the block printing technique, the deep lying part remaining unmetallised;

Figure 29A is a plan view of a further fragment of such a receiver and shows a method of designing a capacity coupled band pass illter with associated parts diagrammatically shown in Figure 29B, all of which are interrelated.

Figure 30A shows a plan view of an inductively coupled band pass circuit and associated parts, the circuit diagram of which is shown in Figure 30B;

Figure 31 shows in a cross sectional view an alternative method of coupling two inductors made in accordance with the invention;

Figure 32 is a cross sectional view of inductive elements, so produced and arranged as to enable the inductances to be varied, within small limits;

Figure 33A shows an example of a short wave band spread oscillator in a fragmentary plan view, part of the circuit diagram of which is shown in Figure 33B, which is adapted to operate on many wave bands;

Figure 34A shows a perspective view of a moulding made in accordance with the invention, adapted to form the rotor member of a double variable condenser;

Figure 34B shows a cross section of same;

Figure 34C shows in cross section a similar moulding with powdered iron core material moulded into the cavities for varying the inductance of two coils;

Figure 35A shows a perspective view of a moulding adapted to be the rotor of a variable condenser;

Figure 35B is a cross section of same;

Figure 36 shows a cross section of a moulded disc, one side of which is adapted for increasing the inductance oi' a coil and the other side for reducing it;

Figure 37A shows in fragmentary perspective view a method of increasing the inductivity of deposited coils by the insertion of conventional shaped powdered iron cores;

Figure 37B is a cross section of same;

Figure 37C is the plan view of an improved shape otpowderediron core for this purpose;

Figure 38 is a fragmentary plan view of a method of providing intimate coupling between the inductors ;v

Figure 39 is a perspective illustration of a method of assembling several plates made in accordance with the invention and by interrelating them with valves, cathode ray tubes, transformers and the like providing an economical method of manufacturing devices, such as oscilloscopes and television receivers;

Figure 40A shows a perspective view of a method of plugging a sub-panel made in accordance with the invention into another part of an electrical apparatus which may or may not necessarily be produced by the same method;

Figure 40B is a plan view of such a sub-panel; and

Figure 40C is a diagrammatic circuit of same;

Figure 41 is a fragmentary plan view of an alternative method of making connections to a valve from a deposited conductor network avoiding the need of sockets;

Figure 42 is a fragmentary plan view of a method, particularly suited for use with an electron-multiplier tube of making a resistance network and the conductor and tube contact parts in a very simple interrelated manner. The resistance material in this case can be squeezed into prepared keyed grooves in the moulding proccss akin to that depicted in Figure 27 for powdered iron core material.

Referring first to Figures 1 and 2, the panel a of insulating material has upon both side surfaces indentations of different depths such as b which when partly lled with metal (shown black and indicated by the reference m in Fig. 2) form one pole, or plate, of a condenser; and grooves, such as c filled with metal forming a conducting path or connection which under orthodox methods of manufacture would be a wire soldered at both ends` The hole d for fixing this panel mechanically to some other part of the apparatus e. g. the cabinet is surrounded by a circular groove filled with metal e1 which is interrelated with grooves similarly filled with metal such as e2, e and e3.

A typical interconnection from conductor paths e, e1, e2 and e3 on one side of the panel a to conductor paths on the other side such as f, is shown between metal deposit e2 with metal deposit f located on the nether side of the panel, the interconnection being provided in this case by an eyelet h pressedand riveted into a suitable hole.

Other conductor paths on the other side of the panel are groove i connecting point f and some other element not shown and shallow indentation g which lies directly opposite the above referred to deeper indentation b.

nation lobes at the ends of the deposited metal conducting paths. This is an operation easily mechanised and avoids the use of and consequent need for wiring up a separate valve holder.

Coil lis a high frequency choke coil the outside turn of which is directly interrelated with the conducting path e2, e3. The inside end communicates by way of an eyelet'connection with an enlarged 'lobe of conductingpath c and g in the other side of the panel a.

In a similar form to the interrelated deposited metal configurations on the main body of panel a, associated metal deposits can be arranged on a v movable circular panel inserted into a clearance hole such as the switch rotor disc o. In this case the deposit n forms a movable metallic link -between the switch contacts such as p which can be arranged around o at any convenient position.

It will be seen that the stationary switch contact blades, such as p are eyeleted right into the enlarged termination lobes of the deposited metal conducting paths. This is another operation easily mechanised and avoids the laborious switch wiring operation and also circumvents the need for careful inspection after wiring which is nor- 4 mally required to avoid wrong connections.

To ensure better contact for the switch the link deposit n can be reproduced on both sides of the rotor disc o and the stator contacts such as p can also be duplicated on both sides.

Having shown, by way of example, a wide rangeA of circuit components and conducting paths that can all be conveniently deposited of one kind of conducting material such as metal of high conductivity, e. g. copper, other circuit elements such as resistors can be, produced in situ such as r1 (shown with slant shading in both figures) by depositing, for instance, graphite` on to the surface of panel a in the space between the metal de-` Provided the specific density and thickness of the resultant deposit of graphite or other resistive material is accurately controlled the various resistance values required can be obtained by merely varying the aspect shape of the resistor deposit.

The latter two metallised indentations (y and b) form a fixed condenser the dielectric of which is of the same moulded plastic substance as a and is preformed at the same time as the whole panel, a thin web w (Fig. 2) being produced in the mould.

