Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUS2490055 A
Publication typeGrant
Publication dateDec 6, 1949
Filing dateMar 30, 1944
Priority dateMar 30, 1944
Publication numberUS 2490055 A, US 2490055A, US-A-2490055, US2490055 A, US2490055A
InventorsHoff Clayton M
Original AssigneeNat Steel Corp
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Metal strip electroplating apparatus
US 2490055 A
Images(2)
Previous page
Next page
Description  (OCR text may contain errors)

Dec. 6, 1949 c. M. HOFF METAL STRIP ELECTROPLATING APPARATUS Filed March 50, 1944 2 Sheets-Sheet 1 INVENYOR.

Patented Dec. 6, 1949 UNITED STATES PATENT OFFICE METAL sum ELrfif'izoPLirriNG *APPARA US lay qn Heft, Wi gt n, el-i..'a r, b

mesne assignments,

to v lfilational *Steel Corpor'atio'n, a corporation Beware Application Mar'chco, 194-4, seriall 5285673 3 Claims.

1 a This invention relates to an apparatus for the application of electrodeposits to metal strips and is more particularly directed to electroplating apparatus for the high speed plating of strip me tal using readily oxidized plating solutions wherein excessive aeration of solution is avoided. M It is an object of the present invention to pro; v id e "apparatus well adapted for the handling ,gf stannous tin plating solutions. It is 'a furthat object to provide apparatus for handling fm etaI strip at high speed and effecting contact "between a plating solution and the strip with ut excessive aeration of the solution. It is 'a still firmer object to provide apparatus which does n'ot involve a radical departure from existing equipment so that such existing equipment can ""adily be altered to conform to the pres ntintion. Still further objects will become apparent hereinafter. v

The foregoing and other objects of the invention are attained by the use'of an apparatus more particularly described hereinafter and 'illustrated in the accompanying drawings in Wljichz I A Figure l is a semi-diagrammatic showing'of "an assembly of a typical plating unit of the resent invention, I Figure 2 is a cross section illustrating a modified apparatus of the invention, and a x t Figure 3 illustrates a still further modification 'jif a roll'assembly where the solution level is maintained above the strip'being plated. I In the general assembly of Figure 1 there will be seen a plating receptacle, I, which is conjfstructed of a suitable material or is suitably lined fto resist corrosion by the plating solution "empl oyed. For a stannous chloride-sodium fluoride bath of a pH about 3 there would be useZLjfor sesame, a tank lined or coated with rubben'poly chloroprene or polyvinyl chloride. a 7 The plating tank, I, is provided with supports, gffo r'holding anodes, 3, in a suitable spaced rela- "em; to the strip to be plated. The anode supports, 2, are made of a suitable conducton suc'h 'carbon, while'the anodes are preferably made "6f ft he'metal to be plated, for instance, tin.

fAtthe entrance end of the platin'gtank th'e're areprovided rolls, 4 and 5. At the exit endthere afr e provided rolls, 6 and 1. The pairs 'o'fffrolls, 'I 5 and 6 -1, engage the strip of metal, Bftdbe '2 plated andserve as guide rolls in the passage of stripacross the top-of theplating tank. Driving arolls, ;not shown, engage the :strip and pull it thrp. the plating equipment. The rolls, 45 and Ii- 1, are driven, by means not shown, so that they turn in synchronism with the driving rolls, but the drive is not positive so thatrolls 45 and 6'--'I may slip to stay-at thesame speed as the moving strip, In this way the rolls shown are "10 driven so that they do not depend upon friction with the strip to turn them, but they are not so posiitively driven that they will go at a different speed from the strip and scratch it. The upper rolls i and 6 are metal and some or all of these uppe r'rolls may serve as electrical contacts. The 10 r rolls 5 and I are back-up rolls and are pr erably made of a nonconducting material "suchas rubber.

sides of the tank, I, are preferably somewhatraisdto minimize overflow of solution. At each end'of the tank there is provided means for retaining solution. As shown at the entrance end of the'tank, there is a sealing means or wall, l9,' e' i'teii'dingfrom the'bottoinof the tank towards the lowerfroll, 5. The upper end of the member 9 terminates in a resilient wiper, II]. The wiper, III, may suitably'be made of rubber. It will be is' 'een "that the solution will be prevented from flowing out of the tank by the wall, 9, the wiper, ID, the roll, '5, and,'of course, by the extension,

'I I, ofthe sides of the tank, I. identical construction 'r'nay be used at the exit end 'of the tank, but for "purposes of illustration; there is' showna very similar construction "which has 'proven successful in plant practice. A."retaining member, I'2,'extends from the end of the l4,and is provided with a rubber wiper, "I3. Itwill'be'obs'erv'ed that the wall, I4, serves to restrain the unimpeded flow of solution and it 40 alsoserves as an electrical shield to minimize plating on the roll. This structure and the wall, I 4, 'are'very important when the strip is moving *at'hig'hspeed. Without means for retaining the solution it would be carried out of the tank so fast redeem ng-would be impossible.

