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Publication numberUS3644792 A
Publication typeGrant
Publication dateFeb 22, 1972
Filing dateJul 2, 1970
Priority dateJul 2, 1970
Publication numberUS 3644792 A, US 3644792A, US-A-3644792, US3644792 A, US3644792A
InventorsJohn H Fields
Original AssigneeHoneywell Inf Systems
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Reusable circuit board for constructing logic circuits using integrated circuit elements
US 3644792 A
Abstract  available in
Images(1)
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Claims  available in
Description  (OCR text may contain errors)

Unite States atent I 1 92 Fields [451 Feb. 22, 1972 [54] REUSABLE CIRCUIT BOARD FOR [56] References Cited CONSTRUCTING LOGIC CIRCUITS OTHER PUBLICATIONS USING INTEGRATED CIRCUIT ELEMENTS Inventor: John H. Fields, Phoenix, Ark.

Assignee: Honeywell Information Systems Inc Ariz.

Filed: mm, 1970 Appl. Nos 51,873-

317/101 CP', 3139/17 C, 17 CF, 276 A, 29/626; 324/158 F High-Density Dualin- Line Packaging Panels," Catalog No. 266 appearing between pages 112- 1l3'of Electronic Design, Aug. 2, 1967, Vol. 15, No. 16 (6 pages) Primary Examiner-Darrell L. Clay Attorney-Edward W. Hughes, James A. Pershon, Frank L.

' Neuhauser, Oscar B. Waddell and Joseph B. Forman [5 7] ABSTRACT The device disclosed utilizes a circuit board having pin connectors mounted thereon for use in combination with an integrated circuit package and a demountable solderless connector for mounting the package on the board. The combination, depending upon the electrical connections to the pin connectors, allows various types of logic structures to be designed and laid out many times over without degrading or damaging the circuit board or the electronic elements.

6 Claims, 3 Drawing Figures REUSABLE CIRCUIT BOARD FOR CONSTRUCTING LOGIC CIRCUITS USING INTEGRATED CIRCUIT ELEMENTS BACKGROUND OF THE INVENTION The present invention relates generally to circuit boards and more particularly to a device which allows logic structures and circuits to be built up on a circuit board using multi-lead electronic emen s SJJ ILQS. i r= sica tjadeaa- 1. Field of thelnvention In the fieldof electronic circuit design it is customary to design and build what is commonly referred to as a prototype" or breadboard" circuit. This custom is particularly true in the case of printed circuit board designs utilizing integrated circuits due to the difficulties and expense'of-making changes or corrections to the circuitry once the board has been fabricated. As such, it is desirable to provide a device for the economical design and construction of prototype circuits to prove the operation of the circuits prior to their fabrication into a final printed circuit board. It is also desirable that the device be constructed such that multilead electronic components and wire connections can be readily changed on the device while the circuit is in its design stages.

2. Description ofthe Prior Art For a clear understanding of the terminology employed throughout this specification a circuit board is defined as a substrate of insulative material having a planar surface including means for mounting and electrically interconnecting electrical and electronic components or elements.

Circuit board design engineers have always been faced with the problem of being able to make wire and component changes to circuits on prototype or special purpose circuit boards without damaging or destroying the circuit board or the components mounted thereon.

In the prior art, several approaches have been used to provide a properly designed reusable circuit board for special purpose and prototype circuit designs. One such approach utilizes a circuit board having a plurality of holes formed therein. The connecting leads of integrated circuit packages or the like are inserted into the holes and soldered to a conductive material surrounding the holes on the side of the board opposite the circuit packages. Wires, which are used to interconnect the various connecting leads of the circuit packages, are also soldered to the conductive material. The circuit board is also provided with a printed circuit connector on one end thereof so that the board may be plugged into a suitable receptacle during test or operation of the circuit.