The preceding shows a typical case of a fixed condenser formed in situ already for use, completely interconnected to the circuit network and requiring no prefabrication and manual assembling, wiring and soldering operations to connect it into the circuit.

At y a hole is shown with the well known key way. This serves to locate a thermionic valve into the surrounding valve pin contact sockets such as lc. It will be seen that these valve pin contacts are eyeleted right into enlarged termi- (=100 milliwatts).

As an example, using a certain colloidal dispersion of graphite in a suitable slightly glutinous medium (such as gelatine) and deposited to a controlled thickness of say 1/20 millimetre one obtains a specific coating resistivity of 25 ohms per square millimetre area when measured from one edge to the parallel edge opposite. This small area is capable of continuously dissipating one milliwatt of energy in the form of heat without rising above a safe working temperature. A wide range of resistor values can be obtained by simply varying the shape and size of the deposit. A few instances will serve to illustrate this. A deposit area one mm. wide and mm. long lwill give in the above case a resistor of 2500 ohms. This will be able safely to dissipate le of a Watt Again a deposit 10 mm. wide and 10 mm. long will have a value of 25 ohms and dissipate 116 watt; another deposit 0.2 mm. wide and 100 mm. long would have a value ot 12.500 ohms at l/o watt; whereas a deposit 25 mm. wide and 40 mm. long would be 40 ohms at one watt.

Similarly other ranges of values can be obtained with similar shapes by varying the con` trolled thickness of deposit (i. e. varying the spraying time) or by changing the density of the deposit (i. e. by varying the dispersion of graphite in the medium) In large scale production several pistons can be used depositing various dispersions of graphite in sequence in each case a different stencil arrangement being employed so that the required sprayed deposit goes to the required place in the circuit.

In practice, one can easily obtain a range of values from 1 ohm to l0 megohms with three dit- Ierent dispersions. Wattages in the lower ohmic values can be up to 10 to 20 watts. This range of values is ample for radio receiver practice. It may be considered a disadvantage of this method that the higher wattage values ot resistors occupy more surface space than is the case with the prefabricated solid stick-like resistors. This is not necessarily a disadvantage as the heating up and continuous heat dissipation of these resistors is much more uniform and the reliability, constancy and endurance of resistors made in accordance with the invention is very high. It should be noted that the larger wattage resistors are according to this invention conveniently sprayed onto the surfaces of the cabinet walls, spreading out the heat radiating elements.

It should be noted that in these proposals the contacts to the two ends of the resistors is obtained without a separate operation by depositing the resistor right into its intended place in the circuit so that it overlaps the previously, or subsequently, deposited metal conductor path deposit over a suilicient area to achieve good contact. It is preferable so to shape the larger wattage resistors that the graphite deposit is widened near the contacts so that the temperature gradient at the vline of contact between hot graphite and cold metal is not too sudden.

To enable a very long and narrow resistor to occupy a relatively small surface area it can be conveniently deposited in a meander or zig-zag form. Such a resistor is shown at r4 (Fig. 1).

It is further convenient, in order to allow for 5 has only three turns and thus has only a very small inductance value coils of this construction can be made with many more turns of narrower surface width and closer spacing and also a total greater surface space area.

Obviously the maximum value of inductance that can thus be obtained has an upper limit which is lower than the conventional wire coils. Several methods of raising the maximum inductance value of coils made in accordance with the present proposals are shown in Figures 23 to 38 and will be more fully described hereafter. In general the kinds of inductances required for radio-frequency work of the order of approximately 1/2 megacycle to 100 megacycles can be arrived at by this means. Further, with certain modification of the described process involving the deposition of metal by known photo-chemical means either directly onto the main panel or onto a iilm and aillxing same. including photographically deposited interrelated conductor paths and condenser plates and the like, by a suitable adhesive, the connections being made between the nlm and the main panel where required by the circuit by means of eyelets or the like, greatly increased range of inductance values are obtainable.

There are certain limits to the values of condensers that can be formed in the manner shown in Figs. 1 and 2, and if larger capacitance values are required Athere can be obtained in accordance with these proposals as follows: The condenser can be produced in situ by depositing tlrst two metallic contacts one of which is as large as a condenser plate. This is sprayed over with a lacquer oi high dielectric coemcient, except the narrower metal contact and a narrow edge oi the luier plate, both o! which are masked. A iurthermnkisnowmedhavingalargecutout andenablingmetdtobesprayedthroughitso that it makes contact with the metal conductor of narrow dimensions. This toi-ms the second -plate ot the condenser. Now again lacquer is sprayed on with the same stencil as was used ior lacquer before. Then metal is again applied through the nrst metal spraying stencil; and so on until a stack is sprayed in which every alternate metal layer forms one pole of the condenser and vice versa. Of course three or more pole condensers can be similarly produced. Moreover, many condensers in many parts of the circuit can be similarly and simultaneously made in this multiplate form and also other interrelated parts or conductor paths can be sprayed on top of lacquer allowing ior instance a conductor path in between lacquer layers to cross over other conductor paths on the main panel as in between other lacquer layers.

A further alternative proposal of producing such interrelated condensers oi higher capacitance value is to make the whole main panel from a material of very high dielectric coemcient for instance by using a plastic illler of a substance with such a high dielectric constant, or by inserting a thin layer of such a substance with a roughened or etched surface into the mould so as to form the thin web w indicated in Fig. 2 when the plastic moulding is completed.

