US3706651A - Apparatus for electroplating a curved surface - Google Patents

Apparatus for electroplating a curved surface Download PDF

Info

Publication number
US3706651A
US3706651A US102723A US3706651DA US3706651A US 3706651 A US3706651 A US 3706651A US 102723 A US102723 A US 102723A US 3706651D A US3706651D A US 3706651DA US 3706651 A US3706651 A US 3706651A
Authority
US
United States
Prior art keywords
anode
plating
workpiece
reciprocable
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US102723A
Inventor
James M Leland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Department of Navy
Original Assignee
US Department of Navy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Department of Navy filed Critical US Department of Navy
Application granted granted Critical
Publication of US3706651A publication Critical patent/US3706651A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/04Tubes; Rings; Hollow bodies

Definitions

  • This invention relates to apparatus for electroplating a curved surface of a workpiece, and more particularly to such apparatus wherein variations in plating thickness over the entire curved surface can be controlled.
  • the present technique of plating a curved surface, such as a bore surface is to custom-make an anode out of suitable material for insertion into the bore for the plating operation.
  • the anode is normally fabricated in a cigar shape in accordance with the best estimate of an experienced anode technician to account for wellknown edge effects.
  • the anode is then re-shaped by a trial-and-error method. That is, a series of workpieces are successively test plated with the anode being reworked by machining between each trail plating until a passable compromise anode design is achieved, at which time further refinements are foregone in order that the anode maker meet other anode fabrication requirements.
  • the anode When plating a bore surface, the anode is usually provided with a hollow longitudinal core with connecting transverse holes to enable fresh plating solution to be circulated up through the core and be distributed out of the transverse holes to the cylindrical space between the anode and the surface to be plated.
  • This flow of plating solution is normally circulated only by convection.
  • the surface area to be plated opposite the transverse anode holes being more effectively presented to the plating solution, tend to build-up in plating thickness. Because of the uneven build-up in plating on such areas, as well as of variations in plating thickness due to imperfections in anode design, substantial post grinding operations are required to meet dimensional tolerances.
  • the present invention provides an electroplating apparatus in which variations in plating thickness can be controlled.
  • This apparatus eliminates the need for custom fabrication of the anodes thereby reducing the lead time, maintenance costs, and the storage of a supply of such anodes.
  • the amount of postmachining operations is reduced substantially as well as overall production costs.
  • an anode having a plurality of longitudinally spaced electrical segments extending for a length greater than the length of the surface to be plated, and variable means for independently controlling the plating current to each segment.
  • the predetermined distribution of the plating thickness is accomplished electrically by controlling the current, rather than by mechanically machining the anode by a trial-by-error configuration. Therefore, the shape of the invention anode need not conform to the configuration of the surface to be plated.
  • variations due to plating irregularities can be minimized.
  • a further refinement can be achieved by the use of a plating thickness indicator which can signal the completion of the plating cycle and/or stop the plating operation OBJECTS OF THE INVENTION
  • a principal purpose of the invention is to provide an electroplating apparatus which will enable the plating thickness to be selectively controlled 'over the entire curved surface of a workpiece, and a correlary object is to achieve the selective control by electrical means.
  • Another important object is to provide an anode which can be made in a standard design without the need for custom fabrication.
  • FIG. I is a front elevation view of the novel electroplating apparatus.
  • FIG. 2 is a side elevation view of the apparatus of FIG. 1, showing a workpeice in broken lines.
  • FIG. 3 is an enlarged front elevation partially in section of the cam drive assembly taken generally along line III-Ill of FIG. 2.
  • FIG. 4 is a longitudinal section of the anode.
  • FIG. 5 is a top sectional view of the apparatus along line VV of FIG. 1 showing a transverse section of the anode and of the workpiece in broken lines.
  • FIG. 6 is a perspective view of a representative anode conductor segment.
  • FIG. I a novel electroplating apparatus 10 constructed according to the teaching of this invention.
  • Apparatus 10 is adapted to be supported within a conventional plating tank (not shown) with the lower portion thereof immersed within a plating solution the level of which is indicated generally at 12.
  • back plate 14 which is secured in a stationary condition during the plating operation.
  • back plate 14 is intended to be stationary during the plating operation it is not necessarily integrally fixed to the tank that would prevent the apparatus from being lifted out of the solution at the end of the plating operation or for other reasons.
  • Back plate 14 and all structural parts hereinafter described are preferably constructed of a material resistant to the corrosive environment of the plating solution, such as polypropylene or polyvinyl chloride.
  • the curved surface to be plated is illustrated as a bore surface 16 of a tubular workpiece 18 shown in broken lines in FIGS. 2 and 5. It should be noted, however, that the invention apparatus is not limited to plating a bore surface since the principles of the invention can be utilized to plate the outer peripheral surface of workpiece 18 in which case suitable changes to the anode construction must be made to provide the necessary male-to-female relationship between the anode and surface to be plated.
  • One of the principal features of the invention apparatus is to provide during the plating operation a predetermined relative motion between the anode and the surface to be plated to control variations in the plating thickness.
  • an anode assembly 19 of the apparatus is designed to be movable in a manner presently to be described, and workpiece 18 is supported in a stationary condition by a fixture comprising a pair of opposing V-shaped clamping members 20 secured by bolts 21 to stationary back plate 14.
  • Bolts 21 are adjustably positioned in slots in back plate 14 to accommodate workpieces of different diameters.
  • cam-follower roller 22 rotatably supported on a shaft 24 bolted to back plate 14 (FIG. 2).
  • Cam-follower 22 through a bevelled circular cam 26 supports the entire anode assembly 19 for rotating and reciprocating (note symbol 28) with respect to fixed workpiece l8.
  • Cam 26 is an integral part of anode assembly 19 and the weight of the entire assembly maintains said cam 26 in rolling contact with follower roller 22.
  • circular cam 26 is rotatably supported by a bearing 30 freely about a shaft 32 and is locked thereto at its upper end by a not 34.
  • Shaft 32- is boltedat its lower end through a circular flange 37 to a long rod-shaped anode 36 which is adapted to project into workpiece l8.
  • Anode 16 will be described later in greater detail with reference to FIG. 4.
  • Cam 26 and the entire anode assembly 19 depending therefrom is rotatably driven freely about shaft 32 through a spacer'hub 37 by a pair of pinion gears 38 and 40 connected. by a bevelled gear train 41 to-a motor 42 bolted to a motor mount 44.
  • suitable bushings 52 can be secured on motor mount 44 and T-bar 46 to engage with and provide a smooth sliding contact with stationary back plate 14, although the use of bushings 52 are not believed necessary where the structural parts are made of the aforementioned plastic material having a very low coefficient of friction.
  • anode assembly 19 is provided an up and down reciprocating movement.
  • anode assembly 19 is also provided a rotary motion v about a vertical axis by a second pair of pinion gears 54 and 56 which gears are also driven by motor 42.
  • upper pinion gear 38 is freely journaled about shaft '32 by bearing 30 for rotating cam 26
  • lower pinion gear 54 is keyed at 58 to shaft 32 for rotating shaft 32 as well as the depending anode assembly 19 (FIG. 3).
