|Publication number||US3680037 A|
|Publication date||Jul 25, 1972|
|Filing date||Nov 5, 1970|
|Priority date||Nov 5, 1970|
|Publication number||US 3680037 A, US 3680037A, US-A-3680037, US3680037 A, US3680037A|
|Inventors||Stewart Nellis, Joseph Ellis Kopf, Adrian R Reti|
|Original Assignee||Tech Wire Prod Inc|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (6), Referenced by (192), Classifications (19), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
United States Patent Nellis et a1.
 ELECTRICAL INTERCONNECTOR  Inventors: Stewart Nellie, Colts Neck; Joseph Ellis Kopt, Cranford, both of N.J.; Adrian R. Reti, Cambridge, Mass.
 Assignee: Technical Wire Products Inc., Cranford,
 Filed: Nov. 5, 1970 [211 App]. No.: 87,172
 US. Cl ..339/61 M, 339/17 R, 339/18 C,
174/685, 29/628  Int. Cl. .1101! 13/24, HOSk 1/04  FieldofSearch ..339/17 R, 17 E,17A, 17C,
339/17 M, 18 R, 18 C, 59 R, 59 M, 61 R, 61 M, 150 R, 150 T, 151 R, 151 M, 154 R, 156 R; 174/68.5;
 References Cited UNITED STATES PATENTS 3,260,907 7/1966 Weller et a] ..339/27s R [451 July 25, 1972 3,541,222 11/1970 Parks et a1. ..174/68.S 3,094,585 6/1963 Rudner .174/68.5 UX 3,077,511 2/1963 Bohrer et a1. 1 74/685 3,324,445 6/1967 Miller ..339/61 M FOREIGN PATENTS OR APPLICATIONS 940,518 10/1963 Great Britain ..174/68.5
Primary Examiner-Marvin A. Champion Assistant Examiner-Lawrence J. Staab Attorney-Littlepage, Quaintance, Wray & Aisenberg [5 7] ABSTRACT Compressible electrical interconnectors have dielectric holder sheets with compressible conductive plastic rods extending through the sheets. When electrical contacts are pressed against opposite ends of the rods, interconnection is completed.
13 Claims, 6 Drawing Figures PATENIEBJuL 25 I972 3' 680 O 37 INVENTOIS STEWART NELLIS JOSEPH ELLIS KOPF ADRIAN R. FEETI 45 L mm? 7% J 7l4 )l KL M k ATTORNEYS ELEC'I'RICAL-INTERCONNECIOR BACKGROUND or THE INVENTION Electrical interconnectors for completing circuits between opposed contact areas are well known. Typically, the interconnectors are thin rigid sheets of dielectric material having holes which are filled with electrically conductive elements. Electrical contacts, such as contacts on printed circuit boards, are placed adjacent opposite sides of the interconnector so that the conductive elements in the interconnectors are lined with and positioned between appropriate complementary contact areas. Usually, small pressure is applied to the contact bearing members to insure sufficient electrical connection.
The contacts to be interconnected take any of several forms. In some devices the contacts are carefully insulated islands in the middle of the circuit board with the conductive wires being insulated or buried on or within the board. In other cases, such as in strip line connectors, parallel conductors may be exposed over a substantial surface area of a circuit board. Any area along any conductor serves as a contact area as controlled by the position of a conductive element in the dielectric retainer of the interconnector.
In other embodiments, a strip line connector may have several layers of connectors which are crossed and insulated from each other. Contacts on the surface of the board may be permanently connected with conductors within the board or holes through the insulation may expose contact areas on conductors within the boards. In the latter case, interconnectors have projecting elements which fit within the holes to reach the exposed area of the embedded conductor.
Some forms of interconnectors may be very thin sheets having openings which have resilient elements for projecting through the openings for contacting contacts on one side of the sheet. Several problems remain in the interconnector art.
For the most part, interconnectors are formed of a dielectric resin and metallic conductive elements. The dielectric retainer and metal conductive elements being of completely different materials require completely different fabricating steps. Hence, the cost of interconnecting devices is increased by the necessity of using dissimilar equipment and steps in manufacturing the dielectric and conductive portions. Temperatures required for the forming of thermoplastic or thermosetting dielectric materials are often too high to form the plastics about preformed fine metallic conductors. Where metals are flowed into openings in the interconductors, temperatures may cause destruction in the dielectric material or may cause latent damage to the interconnectors which may be found only after the connectors have been used for a period of time in expensive electronic equipment.
During use, metal contact elements may scratch or otherwise damage delicate contact areas on printed circuits. The best interconnectors employ highly conductive metal elements such as, for example, silver, and consequently, the high cost of the conducting element adds to the cost of the interconnectors. These and other problems cause the continued search for improved interconnectors.
SUMMARY OF THE INVENTION The present invention concerns interconnector elements and their making and using in which elements are short compressible rods having discreet conductors disposed therein and being positioned between contact areas which are intended for electrical connection. The elements'are assembled in a dielectric retainer which typically takes the form of a flat thin material having a plurality of holes extending from one surface to an opposite surface, with the elements disposed in the holes and extending from surface to surface. The retaining dielectric is flexible or rigid. In one rigid dielectric embodiment, compressible conductor elements extend beyond surfaces of the retainer. In another embodiment, compressible conductive elements are level with or depressed from relatively less compressible or incompressible surrounding dielectric material, and rigid convex contacts are fixed to junctions on the conductors to be connected. When used with convex contacts, conductive elements and rigid retainers may be flush with or depressed in the surface of rigid retainers. In both cases, the resilient conductive elements are compressed between complementary opposed contacts to complete electrical circuits.