A further alternative is to make a sub-panel of a substance having a high dielectric constant on which part of the interrelated conductor paths and the high value condensers are deposited and this sub-panel is connected into the main circuit by eyelets and the like providing also the electrical connections between the circuits on the two panels. In general terms the upper limit of capacitance values that can be conveniently produced by these means lie in the region of 1000 micro-microfarads, using Bakelite panel material and up to 30,000 micro-microfarads (0.03 microfarad) with special materials such as suitable ceramic.

To obtain the greatest production economy the circuit design should preferably avoid the larger values of inductances and capacitances. (In many cases the required time constants of a part of a circuit can be obtained with smaller values of reactive components if the corresponding resistive component is increased.)

When larger reactive components are indispensable (such as electrolytic smoothing condensers) these can be preiabricated with plug shaped outlets and plugged into suitable sockets inserted into emerged lobes of the interrelated deposited metal circuit on the niain panel a.

Having explained the general principles of the.

invention reference is now made to Figs. 3-22 which illustrate the method oi production of a complete A. C./D. C. all mains 2 valve broadcast radio receiver, the complete circuit oi which is shown in Fig. 22.

Figure 3 is. as'before indicated, an isometric perspective view oi one side of a moulded plastic panel I of insulating material prior to deposition of any other materials. The arrow which appears on the narrow edge of the panel on this and several subsequent iigures serves to show which side of the panel is viewed and should be imagined as permanently inscribed on the panel.

Figure 4 shows the same side (see arrow) oi' the panel at a later stage in the production process after the moulding has been metallised all over in accordance with the invention by spraying the metal on from a pistol and thereafter face grinding the whole surface down with an abrasive in any known manner e. g. by a surface grinder so that only metal deposited in the grooves, holes and indentations remains on the panel.

Figure 5 shows diagrammatically the circuit scheme which this panel will ultimately carry.l It will be noted that this is the same electrically as the portion between the vertical dot-dash lines of completed receiver Fig. 22. However an unconventional mode of showing the circuit has been adopted in Fig. 5 (also in Fig. 8 and Fig. 14) to 4show the progress of the production sequence. In these three figures which all represent the identical circuit all those parts not yet present on the panel shown in the preceding iigure are shown with very thin dotted lines. These circuit components and conductor paths on top, i. e. visible, iny Figs. 3, 4 and 6 are shown with full black lines, Whilst those on the nether side in these gures but on top in Fig. '7 are shown as white lines, i. e. are thin double contour lines. The arrows in Fig. 6 and Fig. 7 serve to indicate which way up the panel is shown on the various figures.

Deep indentations 2a, 3a, la and 5a in the moulded panel i in Figs. 3 and 4 are intended after metallisation to form the top plates of each of the condensers shown with the same number in the circuit diagram, Fig. 5. To distinguish these deep indentations from through holes the shadow cast bythe walls of the indentations is shown on the webs of moulded plastic material at the bottoms of the indentations. These thin webs will form the dielectrict of these condensers. The reference characters from 6 to 30 on Fig. 3 are shallower indentations and grooves which will later serve as interconnecting conducting paths and termination lobes for sockets or eyelets. Their exact function will become clear to those versed in the art by comparison of Figs. 3 and 4 with Fig. 5. The number I which occurs several times in Figs. 3, 4, 6 and 7 relates to a large indeterminately shaped interconnecting metal deposit and its purpose is to act similarly to a grounding bus-bar of the metal chassis of a conventional receiver. It can be conveniently applied so that it is in continuous and intimate contact through the large round hole in the middle of the panel with another large interconnecting metal deposit on the other side of the panel. This is also marked 1 on Fig. 7. y

In most designs of a radio receiver it is good practice to make this element as all-embracing as possible and to be continuous with the grounded condenser plates as shown at 3a and 5a, in Fig. 4, andat lhinFlgs. 5. I anda.- A

f1'0 The various groups of smaller holes will be described later. The full' black and white lines in Figure 5 show how many separate assembly, fixing, wiring and soldering operations of the normal set making procedure have been eliminated by the simple and economical expedient of designing the panel moulding with recesses of the proper depth and coniiguration and comparatively more shallow grooves interconnecting the same, and by metallising this panel all over and grinding oir the surplus'metal from both sides so as to leave the metal only in the grooved and re- I cessed places.

Before explaining the parts in detail it will be noted that one of. the-reasons for the use of both sides of the panel is to allow the conductor paths to cross over each other, where required by the circuit. Another reason is to facilitate the arrangement of the fixed condensers in the circuit.

Figs. 6 and 7 show the application of the resistor elements. the resistors being shown as shaded areas; in this'instance one operation only is required for each side, the two sides being sprayed with a. diierent graphite dispersion, the specific resistance of the graphite deposit on the side oi the panel shown in Fig. 'I being approximately ten times higher than that shown in Fig. 6.

Viewing Fig. 8 and where necessary the preceding Figures. it will be seen that we have resistor 3i '(Fig. 6) of graphite deposited in a meander or zig-zag form between the lobes of metal conductors I9 and 20 to act as the anode load for the rst valve. Anothermeander form resistor 32 is inserted between conductors 20 and 23 to act as a. smoothing filter resistance. A straight narrow resistor with enlarged ends 33 is deposited between conductors 6 andll to act as a high-frequency stopper to assist regeneration in the aerial circuit which will be connected to point I8 (see Fig. 22).

A straight resistor 34 is deposited between conductor lobes 8 and 29 to act as a cathode-grid biasing resistance' for the second valve of the set.

