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Publication numberUS3268774 A
Publication typeGrant
Publication dateAug 23, 1966
Filing dateMay 29, 1964
Priority dateMay 29, 1964
Publication numberUS 3268774 A, US 3268774A, US-A-3268774, US3268774 A, US3268774A
InventorsErnest E Ortner
Original AssigneeInt Rectifier Corp
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Encapsulated diode assembly
US 3268774 A
Abstract  available in
Previous page
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Claims  available in
Description  (OCR text may contain errors)

Unted States Patent O 3,268,774 ENCAPSULATED DIODE ASSEMBLY Ernest E. Ortner, Los Angeles, Calif., assignor to International Rectifier Corporation, El Segundo, Calif., a corporation of California Filed May 29, 1964, Ser. No. 371,197 4 Claims. (Cl. 317-101) This invention relates to a novel diode `assembly structure, and more specifically relates to a diode assembly structure Iwherein diodes are encapsulated in -a support lbody having extending plug connectors and sockets which may be easily stacked and connected to one another to tormdiode assemblages containing a large number of diodes.

A primary object of this invention is to provide a novel encapsulated diode assembly iw-hich can be easily connected to other similar assemblies to form various rectier ooniigurations.

Another object of this invention is to provide a novel plug-in rectifier module.

These and other objects of this invention will become apparent from the following description when taken in connection with the drawings in which:

FIGURE 1 shows a side cross-sectional view of a single module manufactured in accordance with the present invention.

FIGURE -2 shows a top View of FIGURE l.

[FIGURE 3 illustrates the connection of a plurality of modules of the type shown in FIGURES l and 2.

FIGURE 4 shows a partial cross-sectional view of the encapsulation medium for one of the modules Wherein plug connectors can be connected to the module in a simplitied manner.

FIGUR-E 5 illustrates a plan View of a typical connector that can be used with the device off FIGURE 4.

FIGURE 6 is a top view of the connector of FIG- URE 5.

FIGURE 7 is a bottom View yof the connector of FIGURE 5.

FIGURE 8 is a partial cross-sectional view of a connector similar to that of FIGURE 5, but which has an insulated projecting section.

Referring now to FIGURES l and 2, I have illustrated therein a typical module constructed in accordance with the invention which is formed of .a series connection of diode elements 10 through 15. Each of diodes 10 through 15 may be of the type disclosed in copending application Serial No. 261,109 tiled February 26, 1963 entitled Semiconductor Device Housing and assigned to the assignee of the lpresen-t invention. These diodes 10 through 1-5 are each connected in series with one another, and terminate on plug-type connectors 16 and 17, respectively.

The complete assembly is then encapsulated in a suitable insulation medium, as schematically illustrated by the dotted lines in FIGURE l, Where the encapsulation medium preferably has openings su-ch as openings 20 and 21 therein which can serve to receive mounting means which supports the module in a suitable support frame.

The connectors 16 and 17 are seen to comprise two sections. The upper sections are female-type sections 25 and 26, respectively, while the lower sections are male-type sections 27 and 28, respectively. Note that the male sections 27 and 28 project through the encapsulation surface for a length corresponding to the depth of female sections 25 and 26. Moreover, the cross-sectional shape of sections 27 and 2.8 conform to the shapes of sections 215 and 26, with means being provided for permitting the snap-type entrance of sections 27 and 28 "nce In operation, modules of .the type shown lin FIGUR-ES 1 and 2 may lbe stacked in the manner shown in FIG- URE 3 for the stacking of modules 30, .31, 32 and 33. Clearly, this stacking is easily done and will deiine an electrical circuit having the parallel connection of twenty-four diodes.

Suitable electrical terminal conductors may be formed in the manner illustrated by terminal conductors 3=5 and f 36 which are received by the fem-ale conductor portions into the equivalent sections 25 and 26 of an adjacent module.

of `the upper module 30. The projecting sections 37 and 38 of lower module 33 may then be capped by a suitable insulation cap or can be clipped off to prevent their accidental short circuiting.

rDhe complete assembly is then held in position, for example, by a frame member such as frame memlber 40 which has suitable securing means such as screws 41, 42, 43 and 44 passing therethrough and through corresponding openings such as opening 2'1 of FIGURES 1 and 2 of modules 30 through 33. A similar securement means will be received by the openings in the left-hand side of modules 30 through 33, but is not shown in FIG- URE 3.

While FIGURE 3 shows the modules connected in parallel circuit relation, it Will be apparent to those skilled in the art that this arrangement could be modiiied whereby the modules are connected in series with one another or can be connected in various series-parallel arrangements. For a direct series connection, the mcdules 31 and 313 Iwould be reversed; the projecting male sections of the connectors at the lett-hand side of modrules 30 and 32 and at the rightah-and side of module 31 would be removed or insulated fromv its adjacent module, and terminal 36 would ibe connected to the left-hand end of module 33.

The module structure shown in the gures may, of course, be modied in many ways. By way of example, the module structure may be formed to leave an opening 60 in the module of the shape shown in FIGURE 4 with lead conductor 61 extending into opening 60 with the encapsulating medium being flexible enough to permit connection of suitable connectors. For example, opening 60 may cooperate with a removable connector section such as the snap-type connector 62 of FIGURE 5 which could be snapped into opening 60.

