|Publication number||US3147801 A|
|Publication date||Sep 8, 1964|
|Filing date||Feb 9, 1961|
|Priority date||Feb 9, 1961|
|Publication number||US 3147801 A, US 3147801A, US-A-3147801, US3147801 A, US3147801A|
|Original Assignee||Astro Dynamics Inc|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (9), Referenced by (3), Classifications (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
Sept. 8, 1964 L. KATz 3,147,801 HEAT RADIATOR Filed Feb. 9. 19 61 mmvrok. Jaw/H2070! In? United States Patent 3,147,801 HEAT RADIATOR Leonhard Katz, Woburn, Mass, assignor to Astro Dynamics, Inc., Cambridge, Mass, a corporation of Massachusetts Filed Feb. 9, 1961, Ser. No. 88,122 3 Claims. (Cl. 165-185) This invention relates to heat exchangers and more particularly to a device for drawing off heat from small heat producing electronic components.
In various situations the removal of heat from electronic apparatus becomes quite critical. Heat is a problem when it is desired to run transistors, silicon diodes or the like at maximum power. The efliciency of these components decreases as the temperature rises and further, high temperatures may lead to a progressive situation the maintenance of which will quickly cause the destruction of the component.
A second situation in which heat is a problem is when miniaturization of electronic equipment is attempted. The metal chassis which is typically associated with the ap paratus will often have insufiicient radiating surface to dispose of the entire thermal load and will present too high a thermal resistance immediately adjacent the heat source so that a slow temperature buildup results.
Accordingly objects of the present invention are to provide a heat radiator for electronic components which provides a large surface for heat radiation and for giving off heat to convection currents, which has a very low thermal resistance immediately adjacent the heat producing element, which is compact and of light weight, and which is of simple and inexpensive manufacture.
In brief summary a heat radiator according to the invention comprises a substantially flat plate having upstanding from at least one face thereof a plurality of fins. Each fin includes at least one transverse flange and a central portion of one side of the plate is adapted to receive a heat producing element.
In a particular aspect the fins are parallel one another as are the flanges so that all transverse sections of the radiator are substantially similar whereby the radiator may be manufactured largely by the relatively inexpensive process of extrusion.
For purposes of illustration preferred embodiments of the present invention are shown in the accompanying drawings in which FIG. 1 is a plan view of a heat radiator.
FIG. 2 is a section on the line 22 of FIG. 1.
FIG. 3 is a similar section of a modification.
Referring now to the drawings the body of the heat radiator shown in FIG. 1 is a substantially flat rectangular plate 10. Preferably, as shown in FIG. 2, the plate is somewhat thicker near its middle than near the edges since the middle portion will pass the heavier thermal load. Projecting from either face of the plate are a series of parallel fins 12. Each fin terminates in a flange which extends away from the fin in a direction parallel the plate It). The flanges 14 on the interior fins project in both directions away from the fin itself while the flanges 15 on the outer fins project only inwardly so as to leave a flush exterior on the radiator as a whole.
It is an advantage of the present construction that the structure 'as thus far described may be manufactured by the relatively inexpensive process of extrusion, all transverse sections of the radiator being similar except for whatever provisions are made for mounting the heat producing elements and the radiator itself. A further advantage of this arrangement and method of manufacture is that the radiator may be made of any desired length, that is the dimension from top to bottom as shown in FIG. 1, whereby the thermal capacity may be conveniently predetermined.
In order that the heat producing element, such as a transistor, may be easily attached in a thermally conductive relationship with the plate 10, the fins 12 and flanges 14 are cut away flush with the plate 10 as at 17 near the center of the plate. Preferably a portion of this area, as at 18, is spotfaced so as to provide a junction of low thermal resistance. A suitable mounting hole 21 is provided for the transistor, silicon diode or other heat producing element and the flange 14 on the opposite side of the plate are cut away as at 22 to provide clearance for a corresponding nut.