A very small resistor 35 is deposited between the circular metal deposit 36, which will ultimately be the contact for holding one of the loudspeaker sockets 56 (see Figs. 9 and 10) and a similar circular metal deposit 31 which will ultimately be the contact holding the appropriate one of the valve socket eyelets 55. This resistor will act as an anti-parasitic oscillation anode stopper for the second valve. The very large resistor 38 is deposited between metal conductors i4 and l5, and acts as part of a heater-filament series resistance. This is a good example of a relatively large wattage resistor. Another large resistor 39 is deposited between metal conductors Il and [4 and acts as the other part oi the heater-filament series resistance.

It should be noted that the arrangement of splitting an electrical circuit componentin this case the heater-filament resistancehinto several separate parts,` either for the purpose of better utilisation of the available panel space or for any other purpose for instance spreading the heat radiating members to different regions of the panel or the cabinetv is easily'accomplished in accordance with this invention and furthermore this does not involve an increase in production costs. This constitutes a distinct advantage over more orthodox methods of production.

The resistor 40 deposited between metal conductors I0V and Il serves to limitthe charging surge current-ilowng 'out of the rectifier valve when-the receiveris-iirst switched on. for this purpose it has a comparatively large area and will stand very great overloads. Conductor ill also communicates with metal deposited condenser plate la, Figs. 4, and 6, which acts as a by-pass to grounding metal deposit 1 for parasitic high frequency oscillations generated by theA rectifier valve.

The meander form resistor 4i in Fig. 7 on the nether or under side of the panel (and consequently shown as double thin lines in Fig. 8) is deposited between the lobe 42 of the condenser plate 3b and conductor path 20 (Fig. 7) which transcommunicates by way of a small hole with conductor path 2li on the nether side (Fig. 6). This acts as a feed resistance for the screen grid of the first valve via the lobe I3 of the condenser formed by deposited plates 2a (Fig. 6) and 3b (Fig. 7), the latter acting as a high-frequency by-pass condenser for the same electrode. A very thin and long resistor M is deposited between the lobe 45 of the main grounding conductor deposit 1 and lobe I6 of the nether plate 2b of the audio-frequency coupling condenser composed of metal deposits 2a (Fig. 6) and 2b (Fig. 7). It will be noted that in the circuit shown in Fig. 8, the condenser plate 2b is in intimate direct contact with condenser plate 5b, the latter serving to produce a high-frequency by-pass for the control grid 'of the second valve. This direct intimate contact in this case is achieved as shown in Fig. '1 by making 2b and Ib into one individual peculiarly shaped metal deposit being in juxtaposition to the two separate deposits 2a and 5a on the former side of the plate (Fig. 6)

This facility of making high-frequency by-pass condensers in such intimate contact with the main (base) ground return is an advantageous feature which is not normally accomplished at such production economy. The very thin resistor 41 (Fig. 7) is deposited between lobe 4l of condenser plate 2b; 5b (Fig. 7) and circular metal deposit 49, the latter being the contact for the control-grid socket of the second valve.

An interesting feature of this system of producing a circuit arrangement is the facility enjoyed by the designer in screening certain sensitive points from picked up hum or unwanted leakage currents and like interference factors. A good example is shown here at 50 (Fig. '1) where a metal deposit going right to the side of the panel and attached to the socket of the cathode pin of the second valve (a relatively hum-free electrode), is used to screen the grid coupling condenser 2b of this same valve-a point very sensitive to external hum-from the influence by leakage or external radiation of the adjacent heater-filament contact pin, which is a point having a very intense hum voltage. Similarly on the other side of the panel the other plate 2a of this same condenser and its lobe i is screened from the humming points by the peculiar configuration of the main grounding electrode 1. This part of 1 is marked 9 on Fig, 6 and also at the same time acts as the means of interconnecting the grounding parts of this panel with the grounding parts of the other panel (see Fig. 18)

The point 5| (Fig. 7) is connected by way of metal path 52 to point 53. Path 52 has a high hum voltage hence it is run round outside the grounding electrode 1, sothat the latter screens it from acting upon sensitive points. Coming back to the resistor Il, which is the grid-leak of the second valve and hence also sensitive to hum, this is likewise arranged to be screened by nonhumming deposits 1 and Ib (see Fig. 7). Metal deposit 5I in Fig. 7 is an interconnecting path for cathode and suppressor grid and one heater pin of the first valve (see Fig. 8) as well as a grounding screen member shielding the hum-sensitive anode circuit of this same valve from humming point 5 I.

Considering Fig. 8 only we now see that except for items such as valves, electrolytic condensers and loud-speakers, we have made every component. Whilst this involved preparatory designing considerations, it requires only a few actual production questions which can be stated as follows:

l. Moulding the panel Fig. 3,

2. Metallising the same all over,

3. Grinding the surface of the panel to obtain the condition shown in Fig. 4,

. Spraying one graphite mixture through spaces on the surface of the panel shown in Fig. 6,

. Spraying another graphite mixture on the side of the panel shown in Fig. 7,

and fifteen electrical components all of individual character and electrical value and in their correct location and more than 35 conducting paths al1 in their correct location have connected these components in circuit.

We now require to provide for the prefabricated components to be plugged in. This is facilitated by inserting eyelets, sockets or the like as shown in Fig. 9. As these are in definitely prearranged positions automatic insertion of these small items and automatic eyeleting. riveting and the like becomes feasible.