When the retainer is resilient and compressible, the conductive elements are either compressible or rigid or relatively rigid. Although the conductive elements may extend outward from the surfaces of the dielectric retainer, the conductive elements are substantially coterminal with surfaces of the retainer in the preferred embodiments.
The dielectric retainer may be made of any convenient material which has a form sufficiently stable to hold the conductor elements in desired alignment with the contact areas. Any suitable therrnosetting or thermoplastic resin may be employed. In high heat applications, thennosetting resins are preferred. The resin used in the dielectric retainer may be identical with the resin of the conducting element.
In preferred embodiments, the conductive elements are resilient and compressible. When the dielectric retainer is resilient and compressible, the conductive elements may be made of materials having similar properties, or the elements may be made of relatively rigid materials.
In one embodiment of the invention, the retainer is made of a silicone rubber, and the conductive element is made of a silicone rubber having embedded therein chunks of similar silicone rubber and a finely dispersed conductive metal, such as for example, silver flake. The metallic content of the conductive element may be as low as about 1.5 percent by volume.
In one example of the manufacture of the interconnectors, rods are formed by mixing cured particles of room temperature vulcanizable-silicone rubber having average particle size of about 3 mils with uncured resin of the same silicone rubber and with silver flake smaller than 325 mesh. A suitable proportion is approximately 3 parts by weight cured particles, 3 parts uncured resin and catalyst in a 9 to 1 ratio and 5 parts silver flake. From 3 to 4 parts of alumina particles may be added. The dielectric retainer may be formed of similar room temperature vulcanizable silicone rubber without the particulate fillers.
The rods are precisely arranged in parallel relationships in a frame, and voids are filled with the flowable resin which will form the retainer. When the resin is cured, the block is sliced into several similar interconnector devices with particularly positioned conductor elements.
The invention has as one object the provision of electrical interconnectors having precisely positioned conductive elements of a dielectric resin containing discreet electrical connectors held in electrical conducting relationship in the elements.
Another object of the invention is the provision of compressible conductive elements precisely positioned in dieleccontacts on opposite sides of the retainer sheet. Other objects of the invention are methods for making compressible electri cal circuit interconnectors and for employing compressible circuit interconnectors.
The foregoing and other objects of the invention are ap parent in the disclosure which includes the foregoing and ongoing specification and claims and the drawings.
BRIEF DESCRIPTION OF THE DRAWINGS I FIG. 1 is a perspective view of an electrical interconnector of the present invention.
FIG. 2 is a detail of an interconnector showing a conductive particle-filled compressible connective element in, an insulating retainer.
FIG. 3 is an assembled detail of spaced opposed printed circuit boards with an interposed connector of the present invention and outer platens for pressing the circuit boards inward to insure electrical communication.
FlG. 4 is an exploded view of a strip line interconnection employing an interconnector of the present invention. FIG. 5 is an exploded view of an interconnector employed in an electroluminescent system.
FIG. 6 is a detail of a conductive element recessed in a dielectric material.
' f DETAILED DESCRIPTION OF THE DRAWINGS Referring to FIG. 1, an interconnector is generally referred to by the numeral 10. The dielectricresin retainer 12 has a plurality of holes which are filled with rod-like conductors 14 which are compressible and resilient. Preferably. dielectric material 12 is the same basic composition as conductive elements l4, and both have substantially the same resilience and compressibility. As shown in FIG. 1, elements 14 are flush with opposed surface areas of the dielectric material 12.
in FIG. 2, the detail shows a relatively resilient conductive element l6 extending slightly beyond opposite surfaces of a dielectric material retainer 18. Forces caused by compressing the oppositeends of elements 16 together in the application of the device insure good electrical contact. in this embodiment, retainer 18 may be made of a relatively rigid dielectric materiln-FlG. 3, interconnector 20 which has dielectric material 22 and conductive plastic elements 24, is positioned between circuit boards 26 and 28. Contact areas30 and 32 are joined by one of the conductive elements while contacts 34 and 36 are joined by theother conductive element. Platens 38 are employed to press boards 26a nd 28 inward to insure good contacts between the contact areas and the conductive elements. The dielectric material '22 and the basic material of conductive elements 24 is similar. Inward pressure of the platens 38tends to compress the conductive elements and dielectric material equally. Alternatively, the dielectric material 22 may have greater or lesser compressibility than the conductive elements 24.
As shown in FIG. 4, an interconnecting device 40 having dielectric material 42 and contact elements 44 is interposed between two strip line circuit boards 46 and 48. The inner hidden surface of board 46 has parallel vertical exposed conductive members 47. Board 48 has parallel horizontal exposed conductive members 49. When the boards are pressed together, conductive plastic elements interconnect specific vertical conductors with specific horizontal conductors.
ln FIG. 5, an electrical interconnector 50 has a dielectric material 52 and a plurality of conductive plastic elements 54 which interconnect contacts 56 on circuit board 58 with ap propriate contacts on the electroluminescent panel 60. A frame at the edges of the panel aids in the compression of the entire device to press the resilient conductors onto the contact areas insuring completed circuits in FIG. 6, a panel has a conductive element 64 recessed from the surface of dielectric material 62.