  • motor 42 through the two pinion gear trains described above simultaneously provide both a rotary and reciprocable motion to anode assembly 19 in relation to stationary workpiece 18.
  • lower and upper pinion gears 54 and 38 respectively have a slightly different number of teeth to provide a constant phase shifting between the rotary and reciprocating motions. That is, the-locus of any single point on the anode projected on the bore surface to be plated will precess in rotation in order that electrical and mechanical irregularities in the plating process will be cancelled and a uniform current distribution over the entire workpiece be achieved.
  • a propeller 60 driven by a sealed motor.6l journaled in a box 62.
  • the propeller functions to achieve better circulation of the plating solution upwardly in the space between anode 36 and workpiece 18 to ensure a supply of fresh'plating solution throughout the plating operation.
  • Propeller box 62 is integrally joined to a bracket 64 bolted at 66 to T-bar 46, bolts 66 extending through and slidable in a slot 68 in stationary back plate 14.
  • the propeller assembly is provided the same guided vertical reciprocable motion with respect to the workpiece as is anode assembly 19, but without the rotational movement of the anode assembly.
  • anode 36 consists of three integral portions, namely, an upper input portion 70, a lower output portion 72, and an intermediate connecting portion 74.
  • Upper anode portion 70 is designed to remain above the'lever of the plating solution 12 for electrically connecting the anode to the source of plating current via a set of six electrical brushes76, cables 78, and programmable current controllers 80, one for each of said electrical brushes (FIG. 1). Controllers are connected to a conventional high current power supply to enable the current to each of the six brushes to be programmed in a selective manner to vary and control the distribution of the plating thickness over the surface of the workpiece.
  • the lower end of housing 82 has an opening 83 (FIG. 2) through which anode 36 moves, a washer 84 making wiping contact therewith to protect the upper portion of the apparatus from the corrosive fumes and splashing of the plating solution.
  • the lower portion of apparatus 10, including workpiece 18, which is immersed in the plating solution is enclosed within a protective screen 85 (FIG. 1) also secured to back plate 14 to prevent undesired stray currents from flowing to adjacent plating set-ups that may be in the same plating tank.
  • the details of anode 36 are best illustrated in FIGS. 4-6.
  • the upper anode portion 70 consists of six vertically spaced electrical slip rings, 70A-70F separated by insulator rings 86, each slip ring being electrically connected to the plating current source by its respective brush 76 (FIG. 1).
  • the anode illustrated utilizes 6 sets of brushes and corresponding slip rings (70A to 70F), the number of sets may vary depending on the length and configuration of the workpiece surface, and the degree of control desired distribution of the plating thickness.
  • the six upper electrical slip rings 70A-F which can be referred to as current input rings, are electrically connected by a series of vertical segmental conductors 88 to six corresponding lower rings 72A-F, which similarly can be called current output rings for transmitting the current through the plating solution to the surface to be plated.
  • Lower rings 72A-F are also separated by insulator rings 86.
  • a representative sample of conductor segment 88 is illustrated in FIG. 6, the actual length will vary depending on the distances of the electrical paths between the respective input-output rings. As will be noted in FIGS.
  • conductor segments 88 are less than semi-circular in cross-sectional configuration to allow two separate conductors to extend in parallel relation, the adjacent conductor segments being insulated from each other by filling the voids 90 therebetween with a potting compound or the like.
  • This parallel arrangement of segmental conductors 88 allows a pairing of input-output rings on-both the left and right sides of the anode which provides a more compact anode construction.
  • segmental conductors 88 are positioned immediately adjacent the various input and output rings 70A-F and 72A-F, these parts, which may include spacer conductors, are brazed together to form an integral electrical conductor, for example as illustrated at 96.
  • a central core opening 94 is provided in anode 36 to accommodate a drive shaft in the event it is desirable to position motor 61 above the lever of the plating solution.
  • the plating thickness on the workpiece surface can be controlled through a conventional amp/hr meter (not shown) or by means of a laser 98, such as the type manufactured by Perkin-Elmer, Model INF-1.
  • laser 98 is mounted on a suitable portion of the reciprocable structure in operative relation to a fixed mirror 100, and a series of five mirrors 102 mounted in successively staggered relation on each of the insulator rings 86 separating the lower output rings 72A-F.
  • a laser micro switch 104 is secured to stationary back plate 14 in a position to contact a laser actuator pin 106 mounted to any portion of the reciprocable anode assembly 19, such as the drive mechanism, when the assembly is reciprocated to the uppermost position.
  • microswitch 104 When microswitch 104 is thus activated, it pulses laser 98 sending a light beam to the surface of the workpiece via mirrors and successively to mirrors 102 and back to the laser.
  • the total travel time of the laser beam is measured by a suitable laser controller 108 in an established manner and the plating build-up thickness can be periodically registered digitally for continuous monitoring on register 110 corresponding to the respective measurement points.
  • the workpiece 18 is properly centered in its fixture and apparatus 10 suspended in an immersed condition within the plating solution in the tank.
  • Current controllers 80 having been properly programmed are turned oninitiating a low current density start-up.
  • Propeller motor 61 and drive motor 42 likewise are energized.
  • Anode assembly 19 will simultaneously rotate and reciprocate with respect to the fixed workpiece in a changing phase relationship due to precession.
  • the current to the anode segments are gradually increased to the running level according to their individual programmed settings.
  • a warning device 112 may be sounded at which time the plating current is reduced to a low maintenance level to prevent etching.
  • Apparatus 10 can be manually or automatically lifted out of the plating tank to complete the plating cycle.
  • the novel electroplating apparatus 10 greatly improves on existing plating methods by decreasing plating thickness variations from the present commercial norms of 20%: at optimum conditions, to an order of accuracy approaching one-tenth of the present commercial tolerances.
  • post-plating grinding operations are reduced, especially important when heavy plating is required, such as during aircraft rework.
  • the same anode can be used for plating different workpieces thereby eliminating long lead time in manufacturing and the expense involved with custom made anodes.
  • propeller pump permits faster plating rates due to less depletion of the plating solution ion content in its circulation over the workpiece surface; scrubbing of hydrogen bubbles; and finally assists uniformity of plating by equalizing the temperature gradients produced by the heating of theplating solution for various reasons.
  • Apparatus for electroplating a curved surface on a workpiece by immersion in a plating solution which comprises:
  • one of said means being both rotatable and l reciprocable with respect to the other of said means;
  • said reciprocable motion is provided by a cam member and cam roller member, one of which members is fixed to a stationary support, and the other member is integrally mounted to the movable means;
  • said anode is fabricated of a plurality [of longitudinally spaced annular electrically conductive segments, and
  • said means including a plurality of slip rings longitudinally mounted on an extension of said anode, a
  • each conductor being less than semi-cylindrical in configuration to enable them to be mounted longitudinally and concentrically on the anode to provide a plurality of independent electrical paths between the corresponding slip rings and conductive segments so as to occupy a minimum space.