Fig. 9 shows the same side of the panel as Fig. 7. At point 20 an eyelet is inserted through the panel to act as an interconnection from conductors on either side of the panel. At points marked 55 suitably shaped metal eyelet tags are inserted so that they radiate conveniently from which ever direction they happen to come into the valve pin socket holes arranged in a circle around key-way hole mentioned above to act in combination as the valve holders. All such tags are not numbered, though all are shown, and they are deliberately drawn in a slightly bent and irregular line to represent more clearly that 'they are springy parts attached on top of the moulding and not part of the latter. Sockets 5E for the two loud speaker connections are inserted into circular metal deposits 35 and 59 previously mentioned, shown in Figs. 6, 9 and 11. Specially shaped springy sockets 51 and 58, 60 and 6i are inserted into holes and cavities 2l, 24, 30 and I2 formed in the panel, which have been previously provided in the metal deposit paths (see Fig. 3) to act as sockets for the positive terminal plugs of electrolytic plug-in condensers. The individual function of each of these items becomes clear by comparing Fig. 11 with Figs. l0, 9, 8, 7 and 6.

It is preferable to spray the panel shown in Fig. 9 with lacquer to protect the deposited circuit, the relevant electrical connections and sockets being, of course, masked during the lacquering operation. This panel is now ready to have the prefabricated components plugged in as shown in Fig. 10. The valve marked 65 is the first valve previously mentioned and in this case is chosen to be of a type having its grid terminal 66 on top to facilitate its connection to the second panel to be described later, which carries the aerial input circuits.

The valve marked 61 is of the type containing an output system as well as a rectifier system. The loudspeaker 8l contains its own output transformer and in this example is of the perma-