Another approach employed in the prior art uses a circuit board somewhat similar to that just described. However, instead of soldering the connecting leads of the circuit packages directly to the circuit board conductive material, integrated circuit package connectors are used. Leads of the circuit package connectors are soldered to the board in the same manner as described for the circuit packages and all point-topoint wiring is done on the leads of the connectors. The connecting leads of the circuit packages are then inserted into spring tension receptacles of the integrated circuit connectors.

There are a number of problems not solved by the previouslydescribed approaches. One of these problems is that the interconnecting wires must be soldered to printed wire connecting points on the side of the board opposite the components. This has the disadvantage of requiring the unsoldering of a wire whenever a change is to be made to the circuit wiring. Further, due to the small size of the connecting points, it is difficult to connect more than one wire to a given point. Also, continuous heating of the printed circuit connecting points can damage the integrated circuits and cause the etched printed circuit conductor to separate from the circuit board. As a result, the board and circuit packages are eventually destroyed and must be replaced.

Another disadvantage of the previously described prior art is the overall thickness of the circuit board. This thickness takes into consideration the thickness of the substrate and the thickness of the circuit packages. In addition the integrated circuit connector leads protruding from the substrate and the wires which are utilized to interconnect the integrated circuits add to the thickness of the circuit board. The thickness of the board becomes a predominant consideration in many applications. For example, in the computer industry, circuit boards are packaged close together in equipment cabinets to provide density and to reduce the overall size of the cabinets. It is not uncommon to vertically mount circuit boards on /-inch centers, and to do so requires that the components, wires, etc., on the boards not touch adjacent boards. I

SUMMARY OF THE INVENTION The device of the present invention alleviates these problems of the prior art by providing a universal reusable circuit board for designing logic structures and electronic circuits. The circuit board is adapted to plug into a suitable electrical receptacle to provide electrical potentials and signals so that the circuits on the board can be operated or tested. Further included on the circuit board is a plurality of pins, some of which are used in combination with demountable solderless connectors for electrically connecting and mounting integrated circuit packages on the circuit board. Other pins serve to facilitate the removable interconnection of wires among the pins ofthe circuit board to design the circuits.

The circuit board of the present invention provides the capability of designing logic structures or circuits for prototype design of limited usage which more closely approximates a finished printed circuit board design than prior art circuit boards. Also the present invention eliminates the requirement of making solder connections on the circuit board, thus allowing the circuit board and associated components to be used many times over.

It is, therefore, an object of the present invention to provide a device for the designing of logic structures using multilead electronic elements;

It is a further object to provide a circuit board including a plurality of pins in combination with an integrated circuit and a connector for designing logic structures;

A still further object is to provide a circuit board having all components and wiring mounted on one side thereof;

A further object is to provide a circuit board having pins, some of which are used for making wiring connections and others for removably mounting an integrated circuit assembly;

It is still a further object to provide a circuit board having a plurality of sets of pins for electrically connecting conductive leads of an integrated circuit assembly to a selected set and for selectively interconnecting wires among the pins of another set,

It is yet a further object to provide a circuit board having contact means for establishing electrical connections between the circuit board and external electrical potentials and signals and including a plurality of sets of pins, one set for electrically connecting conductive leads of an integrated circuit assembly to a second set and further including wires selectively interconnecting the second set and the contact means.

The foregoing and other objects will become apparent as this description proceeds and the features of novelty which characterize the invention will be pointed out in particularity in the claims annexed to and forming a part of this specification.