Abstract

Apparatus for electroplating a curved surface of a workpiece wherein a relative rotatable and reciprocable motion is provided between the anode and the surface to be plated for controlling variations in plating thickness, with the rotary motion being precessed to provide a constant phase shifting to cancel out plating irregularities. The anode is fabricated of a plurality of longitudinally spaced annular segments, with means to independently control the current to each segment.

Description

Unlted States Patent 1151 3,706,651
Leland 1 1 Dec. 19, 1972 [54] APPARATUS FOR ELECTROPLATING 3,390,068 6/1968 Ellis et al ..204/222 A RVEI) URFA 3.108.031 10/1963 Hasala el al. ..204/212 ux [72] Inventor: James M. Leland, San Diego, Calif. FOREIGN PATENTS OR APPLICATIONS Assigneel The United States of America as 37/18613 12/1962 Japan .204/222 represented by the Secretary of the y Primary [Ixar niner.lohn H. Mack Dec. 3 ASSiSlll"! Examiner-W. Solomon Attorney-R. S. Sciascia, George J. Rubens and J. W. [21] App]. No.: 102,723 McLurcn 52 us. c1. ..204/21s, 204/212, 204/222, 1 7 ABSTRACT 204/223 Apparatus for electroplating a curved surface of a [51] Int. Cl. ..C23b'5/68 workpiece wherein a relative rotatabk; and reciPrOca- [58] held of Search "204/26, ble motion is provided between the anode and the sur- 2O4/DIG- H face to be plated for controlling variations in plating thickness, with the rotary motion being precessed to [56] References cued provide a constant phase shifting to cancel out plating UNITED STATES PATENTS irregularities. The anode is fabricated of a plurality of long1tud1nally spaced annular segments, w1th means to 3,022,232 2/1962 Bailey et al ..204/26 independently control the current to each segment. 3,183,176 5/1965 Schwartz, Jr... .....204/2l2 2,746,917 5/1956 Comstock ..204/2l8 6 Claims, 6 Drawing Figures III PATENTED 19 3. 706, 651
sum 1 or 4 INVENTOR. JAMES M. LELAND PATENTEI'Jum 19 I972 SHEET 2 [IF 4 INVENTOR. JAMES M. LELAND $52 &
Pmmmm 19 m 3.706. 651 SHEET 3 OF 4 INVENTOR. JAMES M. LELAND APPARATUS FOR ELECTROPLATING A CURVED SURFACE STATEMENT OF GOVERNMENT INTEREST The invention described herein may be manufactured and used by or for the Government of the United States of America for governmental purposes without the payment of any royalties thereon or therefor.
BACKGROUND OF THE INVENTION This invention relates to apparatus for electroplating a curved surface of a workpiece, and more particularly to such apparatus wherein variations in plating thickness over the entire curved surface can be controlled.
The present technique of plating a curved surface, such as a bore surface, is to custom-make an anode out of suitable material for insertion into the bore for the plating operation. The anode is normally fabricated in a cigar shape in accordance with the best estimate of an experienced anode technician to account for wellknown edge effects. The anode is then re-shaped by a trial-and-error method. That is, a series of workpieces are successively test plated with the anode being reworked by machining between each trail plating until a passable compromise anode design is achieved, at which time further refinements are foregone in order that the anode maker meet other anode fabrication requirements. When plating a bore surface, the anode is usually provided with a hollow longitudinal core with connecting transverse holes to enable fresh plating solution to be circulated up through the core and be distributed out of the transverse holes to the cylindrical space between the anode and the surface to be plated. This flow of plating solution is normally circulated only by convection. The surface area to be plated opposite the transverse anode holes, being more effectively presented to the plating solution, tend to build-up in plating thickness. Because of the uneven build-up in plating on such areas, as well as of variations in plating thickness due to imperfections in anode design, substantial post grinding operations are required to meet dimensional tolerances.
SUMMARY OF THE INVENTION The present invention provides an electroplating apparatus in which variations in plating thickness can be controlled. This apparatus eliminates the need for custom fabrication of the anodes thereby reducing the lead time, maintenance costs, and the storage of a supply of such anodes. In addition, the amount of postmachining operations is reduced substantially as well as overall production costs.
These unique results are achieved by fabricating an anode having a plurality of longitudinally spaced electrical segments extending for a length greater than the length of the surface to be plated, and variable means for independently controlling the plating current to each segment. In other words, the predetermined distribution of the plating thickness is accomplished electrically by controlling the current, rather than by mechanically machining the anode by a trial-by-error configuration. Therefore, the shape of the invention anode need not conform to the configuration of the surface to be plated. In addition, by providing a relative rotational and longitudinal movement between the anode and the workpiece, variations due to plating irregularities can be minimized. A further refinement can be achieved by the use of a plating thickness indicator which can signal the completion of the plating cycle and/or stop the plating operation OBJECTS OF THE INVENTION A principal purpose of the invention is to provide an electroplating apparatus which will enable the plating thickness to be selectively controlled 'over the entire curved surface of a workpiece, and a correlary object is to achieve the selective control by electrical means.
Another important object is to provide an anode which can be made in a standard design without the need for custom fabrication.