As described herein, the interconnector of the present inhave surface. irregularities due to production faults, thus eliminating errors caused by non-surface conforming interconnectors of the prior art when used with non-planar printed circuit surfaces.
While the invention has been particularly shown and described with reference to a preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
What is claimed is:
1. Electrical interconnecting apparatus comprising a dielectric material having first and second opposite surface areas and having at least one hole extending through the dielectric material from the first surface area to the second surface area, at least one elastomeric compressible resilient electroconductive element disposed in the hole, the at least one element comprising a dielectric resin containing discrete electrical conductors held in electrical conducting relationship in the element.
2. The electrical interconnecting apparatus of claim I wherein the dielectric material has a plurality of holes therein and wherein the at least one element comprises a plurality of elements disposed within the holes for electrically connecting a plurality of first contacts adjacent the first surface area of the material with a plurality of second contacts adjacent the second surface area of the material.
3. The electrical interconnecting apparatus of claim 1 wherein the dielectric material comprises a resin.
4. The electrical interconnecting apparatus of claim I wherein the dielectric material comprises a flexible, thin resin sheet.
5. The electrical interconnecting apparatus of claim I wherein the dielectric material comprises a thin resilient resin sheet.
6. The electrical interconnecting apparatus of claim 1 wherein the dielectric material comprises a flexible resilient and compressible resin sheet having first and second opposite faces and having a plurality of holes extending through the sheet, and wherein the at least one electroconductive elements comprises a plurality of elastomeric rods disposed in the vention provides solution to many' of the extant problems of the prior art. Cost economies are realized by the use of very ing element are temperature suited, since both are constructed of similar materials. The metal-filled compressible elements neither abrade nor otherwise damage the delicate contact areas of printed circuits.
The interconnectors of the present invention are lighter in weight than conventional interconnectors, since metallic content is reduced. Thepresent interconnectors conveniently and holes, the rods having electroconductors therein whereby a plurality of contacts adjacent the, first face are electrically connected with a plurality of contacts adjacent the second face. i
7. The electrical interconnecting apparatus of claim 6 wherein each rod has a plurality of relatively. small discreet conductors held by the elastomeric rods inelectrical conducting relation which is enhanced by compressing the rods between contacts adjacent the sheet faces.
8. The electrical interconnecting apparatus of claim] further comprising first contact bearing means adjacent the first surface area and having positioned thereon'at least one first contact adjacent the at least one element, and second contact holding means adjacent the second surface area and having a'second contact adjacent the at least one element andmeans pressing the first and second contact means inward thereby tending to compress the at least one element and completing an electrical circuit between the first and second contacts.
9. The apparatus of claim I wherein the element extends from one surface of the dielectric material to an opposite surface thereof.
10. The apparatus of claim 1 wherein the element extends beyond opposite surfaces of the dielectric material.
I]. The method of joining electrical contacts comprising positioning contacts opposite each other, interposing a dielectric retainer having a conductive elastomeric element extending therethrough between the contacts and pressing the contacts towards each other, thereby compressing the conductive elastomeric element and completing a circuit between the contacts.
12. Electrical interconnecting apparatus comprising a thoroughly interconnect printed circuit devices which may dielectric material having first and second opposite'surface areas and having at least one hole extending through the dielectric material from the first surface area to the second surface area, at least one electroconductive element disposed in the hole, the at least one element comprising a dielectric resin containing discrete electrical conductors held in electrical conducting relationship in the element, wherein the element terminates short of opposite surfaces of the dielectric material.
