US3268774A - Encapsulated diode assembly - Google Patents
Encapsulated diode assembly Download PDFInfo
- Publication number
- US3268774A US3268774A US371197A US37119764A US3268774A US 3268774 A US3268774 A US 3268774A US 371197 A US371197 A US 371197A US 37119764 A US37119764 A US 37119764A US 3268774 A US3268774 A US 3268774A
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- connectors
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- connector
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- module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Definitions
- This invention relates to a novel diode ⁇ assembly structure, and more specifically relates to a diode assembly structure Iwherein diodes are encapsulated in -a support lbody having extending plug connectors and sockets which may be easily stacked and connected to one another to tormdiode assemblages containing a large number of diodes.
- a primary object of this invention is to provide a novel encapsulated diode assembly iw-hich can be easily connected to other similar assemblies to form various rectier ooniigurations.
- Another object of this invention is to provide a novel plug-in rectifier module.
- FIGURE 1 shows a side cross-sectional view of a single module manufactured in accordance with the present invention.
- FIGURE -2 shows a top View of FIGURE l.
- FIGURE 3 illustrates the connection of a plurality of modules of the type shown in FIGURES l and 2.
- FIGURE 4 shows a partial cross-sectional view of the encapsulation medium for one of the modules Wherein plug connectors can be connected to the module in a simplitied manner.
- FIGUR-E 5 illustrates a plan View of a typical connector that can be used with the device off FIGURE 4.
- FIGURE 6 is a top view of the connector of FIG- URE 5.
- FIGURE 7 is a bottom View yof the connector of FIGURE 5.
- FIGURE 8 is a partial cross-sectional view of a connector similar to that of FIGURE 5, but which has an insulated projecting section.
- FIGURES l and 2 I have illustrated therein a typical module constructed in accordance with the invention which is formed of .a series connection of diode elements 10 through 15.
- diodes 10 through 15 may be of the type disclosed in copending application Serial No. 261,109 tiled February 26, 1963 entitled Semiconductor Device Housing and assigned to the assignee of the lpresen-t invention.
- These diodes 10 through 1-5 are each connected in series with one another, and terminate on plug-type connectors 16 and 17, respectively.
- the complete assembly is then encapsulated in a suitable insulation medium, as schematically illustrated by the dotted lines in FIGURE l, Where the encapsulation medium preferably has openings su-ch as openings 20 and 21 therein which can serve to receive mounting means which supports the module in a suitable support frame.
- the connectors 16 and 17 are seen to comprise two sections.
- the upper sections are female-type sections 25 and 26, respectively, while the lower sections are male-type sections 27 and 28, respectively.
- the male sections 27 and 28 project through the encapsulation surface for a length corresponding to the depth of female sections 25 and 26.
- the cross-sectional shape of sections 27 and 2.8 conform to the shapes of sections 215 and 26, with means being provided for permitting the snap-type entrance of sections 27 and 28 "nce
- modules of .the type shown lin FIGUR-ES 1 and 2 may lbe stacked in the manner shown in FIG- URE 3 for the stacking of modules 30, .31, 32 and 33.
- this stacking is easily done and will deiine an electrical circuit having the parallel connection of twenty-four diodes.
- the projecting sections 37 and 38 of lower module 33 may then be capped by a suitable insulation cap or can be clipped off to prevent their accidental short circuiting.
- rDhe complete assembly is then held in position, for example, by a frame member such as frame memlber 40 which has suitable securing means such as screws 41, 42, 43 and 44 passing therethrough and through corresponding openings such as opening 2'1 of FIGURES 1 and 2 of modules 30 through 33.
- suitable securing means such as screws 41, 42, 43 and 44 passing therethrough and through corresponding openings such as opening 2'1 of FIGURES 1 and 2 of modules 30 through 33.
- a similar securement means will be received by the openings in the left-hand side of modules 30 through 33, but is not shown in FIG- URE 3.
- FIGURE 3 shows the modules connected in parallel circuit relation
- this arrangement could be modiiied whereby the modules are connected in series with one another or can be connected in various series-parallel arrangements.