Still other objects'are to provide electroplating apparatus which will achieve greater uniformity in plating thickness thereby reducing post machining operations as well as reducing the overall time and cost of plating operations.
Other objects, advantages and novel features of the invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings wherein:
BRIEF DESCRIPTION OF THE DRAWINGS FIG. I is a front elevation view of the novel electroplating apparatus.
FIG. 2 is a side elevation view of the apparatus of FIG. 1, showing a workpeice in broken lines.
FIG. 3 is an enlarged front elevation partially in section of the cam drive assembly taken generally along line III-Ill of FIG. 2.
FIG. 4 is a longitudinal section of the anode.
FIG. 5 is a top sectional view of the apparatus along line VV of FIG. 1 showing a transverse section of the anode and of the workpiece in broken lines.
FIG. 6 is a perspective view of a representative anode conductor segment.
DESCRIPTION OF THE PREFERRED v EMBODIMENT Referring to the drawings where like reference numerals refer to similar parts throughout the figures there is shown in FIG. I a novel electroplating apparatus 10 constructed according to the teaching of this invention. Apparatus 10 is adapted to be supported within a conventional plating tank (not shown) with the lower portion thereof immersed within a plating solution the level of which is indicated generally at 12.
The entire electroplating apparatus is suspended from a back plate 14 which is secured in a stationary condition during the plating operation. Although back plate 14 is intended to be stationary during the plating operation it is not necessarily integrally fixed to the tank that would prevent the apparatus from being lifted out of the solution at the end of the plating operation or for other reasons. Back plate 14 and all structural parts hereinafter described are preferably constructed of a material resistant to the corrosive environment of the plating solution, such as polypropylene or polyvinyl chloride.
l060ll 0291 The curved surface to be plated is illustrated as a bore surface 16 of a tubular workpiece 18 shown in broken lines in FIGS. 2 and 5. It should be noted, however, that the invention apparatus is not limited to plating a bore surface since the principles of the invention can be utilized to plate the outer peripheral surface of workpiece 18 in which case suitable changes to the anode construction must be made to provide the necessary male-to-female relationship between the anode and surface to be plated.
One of the principal features of the invention apparatus is to provide during the plating operation a predetermined relative motion between the anode and the surface to be plated to control variations in the plating thickness. In the illustrated embodiment an anode assembly 19 of the apparatus is designed to be movable in a manner presently to be described, and workpiece 18 is supported in a stationary condition by a fixture comprising a pair of opposing V-shaped clamping members 20 secured by bolts 21 to stationary back plate 14. Bolts 21 are adjustably positioned in slots in back plate 14 to accommodate workpieces of different diameters. H
The only other component of apparatus that is also stationary during the plating process is a cam-follower roller 22 rotatably supported on a shaft 24 bolted to back plate 14 (FIG. 2). Cam-follower 22 through a bevelled circular cam 26 supports the entire anode assembly 19 for rotating and reciprocating (note symbol 28) with respect to fixed workpiece l8. Cam 26 is an integral part of anode assembly 19 and the weight of the entire assembly maintains said cam 26 in rolling contact with follower roller 22.
Referring to FIGS. 1 and 3, circular cam 26 is rotatably supported by a bearing 30 freely about a shaft 32 and is locked thereto at its upper end by a not 34. Shaft 32- is boltedat its lower end through a circular flange 37 to a long rod-shaped anode 36 which is adapted to project into workpiece l8. Anode 16 will be described later in greater detail with reference to FIG. 4. Cam 26 and the entire anode assembly 19 depending therefrom is rotatably driven freely about shaft 32 through a spacer'hub 37 by a pair of pinion gears 38 and 40 connected. by a bevelled gear train 41 to-a motor 42 bolted to a motor mount 44.
Because the'entire anode assembly 19 is actuated in an up and down reciprocable movement by rotation of bevelled circular cam 26, the entire motor 42 and its drive mechanism must be supported for reciprocable movement with respect to back plate 14. This is accomplished through a T-bar 46 (FIG. 2) which is secured to motor mount 44 via bolts 48 freely guided in vertical slots 50in back plate 14.
If desired suitable bushings 52 can be secured on motor mount 44 and T-bar 46 to engage with and provide a smooth sliding contact with stationary back plate 14, although the use of bushings 52 are not believed necessary where the structural parts are made of the aforementioned plastic material having a very low coefficient of friction. Thus, by means of the above described motor drive mechanism anode assembly 19 is provided an up and down reciprocating movement.
In addition to the vertical reciprocating motion, anode assembly 19 is also provided a rotary motion v about a vertical axis by a second pair of pinion gears 54 and 56 which gears are also driven by motor 42. Whereas upper pinion gear 38 is freely journaled about shaft '32 by bearing 30 for rotating cam 26, lower pinion gear 54 is keyed at 58 to shaft 32 for rotating shaft 32 as well as the depending anode assembly 19 (FIG. 3). Thus, motor 42 through the two pinion gear trains described above simultaneously provide both a rotary and reciprocable motion to anode assembly 19 in relation to stationary workpiece 18. It is preferred that lower and upper pinion gears 54 and 38 respectively have a slightly different number of teeth to provide a constant phase shifting between the rotary and reciprocating motions. That is, the-locus of any single point on the anode projected on the bore surface to be plated will precess in rotation in order that electrical and mechanical irregularities in the plating process will be cancelled and a uniform current distribution over the entire workpiece be achieved.