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US636203 *Apr 19, 1898Oct 31, 1899Hugo HelbergerElectric resistance.
US1254664 *Sep 12, 1916Jan 29, 1918D & W Fuse CompanyMethod of forming magnetic chucks.
US1256599 *Jul 3, 1916Feb 19, 1918Max Ulrich SchoopProcess and mechanism for the production of electric heaters.
US1464255 *Jul 14, 1922Aug 7, 1923Zimmermann Raul FedericoElectrical heating device
US1528711 *Dec 6, 1923Mar 3, 1925Leon VerhaertProcess for the manufacture of electrical resistances
US1563731 *Mar 2, 1925Dec 1, 1925Ducas CharlesElectrical apparatus and method of manufacturing the same
US1582683 *Mar 19, 1925Apr 27, 1926Francis T HarmonRadiocoil and process of making same
US1647474 *Oct 25, 1923Nov 1, 1927Seymour Frederick WVariable pathway
US1684164 *Apr 23, 1924Sep 11, 1928Wired Radio IncRadioreception
US1767715 *Feb 19, 1927Jun 24, 1930Central Radio LabElectrical resistance
US1830092 *Jul 24, 1930Nov 3, 1931Hardwick Hindle IncResistor
US1837678 *Feb 14, 1929Dec 22, 1931Charles Ryder SamuelInductance coil particularly adapted for use with radio tuning devices
US1842433 *Dec 28, 1928Jan 26, 1932Ward Leonard Electric CoResistance device and insulator
US1899068 *Jan 11, 1930Feb 28, 1933Celluloid CorpDecorated thermoplastics and process of making same
US2019625 *Mar 30, 1934Nov 5, 1935Rca CorpElectrical apparatus
US2066511 *Jul 20, 1935Jan 5, 1937Bell Telephone Labor IncWiring device
US2173923 *Aug 27, 1936Sep 26, 1939Bell Telephone Labor IncCathode ray tube
US2179257 *Apr 13, 1938Nov 7, 1939Goloviznin Vladimir SInduction coil
US2182968 *Feb 28, 1935Dec 12, 1939Bell Telephone Labor IncMethod of making electrical connections
US2184485 *Mar 29, 1937Dec 26, 1939Entpr S Electr FribourgeoisesLow power heating element
US2216559 *Jan 17, 1938Oct 1, 1940Bosch Gmbh RobertElectrostatic condenser
US2244009 *Aug 4, 1939Jun 3, 1941Philips NvElectrical apparatus
US2297488 *Oct 18, 1940Sep 29, 1942Rudolf LuderitzRadio-frequency coil and electrostatic shield
US2336091 *Jun 15, 1940Dec 7, 1943Cornell Dubiller Electric CorpElectrical condenser
US2351604 *Jan 18, 1941Jun 20, 1944Nat Company IncInductance coil
US2390025 *Oct 4, 1943Nov 27, 1945Du PontProcess for the manufacture of electrical capacitors
FR686445A * Title not available
GB201092A * Title not available
GB262923A * Title not available
GB302482A * Title not available
GB344677A * Title not available
GB357171A * Title not available
GB502421A * Title not available
GB189219919A * Title not available
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US2512945 *Jun 28, 1946Jun 27, 1950Kallmann Heinz ERadio-frequency transmission line section
US2542726 *Jun 30, 1945Feb 20, 1951Herbert W SullivanMethod of forming inductor coils
US2581966 *Feb 14, 1947Jan 8, 1952Motorola IncTuner
US2589351 *Feb 27, 1947Mar 18, 1952Charles N EhrlichVariable condenser
US2610248 *Jan 3, 1949Sep 9, 1952Avco Mfg CorpRadio frequency coupling circuit
US2611010 *Jul 30, 1949Sep 16, 1952Rca CorpPrinted circuit structure for highfrequency apparatus
US2611807 *Jun 30, 1949Sep 23, 1952Rca CorpMultiple band turret-type tuning system
US2629166 *Oct 7, 1948Feb 24, 1953Int Resistance CoMethod of forming resistor assemblies
US2633526 *May 13, 1949Mar 31, 1953Sylvania Electric ProdElectrical circuit apparatus
US2637778 *Oct 20, 1950May 5, 1953Sprague Electric CoTone compensated volume control
US2649513 *Mar 8, 1949Aug 18, 1953IbmDistributor and method for making the same
US2665376 *Jul 20, 1948Jan 5, 1954Herlec CorpMultiple electric capacitor
US2666254 *Oct 4, 1949Jan 19, 1954Hermoplast LtdMethod of manufacturing electrical windings
US2679596 *Aug 21, 1948May 25, 1954Franklin Albert WTelevision station selector
US2683839 *Jan 12, 1950Jul 13, 1954Beck S IncElectric circuit components and method of preparing same
US2688119 *Apr 20, 1953Aug 31, 1954Gabriel CoPrinted circuit network system
US2694185 *Jan 19, 1951Nov 9, 1954Sprague Electric CoElectrical circuit arrangement
US2695351 *Jan 12, 1950Nov 23, 1954Beck S IncElectric circuit components and methods of preparing the same
US2715681 *Sep 21, 1949Aug 16, 1955Du Mont Allen B Lab IncTuner for ultra high frequencies
US2716736 *Dec 8, 1949Aug 30, 1955Rex Harold BSaturable reactor
US2721152 *Nov 10, 1949Oct 18, 1955Ward Blenkinsop & Co LtdProduction of electrical elements
US2721153 *May 29, 1950Oct 18, 1955Ward Blenkinsop & Co LtdProduction of conducting layers upon electrical resistors
US2730690 *Mar 29, 1952Jan 10, 1956Motorola IncPrinted circuit chassis and tube clip
US2740097 *Apr 19, 1951Mar 27, 1956Hughes Aircraft CoElectrical hinge connector for circuit boards
US2754454 *May 27, 1952Jul 10, 1956International Business Machines CorporationMultiple pluggable unit
US2756485 *Aug 28, 1950Jul 31, 1956Stanislaus F DankoProcess of assembling electrical circuits
US2758256 *Sep 30, 1952Aug 7, 1956Technograph Printed Circuits LElectric circuit components
US2759098 *Dec 13, 1951Aug 14, 1956Standard Coil Prod Co IncPrinted circuit band switching television tuner
US2760058 *Jun 26, 1950Aug 21, 1956Stewart Warner CorpRadio frequency oscillator mounting
US2760127 *Mar 22, 1954Aug 21, 1956Raytheon Mfg CoCapacitor commutator
US2762113 *Nov 3, 1950Sep 11, 1956Standard Coil Prod Co IncMethod of making tuner devices