BRIEF DESCRIPTION OF THE DRAWING The present invention may be more readily described and understood by reference to the accompanying drawing in which:

FIG. 1 is an isometric view of a fragmentary portion of a circuit board of the present invention;

FIG. 2 is a top view of the printed circuit board of FIG. 1;

FIG. 3 is an enlarged fragmentary section view taken on the line 3-3 of FIG. 2. I

FIG. 1 is an isometric drawing of a circuit board 5 of the preferred embodiment which is fabricated preferably from a sheet of insulative material. Included as a part of board 5 are a plurality of connecting pins 7 and 8, mounting pins 9 and 10, and terminating pins 11 rigidly mounted in a vertical position on the planar surface of the board. The connecting pins are arranged into a first set of two rows, a first row of connecting pins 7 and a second row of connecting pins 8. In a similar fashion the mounting pins are juxtapositionally arranged inside connecting pins 7 and 8 into a second set, a third row of mounting pins 9 and a fourth row of mounting pins 10. Con-' necting pins 7 and 8 and terminating pins 11 serve as connecting terminals for conductors or wires 22. In FIG. 1 the conductors 22 are shown connected to pins 7, 8 and-11 by the wellknown method of wrapping the wire around the pins; however, any suitable means for connecting the conductors to the pins may be used. An example for purely experimental use is to use a wire with clips on each end as the conductors 22 to selectively fasten the conductors to the correct pins. The clips provide for the easy removal of the conductors when it is necessary to make circuitry changes during experimentation.

Mounting pins 9 and are utilized for the mounting or installation of a circuit or component assembly 13 on the circuit board 5. The circuit assembly 13 is comprises of an integrated circuit package 15 and an integrated circuit connector 17. Preferably at the time of manufacture, the circuit package 15 is positioned on top-of the circuit connector 17 such that a plurality of conductive leads 19 of the circuit package extend through corresponding ones of a plurality of apertures 21 in the circuit connector. The portions of the leads 19 extending through the apertures 21 are bent inwardly toward the bottom center of the circuit connector 17 to firmly assemble the circuit package 15 and circuit connector 17 into circuit assembly As shown in FIGS. 1, 2 and 3, circuit assembly 13 is mounted on the circuit board 5 by positioning the apertures 21 over corresponding mounting pins 9 and 10 and pressing the assembly toward the circuit board 5. With the circuit assembly 13 in place on the circuit board, a tight electrical connection is established within each of the apertures 21 between the adjacent surfaces of the corresponding conductive leads 19 and mounting pins 9 and 10.

The integrated circuit connector 17, illustrated in the present embodiment, is preferably of the type disclosed in US. Pat. No. 3,605,062, issued to William G. Tinkelenberg, et al., entitled, A Connector and Handling Device for Multilead Electronic Elements, and assigned to the same assignee as the present invention.

As shown in FIGS. 1 and 3 in particular, a suitable connecting means or conductors 23, such as an etched printed circuit conductor, is utilized to connect individual ones of the connecting pins 7 and 8 to corresponding ones of the mounting pins 9 and 10 respectively. Thus, each lead of the plurality of conductive leads 19 of the circuit package 15 establishes electrical contact with corresponding ones of the connecting pins 7 and 8 via conductors 23.

Referring again to the terminating pins' 11 (FIGS. 1, 2 and 3), it is shown that the terminating pins 11 are individually electrically connected to an associated one of a plurality of etched conductive layers 25 on one end of the circuit board. The conductive layers 25 provide a suitably arranged contact means for plugging the board 5 into a properly adapted receptacle during operation or testing of the circuit previously wired on the board.

The receptacle is utilized in conjunction with the conductive layers 25 and terminating pins 11 to provide the necessary connection of electrical potentials and signals required for the operation and testing of the integrated circuit packages 15 on the circuit board 5. The electrical potentials and signals are selectively distributed from and to the integrated circuits via the terminating pins 11, the conductors 22 and the connecting pins 7 and 8. lnterconnections necessary for the integrated circuit packages 15 are also provided via conductors 22 and connecting pins 7 and 8.

For exemplary purposes, FIG. 1 and 2 show the interconnection among connecting pins 7 and 8 and terminating pins 11 by the utilization of conductors 22 which are wrapped than one conductor to a single pin.