As shown in FIGS. 2 and 3, at the lower end of apparatus '10 is positioned a propeller 60 driven by a sealed motor.6l journaled in a box 62. The propeller functions to achieve better circulation of the plating solution upwardly in the space between anode 36 and workpiece 18 to ensure a supply of fresh'plating solution throughout the plating operation. Propeller box 62 is integrally joined to a bracket 64 bolted at 66 to T-bar 46, bolts 66 extending through and slidable in a slot 68 in stationary back plate 14. Thus, the propeller assembly is provided the same guided vertical reciprocable motion with respect to the workpiece as is anode assembly 19, but without the rotational movement of the anode assembly.
As best seen in FIGS. 1, 2, and 4, anode 36 consists of three integral portions, namely, an upper input portion 70, a lower output portion 72, and an intermediate connecting portion 74. Upper anode portion 70 is designed to remain above the'lever of the plating solution 12 for electrically connecting the anode to the source of plating current via a set of six electrical brushes76, cables 78, and programmable current controllers 80, one for each of said electrical brushes (FIG. 1). Controllers are connected to a conventional high current power supply to enable the current to each of the six brushes to be programmed in a selective manner to vary and control the distribution of the plating thickness over the surface of the workpiece.
The upper portion of electroplating apparatus 10, including the upper input portion 70, is enclosed within a housing 82 secured to back plate 14. The lower end of housing 82 has an opening 83 (FIG. 2) through which anode 36 moves, a washer 84 making wiping contact therewith to protect the upper portion of the apparatus from the corrosive fumes and splashing of the plating solution. The lower portion of apparatus 10, including workpiece 18, which is immersed in the plating solution is enclosed within a protective screen 85 (FIG. 1) also secured to back plate 14 to prevent undesired stray currents from flowing to adjacent plating set-ups that may be in the same plating tank.
The details of anode 36 are best illustrated in FIGS. 4-6. The upper anode portion 70 consists of six vertically spaced electrical slip rings, 70A-70F separated by insulator rings 86, each slip ring being electrically connected to the plating current source by its respective brush 76 (FIG. 1). Although the anode illustrated utilizes 6 sets of brushes and corresponding slip rings (70A to 70F), the number of sets may vary depending on the length and configuration of the workpiece surface, and the degree of control desired distribution of the plating thickness.
The six upper electrical slip rings 70A-F, which can be referred to as current input rings, are electrically connected by a series of vertical segmental conductors 88 to six corresponding lower rings 72A-F, which similarly can be called current output rings for transmitting the current through the plating solution to the surface to be plated. Lower rings 72A-F are also separated by insulator rings 86. A representative sample of conductor segment 88 is illustrated in FIG. 6, the actual length will vary depending on the distances of the electrical paths between the respective input-output rings. As will be noted in FIGS. 5 and 6, conductor segments 88 are less than semi-circular in cross-sectional configuration to allow two separate conductors to extend in parallel relation, the adjacent conductor segments being insulated from each other by filling the voids 90 therebetween with a potting compound or the like. This parallel arrangement of segmental conductors 88 allows a pairing of input-output rings on-both the left and right sides of the anode which provides a more compact anode construction.
As shown in Fig. 4, three input slip rings 70A-C by conductors 88 extending on the right side of Fig. 4, whereas, input slip rings 70D-F are inversely paired with output rings 72D-F on the left side of FIG. 4. Arrows 91 have been utilized as a means of graphically illustrating one of each of said electrical paths on both sides of the anode. The six separate electrical paths via the corresponding segmental conductors 88 between each pair of input-output rings are concentrically disposed in the anode with suitable vertical segmental insulation segments 92 disposed between the various conductors 88 to prevent short-circuits between the concentrically adjacent electrical paths. Insulation segments 92 may be similar in configuration to conductor segments 88. As a manufacturing expedient, it may be noted that where the lateral ends of segmental conductors 88 are positioned immediately adjacent the various input and output rings 70A-F and 72A-F, these parts, which may include spacer conductors, are brazed together to form an integral electrical conductor, for example as illustrated at 96. A central core opening 94 is provided in anode 36 to accommodate a drive shaft in the event it is desirable to position motor 61 above the lever of the plating solution.