US2762987 *Apr 9, 1953Sep 11, 1956Rca CorpTunable signal amplifier structure and coupling elements therefor
US2771663 *Dec 4, 1952Nov 27, 1956Henry Jr Robert LMethod of making modular electronic assemblies
US2773239 *May 14, 1952Dec 4, 1956 Electrical indicating instruments
US2774014 *Oct 31, 1952Dec 11, 1956Henry Jr Robert LModular electronic assembly
US2777110 *Oct 7, 1952Jan 8, 1957Sprague Electric CoMiniature high dielectric multicapacitor unit
US2786142 *Nov 19, 1952Mar 19, 1957Du Mont Allen B Lab IncElectrical tuning device
US2786187 *Apr 6, 1950Mar 19, 1957Chrysler CorpElectrical coil
US2786969 *Jan 28, 1954Mar 26, 1957Sanders Associates IncElectronic module structure
US2790970 *Jan 4, 1951Apr 30, 1957Sprague Electric CoAudio frequency signal transfer control circuits
US2796497 *Mar 14, 1956Jun 18, 1957Chicago Telephone Supply CorpElectric switch with terminal assembly especially adapted for connection to printed circuits
US2796498 *Mar 19, 1956Jun 18, 1957Chicago Telephone Supply CorpElectric switch with terminal assembly especially adapted for connection to printed circuits
US2796499 *Mar 19, 1956Jun 18, 1957Chicago Telephone Supply CorpElectric switch with terminal assembly especially adapted for connection to printed circuits
US2796500 *Mar 19, 1956Jun 18, 1957Chicago Telephone Supply CorpElectric switch with terminal assembly especially adapted for connection to printed circuits
US2798897 *May 11, 1953Jul 9, 1957Du Mont Allen B Lab IncShield for printed wiring
US2803788 *Dec 10, 1953Aug 20, 1957Sanders Associates IncElectronic module
US2816252 *Nov 12, 1953Dec 10, 1957Sanders Associates IncElectronic module device
US2816253 *Dec 23, 1953Dec 10, 1957Sanders Associates IncElectronic module structure
US2824294 *Dec 31, 1954Feb 18, 1958Rca CorpMagnetic core arrays
US2834922 *May 28, 1954May 13, 1958Paul J SelginCellular method of electronic assembly
US2844807 *Jan 11, 1955Jul 22, 1958Rca CorpElectron tube socket or the like for printed circuits
US2847651 *Jun 26, 1956Aug 12, 1958Robotron CorpCoupling transformer for radio frequency heating applications
US2848359 *Jun 20, 1955Aug 19, 1958Gen Am TransportMethods of making printed electric circuits
US2853656 *Aug 7, 1953Sep 23, 1958Burroughs CorpPrinted circuit panel assembly
US2862153 *Jul 7, 1955Nov 25, 1958Asea AbDevice for stacking series-connected impedance units
US2864156 *Apr 17, 1953Dec 16, 1958Donald K CardyMethod of forming a printed circuit
US2872624 *May 15, 1957Feb 3, 1959Bell Telephone Labor IncMounting and connecting apparatus
US2876390 *Dec 9, 1953Mar 3, 1959Sanders Associates IncMounting device for electrical components
US2876391 *Dec 9, 1953Mar 3, 1959Sanders Associates IncElectrical circuit assembly
US2879455 *Jul 30, 1954Mar 24, 1959Scal Robert K-FMiniature radar sub-assembly
US2880378 *Jul 30, 1954Mar 31, 1959Lindseth Clinton OShaped processed circuitry
US2883537 *Oct 14, 1954Apr 21, 1959Bendix Aviat CorpRadiosonde transmitter
US2886475 *Feb 24, 1953May 12, 1959Herbert C MckayMethod of producing an electrical device
US2886880 *May 26, 1952May 19, 1959Hermoplast LtdMethod of producing electric circuit components
US2891116 *Mar 4, 1955Jun 16, 1959Nichols & Clark IncHearing aid device
US2892129 *Jul 24, 1953Jun 23, 1959Henry Jr Robert LElectronic module mounting device
US2892130 *Dec 16, 1953Jun 23, 1959Globe Union IncPlug-in circuit units
US2894077 *Nov 21, 1955Jul 7, 1959Philco CorpModular circuitry
US2896028 *Sep 30, 1954Jul 21, 1959Rca CorpPrinted circuit for high frequency amplifier apparatus
US2897409 *Oct 6, 1954Jul 28, 1959Sprague Electric CoPlating process
US2898520 *Feb 17, 1956Aug 4, 1959Erie Resistor CorpElectric circuit assembly
US2899608 *Dec 7, 1954Aug 11, 1959 Multiple element printed circuit component
US2902629 *Nov 22, 1954Sep 1, 1959IbmPrinted circuit connection and method of making same
US2907925 *Sep 29, 1955Oct 6, 1959Gertrude M ParsonsPrinted circuit techniques
US2910351 *Aug 3, 1955Oct 27, 1959Gen ElectricMethod of making printed circuit
US2910628 *Sep 26, 1955Oct 27, 1959Robert L KecnerRight angle printed circuit connector
US2910662 *Jun 29, 1956Oct 27, 1959Harold B RexPrinted transformer
US2910675 *Jan 9, 1957Oct 27, 1959IbmCore array using coaxially spaced conductors
US2912481 *Dec 30, 1955Nov 10, 1959Gen ElectricCircuit apparatus and method
US2920245 *Jan 26, 1955Jan 5, 1960Raytheon CoStandard subminiature package technique
US2929965 *Jul 2, 1956Mar 22, 1960Oden Alonzo FMounting structures for electrical assemblies and methods of forming same
US2937351 *Feb 13, 1956May 17, 1960Craig Palmer HMagnetic amplifier
US2940018 *Apr 10, 1957Jun 7, 1960Gen Am TransportPrinted electric circuits
US2942332 *Jan 12, 1953Jun 28, 1960Int Standard Electric CorpMounting arrangements for components of electrical circuits
US2943956 *Dec 18, 1952Jul 5, 1960Automated Circuits IncPrinted electrical circuits and method of making the same
US2945163 *Jan 10, 1955Jul 12, 1960Globe Union IncComponent mounting for printed circuits
US2946976 *Aug 22, 1955Jul 26, 1960Sperry Rand CorpPrinted circuit board with bifurcated terminals
US2952840 *Mar 8, 1955Sep 13, 1960Int Standard Electric CorpIntelligence storage devices
US2958013 *Aug 20, 1956Oct 25, 1960Arthur Ansley Mfg CoElectrical unit
US2959645 *May 22, 1956Nov 8, 1960Ladd JohnHearing aid