'o'lution which passes through the rolls or 'hich'splashes over the sides of the plating re- :ceptfacle is caught in the tray, I5. Solution from trayis withdrawn from the tray through a "hire, '16, to a tank, '11, frorn'which itis returned by a pump, l'8, to the plating tank, I, by the pipes, I9 and 20.

In the operation of the apparatus illustrated in Figure 1, any suitable solution such as a stannous chloride-sodium fluoride tin plating bath is put in the tank, I. A metal strip, such as strip steel, is run across the top of the receptacle, the solution level being such that at least the lower surface of the steel is in contact with the electrolyte. Suitable anodes, such as tin are slipped into place and electrodeposition is effected in the customary way by the application of current.

The strip steel is guided as it moves rapidly across the top of the cell by the rolls, 45 and 6-'l. caught and returned to the tank. It will be seen that only a relatively small amount of the solu-.

tion will overflow, and thus aeration will be held at a minimum. It will also be understood that the assembly of Figure 1 represents only a single plating unit and a number of such units will ordinarily be required to obtain a suificiently heavy metal deposit at relatively high speeds.

In Figure 2 there is illustrated a modification in which two units like that of Figure 1 are juxtaposed. The plating tank, I, is provided with a retaining member, 9, and a Wiper, N), at the inlet and at the exit end. The construction in eiiect provides two tanks, like that in Figure l, which are joined by a member, 2!, which extends around the bottom and sides of the tank to form one long plating tank. Rolls 22 and 23 are pro vided intermediate the length of the long tank to provide driving power, to hold the sheet in position, and to provide an electrical contact. Walls, 2t and 25, serve to minimize plating on the roll 22 and to slow down the motion of plating soiution.

It will be seen that the modification of Figure 2 is applicable to installations using a still larger number of tanks. Thus, according to the invention, one may either use a plurality of elements like that shown in Fi ure 1 or may use a plurality of elements joined by rolls, such as 2223, the tanks in the latter event being interconnected.

Figure 3 illustrates a still further modification and shows the exit end of a modified structure. tank, l, is provided with a wall, 9, and a Wiper, it There is also provided a wall, It, which serves like that of Figure 1.

The apparatus of Figure 3 is characterized by the fact that the sides of the tank are considerably than those of Figure 1 so that the solution level may be raised to a point well above the moving strip and the strip accordingly may be plated on both sides at the same time. Anodes, 26, may be provided for this purpose. It is to be noted that the anodes, 25, may be omitted and this structure used if it is considered important to maintain a somewhat higher solution level than that readily obtainable in a structure of Figure l. I

A suitable solution retaining member, 2?, is provided and this carries at its end a wiper, 28. It will be seen that this structure minimizes the loss of solution at the exit end of the plating receptacle as shown.

While I have shown certain illustrative embodiments of the invention, it will be understood that one skilled in the art may without depart.- ing from the spirit of the invention readily devise numerous similar apparatus for the plating of strip metals with a minimum of solution aeration.

Any solution which overflows will be I claim:

1. A strip plating apparatus comprising a tank for holding a plating solution, having side, end, and bottom walls, means for passing a strip across the top of said tank in a plane substantialiy coincident with the plane of solution level, said last-mentioned means comprising a lower roll at the exit end and located with its upper surface substantially tangential to the plane of the solution level, and a cathode contact roll above said roll, said rolls being adapted to re ceive the strip therebetween, the end wall of said tank at the exit end extending upward almost to the plane of the solution level and being positioned so that the rolls are beyond the said end wall in the direction of motion of said strip, an anode located in said tank below the solution level, electrode connections for the said anode and for said contact roll, extensions on the side walls of the tank and a sealing means extending from the said exit end wall to said lower roll which together with the extensions on the side walls of the tank form a container for holding the plating solution and for restraining its fiow from the tank.

