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Publication numberUS27934 A
Publication typeGrant
Publication dateApr 17, 1860
Publication numberUS 27934 A, US 27934A, US-A-27934, US27934 A, US27934A
InventorsWilliam Steinmetz
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
US 27934 A
Abstract  available in
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Description  (OCR text may contain errors)



Specification of Letters Patent No. 27,934, dated April 17, 1860.

To all 'whom it may concern:

Be it known that I, WILLIAM STEINMETZ, of the city of Philadelphia, State of Penn- Sylvania, have invented a new and useful Improvement in Eyelet-Machines; and I do hereby declare that the following is a full and exact description of the construction and operation of the same, reference being had to the accompanying drawings, which form a portion of this specification.

Figure 1, is a side view of my improved eyelet machine; Fig. 2, a view of the under side of the bottom of the same, and Fig. 3, a section of a portion of the pointed cutterpunch of said machine.

The peculiar shape of the punch c, CZ, f, employed in my improved eyelet-machine. which enables it, when used in combination with a perforated die-plate la, to cleanly cut holes in several thicknesses of paper and then insert eyelets into said holes and clench the same all at one operation, constitutes the improvement in said machine which I have invented and desire to secure by Letters Patent.

The point c, which descends from the shank cl, of the punch of my improved eye let machine, is divided into several faces whose separating angles as also the angles between the upper port-ions of said faces and the periphery of the shank CZ, are kept sharp by any suitable means. The aforesaid shank d, of the punch f, fit-s closely into the aperture in the die plate 7c; and the angle at the upper end of the aperture in said die-- plate, is kept sharp by grinding off the upper surface of the plate, or by any other suitable means. Therefore, it will be perceived that while the sharp point of the aforesaid punch can beeasily forced through many thicknesses of paper, the sharp angles between the faces of the said point and the periphery of the shank 0l, of said punch acting in conjunction with the perforated dieplate 7c, will form a clean hole through the said mass of papers. Or, should it be desired to form the hole in a mass of papers and to secure them together by a clenched eyelet, all at one operation, it may be accomplished in the following manner, viz, first, place the outwardly curving end of an eyelet vover the aperture in the dieplate c, then place the papers to be united upon the upper end of said eyelet, and then force down the punch through the said papers and through the eyelet, to such a distance that the curved shoulder of the punch f, at the upper end of the shank d, will first force the said papers over the eyelet and then turn outward and clench the upper end thereof down upon the face of said papers. In this operation the eyelet itself serves as the counter cutting die in the process of forming the hole in the papers thus united together by the machine.

The punch of my improved eyelet machine is forced downward by a cam-lever and is thrown upward by a spring in the usual manner of operating the punches of eyelet machines.

That I claim as my invention, and desire to secure by Let-ters Patent, is-` Giving a sharp-angled pointed shape to the extremity of the shank d, of the punch of my improved eyelet-machine, when the said punch is otherwise of the shape represented in the accompanying drawings, and when it is used in connection with a perforated die-plate substantially in the manner and for the purpose herein set forth.




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US4176567 *May 1, 1978Dec 4, 1979Warren WeisbergMethod of making a tear line-forming perforation in a sealed marginal portion of a bag and a sealed bag formed thereby
US4505029 *Jul 8, 1983Mar 19, 1985General Electric CompanySemiconductor device with built-up low resistance contact
US4894751 *May 20, 1988Jan 16, 1990Siemens AktiengesellschaftPrinted circuit board for electronics
US5367195 *Jan 8, 1993Nov 22, 1994International Business Machines CorporationStructure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
US5820522 *Apr 23, 1997Oct 13, 1998Taylor-Nathan Co., Inc.Orthopaedic gripping device
US5929521 *Mar 26, 1997Jul 27, 1999Micron Technology, Inc.Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US6109156 *Jul 31, 1997Aug 29, 2000Ngk Insulators, Ltd.Punching apparatus and punch
US6111321 *Jun 7, 1995Aug 29, 2000International Business Machines CorporationBall limiting metalization process for interconnection
US6133065 *Jan 16, 1998Oct 17, 2000Micron Technology, Inc.Multi-chip module employing carrier substrate with micromachined alignment structures and method of forming
US20060055034 *Nov 8, 2005Mar 16, 2006Wark James MProjected contact structures for engaging bumped semiconductor devices and methods of making the same
Cooperative ClassificationB26F1/24