k l i Q
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3077511 *||Mar 11, 1960||Feb 12, 1963||Int Resistance Co||Printed circuit unit|
|US3094585 *||Apr 16, 1951||Jun 18, 1963||Garlock Inc||Fluorocarbon resin mixtures and metal to plastic bonding|
|US3260907 *||Sep 26, 1963||Jul 12, 1966||Vitramon Inc||Electrical unit and terminal lead connection therefor|
|US3324445 *||Apr 13, 1964||Jun 6, 1967||Miller Jack V||Electrical connectors|
|US3541222 *||Jan 13, 1969||Nov 17, 1970||Bunker Ramo||Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making|
|GB940518A *||Title not available|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US3835442 *||Feb 1, 1973||Sep 10, 1974||Bunker Ramo||Termination module utilizing conductive elastomer bussing|
|US3862790 *||Jul 10, 1972||Jan 28, 1975||Plessey Handel Investment Ag||Electrical interconnectors and connector assemblies|
|US3870385 *||Sep 10, 1973||Mar 11, 1975||Said Avakian By Said Laizerovi||Interconnecting systems and devices using conductive elastomer pellets in planar component supporting structures and in electronic circuit connectors|
|US3905666 *||Mar 4, 1974||Sep 16, 1975||Ebauches Sa||Device for the electric connection between a display device of an electronic timepiece and the circuit controlling the said display device|
|US3910029 *||Aug 1, 1973||Oct 7, 1975||Suwa Seikosha Kk||Liquid crystal timepiece with improved display panel|
|US3945196 *||May 30, 1974||Mar 23, 1976||American Microsystems, Inc.||Universal solid state time-keeping package|
|US3965665 *||Mar 31, 1975||Jun 29, 1976||Hughes Aircraft Company||Electronic watch construction|
|US3967162 *||Jul 23, 1975||Jun 29, 1976||Amp Incorporated||Interconnection of oppositely disposed circuit devices|
|US3971610 *||May 10, 1974||Jul 27, 1976||Technical Wire Products, Inc.||Conductive elastomeric contacts and connectors|
|US3998513 *||Jan 28, 1976||Dec 21, 1976||Shinetsu Polymer Co., Ltd||Multi-contact interconnectors|
|US4008300 *||Oct 15, 1974||Feb 15, 1977||A & P Products Incorporated||Multi-conductor element and method of making same|
|US4013344 *||Jun 9, 1975||Mar 22, 1977||U.S. Philips Corporation||Display device|
|US4027936 *||Jul 16, 1975||Jun 7, 1977||Kabushiki Kaisha Daini Seikosha||Connector having electro-conductive rubber terminal|
|US4050756 *||Dec 22, 1975||Sep 27, 1977||International Telephone And Telegraph Corporation||Conductive elastomer connector and method of making same|
|US4064623 *||Oct 28, 1976||Dec 27, 1977||International Telephone And Telegraph Corporation||Method of making conductive elastomer connectors|
|US4065197 *||Jun 17, 1974||Dec 27, 1977||Chomerics, Inc.||Isolated paths connector|
|US4118102 *||Apr 3, 1975||Oct 3, 1978||Chomerics, Inc.||Isolated path coupling system|
|US4158115 *||Jun 26, 1978||Jun 12, 1979||W. H. Brady Co.||Internally connecting flexible switch|
|US4326458 *||Jul 11, 1980||Apr 27, 1982||Sign Electronics Limited||Printing apparatus|
|US4364618 *||May 19, 1980||Dec 21, 1982||Burr-Brown Research Corp.||Electronic device package|
|US4408814 *||Aug 19, 1981||Oct 11, 1983||Shin-Etsu Polymer Co., Ltd.||Electric connector of press-contact holding type|
|US4421370 *||Jul 16, 1981||Dec 20, 1983||Accutest Corporation||Contact array|
|US4507341 *||Feb 17, 1984||Mar 26, 1985||Westland Plc||Carbon fibre structures|
|US4542082 *||Feb 8, 1982||Sep 17, 1985||California Institute Of Technology||Bipolar battery plate|
|US4574331 *||May 31, 1983||Mar 4, 1986||Trw Inc.||Multi-element circuit construction|
|US4655382 *||Nov 12, 1985||Apr 7, 1987||Raychem Corp.||Materials for use in forming electronic interconnect|
|US4664309 *||Jun 30, 1983||May 12, 1987||Raychem Corporation||Chip mounting device|
|US4705205 *||May 14, 1984||Nov 10, 1987||Raychem Corporation||Chip carrier mounting device|
|US4729809 *||Feb 17, 1987||Mar 8, 1988||Amp Incorporated||Anisotropically conductive adhesive composition|
|US4862588 *||Jul 21, 1988||Sep 5, 1989||Microelectronics And Computer Technology Corporation||Method of making a flexible interconnect|
|US4922376 *||Apr 10, 1989||May 1, 1990||Unistructure, Inc.||Spring grid array interconnection for active microelectronic elements|
|US4926549 *||May 30, 1989||May 22, 1990||Canon Kabushiki Kaisha||Method of producing electrical connection members|
|US4975079 *||Feb 23, 1990||Dec 4, 1990||International Business Machines Corp.||Connector assembly for chip testing|
|US4988306 *||May 16, 1989||Jan 29, 1991||Labinal Components And Systems, Inc.||Low-loss electrical interconnects|