- the mcdules 31 and 313 I would be reversed; the projecting male sections of the connectors at the lett-hand side of modrules 30 and 32 and at the rightah-and side of module 31 would be removed or insulated fromv its adjacent module, and terminal 36 would ibe connected to the left-hand end of module 33.
- the module structure shown in the gures may, of course, be modied in many ways.
- the module structure may be formed to leave an opening 60 in the module of the shape shown in FIGURE 4 with lead conductor 61 extending into opening 60 with the encapsulating medium being flexible enough to permit connection of suitable connectors.
- opening 60 may cooperate with a removable connector section such as the snap-type connector 62 of FIGURE 5 which could be snapped into opening 60.
- the connector 62 of FIGURE 5 has an upper femaletype section 63 which is formed of slit sections in the usual manner to permit spreading of section 63 when making snap connection to a suitable male connector.
- the lower male-type sect-ion 64 of FIGURES 5 and 7 is also formed of a plurality of slit sections. Clearly, when the connector of FIGURE 5 is inserted into opening 60 in FIGURE 4, there will also -be engagement between lead 61 and the conductive connector body.
- FIGURE 8 illustrates a connector 70 which can be snapped into opening 60 of FIGURE 4, and includes the conductive upper section 71 with a lower insulation body 72.
- the insulation body 72 can, if desired, 'be slit in the manner illustrated in FIGURES 5 and 7 for conductive sections 64.
- the insulation section 72 is provided solely for mechanical purposes. It can, of course, be eliminated if desired with all mechanical connection between adjacent modules 4being accomplished by the cooperating conductive sections and clamps such as the clamp 40.
- a diode module comprising a plurality of series connected diodes arranged in ya predetermined manner, first and second connectors connected to the respective ends of said series connection of diodes and an encapsulation medium for encapsulating said first and second connectors and said plurality of series connected diodes; said encapsulation medium having a first and second smooth opposing surfaces; said first and second connectors being elongated in a direction perpendicular vto said first and second smooth surfaces; said first and second connectors having respective female sections extending from said first surface; said first connectors having a male section extending from the end of said female section; said male section extending through said second surface for a distance substantially equal to the depth of said female section.
- said encapsulation medium has third and fourth smooth opposing surfaces perpendicular to said first and second surfaces; and a mounting opening extending through said encapsulation medium from said third surface to said fourth surface.
Description
Unted States Patent O 3,268,774 ENCAPSULATED DIODE ASSEMBLY Ernest E. Ortner, Los Angeles, Calif., assignor to International Rectifier Corporation, El Segundo, Calif., a corporation of California Filed May 29, 1964, Ser. No. 371,197 4 Claims. (Cl. 317-101) This invention relates to a novel diode `assembly structure, and more specifically relates to a diode assembly structure Iwherein diodes are encapsulated in -a support lbody having extending plug connectors and sockets which may be easily stacked and connected to one another to tormdiode assemblages containing a large number of diodes.
A primary object of this invention is to provide a novel encapsulated diode assembly iw-hich can be easily connected to other similar assemblies to form various rectier ooniigurations.
Another object of this invention is to provide a novel plug-in rectifier module.
These and other objects of this invention will become apparent from the following description when taken in connection with the drawings in which:
FIGURE 1 shows a side cross-sectional view of a single module manufactured in accordance with the present invention.
FIGURE -2 shows a top View of FIGURE l.
[FIGURE 3 illustrates the connection of a plurality of modules of the type shown in FIGURES l and 2.
FIGURE 4 shows a partial cross-sectional view of the encapsulation medium for one of the modules Wherein plug connectors can be connected to the module in a simplitied manner.
FIGUR-E 5 illustrates a plan View of a typical connector that can be used with the device off FIGURE 4.
FIGURE 6 is a top view of the connector of FIG- URE 5.
FIGURE 7 is a bottom View yof the connector of FIGURE 5.
FIGURE 8 is a partial cross-sectional view of a connector similar to that of FIGURE 5, but which has an insulated projecting section.
Referring now to FIGURES l and 2, I have illustrated therein a typical module constructed in accordance with the invention which is formed of .a series connection of diode elements 10 through 15. Each of diodes 10 through 15 may be of the type disclosed in copending application Serial No. 261,109 tiled February 26, 1963 entitled Semiconductor Device Housing and assigned to the assignee of the lpresen-t invention. These diodes 10 through 1-5 are each connected in series with one another, and terminate on plug- type connectors 16 and 17, respectively.