The plating thickness on the workpiece surface can be controlled through a conventional amp/hr meter (not shown) or by means of a laser 98, such as the type manufactured by Perkin-Elmer, Model INF-1. As shown in FIG. 1 laser 98 is mounted on a suitable portion of the reciprocable structure in operative relation to a fixed mirror 100, and a series of five mirrors 102 mounted in successively staggered relation on each of the insulator rings 86 separating the lower output rings 72A-F. A laser micro switch 104 is secured to stationary back plate 14 in a position to contact a laser actuator pin 106 mounted to any portion of the reciprocable anode assembly 19, such as the drive mechanism, when the assembly is reciprocated to the uppermost position. When microswitch 104 is thus activated, it pulses laser 98 sending a light beam to the surface of the workpiece via mirrors and successively to mirrors 102 and back to the laser. The total travel time of the laser beam is measured by a suitable laser controller 108 in an established manner and the plating build-up thickness can be periodically registered digitally for continuous monitoring on register 110 corresponding to the respective measurement points.
OPERATION The workpiece 18 is properly centered in its fixture and apparatus 10 suspended in an immersed condition within the plating solution in the tank. Current controllers 80 having been properly programmed are turned oninitiating a low current density start-up. Propeller motor 61 and drive motor 42 likewise are energized. Anode assembly 19 will simultaneously rotate and reciprocate with respect to the fixed workpiece in a changing phase relationship due to precession. The current to the anode segments are gradually increased to the running level according to their individual programmed settings. When the desired plating thickness is reached as determined by the laser or other indicator a warning device 112 may be sounded at which time the plating current is reduced to a low maintenance level to prevent etching. Apparatus 10 can be manually or automatically lifted out of the plating tank to complete the plating cycle.
The novel electroplating apparatus 10 greatly improves on existing plating methods by decreasing plating thickness variations from the present commercial norms of 20%: at optimum conditions, to an order of accuracy approaching one-tenth of the present commercial tolerances. Thus, post-plating grinding operations are reduced, especially important when heavy plating is required, such as during aircraft rework. By having a segmented anode in which the current can be programmed and controlled at a plurality of stations throughout its length, the same anode can be used for plating different workpieces thereby eliminating long lead time in manufacturing and the expense involved with custom made anodes.
Better uniformity of plating thickness is also achieved by providing a reciprocating and rotating motion between the anode and the workpiece. In the preferred embodiment, the workpiece is held stationary and the anode provided the reciprocating and rotating motion. However, a reverse condition may be desired, that is, the anode assembly can be held stationary and the workpiece moved, in which construction a deeper plating tank would probably be required. Uniformity in plating thickness is also enhanced by arranging for precession in the rotation of the anode with I respect to the workpiece.
Use of a propeller pump permits faster plating rates due to less depletion of the plating solution ion content in its circulation over the workpiece surface; scrubbing of hydrogen bubbles; and finally assists uniformity of plating by equalizing the temperature gradients produced by the heating of theplating solution for various reasons.
Obviously many modifications and variations of the present invention are possible in the light of the above teachings. It is therefore to be understood that within the scope of the appended claims the invention may be practiced otherwise than as specifically described.
What is claimed is: 1. Apparatus for electroplating a curved surface on a workpiece by immersion in a plating solution which comprises:
means for supporting the workpiece in operative relation to said anode means;
one of said means being both rotatable and l reciprocable with respect to the other of said means;
means for precessing the rotary motion to provide a constant phase shifting to cancel out plating irregularities;
whereby variations in the plating thickness over the entire surface of the workpiece can be controlled in a uniform manner.
2. The apparatus of claim 1 wherein:
said reciprocable motion is provided by a cam member and cam roller member, one of which members is fixed to a stationary support, and the other member is integrally mounted to the movable means;
a pair of pinion gear trains for driving the movable member to provide the reciprocable and rotatable motions;
said pinion gears in each pair having a different number of teeth to provide the phase shifting.
3. The apparatus of claim 1 wherein:
said anode is fabricated of a plurality [of longitudinally spaced annular electrically conductive segments, and
means for independently controlling the plating current to each of said segments whereby a distribution of current can be programmed over the entire plating surface in a selectively variable manner.
4. The apparatus of claim 3 wherein a laser thickness indicator is provided each of said electrically conductive segments provided with a mirror in successively staggered relationship around the anode and so oriented that the plating thickness opposite each segment can be ascertained optically.
5. The apparatus of claim 3 wherein:
said means including a plurality of slip rings longitudinally mounted on an extension of said anode, a
separate slip ring provided for each of said conductive elements.
6. The apparatus of claim 5 wherein is provided:
a plurality of conductors for electrically connecting the slip rings to the conductive segments,
each conductor being less than semi-cylindrical in configuration to enable them to be mounted longitudinally and concentrically on the anode to provide a plurality of independent electrical paths between the corresponding slip rings and conductive segments so as to occupy a minimum space.