|US4991290 *||Jun 16, 1989||Feb 12, 1991||Microelectronics And Computer Technology||Flexible electrical interconnect and method of making|
|US5007841 *||Mar 8, 1986||Apr 16, 1991||Trw Inc.||Integrated-circuit chip interconnection system|
|US5071359 *||Apr 27, 1990||Dec 10, 1991||Rogers Corporation||Array connector|
|US5087494 *||Apr 12, 1991||Feb 11, 1992||Minnesota Mining And Manufacturing Company||Electrically conductive adhesive tape|
|US5127837 *||Aug 28, 1991||Jul 7, 1992||Labinal Components And Systems, Inc.||Electrical connectors and IC chip tester embodying same|
|US5147210 *||Oct 1, 1991||Sep 15, 1992||Western Digital Corporation||Polymer film interconnect|
|US5148266 *||Sep 24, 1990||Sep 15, 1992||Ist Associates, Inc.||Semiconductor chip assemblies having interposer and flexible lead|
|US5163834 *||Jul 23, 1991||Nov 17, 1992||International Business Machines Corporation||High density connector|
|US5174766 *||Dec 19, 1991||Dec 29, 1992||Canon Kabushiki Kaisha||Electrical connecting member and electric circuit member|
|US5207585 *||Oct 31, 1990||May 4, 1993||International Business Machines Corporation||Thin interface pellicle for dense arrays of electrical interconnects|
|US5216807 *||Feb 11, 1992||Jun 8, 1993||Canon Kabushiki Kaisha||Method of producing electrical connection members|
|US5245751 *||Oct 25, 1991||Sep 21, 1993||Circuit Components, Incorporated||Array connector|
|US5258330 *||Feb 17, 1993||Nov 2, 1993||Tessera, Inc.||Semiconductor chip assemblies with fan-in leads|
|US5325094 *||May 15, 1992||Jun 28, 1994||Chomerics, Inc.||Electromagnetic energy absorbing structure|
|US5340318 *||Dec 9, 1992||Aug 23, 1994||Elastomeric Technologies, Inc.||Conductive elastomeric element electronic connector assembly|
|US5346861 *||Apr 9, 1992||Sep 13, 1994||Tessera, Inc.||Semiconductor chip assemblies and methods of making same|
|US5374196 *||May 2, 1994||Dec 20, 1994||Fujitsu Limited||High-density/long-via laminated connector|
|US5410807 *||Mar 30, 1994||May 2, 1995||International Business Machines Corporation||High density electronic connector and method of assembly|
|US5428190 *||Jul 2, 1993||Jun 27, 1995||Sheldahl, Inc.||Rigid-flex board with anisotropic interconnect and method of manufacture|
|US5443876 *||Dec 30, 1993||Aug 22, 1995||Minnesota Mining And Manufacturing Company||Electrically conductive structured sheets|
|US5485351 *||Jul 31, 1992||Jan 16, 1996||Labinal Components And Systems, Inc.||Socket assembly for integrated circuit chip package|
|US5495668 *||Dec 19, 1994||Mar 5, 1996||The Furukawa Electric Co., Ltd.||Manufacturing method for a supermicro-connector|
|US5502889 *||Jan 8, 1993||Apr 2, 1996||Sheldahl, Inc.||Method for electrically and mechanically connecting at least two conductive layers|
|US5519201 *||Apr 29, 1994||May 21, 1996||Us3, Inc.||Electrical interconnection for structure including electronic and/or electromagnetic devices|
|US5522962 *||May 19, 1995||Jun 4, 1996||Minnesota Mining And Manufacturing Company||Method of forming electrically conductive structured sheets|
|US5527998 *||Oct 22, 1993||Jun 18, 1996||Sheldahl, Inc.||Flexible multilayer printed circuit boards and methods of manufacture|
|US5576710 *||Jun 16, 1994||Nov 19, 1996||Chomerics, Inc.||Electromagnetic energy absorber|
|US5597313 *||Dec 21, 1994||Jan 28, 1997||Labinal Components And Systems, Inc.||Electrical connectors|
|US5599193 *||Aug 23, 1994||Feb 4, 1997||Augat Inc.||Resilient electrical interconnect|
|US5672062 *||May 11, 1994||Sep 30, 1997||Labinal Components And Systems, Inc.||Electrical connectors|
|US5679977 *||Apr 28, 1993||Oct 21, 1997||Tessera, Inc.||Semiconductor chip assemblies, methods of making same and components for same|
|US5682061 *||Jun 5, 1995||Oct 28, 1997||Tessera, Inc.||Component for connecting a semiconductor chip to a substrate|
|US5688584 *||Sep 27, 1995||Nov 18, 1997||Sheldahl, Inc.||Multilayer electronic circuit having a conductive adhesive|
|US5704795 *||Jun 3, 1996||Jan 6, 1998||Labinal Components And Systems, Inc.||Electrical connectors|
|US5727310 *||Jun 11, 1996||Mar 17, 1998||Sheldahl, Inc.||Method of manufacturing a multilayer electronic circuit|
|US5761036 *||Jun 6, 1995||Jun 2, 1998||Labinal Components And Systems, Inc.||Socket assembly for electrical component|
|US5788512 *||Jun 6, 1995||Aug 4, 1998||Labinal Components And Systems, Inc.||Electrical connectors|
|US5798780 *||Jun 7, 1995||Aug 25, 1998||Canon Kabushiki Kaisha||Recording element driving unit having extra driving element to facilitate assembly and apparatus using same|
|US5800650 *||Oct 16, 1995||Sep 1, 1998||Sheldahl, Inc.||Flexible multilayer printed circuit boards and methods of manufacture|
|US5820014 *||Jan 11, 1996||Oct 13, 1998||Form Factor, Inc.||Solder preforms|