The complete assembly is then encapsulated in a suitable insulation medium, as schematically illustrated by the dotted lines in FIGURE l, Where the encapsulation medium preferably has openings su-ch as openings 20 and 21 therein which can serve to receive mounting means which supports the module in a suitable support frame.
The connectors 16 and 17 are seen to comprise two sections. The upper sections are female- type sections 25 and 26, respectively, while the lower sections are male- type sections 27 and 28, respectively. Note that the male sections 27 and 28 project through the encapsulation surface for a length corresponding to the depth of female sections 25 and 26. Moreover, the cross-sectional shape of sections 27 and 2.8 conform to the shapes of sections 215 and 26, with means being provided for permitting the snap-type entrance of sections 27 and 28 "nce In operation, modules of .the type shown lin FIGUR-ES 1 and 2 may lbe stacked in the manner shown in FIG- URE 3 for the stacking of modules 30, .31, 32 and 33. Clearly, this stacking is easily done and will deiine an electrical circuit having the parallel connection of twenty-four diodes.
Suitable electrical terminal conductors may be formed in the manner illustrated by terminal conductors 3=5 and f 36 which are received by the fem-ale conductor portions into the equivalent sections 25 and 26 of an adjacent module.
of `the upper module 30. The projecting sections 37 and 38 of lower module 33 may then be capped by a suitable insulation cap or can be clipped off to prevent their accidental short circuiting.
rDhe complete assembly is then held in position, for example, by a frame member such as frame memlber 40 which has suitable securing means such as screws 41, 42, 43 and 44 passing therethrough and through corresponding openings such as opening 2'1 of FIGURES 1 and 2 of modules 30 through 33. A similar securement means will be received by the openings in the left-hand side of modules 30 through 33, but is not shown in FIG- URE 3.
While FIGURE 3 shows the modules connected in parallel circuit relation, it Will be apparent to those skilled in the art that this arrangement could be modiiied whereby the modules are connected in series with one another or can be connected in various series-parallel arrangements. For a direct series connection, the mcdules 31 and 313 Iwould be reversed; the projecting male sections of the connectors at the lett-hand side of modrules 30 and 32 and at the rightah-and side of module 31 would be removed or insulated fromv its adjacent module, and terminal 36 would ibe connected to the left-hand end of module 33.
The module structure shown in the gures may, of course, be modied in many ways. By way of example, the module structure may be formed to leave an opening 60 in the module of the shape shown in FIGURE 4 with lead conductor 61 extending into opening 60 with the encapsulating medium being flexible enough to permit connection of suitable connectors. For example, opening 60 may cooperate with a removable connector section such as the snap-type connector 62 of FIGURE 5 which could be snapped into opening 60.
The connector 62 of FIGURE 5 has an upper femaletype section 63 which is formed of slit sections in the usual manner to permit spreading of section 63 when making snap connection to a suitable male connector.
In a similar manner, the lower male-type sect-ion 64 of FIGURES 5 and 7 is also formed of a plurality of slit sections. Clearly, when the connector of FIGURE 5 is inserted into opening 60 in FIGURE 4, there will also -be engagement between lead 61 and the conductive connector body.
As indicated above, it is frequently desirable to have the lower male-type section of the connector (or -alternatively, the female section of a connector) electrically insulated from the adjacent connector of the next module. This would be necessary, for example, when arranging the modules in series relation.
FIGURE 8 illustrates a connector 70 which can be snapped into opening 60 of FIGURE 4, and includes the conductive upper section 71 with a lower insulation body 72. The insulation body 72 can, if desired, 'be slit in the manner illustrated in FIGURES 5 and 7 for conductive sections 64. The insulation section 72 is provided solely for mechanical purposes. It can, of course, be eliminated if desired with all mechanical connection between adjacent modules 4being accomplished by the cooperating conductive sections and clamps such as the clamp 40.