Claims (6)

1. Apparatus for electroplating a curved surface on a workpiece by immersion in a plating solution which comprises: anode means positionable relative to said workpiece in spaced relation to said surface; said workpiece serving as a cathode; means for supporting the workpiece in operative relation to said anode means; one of said means being both rotatable and reciprocable with respect to the other of said means; means for precessing the rotary motion to provide a constant phase shifting to cancel out plating irregularities; whereby variations in the plating thickness over the entire surface of the workpiece can be controlled in a uniform manner.
2. The apparatus of claim 1 wherein: said reciprocable motion is provided by a cam member and cam roller member, one of which members is fixed to a stationary support, and the other member is integrally mounted to the movable means; a pair of pinion gear trains for driving the movable member to provide the reciprocable and rotatable motions; said pinion gears in each pair having a different number of teeth to provide the phase shifting.
3. The apparatus of claim 1 wherein: said anode is fabricated of a plurality of longitudinally spaced annular electrically conductive segments, and means for independently controlling the plating current to each of said segments whereby a distribution of current can be programmed over the entire plating surface in a selectively variable manner.
4. The apparatus of claim 3 wherein a laser thickness indicator is provided each of said electrically conductive segments provided with a mirror in successively staggered relationship around the anode and so oriented that the plating thickness opposite each segment can be ascertained optically.
5. The apparatus of claim 3 wherein: said means including a plurality of slip rings longitudinally mounted on an extension of said anode, a separate slip ring provided for each of said conductive elements.
6. The apparatus of claim 5 wherein is provided: a plurality of conductors for electrically connecting the slip rings to the conductive segments, each conductor being less than semi-cylindrical in configuration to enable them to be mounted longitudinally and concentrically on the anode to provide a plurality of independent electrical paths between the corresponding slip rings and conductive segments so as to occupy a minimum space.
US102723A 1970-12-30 1970-12-30 Apparatus for electroplating a curved surface Expired - Lifetime US3706651A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10272370A 1970-12-30 1970-12-30