|US5840417 *||Jun 1, 1995||Nov 24, 1998||Bolger; Justin C.||Multilayer electrical devices comprising area bonding conductive adhesive preforms|
|US5890915 *||May 17, 1996||Apr 6, 1999||Minnesota Mining And Manufacturing Company||Electrical and thermal conducting structure with resilient conducting paths|
|US5915170 *||Sep 16, 1997||Jun 22, 1999||Tessera, Inc.||Multiple part compliant interface for packaging of a semiconductor chip and method therefor|
|US5937276 *||Oct 8, 1997||Aug 10, 1999||Tessera, Inc.||Bonding lead structure with enhanced encapsulation|
|US5949246 *||Jan 28, 1997||Sep 7, 1999||International Business Machines||Test head for applying signals in a burn-in test of an integrated circuit|
|US5950304 *||May 21, 1997||Sep 14, 1999||Tessera, Inc.||Methods of making semiconductor chip assemblies|
|US5994152 *||Jan 24, 1997||Nov 30, 1999||Formfactor, Inc.||Fabricating interconnects and tips using sacrificial substrates|
|US6015081 *||Mar 7, 1994||Jan 18, 2000||Canon Kabushiki Kaisha||Electrical connections using deforming compression|
|US6030856 *||Jun 10, 1997||Feb 29, 2000||Tessera, Inc.||Bondable compliant pads for packaging of a semiconductor chip and method therefor|
|US6062870 *||Jun 7, 1995||May 16, 2000||Labinal Components And Systems, Inc.||Electrical interconnects|
|US6094059 *||Feb 1, 1999||Jul 25, 2000||International Business Machines Corporation||Apparatus and method for burn-in/testing of integrated circuit devices|
|US6094060 *||Feb 1, 1999||Jul 25, 2000||International Business Machines Corporation||Test head for applying signals in a burn-in test of an integrated circuit|
|US6118080 *||Jan 13, 1998||Sep 12, 2000||Micron Technology, Inc.||Z-axis electrical contact for microelectronic devices|
|US6133627 *||Dec 3, 1997||Oct 17, 2000||Tessera, Inc.||Semiconductor chip package with center contacts|
|US6144216 *||May 8, 1996||Nov 7, 2000||Enplas Corporation||Electric contact apparatus for inspecting a liquid crystal display panel|
|US6147870 *||Nov 19, 1998||Nov 14, 2000||Honeywell International Inc.||Printed circuit assembly having locally enhanced wiring density|
|US6191473||May 20, 1999||Feb 20, 2001||Tessera, Inc.||Bonding lead structure with enhanced encapsulation|
|US6210173 *||Jun 25, 1999||Apr 3, 2001||Unitechno Inc.||Electrical connector incorporating an elastic electrically conductive material|
|US6246014||Jul 24, 1998||Jun 12, 2001||Honeywell International Inc.||Printed circuit assembly and method of manufacture therefor|
|US6274823||Oct 21, 1996||Aug 14, 2001||Formfactor, Inc.||Interconnection substrates with resilient contact structures on both sides|
|US6372527||Sep 8, 1999||Apr 16, 2002||Tessera, Inc.||Methods of making semiconductor chip assemblies|
|US6373141||Aug 16, 1999||Apr 16, 2002||Tessera, Inc.||Bondable compliant pads for packaging of a semiconductor chip and method therefor|
|US6392306||Jul 24, 1998||May 21, 2002||Tessera, Inc.||Semiconductor chip assembly with anisotropic conductive adhesive connections|
|US6403226||May 17, 1996||Jun 11, 2002||3M Innovative Properties Company||Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance|
|US6433419||Jan 20, 2000||Aug 13, 2002||Tessera, Inc.||Face-up semiconductor chip assemblies|
|US6437584||Oct 10, 2000||Aug 20, 2002||Cascade Microtech, Inc.||Membrane probing system with local contact scrub|
|US6465893||Oct 19, 2000||Oct 15, 2002||Tessera, Inc.||Stacked chip assembly|
|US6578264||Apr 11, 2000||Jun 17, 2003||Cascade Microtech, Inc.||Method for constructing a membrane probe using a depression|
|US6686015||Jun 20, 2001||Feb 3, 2004||Tessera, Inc.||Transferable resilient element for packaging of a semiconductor chip and method therefor|
|US6708386||Mar 22, 2001||Mar 23, 2004||Cascade Microtech, Inc.||Method for probing an electrical device having a layer of oxide thereon|
|US6717825 *||Jan 18, 2002||Apr 6, 2004||Fci Americas Technology, Inc.||Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other|
|US6762380 *||Jun 29, 2001||Jul 13, 2004||Icorp||Membrane switch circuit layout and method for manufacturing|
|US6825677||Mar 22, 2001||Nov 30, 2004||Cascade Microtech, Inc.||Membrane probing system|
|US6838890||Nov 29, 2000||Jan 4, 2005||Cascade Microtech, Inc.||Membrane probing system|
|US6860009||Mar 22, 2001||Mar 1, 2005||Cascade Microtech, Inc.||Probe construction using a recess|
|US6927585||May 20, 2002||Aug 9, 2005||Cascade Microtech, Inc.||Membrane probing system with local contact scrub|
|US6930498||Jul 29, 2004||Aug 16, 2005||Cascade Microtech, Inc.||Membrane probing system|
|US6948242 *||Aug 6, 2002||Sep 27, 2005||Infineon Technologies Ag||Process for producing a contact-making device|
