|Publication number||US3451793 A|
|Publication date||Jun 24, 1969|
|Filing date||Dec 12, 1966|
|Priority date||Feb 12, 1966|
|Publication number||US 3451793 A, US 3451793A, US-A-3451793, US3451793 A, US3451793A|
|Original Assignee||Toko Inc|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (6), Referenced by (27), Classifications (20)|
|External Links: USPTO, USPTO Assignment, Espacenet|
J1me 1969 AKIRA MATSUSHITA 3,451,793
MAGNETIC THIN FILM WIRE WITH MULTIPLE LAMINATED FILM COATING Filed Dec. 12, 1966 FIG. 4
COERCIVE FORCE. HC 0 m 4 m TEMPERATURE INVENTOR.
' mum nm-susni-m Patented June 24, 1969 rm. Cl. Hillb 1/02 US. Cl. 29194 7 Claims This invention relates to wires coated with magnetic thin films (herein referred to as magnetic thin film wire) suitable foruse principally in memory elements and parametron elements. More particularly the invention concerns a new and improved magnetic thin film wire which is not subject to magnetostriction, has almost zero temperature coeflicient, and has extremely stable characteristics.
Magnetic thin film wires of the type referred to above consist of a conductor core wire coated with a magnetic thin film such as Permalloy applied on the conductor wire by electrodeposition. In general, since the magnetic thin film is affected by ambient temperatures, variations in temperature cause fluctuations in the magnetic characteristics, particularly the coercive force He, and, moreover, is readily subjected to magnetostriction.
It is an object of the present invention to provide a magnetic thin film wire which is almost completely free of magnetostriction, having a temperature coefficient close to zero, and having a remarkably stable characteristics.
Briefly stated, a feature of the magnetic thin film wire of the invention is that on the surfaces of a single conductor core wire, at least one thin film of an iron-nickel alloy of a compositional ratio of 50 percent of iron and 50 percent of nickel and at least one thin film of an iron-' nickel alloy of a compositional ratio of 21 percent of iron and 79 percent of nickel are deposited in laminate arrangement.
The nature and details of the invention will be more clearly apparent from the following detailed description with respect to preferred embodiments of the invention when read in conjunction with the accompanying drawing, in which like parts are designated by like reference numerals.
In the drawing:
FIGS. 1, 2, and 3 are fragmentary perspective views, with parts cut away, showing examples of magnetic thin film wire embodying the invention; and
FIG. 4 is a graphical representation indicating the relationship between temperature and coercive force in various components of the magnetic thin film wire according to the invention.
Referring to FIGS. 1, 2, and 3, there are shown examples of magnetic thin film wire embodying the invention. In each wire, a conductor core wire 1 is coated with at least one magnetic thin film 2 of an allow (hereinafter referred to as allow A) of 50 percent Fe and 50 percent Ni, and at least one magnetic thin film 3 of an alloy (hereinafter referred to as alloy B) of 21 percent Fe and 79 percent Ni.
FIG. 1 illustrates the most simple example in which the conductor core wire 1 is coated with one film 2 of alloy A which in turn is coated with one film 3 of alloy B. According to the invention, a plurality of alternate layers of films 2 and 3 may be deposited as illustrated in FIG. 2. I
Furthermore, an intermediate layer 4 of a conductor such as gold, silver, and copper or an insulating material can be interposed between magnetic thin films 2 and 3 as illustrated in FIG. 3. In this case, mutual interference between the magnetic thin films 2 and 3 can be reduced, and, by suitably selecting the material, thickness, and other features. of the intermediate film layer 4, magnetic thin film wires of various magnetization characteristics can be obtained.
The magnetization easy axes of the magnetic thin films 2 and 3 can be respectively selected as desired to be in the wire circumferential direction or the wire axial direction, it being possible to cause the two easy axes to be in the same direction or to be independently in different directions.
Alloy A (50% Fe, 50% Ni) and alloy B (21% Fe, 79% Ni) both have compositions which are not subject to magnetostriction and their respective temperature characteristics are as indicated in FIG. 4.