The connector 62 of FIGURE 5 has an upper femaletype section 63 which is formed of slit sections in the usual manner to permit spreading of section 63 when making snap connection to a suitable male connector.

In a similar manner, the lower male-type sect-ion 64 of FIGURES 5 and 7 is also formed of a plurality of slit sections. Clearly, when the connector of FIGURE 5 is inserted into opening 60 in FIGURE 4, there will also -be engagement between lead 61 and the conductive connector body.

As indicated above, it is frequently desirable to have the lower male-type section of the connector (or -alternatively, the female section of a connector) electrically insulated from the adjacent connector of the next module. This would be necessary, for example, when arranging the modules in series relation.

FIGURE 8 illustrates a connector 70 which can be snapped into opening 60 of FIGURE 4, and includes the conductive upper section 71 with a lower insulation body 72. The insulation body 72 can, if desired, 'be slit in the manner illustrated in FIGURES 5 and 7 for conductive sections 64. The insulation section 72 is provided solely for mechanical purposes. It can, of course, be eliminated if desired with all mechanical connection between adjacent modules 4being accomplished by the cooperating conductive sections and clamps such as the clamp 40.

Although this invention has been described with respect to its preferred embodiments, it should be understood that many variations and modifications will now be obvious to those skilled in the art, and it is preferred therefore that the scope of the invention be limited not by the specific disclosure herein ,but only by the appended claims.

The embodiments of the invention in which an exclusive privilege or property -is claimed are defined as follows: Y

1. A diode module comprising a plurality of series connected diodes arranged in ya predetermined manner, first and second connectors connected to the respective ends of said series connection of diodes and an encapsulation medium for encapsulating said first and second connectors and said plurality of series connected diodes; said encapsulation medium having a first and second smooth opposing surfaces; said first and second connectors being elongated in a direction perpendicular vto said first and second smooth surfaces; said first and second connectors having respective female sections extending from said first surface; said first connectors having a male section extending from the end of said female section; said male section extending through said second surface for a distance substantially equal to the depth of said female section.

2. The device substantially as set forth in claim 1 wherein said second connector has an extending male section identical to said male section of said first connector.

3. The device substantially as set forth in claim 1 wherein said male section has dimensions for electrical connection with sa-id female section of said first and second connector.

4. The device substantially as set forth in claim 1 wherein said encapsulation medium has third and fourth smooth opposing surfaces perpendicular to said first and second surfaces; and a mounting opening extending through said encapsulation medium from said third surface to said fourth surface.

References Cited by the Examiner UNITED STATES PATENTS 5/1960 Silverschotz 339--17 X 7/ 1965 Richardson 317-101

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US2938068 *Oct 28, 1957May 24, 1960IttElectrical connectors
US3196318 *Jun 6, 1960Jul 20, 1965IbmHigh density electronic package
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US3465435 *May 8, 1967Sep 9, 1969IbmMethod of forming an interconnecting multilayer circuitry
US4398235 *Sep 11, 1980Aug 9, 1983General Motors CorporationVertical integrated circuit package integration
US4697223 *Jan 8, 1987Sep 29, 1987Heinz GrunstElectrical apparatus, particularly apparatus for installation
US4797113 *Feb 5, 1987Jan 10, 1989Lambert Roger TBoard to board flexible pin
US5411400 *Mar 14, 1994May 2, 1995Motorola, Inc.Interconnect system for a semiconductor chip and a substrate
US5742486 *Jan 23, 1996Apr 21, 1998Xiaoli ZhouReusable electronic circuit building set with interchangeable modular components
US6672795May 11, 2000Jan 6, 2004Zyvex CorporationSystem and method for coupling microcomponents
US6676416 *May 11, 2000Jan 13, 2004Zyvex CorporationRibbon cable and electrical connector for use with microcomponents
US6837723May 24, 2002Jan 4, 2005Zyvex CorporationSelf-actuating connector for coupling microcomponents
US7025619Mar 8, 2005Apr 11, 2006Zyvex CorporationSockets for microassembly
US7096568Jul 10, 2003Aug 29, 2006Zyvex CorporationMethod of manufacturing a microcomponent assembly
US7314382May 18, 2005Jan 1, 2008Zyvex Labs, LlcApparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies
US7605377Oct 17, 2006Oct 20, 2009Zyvex CorporationOn-chip reflectron and ion optics
US20050181636 *Mar 8, 2005Aug 18, 2005Zyvex CorporationSockets for microassembly
US20050199821 *Mar 12, 2004Sep 15, 2005Zyvex CorporationCompact microcolumn for automated assembly
US20050199822 *Nov 12, 2004Sep 15, 2005Zyvex CorporationMems based charged particle deflector design
US20080087841 *Oct 17, 2006Apr 17, 2008Zyvex CorporationOn-chip reflectron and ion optics
WO1997027729A1 *Jan 17, 1997Jul 31, 1997Xiaoli ZhouReusable electronic circuit building set with interchangeable modular components
U.S. Classification361/728, 439/80, 361/729, 29/874, 439/69, 439/638
International ClassificationH01L25/03, H01L23/48
Cooperative ClassificationH01L23/48, H01L25/03
European ClassificationH01L23/48, H01L25/03