|US6984056 *||Aug 28, 2003||Jan 10, 2006||Harison Toshiba Lighting Corporation||Lighting device|
|US7001191||Jun 26, 2003||Feb 21, 2006||Shin-Etsu Polymer Co., Ltd.||Conductive contact elements and electric connectors|
|US7098078||Nov 21, 2002||Aug 29, 2006||Tessera, Inc.||Microelectronic component and assembly having leads with offset portions|
|US7109731||Jun 17, 2005||Sep 19, 2006||Cascade Microtech, Inc.||Membrane probing system with local contact scrub|
|US7148711||Jun 3, 2005||Dec 12, 2006||Cascade Microtech, Inc.||Membrane probing system|
|US7159313 *||Nov 30, 2004||Jan 9, 2007||Intel Corporation||Solderless electronics packaging and methods of manufacture|
|US7161363||May 18, 2004||Jan 9, 2007||Cascade Microtech, Inc.||Probe for testing a device under test|
|US7178236||Apr 16, 2003||Feb 20, 2007||Cascade Microtech, Inc.||Method for constructing a membrane probe using a depression|
|US7198969||Sep 7, 2000||Apr 3, 2007||Tessera, Inc.||Semiconductor chip assemblies, methods of making same and components for same|
|US7233160||Nov 19, 2001||Jun 19, 2007||Cascade Microtech, Inc.||Wafer probe|
|US7266889||Jan 14, 2005||Sep 11, 2007||Cascade Microtech, Inc.||Membrane probing system|
|US7271481||May 26, 2006||Sep 18, 2007||Tessera, Inc.||Microelectronic component and assembly having leads with offset portions|
|US7271603||Mar 28, 2006||Sep 18, 2007||Cascade Microtech, Inc.||Shielded probe for testing a device under test|
|US7285969||Mar 5, 2007||Oct 23, 2007||Cascade Microtech, Inc.||Probe for combined signals|
|US7291910||Jun 5, 2002||Nov 6, 2007||Tessera, Inc.||Semiconductor chip assemblies, methods of making same and components for same|
|US7304488||Dec 1, 2006||Dec 4, 2007||Cascade Microtech, Inc.||Shielded probe for high-frequency testing of a device under test|
|US7355420||Aug 19, 2002||Apr 8, 2008||Cascade Microtech, Inc.||Membrane probing system|
|US7368927||Jul 5, 2005||May 6, 2008||Cascade Microtech, Inc.||Probe head having a membrane suspended probe|
|US7400155||Feb 3, 2004||Jul 15, 2008||Cascade Microtech, Inc.||Membrane probing system|
|US7403025||Aug 23, 2006||Jul 22, 2008||Cascade Microtech, Inc.||Membrane probing system|
|US7403028||Feb 22, 2007||Jul 22, 2008||Cascade Microtech, Inc.||Test structure and probe for differential signals|
|US7417446||Oct 22, 2007||Aug 26, 2008||Cascade Microtech, Inc.||Probe for combined signals|
|US7420381||Sep 8, 2005||Sep 2, 2008||Cascade Microtech, Inc.||Double sided probing structures|
|US7427868||Dec 21, 2004||Sep 23, 2008||Cascade Microtech, Inc.||Active wafer probe|
|US7436194||Oct 24, 2007||Oct 14, 2008||Cascade Microtech, Inc.||Shielded probe with low contact resistance for testing a device under test|
|US7443186||Mar 9, 2007||Oct 28, 2008||Cascade Microtech, Inc.||On-wafer test structures for differential signals|
|US7449899||Apr 24, 2006||Nov 11, 2008||Cascade Microtech, Inc.||Probe for high frequency signals|
|US7453276||Sep 18, 2007||Nov 18, 2008||Cascade Microtech, Inc.||Probe for combined signals|
|US7456646||Oct 18, 2007||Nov 25, 2008||Cascade Microtech, Inc.||Wafer probe|
|US7482823||Oct 24, 2007||Jan 27, 2009||Cascade Microtech, Inc.||Shielded probe for testing a device under test|
|US7489149||Oct 24, 2007||Feb 10, 2009||Cascade Microtech, Inc.||Shielded probe for testing a device under test|
|US7492175||Jan 10, 2008||Feb 17, 2009||Cascade Microtech, Inc.||Membrane probing system|
|US7495461||Oct 18, 2007||Feb 24, 2009||Cascade Microtech, Inc.||Wafer probe|
|US7498829||Oct 19, 2007||Mar 3, 2009||Cascade Microtech, Inc.||Shielded probe for testing a device under test|
|US7501842||Oct 19, 2007||Mar 10, 2009||Cascade Microtech, Inc.||Shielded probe for testing a device under test|
|US7504842||Apr 11, 2007||Mar 17, 2009||Cascade Microtech, Inc.||Probe holder for testing of a test device|
|US7514944||Mar 10, 2008||Apr 7, 2009||Cascade Microtech, Inc.||Probe head having a membrane suspended probe|
|US7518387||Sep 27, 2007||Apr 14, 2009||Cascade Microtech, Inc.||Shielded probe for testing a device under test|
|US7533462||Dec 1, 2006||May 19, 2009||Cascade Microtech, Inc.||Method of constructing a membrane probe|
|US7535247||Jan 18, 2006||May 19, 2009||Cascade Microtech, Inc.||Interface for testing semiconductors|
|US7541821||Aug 29, 2007||Jun 2, 2009||Cascade Microtech, Inc.||Membrane probing system with local contact scrub|
|US7601039||Jul 11, 2006||Oct 13, 2009||Formfactor, Inc.||Microelectronic contact structure and method of making same|
|US7609077||Jun 11, 2007||Oct 27, 2009||Cascade Microtech, Inc.||Differential signal probe with integral balun|
|US7619419||Apr 28, 2006||Nov 17, 2009||Cascade Microtech, Inc.||Wideband active-passive differential signal probe|