I have found that when a magnetic thin film wire is provided with composite layers of films of alloys A and B according to the invention, the temperature characteristic of the entire magnetic thin film wire becomes that as indicated by curve C in FIG. 4, whereby the temperature coefficient with respect to He is almost zero.
Moreover, since both of the alloys A and B have composition which, from the beginning, are not subject to magnetostriction, it is possible to produce a magnetic thin film wire which is not subject to magnetostriction, has practically zero temperature coefficient, and has extremely stable characteristics even when films of the alloys A and B are deposited in composite arrangement.
It should be understood, of course, that the foregoing disclosure relates to only preferred embodiments of the invention and that it is intended to cover all changes and modifications of the examples of the invention herein chosen for the purposes of the disclosure, which do not constitute departures from the spirit and scope of the invention as set forth in the appended claims.
What I claim is:
1. A magnetic thin film wire comprising a conductor core wire, at least one first film of an iron-nickel alloy containing 50 percent of iron and 50 percent of nickel, and at least one second film of an iron-nickel alloy containing 21 percent of iron and 79 percent of nickel, said first and second films being deposited to envelope the conductor core wire in alternate laminated layers.
2. A magnetic thin film' wire comprising a conductor core wire, at least one first film of an iron-nickel alloy containing 50 percent of iron and 50 percent of nickel, at least one second film of an iron-nickel alloy containing 21 percent of iron and 79 percent of nickel, and at least one intermediate film, said first and second films being deposited to envelope the conductor core wire in alternate laminated layers with said intermediate film interposed between adjacent first and second film.
3. The magnetic thin film wire as claimed in claim 2 in which the intermediate film is an electrical conductor.
4. The magnetic thin film as claimed in claim 2 in which the intermediate film is an electrical insulator.
5. The magnetic thin film wire as claimed in claim 1 in which all first and second films are caused to have magnetization easy axes in the wire axial direction.
6. The magnetic thin film wire as claimed in claim 1 in which all first and second films are caused to have magnetization easy axes in the wire circumferential direction.
7. The magnetic thin film wire as claimed in clainrl ""3-,-2-13,43'1 10/ 1965 Kolk etal. '340-174 in which either of the first and second films is caused to 3,328,195 6/1967 May 29-194 X have a. magnetization easy axis in a first direction and 3,350,180 10/1967 Croll 29--183.5 the other is caused to have a magnetization easy axis in a 3,375,091 3/1968 Feldtkeller 29--194 direction different from said first direction. 5
L. DEWAYNE RUTLEDGE, Primary Examiner.
References Cited E. L. WEISE, Assistant Examiner.
UNITED STATES PATENTS 2,853,402 9/1958 BlOiS 340-174 X 3,089,228 5/1963 Lynch 29-194 10 29 19s, 196.1, 196.6; 340 174
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US2853402 *||Aug 6, 1954||Sep 23, 1958||Blois Jr Marsden S||Magnetic element and method for producing the same|
|US3089228 *||Jul 21, 1958||May 14, 1963||Post Office||Magnetic strip material|
|US3213431 *||Dec 21, 1960||Oct 19, 1965||Ncr Co||Bilayer magnetic device operating as a single layer device|
|US3328195 *||Jun 24, 1966||Jun 27, 1967||Ibm||Magnetic recording medium with two storage layers for recording different signals|
|US3350180 *||Sep 30, 1963||Oct 31, 1967||Magnetic device with alternating lami- na of magnetic material and non-mag- netic metal on a substrate|