It can be readily seen in the drawing that all wiring is accomplished on the component or integrated circuit mounting side of the circuit board, thus facilitating circuit layout and the dressing of wires on the board. This facilitation makes it possible for the circuit design engineer to optimally lay out a circuit or logic structure on the board to such an extent that the lengths and the routing of conductors 22 are relatively close to what is required in a final printed circuit board design, thus simplifying the final design work required to prepare a finished printed circuit board. I

While the principles of the invention have now been made clear in a preferred embodiment, there will be immediately obvious to those skilled in the art many modifications of structure, arrangement, proportions, the elements, materials and components used in the practice of the invention and otherwise which are particularly adapted for specific environments and operating requirements without departing from those principles. The appended claims are, therefore, intended to cover and embrace any such modifications within the limits only of the true scope of the invention.

Iclaim:

1. A reusable circuit board for designing logic structures utilizing integrated circuits comprising, in combination:

an insulative material having a planar surface;

first and second sets of pins vertically mounted on said planar surface;

connecting means on said planar surface interconnecting selected ones of the pins of said first set to selected ones of the pins of said second set;

a removable component assembly including a connector having a plurality of apertures formed therein and a multilead integrated circuit package mounted on said connector, each of said apertures receiving a lead from said circuit package and one pin of said first set of pins to form an electrical connection therebetween; and

a plurality of conductors wrapped to selected pins of said second set of pins to apply electrical signals and electrical potentials to said integrated circuit package for designing a logic structure.

2. A reusable circuit board for designing electronic circuits comprising, in combination:

an insulative material having a planar surface;

a plurality of first pins vertically mounted on said planar surface;

a plurality of second pins equal in number to the number of said first pins vertically mounted on said planar surface adjacent said first pins;

a plurality of third pins vertically mounted on said planar surface;

a plurality of contact means for receiving external electrical signals and potentials, said contact means formed on said planar surface and connected to said plurality of third pins;

means electrically connecting individual ones of said first pins to corresponding ones of said second pins;

a multilead integrated circuit package;

an integrated circuit connector having a plurality of apertures formed therein, each of said apertures receiving a lead of said integrated circuit package and one of said first pins to form an electrical connection therebetween; and

electrical conductors selectively wrap connected to and interconnecting said plurality of second pins, electrical conductors selectively wrap connected to and between said second pins and said third pins to apply the electrical signals and electrical potentials to said multilead integrated circuit package to form an electronic circuit, all of said conductors lying below the upper extremities of said first, second, and third pins. 1 3. The circuit board of claim 2 in which a portion of the leads of said multilead integrated circuit package extending through said apertures are bent around said integrated circuit connector to join said package and said connector to form a removable assembly.

4. A reusable circuit board for designing electronic circuits comprising, in combination:

an insulative material having oppositely disposed sides; first, second and third sets of pins mounted on one of said sides, said third set of pins connected to external electrical signals and electrical potentials; means electrically connecting individual ones of the pins of said first set to corresponding ones of the pins of said second set; a removable assembly mounting and electrically connecting a multilead integrated circuit package to said first set of pins, said assembly including the multilead integrated circ uit package and a connector having apertures formed therein equal in number to the number ofconnecting pins in said first set, each of said apertures receiving a lead from said circuit package and a pin ofsaid first set to form an electrical connection therebetween; and

electrical conductors selectively wrap connected to and interconnecting said second set of pins, electrical conductors selectively wrap connected to and connecting said third set of pins to said second set of pins to apply the electrical signals and the electrical potentials to said multilead integrated circuit package to form an electronic circuit, all of said conductors lying below the upper extremities of said removable assembly and said first, second and third sets of pins.

5. A circuit board as recited in claim 4 wherein said first set of pins is aligned into first and second rows and said second set of pins is juxtapositionally aligned with said first and second rows into third and fourth rows, said third and fourth rows positioned between said first and second rows.