US2959658 *Jun 4, 1958Nov 8, 1960Monroe Calculating MachineSequence switch
US2961584 *Jun 8, 1956Nov 22, 1960Burroughs CorpMagnetic core package
US2962690 *Apr 20, 1956Nov 29, 1960Ind Hardware Mfg Co IncRadio tube sockets
US2964602 *Apr 2, 1956Dec 13, 1960Joe DavidsonSnap acting mechanism
US2967267 *Mar 26, 1958Jan 3, 1961Litton Systems IncReactive intercoupling of modular units
US2977512 *Sep 8, 1958Mar 28, 1961Philco CorpModular circuit construction
US2984697 *Dec 9, 1957May 16, 1961Plastic Prec Parts CoPre-wired circuit panel
US2988620 *Sep 30, 1958Jun 13, 1961Chase Shawmut CoTime-lag fuses
US2989665 *Aug 25, 1958Jun 20, 1961Globe Union IncElectronic circuits
US2989705 *Dec 31, 1956Jun 20, 1961Webcor IncPrinted circuit hum control
US2994848 *Aug 20, 1958Aug 1, 1961Illinois Tool WorksResistor device
US2998475 *Dec 3, 1959Aug 29, 1961Raymond C GrimsingerPrinted electrical circuit panel having angularly disposed sections
US3002481 *May 31, 1955Oct 3, 1961Hughes Aircraft CoElectrical component mounting device
US3029367 *Jul 9, 1959Apr 10, 1962Haruki TomonohDevice for assembling the circuits elements
US3049711 *Nov 12, 1958Aug 14, 1962Packard Bell Electronics CorpOmni-directional portable antenna
US3058078 *Aug 7, 1958Oct 9, 1962Hoh Siegfried RLow capacitance transformer
US3067301 *Feb 26, 1960Dec 4, 1962Mititaka YamamotoTumbler switches
US3071749 *May 17, 1960Jan 1, 1963Budd CoAdjustable resistors and method of making the same
US3081525 *Sep 3, 1959Mar 19, 1963Gen Am TransportMethods of making printed electric circuits
US3096466 *Apr 26, 1957Jul 2, 1963Standard Coil Prod Co IncFixed frequency amplifier
US3100855 *Nov 24, 1958Aug 13, 1963Erie Resistor CorpTrimming capacitor
US3104282 *Apr 6, 1960Sep 17, 1963Motorola IncPrinted circuit panel with plug-in connectors
US3110087 *Dec 26, 1957Nov 12, 1963Rca CorpMagnetic storage device
US3148356 *Sep 14, 1959Sep 8, 1964Jr George A HeddenPrinted circuit connector
US3163588 *Feb 14, 1955Dec 29, 1964Technograph Printed ElectronicMethod of interconnecting pathway patterns of printed circuit products
US3191098 *May 26, 1960Jun 22, 1965Lockheed Aircraft CorpStructurally integrated capacitor assembly
US3191100 *Mar 7, 1963Jun 22, 1965Sorvillo EugeneLaminated electric circuit mounting boards
US3202952 *May 23, 1961Aug 24, 1965Illinois Tool WorksWafer mounted component capable of electrical adjustment
US3251939 *Oct 24, 1962May 17, 1966Warwick Electronics IncElectrical component receiving cabiving
US3270148 *Sep 18, 1964Aug 30, 1966Frederick Oxley RobertElectric switch with flexible snap action contact elements
US3292128 *Dec 26, 1961Dec 13, 1966Gen ElectricSemiconductor strain sensitive devices
US3335295 *Feb 4, 1959Aug 8, 1967Philips CorpThin film cryotron device composed of a plurality of superimposed planar elements
US3377512 *Aug 18, 1965Apr 9, 1968Rca CorpUnitary beam convergence magnet structure and control apparatus
US3438127 *Oct 21, 1965Apr 15, 1969Friden IncManufacture of circuit modules using etched molds
US3451131 *Jun 27, 1966Jun 24, 1969Lockheed Aircraft CorpMethod for making an encapsulated electrical circuit module assembly
US3504276 *Apr 19, 1967Mar 31, 1970American Mach & FoundryPrinted circuit coils for use in magnetic flux leakage flow detection
US3696479 *Oct 22, 1970Oct 10, 1972Zenith Radio CorpMethod of making a piezoelectric transducer
US3928907 *Oct 17, 1973Dec 30, 1975Chisholm JohnMethod of making thermal attachment to porous metal surfaces
US3947934 *Aug 7, 1974Apr 6, 1976Rca CorporationMethod of tuning a tunable microelectronic LC circuit
US4051550 *Nov 25, 1975Sep 27, 1977Hitachi, Ltd.Thick film integrated circuits
US4082984 *May 5, 1976Apr 4, 1978West Electric Company, Ltd.Electric flash device with printed coil transformer
US4445274 *May 21, 1981May 1, 1984Ngk Insulators, Ltd.Method of manufacturing a ceramic structural body
US4480885 *Feb 16, 1983Nov 6, 1984Honeywell Information Systems Inc.Printed circuit board interconnection system
US4604677 *Aug 16, 1983Aug 5, 1986Ngk Insulators, Ltd.Ceramic structural body and a method of manufacturing the same
US5017741 *Mar 29, 1989May 21, 1991Hamilton Standard Controls, Inc.Rotary digital contact encoder substrate
US20080047738 *Jul 26, 2007Feb 28, 2008Pioneer CorporationPrinted wiring board and printed circuit board
US20080149366 *Dec 5, 2007Jun 26, 2008Tsuneo SuzukiInterleaved printed circuit board
DE1014183B *Oct 28, 1953Aug 22, 1957Int Standard Electric CorpAus HF- und NF-Teilen bestehender Mikrowellen-Empfaenger
DE1063663B *Aug 20, 1957Aug 20, 1959Telefunken GmbhEinrichtung fuer Geraete der Nachrichtentechnik zum Herstellen elektrischer Verbindungen
DE1098564B *Apr 25, 1955Feb 2, 1961Henry J ModreyVerbinder fuer elektrische Leitungen
DE1279136B *May 26, 1962Oct 3, 1968Telefunken PatentHochfrequenz-Spulenanordnung
EP1931185A1 *Dec 7, 2006Jun 11, 2008Harman Becker Automotive Systems GmbHPrinted circuit board for an optical pickup with interleaved tilt and focus windings printed thereon
Classifications
U.S. Classification29/25.42, 361/803, 439/56, 361/766, 29/830, 427/96.9, 29/853, 29/604, 427/427, 174/267, 174/260, 336/200, 427/98.2, 427/122, 174/262
International ClassificationH05K1/16
Cooperative ClassificationH05K2201/09036, H05K1/16, H05K2201/0317, H05K1/165, H05K1/162
European ClassificationH05K1/16