2. A strip plating apparatus comprising a tank for holding a plating solution, having side, end, and bottom walls, means for passing a strip across the top of said tank from end to end in a plane substantially coincident with the plane of solution level, said last-mentioned means comprising a lower roll located at the exit end with its upper surface substantially tangential to the plane of the solution level, and a cathode contact roll above said lower roll, said rolls being adapted to receive the strip therebetween, the end wail of said tank at the exit end extending upwardly almost to the plane of the strip and being positioned so that the rolls are beyond the said end wall in the direction of motion of said strip, an anode located in said tank below the solution level, electrode connection for the said anode and for said contact roll, side wall extensions extending from the side walls to the rolls and above the plane of the strip, and a sealing means extending from the said exit end wall to said lower roll, said sealing means and said rolls together with the extensions of the tank side walls forming a container for holding the plating solution and for restraining its flow from the exit end of the tank.

3. A strip plating apparatus comprising a tank for holding a plating solution, having side, end, and bottom walls, the side walls extending above the solution level, means for passing a strip across the top of said tank from end to end in a plane substantially coincident with the plane of solution level, said last-m ntioned means comprising a lower roll located at the exit end with its upper surface substantially tangential to the plane of the solution level, and a cathode contact roll above said lower roll, said rolls being adapted to receive the strip therebetween, the end wall of said tank at the exit end extending upwardly almost to the plane of the strip and being positioned so that the rolls are beyond the said end wall in the direction of motion of said strip, an anode located in said tank below the solution level, electrode connection for the said anode and for said contact roll, side wall extensions extending from the side walls to the rolls and above the plane of the strip, and a sealing means extending from the said exit end wall to said lower roll, said sealing means and said rolls together with the extensions of the tank side walls forming a con- 5 6 tainer for holding the plating solution and for re- Number Name Date straining its flow from the exit end of the tank. 2,240,265 Nachtman Apr. 29, 1941 CLAYTON M. HOFF. 2,244,423 Hall June 3, 1941 2,324,652 Stoker July 20, 1943 REFERENCES CITED 5 2,377,550 Hall June 5, 1945 The following references are of record in the 2334560 Ward sept- 1945 file of this patent: FOREIGN PATENTS UNITED STATES PATENTS Number c t y t Number Name Date 10 467,019 Great Britain June 9, 1937 347,959 Rau Aug. 24, 1386 OTHER REFERENCES 929,312 King July 27, 1909 1 9 3 Battle July 13 191 Metal Finishing, February 1 4, pages '77 to 1,813,297 Klein July 7, 1931 '79, article entitled Electrotinning Steel Strip at 2,061,554 Billiter Nov. 24, 1936 u Weirmn steel 2,223,860 Schellenberg D86. 3. 1940