6. The circuit board of claim 4 in which a portion of the leads of said multilead integrated circuit package extending through said apertures are bent around said integrated circuit connector to form said removable assembly.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US3753046 *Nov 3, 1971Aug 14, 1973Univ Computing CoMulti-layer printed circuit board
US3760328 *Apr 19, 1972Sep 18, 1973Gte Automatic Electric Lab IncTelephone type electrical connectors
US3771101 *Jun 21, 1971Nov 6, 1973Bunker RamoElectronic circuit assemblies and method of manufacture
US3780211 *Dec 29, 1971Dec 18, 1973F VernetInsulating printed-circuit board having pin-shaped connecting members
US3825999 *Dec 26, 1972Jul 30, 1974United Wiring And Mfg Co IncMethod of connecting electrical component
US3846740 *Jul 17, 1972Nov 5, 1974Augat IncMultiple-pin plug adaptor
US3865454 *Jul 18, 1973Feb 11, 1975Loral CorpAdapter for high density connectors
US3917984 *Oct 1, 1974Nov 4, 1975Microsystems Int LtdPrinted circuit board for mounting and connecting a plurality of semiconductor devices
US3932012 *Sep 27, 1974Jan 13, 1976Gte Automatic Electric Laboratories IncorporatedComponent terminal system
US3950060 *Oct 29, 1974Apr 13, 1976Molex IncorporatedConnector assembly
US4012096 *Jun 4, 1975Mar 15, 1977Porta Systems CorporationTelephone connector block apparatus
US4188653 *Aug 17, 1978Feb 12, 1980Gte Sylvania IncorporatedElectrical component mounting package
US4195896 *Nov 29, 1978Apr 1, 1980Wescom, Inc.Program plug
US4414741 *May 22, 1981Nov 15, 1983Augat Inc.Process for interconnecting components on a PCB
US4490775 *May 24, 1982Dec 25, 1984Westinghouse Electric Corp.Universal programmable interface
US4516816 *Jan 5, 1983May 14, 1985Winthrop Michael FIn circuit modification device for dual in line packaged components
US4627162 *Nov 4, 1983Dec 9, 1986Augat IncorporatedMethod of producing a wired circuit board
US4648180 *Jan 29, 1985Mar 10, 1987Augat Inc.Method of producing a wired circuit board
US4698275 *Jul 16, 1986Oct 6, 1987Augat Inc.Wire mat mateable with a circuit board
US4734980 *May 13, 1986Apr 5, 1988Hitachi, Ltd.Printed circuit board wiring method
US4791722 *Dec 23, 1986Dec 20, 1988Ltv Aerospace And Defense Co.Method of designing and manufacturing circuits using universal circuit board
US4821150 *Mar 31, 1988Apr 11, 1989Hubbell IncorporatedPrinted circuit board mounting for communication termination
US4835345 *Sep 15, 1988May 30, 1989Compaq Computer CorporationPrinted wiring board having robber pads for excess solder
US4868980 *Jul 12, 1988Sep 26, 1989Ltv Aerospace & Defense CompanyMethod of designing and manufacturing circuits using universal circuit board
US5459284 *Sep 1, 1994Oct 17, 1995Motorola, Inc.Twisted-pair wire bond and method thereof
US5471010 *Oct 28, 1994Nov 28, 1995Motorola, Inc.Spatially separated uninsulated twisted wire pair
US6124773 *Jan 21, 1998Sep 26, 2000Victor Company Of Japan, Ltd.Deflection yoke
US20120271586 *Apr 19, 2011Oct 25, 2012Ching-Cheng WangTesting module for generating analog testing signal to external device under test, and related testing method and testing system thereof
Classifications
U.S. Classification361/767, 174/261, 174/254, 439/55, 361/777, 361/774
International ClassificationH05K3/22, H05K1/00, H05K7/06
Cooperative ClassificationH05K2201/10325, H05K2201/10303, H05K7/06, H05K1/0287, H05K3/222, H05K2201/10689, H05K2201/10287
European ClassificationH05K3/22A, H05K7/06