|US7656172||Jan 18, 2006||Feb 2, 2010||Cascade Microtech, Inc.||System for testing semiconductors|
|US7681312||Jul 31, 2007||Mar 23, 2010||Cascade Microtech, Inc.||Membrane probing system|
|US7688097||Apr 26, 2007||Mar 30, 2010||Cascade Microtech, Inc.||Wafer probe|
|US7723999||Feb 22, 2007||May 25, 2010||Cascade Microtech, Inc.||Calibration structures for differential signal probing|
|US7750652||Jun 11, 2008||Jul 6, 2010||Cascade Microtech, Inc.||Test structure and probe for differential signals|
|US7759953||Aug 14, 2008||Jul 20, 2010||Cascade Microtech, Inc.||Active wafer probe|
|US7761983||Oct 18, 2007||Jul 27, 2010||Cascade Microtech, Inc.||Method of assembling a wafer probe|
|US7761986||Nov 10, 2003||Jul 27, 2010||Cascade Microtech, Inc.||Membrane probing method using improved contact|
|US7764072||Feb 22, 2007||Jul 27, 2010||Cascade Microtech, Inc.||Differential signal probing system|
|US7876114||Aug 7, 2008||Jan 25, 2011||Cascade Microtech, Inc.||Differential waveguide probe|
|US7888957||Oct 6, 2008||Feb 15, 2011||Cascade Microtech, Inc.||Probing apparatus with impedance optimized interface|
|US7893704||Mar 20, 2009||Feb 22, 2011||Cascade Microtech, Inc.||Membrane probing structure with laterally scrubbing contacts|
|US7898273||Feb 17, 2009||Mar 1, 2011||Cascade Microtech, Inc.||Probe for testing a device under test|
|US7898281||Dec 12, 2008||Mar 1, 2011||Cascade Mircotech, Inc.||Interface for testing semiconductors|
|US7940069||Dec 15, 2009||May 10, 2011||Cascade Microtech, Inc.||System for testing semiconductors|
|US8013623||Jul 3, 2008||Sep 6, 2011||Cascade Microtech, Inc.||Double sided probing structures|
|US8033838||Oct 12, 2009||Oct 11, 2011||Formfactor, Inc.||Microelectronic contact structure|
|US8373428||Aug 4, 2009||Feb 12, 2013||Formfactor, Inc.||Probe card assembly and kit, and methods of making same|
|US8410806||Nov 20, 2009||Apr 2, 2013||Cascade Microtech, Inc.||Replaceable coupon for a probing apparatus|
|US8451017||Jun 18, 2010||May 28, 2013||Cascade Microtech, Inc.||Membrane probing method using improved contact|
|US20010030370 *||Apr 6, 2001||Oct 18, 2001||Khandros Igor Y.||Microelectronic assembly having encapsulated wire bonding leads|
|US20020135388 *||May 20, 2002||Sep 26, 2002||Gleason K. Reed||Membrane probing system with local contact scrub|
|US20020184759 *||Aug 6, 2002||Dec 12, 2002||Siemens Aktiengesellschaft||Process for producing a contact-making device|
|US20030000820 *||Jun 29, 2001||Jan 2, 2003||Wayne Nelson||Membrane switch circuit layout and method for manufacturing|
|US20030132767 *||Nov 29, 2000||Jul 17, 2003||Tervo Paul A.||Membrane probing system|
|US20040047149 *||Aug 28, 2003||Mar 11, 2004||Harison Toshiba Lighting Corporation||Lighting device|
|US20040082207 *||Sep 15, 2003||Apr 29, 2004||Fuji Polymer Industries Co., Ltd.||Anisotropic conductive elastic connector|
|US20040203268 *||Jun 26, 2003||Oct 14, 2004||Koji Nishizawa||Conductive contact elements and electric connectors|
|US20050007131 *||Jul 29, 2004||Jan 13, 2005||Cascade Microtech, Inc.||Membrane probing system|
|US20050091844 *||Nov 30, 2004||May 5, 2005||Intel Corporation||Solderless electronics packaging and methods of manufacture|
|US20050164526 *||Jan 28, 2004||Jul 28, 2005||International Business Machines Corporation||High performance interposer for a chip package using deformable button contacts|
|US20050221645 *||Mar 20, 2003||Oct 6, 2005||Miki Hasegawa||Anisotropically conductive block and its manufacturing method|
|US20050224762 *||Mar 20, 2003||Oct 13, 2005||J.S.T. Mfg. Co., Ltd.||Flexible good conductive layer and anisotropic conductive sheet comprising same|
|US20060286828 *||Aug 1, 2006||Dec 21, 2006||Formfactor, Inc.||Contact Structures Comprising A Core Structure And An Overcoat|
|US20080252316 *||Jun 16, 2008||Oct 16, 2008||Cascade Microtech, Inc.||Membrane probing system|
|EP0029641A1 *||Jul 18, 1980||Jun 3, 1981||Sign Electronics Limited||Printing apparatus|
|U.S. Classification||439/591, 174/262, 200/86.00R, 174/265, 29/884, 200/511, 200/85.00R, 29/876, 439/66, 439/91|
|International Classification||H05K3/36, H05K3/46, H05K1/14, H01R4/00, H05K3/32|
|Cooperative Classification||H05K3/368, H05K3/325, H01R12/714|
|Feb 8, 1989||AS||Assignment|
Owner name: FUJI POLYMER INDUSTRIES CO., LTD., A CORP. OF JAPA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:TECHNICAL WIRE PRODUCTS, INC.;REEL/FRAME:005017/0024
Effective date: 19881206
|Feb 8, 1989||AS02||Assignment of assignor's interest|
Owner name: FUJI POLYMER INDUSTRIES CO., LTD., 21-11 CHIYODA 5
Owner name: TECHNICAL WIRE PRODUCTS, INC.
Effective date: 19881206