Although this invention has been described with respect to its preferred embodiments, it should be understood that many variations and modifications will now be obvious to those skilled in the art, and it is preferred therefore that the scope of the invention be limited not by the specific disclosure herein ,but only by the appended claims.
The embodiments of the invention in which an exclusive privilege or property -is claimed are defined as follows: Y
1. A diode module comprising a plurality of series connected diodes arranged in ya predetermined manner, first and second connectors connected to the respective ends of said series connection of diodes and an encapsulation medium for encapsulating said first and second connectors and said plurality of series connected diodes; said encapsulation medium having a first and second smooth opposing surfaces; said first and second connectors being elongated in a direction perpendicular vto said first and second smooth surfaces; said first and second connectors having respective female sections extending from said first surface; said first connectors having a male section extending from the end of said female section; said male section extending through said second surface for a distance substantially equal to the depth of said female section.
2. The device substantially as set forth in claim 1 wherein said second connector has an extending male section identical to said male section of said first connector.
3. The device substantially as set forth in claim 1 wherein said male section has dimensions for electrical connection with sa-id female section of said first and second connector.
4. The device substantially as set forth in claim 1 wherein said encapsulation medium has third and fourth smooth opposing surfaces perpendicular to said first and second surfaces; and a mounting opening extending through said encapsulation medium from said third surface to said fourth surface.
References Cited by the Examiner UNITED STATES PATENTS 5/1960 Silverschotz 339--17 X 7/ 1965 Richardson 317-101
Claims (1)
1. A DIODE MODULE COMPRISING A PLURALITY OF SERIES CONNECTED DIODES ARRANGED IN A PREDETERMINED MANNER, FIRST AND SECOND CONNECTORS CONNECTED TO THE RESPECTIVE ENDS OF SAID SERIES CONNECTED OF DIODES AND AN ENCAPSULATION MEDIUM FOR ENCAPSULATING SAID FIRST AND SECOND CONNECTORS AND SAID PLURALITY OF SERIES CONNECTED DIODES; SAID ENCAPSULATION MEDIUM HAVING A FIRST AND SECOND SMOOTH OPPOSING SURFACES; SAID FIRST AND SECOND CONNECTORS BEING ELONGATED IN A DIRECTION PERPENDICULAR TO SAID FIRST AND SECOND SMOOTH SURFACES; SAID FIRST AND SECOND CONNECTORS HAVING RESPECTIVE FEMALE SECTIONS EXTENDING FROM SAID FIRST SURFACE; SAID FIRST CONNECTORS HAVING A MALE SECTION EXTENDING FROM THE END OF SAID FEMALE SECTION; SAID MALE SECTION EXTENDING THROUGH SAID SECOND SURFACE FOR A DISTANCE SUBSTANTIALLY EQUAL TO THE DEPTH OF SAID FEMALE SECTION.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US371197A US3268774A (en) | 1964-05-29 | 1964-05-29 | Encapsulated diode assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US371197A US3268774A (en) | 1964-05-29 | 1964-05-29 | Encapsulated diode assembly |
Publications (1)
Publication Number | Publication Date |
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US3268774A true US3268774A (en) | 1966-08-23 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US371197A Expired - Lifetime US3268774A (en) | 1964-05-29 | 1964-05-29 | Encapsulated diode assembly |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3465435A (en) * | 1967-05-08 | 1969-09-09 | Ibm | Method of forming an interconnecting multilayer circuitry |
US4398235A (en) * | 1980-09-11 | 1983-08-09 | General Motors Corporation | Vertical integrated circuit package integration |
US4697223A (en) * | 1980-03-24 | 1987-09-29 | Heinz Grunst | Electrical apparatus, particularly apparatus for installation |
US4797113A (en) * | 1987-02-05 | 1989-01-10 | Lambert Roger T | Board to board flexible pin |