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US347959 *Dec 28, 1885Aug 24, 1886 Eugene eau
US929312 *Nov 13, 1908Jul 27, 1909Hanson & Van Winkle CoElectroplating plant.
US1191386 *May 24, 1915Jul 18, 1916Albert Ernest BattleApparatus for use in and in connection with electrolytic processes.
US1813297 *Aug 3, 1928Jul 7, 1931Klein Weiner & BellMachine for washing rugs and the like
US2061554 *Dec 11, 1930Nov 24, 1936Copperweld Steel CoElectrolytic deposition of metals
US2223860 *Dec 12, 1939Dec 3, 1940Albert SchellenbergMultiple roll wringer
US2240265 *Mar 30, 1937Apr 29, 1941Nachtman John SMethod of continuously tin plating ferrous metal stock
US2244423 *Jun 28, 1938Jun 3, 1941Hanson Van Winkle Munning CoApparatus for strip plating
US2324652 *Jul 30, 1940Jul 20, 1943Carnegie Illinois Steel CorpApparatus for continuously conditioning conveyer rolls
US2377550 *Dec 2, 1940Jun 5, 1945Hanson Van Winkle Munning CoApparatus for electrogalvanizing
US2384660 *Mar 11, 1940Sep 11, 1945Bethlehem Steel CorpApparatus for electrolytic galvanizing of sheets
GB467019A * Title not available
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US2569578 *Aug 7, 1944Oct 2, 1951Nat Steel CorpApparatus for electrocoating striplike material
US2753298 *Oct 2, 1952Jul 3, 1956Pittsburgh Plate Glass CoMethod and apparatus for continuous plating
US2876191 *Sep 5, 1952Mar 3, 1959Western Electric CoElectroplating apparatus
US2924563 *Aug 19, 1954Feb 9, 1960Pittsburgh Plate Glass CoContinuous electroplating apparatus
US3354070 *Jan 24, 1964Nov 21, 1967United States Steel CorpOverflow cell for plating strip
US3468783 *Mar 8, 1965Sep 23, 1969Republic Steel CorpElectroplating apparatus
US4102772 *Mar 30, 1977Jul 25, 1978Sumitomo Metal Industries, Ltd.Apparatus for continuously electroplating on only a single surface of running metal strip
US4164454 *Nov 1, 1977Aug 14, 1979Borg-Warner CorporationElectrodeposition, incline
US4326933 *May 9, 1979Apr 27, 1982Finishing Equipment, Inc.Electro-chemical deburring method
US4367125 *Dec 18, 1980Jan 4, 1983Republic Steel CorporationApparatus and method for plating metallic strip
US4401522 *Sep 29, 1980Aug 30, 1983Micro-Plate, Inc.Conveying objects continuously through plating tank or hangers, non-polarizing
US4401523 *May 19, 1982Aug 30, 1983Republic Steel CorporationApparatus and method for plating metallic strip
US4904350 *Nov 14, 1988Feb 27, 1990International Business Machines CorporationSubmersible contact cell-electroplating films
US6979248May 7, 2002Dec 27, 2005Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US6988942Jul 20, 2004Jan 24, 2006Applied Materials Inc.Conductive polishing article for electrochemical mechanical polishing
US6991528Jun 6, 2003Jan 31, 2006Applied Materials, Inc.Polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The
US7014538Mar 5, 2003Mar 21, 2006Applied Materials, Inc.Article for polishing semiconductor substrates
US7029365Dec 23, 2003Apr 18, 2006Applied Materials Inc.Pad assembly for electrochemical mechanical processing
US7059948Dec 20, 2001Jun 13, 2006Applied MaterialsArticles for polishing semiconductor substrates
US7077721Dec 3, 2003Jul 18, 2006Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7084064Sep 14, 2004Aug 1, 2006Applied Materials, Inc.Full sequence metal and barrier layer electrochemical mechanical processing
US7125477Aug 2, 2002Oct 24, 2006Applied Materials, Inc.Contacts for electrochemical processing
US7137868Mar 6, 2006Nov 21, 2006Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7137879Mar 30, 2006Nov 21, 2006Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7207878Jan 8, 2005Apr 24, 2007Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7278911Aug 30, 2005Oct 9, 2007Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7285036Nov 21, 2006Oct 23, 2007Applied Materials, Inc.Pad assembly for electrochemical mechanical polishing
US7303462Mar 22, 2005Dec 4, 2007Applied Materials, Inc.Edge bead removal by an electro polishing process
US7303662Aug 2, 2002Dec 4, 2007Applied Materials, Inc.Contacts for electrochemical processing
US7311592Nov 2, 2006Dec 25, 2007Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7344431Jul 18, 2006Mar 18, 2008Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7344432Oct 31, 2006Mar 18, 2008Applied Materials, Inc.Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7374644Jun 26, 2003May 20, 2008Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7427340Apr 8, 2005Sep 23, 2008Applied Materials, Inc.Conductive pad
US7446041Jun 21, 2006Nov 4, 2008Applied Materials, Inc.Full sequence metal and barrier layer electrochemical mechanical processing
US7520968Oct 4, 2005Apr 21, 2009Applied Materials, Inc.Conductive pad design modification for better wafer-pad contact
US7569134Jun 14, 2006Aug 4, 2009Applied Materials, Inc.Electropolishing by having a conductive rotating contact element extending from a polishing surface of a pad body which rotates while in contact with the substrate and is in a fluid channel formed in the pad through which an electrolyte is flowing to activate the conductive rotating contact element
US7670468Sep 15, 2005Mar 2, 2010Applied Materials, Inc.Contact assembly and method for electrochemical mechanical processing
US7678245Jun 30, 2004Mar 16, 2010Applied Materials, Inc.Method and apparatus for electrochemical mechanical processing
EP0030227A2 *Aug 1, 1979Jun 10, 1981Production Machinery CorporationMethod and apparatus for electrolytically treating a metal strip
Classifications
U.S. Classification204/206, 204/237
International ClassificationC25D7/06
Cooperative ClassificationC25D7/0614
European ClassificationC25D7/06C