|US3375091 *||Mar 17, 1965||Mar 26, 1968||Siemens Ag||Storer with memory elements built up of thin magnetic layers|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US3531783 *||Aug 9, 1965||Sep 29, 1970||Sperry Rand Corp||Multilayer magnetic wire memory|
|US3576552 *||Dec 26, 1967||Apr 27, 1971||Ibm||Cylindrical magnetic memory element having plural concentric magnetic layers separated by a nonmagnetic barrier layer|
|US3637443 *||Nov 28, 1969||Jan 25, 1972||Motorola Inc||Method for annealing magnetic wire|
|US3736576 *||Nov 27, 1970||May 29, 1973||Plated wire magnetic memory device|
|US3757754 *||Sep 28, 1971||Sep 11, 1973||Milton Velinsky||Ignition system|
|US3922651 *||Oct 25, 1973||Nov 25, 1975||Kokusai Denshin Denwa Co Ltd||Memory device using ferromagnetic substance lines|
|US3994694 *||Mar 3, 1975||Nov 30, 1976||Oxy Metal Industries Corporation||Composite nickel-iron electroplated article|
|US3999174 *||Sep 19, 1975||Dec 21, 1976||The United States Of America As Represented By The Secretary Of The Navy||Discontinuous chromium film for memory element|
|US4180699 *||Jun 19, 1978||Dec 25, 1979||Gte Sylvania Incorporated||Shielded electrically conductor|
|US4374403 *||Jun 24, 1980||Feb 15, 1983||Matsushita Electric Industrial Co., Ltd.||Magnetic recording and reproducing system|
|US5736235 *||Aug 6, 1991||Apr 7, 1998||Hitachi, Ltd.||Magnetic recording medium having at least two magnetic layers with easy axes oriented in the same direction|
|US6713587 *||Jun 27, 2002||Mar 30, 2004||Ppg Industries Ohio, Inc.||Electrodepositable dielectric coating compositions and methods related thereto|
|US6824959||Jun 27, 2002||Nov 30, 2004||Ppg Industries Ohio, Inc.||Process for creating holes in polymeric substrates|
|US7000313||Jun 27, 2002||Feb 21, 2006||Ppg Industries Ohio, Inc.||Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions|
|US7002081||Aug 3, 2004||Feb 21, 2006||Ppg Industries Ohio, Inc.||Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof|
|US7159308||Sep 12, 2005||Jan 9, 2007||Ppg Industries Ohio, Inc.||Method of making a circuit board|
|US7228623||Nov 8, 2002||Jun 12, 2007||Ppg Industries Ohio, Inc.||Process for fabricating a multi layer circuit assembly|
|US8065795||Jun 8, 2007||Nov 29, 2011||Ppg Industries Ohio, Inc||Multi-layer circuit assembly and process for preparing the same|
|US8598467||Oct 18, 2011||Dec 3, 2013||PPG Industries Chio, Inc.||Multi-layer circuit assembly and process for preparing the same|
|US20030140490 *||Nov 8, 2002||Jul 31, 2003||Olson Kevin C.||Multi-layer circuit assembly and process for preparing the same|
|US20040000049 *||Jun 27, 2002||Jan 1, 2004||Mccollum Gregory J.||Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions|
|US20050006138 *||Aug 3, 2004||Jan 13, 2005||Wang Alan E.||Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof|
|US20060005995 *||Sep 12, 2005||Jan 12, 2006||Wang Alan E||Circuit board and method of manufacture thereof|
|US20060075633 *||Nov 29, 2005||Apr 13, 2006||Wang Alan E||Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof|
|US20060213685 *||May 26, 2006||Sep 28, 2006||Wang Alan E||Single or multi-layer printed circuit board with improved edge via design|
|US20140138366 *||Nov 11, 2013||May 22, 2014||GM Global Technology Operations LLC||Self-adjusting wire for welding applications|
|WO2015006660A3 *||Jul 11, 2014||Nov 26, 2015||The University Of Florida Reearch Foundation, Inc.||Low ohmic loss radial superlattice conductors|
|U.S. Classification||428/611, 365/139, 428/900, 428/671, 428/829, 307/403, 365/131, 365/133, 428/681, 428/928, 428/680, 365/171, 428/826, 428/931|
|Cooperative Classification||Y10S428/928, Y10S428/931, H01B11/14, Y10S428/90|