US5411400A (en) * | 1992-09-28 | 1995-05-02 | Motorola, Inc. | Interconnect system for a semiconductor chip and a substrate |
WO1997027729A1 (en) * | 1996-01-23 | 1997-07-31 | Xiaoli Zhou | Reusable electronic circuit building set with interchangeable modular components |
US6672795B1 (en) | 2000-05-11 | 2004-01-06 | Zyvex Corporation | System and method for coupling microcomponents |
US6676416B1 (en) * | 2000-05-11 | 2004-01-13 | Zyvex Corporation | Ribbon cable and electrical connector for use with microcomponents |
US6837723B1 (en) | 2002-05-24 | 2005-01-04 | Zyvex Corporation | Self-actuating connector for coupling microcomponents |
US20050181636A1 (en) * | 2004-02-13 | 2005-08-18 | Zyvex Corporation | Sockets for microassembly |
US20050199821A1 (en) * | 2004-03-12 | 2005-09-15 | Zyvex Corporation | Compact microcolumn for automated assembly |
US20050199822A1 (en) * | 2004-03-12 | 2005-09-15 | Zyvex Corporation | Mems based charged particle deflector design |
US7096568B1 (en) | 2003-07-10 | 2006-08-29 | Zyvex Corporation | Method of manufacturing a microcomponent assembly |
US7314382B2 (en) | 2005-05-18 | 2008-01-01 | Zyvex Labs, Llc | Apparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies |
US20080087841A1 (en) * | 2006-10-17 | 2008-04-17 | Zyvex Corporation | On-chip reflectron and ion optics |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2938068A (en) * | 1957-10-28 | 1960-05-24 | Itt | Electrical connectors |
US3196318A (en) * | 1960-06-06 | 1965-07-20 | Ibm | High density electronic package |
-
1964
- 1964-05-29 US US371197A patent/US3268774A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2938068A (en) * | 1957-10-28 | 1960-05-24 | Itt | Electrical connectors |
US3196318A (en) * | 1960-06-06 | 1965-07-20 | Ibm | High density electronic package |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3465435A (en) * | 1967-05-08 | 1969-09-09 | Ibm | Method of forming an interconnecting multilayer circuitry |
US4697223A (en) * | 1980-03-24 | 1987-09-29 | Heinz Grunst | Electrical apparatus, particularly apparatus for installation |
US4398235A (en) * | 1980-09-11 | 1983-08-09 | General Motors Corporation | Vertical integrated circuit package integration |
US4797113A (en) * | 1987-02-05 | 1989-01-10 | Lambert Roger T | Board to board flexible pin |
US5411400A (en) * | 1992-09-28 | 1995-05-02 | Motorola, Inc. | Interconnect system for a semiconductor chip and a substrate |
WO1997027729A1 (en) * | 1996-01-23 | 1997-07-31 | Xiaoli Zhou | Reusable electronic circuit building set with interchangeable modular components |
US5742486A (en) * | 1996-01-23 | 1998-04-21 | Xiaoli Zhou | Reusable electronic circuit building set with interchangeable modular components |
US6676416B1 (en) * | 2000-05-11 | 2004-01-13 | Zyvex Corporation | Ribbon cable and electrical connector for use with microcomponents |
US6672795B1 (en) | 2000-05-11 | 2004-01-06 | Zyvex Corporation | System and method for coupling microcomponents |
US6837723B1 (en) | 2002-05-24 | 2005-01-04 | Zyvex Corporation | Self-actuating connector for coupling microcomponents |
US7096568B1 (en) | 2003-07-10 | 2006-08-29 | Zyvex Corporation | Method of manufacturing a microcomponent assembly |
US20050181636A1 (en) * | 2004-02-13 | 2005-08-18 | Zyvex Corporation | Sockets for microassembly |
US7025619B2 (en) | 2004-02-13 | 2006-04-11 | Zyvex Corporation | Sockets for microassembly |
US20050199821A1 (en) * | 2004-03-12 | 2005-09-15 | Zyvex Corporation | Compact microcolumn for automated assembly |
US20050199822A1 (en) * | 2004-03-12 | 2005-09-15 | Zyvex Corporation | Mems based charged particle deflector design |
US7314382B2 (en) | 2005-05-18 | 2008-01-01 | Zyvex Labs, Llc | Apparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies |
US20080087841A1 (en) * | 2006-10-17 | 2008-04-17 | Zyvex Corporation | On-chip reflectron and ion optics |
US7605377B2 (en) | 2006-10-17 | 2009-10-20 | Zyvex Corporation | On-chip reflectron and ion optics |
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