For mounting the radiator itself there are provided, at each corner of the plate 10, apertures 23 for receiving mounting bolts. The flanges 14 and 15 are cut away as at 24 so as to clear the heads of the bolts and any nuts or spacers which may be required.
FIG. 3 illustrates a modification of somewhat greater complexity and having a correspondingly increased heatdissipating capacity. The fins 32 project a relatively greater distance from the plate 30 and include a plurality of transverse flanges 34. The fins at the sides of the radiator include at one end portions 37 which project beyond the rest of the fins. By these extending portions 37 the radiator may be mounted, as by angle brackets 39, to a chassis. It should be noted that this modification can also be largely manufactured by extrusion.
While the heat handling capacity of the radiator is increased by having fins and flanges projecting from both faces of the flat plate, there are some situations in which it may be desirable to have the fins projecting from only one face and thus the present invention should be understood to include such a construction. Likewise, it should be understood that this disclosure is for the purpose of illustration only and that the present invention includes all modifications and equivalents falling Within the scope of the appended claims.
1. A heat radiator constituted by a single piece of heat-conductive material having a substantially flat rectangular plate with a plurality of parallel fins extending from said plate at opposite sides thereof, each of said fins having only one flange extending therefrom, said flanges being located at the end of said fins remote from said plate and being parallel to said plate, said plate having a central portion of predetermined thickness provided with means to support a heat generator thereon and having a pair of end portions extending from said central portion and of substantially uniform thickness less than said predetermined thickness, each of said portions having a plurality of said parallel fins extending therefrom at each side thereof, the flanges at opposite sides of said plate being disposed in a corresponding pair of planes parallel to said plate.
2. The heat radiator of claim 1, said plate having certain ones of said fins at the ends of said plate, the flanges Of 755,399 Shambaugh Mar. 22, 1904 the last-mentioned fins extending only from the side of 2,535,721 Chausson D 26, 1950 those fins facing the opposite end of said p ate. 2 935 4 Scharli May 3 19 0 3. The heat radiator of claim 2, said means to s pp rt 2,965,819 Rosenbaum 20, 1960 a heat generator comprising means defining an opening 5 2 984 774 Race May 16 1961 in said plate. h n
FOREIGN PATENTS References Cited in the file of this patent 219,887 Australia Jam 30 1959 UNITED STATES PATENTS 436,656 Great Britain Oct. 16, 1935 711,446 Thacker Oct. 14, 1902 768,103 Great Britain Feb. 13, 1957
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US711446 *||May 7, 1902||Oct 14, 1902||Stilwell Bierce & Smith Vaile Co||Apparatus for separating oil.|
|US755399 *||Jun 30, 1903||Mar 22, 1904||Charles E Shambaugh||Gas-engine cooler.|
|US2535721 *||Jun 3, 1947||Dec 26, 1950||Chausson Usines Sa||Cylindrical heat exchanger|
|US2935664 *||Jun 10, 1957||May 3, 1960||Bbc Brown Boveri & Cie||Cooler for heat removal on a semi-conductor cell built into a container|
|US2965819 *||Aug 7, 1958||Dec 20, 1960||Jacob Rosenbaum||Heat dissipating electronic mounting apparatus|
|US2984774 *||Oct 1, 1956||May 16, 1961||Motorola Inc||Transistor heat sink assembly|
|AU219887B *||Title not available|
|GB436656A *||Title not available|
|GB768103A *||Title not available|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US3217793 *||Nov 30, 1962||Nov 16, 1965||Wakefield Eng Inc||Heat transfer|
|US5304845 *||Sep 30, 1992||Apr 19, 1994||Digital Equipment Corporation||Apparatus for an air impingement heat sink using secondary flow generators|
|US20060011325 *||Jul 13, 2005||Jan 19, 2006||Schlitz Daniel J||Micro-channel heat sink|
|U.S. Classification||165/185, 165/80.3, 257/722|