Publications (1)

Publication Number Publication Date
US3706651A true US3706651A (en) 1972-12-19

Family

ID=22291357

Family Applications (1)

Application Number Title Priority Date Filing Date
US102723A Expired - Lifetime US3706651A (en) 1970-12-30 1970-12-30 Apparatus for electroplating a curved surface

Country Status (1)

Country Link
US (1) US3706651A (en)

Cited By (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049507A (en) * 1974-09-18 1977-09-20 Sony Corporation Electrodepositing method
US4132618A (en) * 1975-12-16 1979-01-02 Commissariat A L'energie Atomique Electrolytic device for marking metallic parts
FR2520009A1 (en) * 1982-01-21 1983-07-22 France Etat PROCESS OF INTERNAL CHROMING OF A TUBULAR ELEMENT, ANODE FOR ITS IMPLEMENTATION AND CHROME ELEMENT OBTAINED ACCORDING TO THIS PROCESS
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US20020125141A1 (en) * 1999-04-13 2002-09-12 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US20040055873A1 (en) * 2002-09-24 2004-03-25 Digital Matrix Corporation Apparatus and method for improved electroforming
US6773571B1 (en) 2001-06-28 2004-08-10 Novellus Systems, Inc. Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources
US6890416B1 (en) 2000-05-10 2005-05-10 Novellus Systems, Inc. Copper electroplating method and apparatus
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7090751B2 (en) 2001-08-31 2006-08-15 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7115196B2 (en) 1998-03-20 2006-10-03 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7267749B2 (en) 1999-04-13 2007-09-11 Semitool, Inc. Workpiece processor having processing chamber with improved processing fluid flow
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7622024B1 (en) 2000-05-10 2009-11-24 Novellus Systems, Inc. High resistance ionic current source
US7682498B1 (en) 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
US7799684B1 (en) 2007-03-05 2010-09-21 Novellus Systems, Inc. Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US7964506B1 (en) 2008-03-06 2011-06-21 Novellus Systems, Inc. Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US8308931B2 (en) 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8475637B2 (en) 2008-12-17 2013-07-02 Novellus Systems, Inc. Electroplating apparatus with vented electrolyte manifold
US8475644B2 (en) 2000-03-27 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8513124B1 (en) 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
US8575028B2 (en) 2011-04-15 2013-11-05 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US8703615B1 (en) 2008-03-06 2014-04-22 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
EP2907900A1 (en) * 2014-02-18 2015-08-19 Italfimet S.R.L. Electroplating process and apparatus, particularly for plating or forming parts made of electrically conducting materials by electrodeposition
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9677190B2 (en) 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2746917A (en) * 1953-03-16 1956-05-22 Norton Co Electrolytic grinding apparatus
US3022232A (en) * 1958-05-26 1962-02-20 Caterpillar Tractor Co Method and apparatus for simultaneously plating and lapping
US3108031A (en) * 1960-04-15 1963-10-22 Ernest N Hasala Apparatus for etching curved metal plates
US3183176A (en) * 1960-07-28 1965-05-11 Steel Improvement & Forge Co Apparatus for electrolytically treating the interior of a bore
US3390068A (en) * 1965-10-20 1968-06-25 Micromatic Hone Corp Electrochemical honing apparatus including bore gauging means

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2746917A (en) * 1953-03-16 1956-05-22 Norton Co Electrolytic grinding apparatus
US3022232A (en) * 1958-05-26 1962-02-20 Caterpillar Tractor Co Method and apparatus for simultaneously plating and lapping
US3108031A (en) * 1960-04-15 1963-10-22 Ernest N Hasala Apparatus for etching curved metal plates
US3183176A (en) * 1960-07-28 1965-05-11 Steel Improvement & Forge Co Apparatus for electrolytically treating the interior of a bore
US3390068A (en) * 1965-10-20 1968-06-25 Micromatic Hone Corp Electrochemical honing apparatus including bore gauging means

Cited By (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049507A (en) * 1974-09-18 1977-09-20 Sony Corporation Electrodepositing method
US4132618A (en) * 1975-12-16 1979-01-02 Commissariat A L'energie Atomique Electrolytic device for marking metallic parts
FR2520009A1 (en) * 1982-01-21 1983-07-22 France Etat PROCESS OF INTERNAL CHROMING OF A TUBULAR ELEMENT, ANODE FOR ITS IMPLEMENTATION AND CHROME ELEMENT OBTAINED ACCORDING TO THIS PROCESS
EP0084752A1 (en) * 1982-01-21 1983-08-03 ETAT-FRANCAIS représenté par le Délégué Général pour l' Armement Process for chromium plating the inner surface of tubes, anode used in this process
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US7115196B2 (en) 1998-03-20 2006-10-03 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US7332066B2 (en) 1998-03-20 2008-02-19 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US7357850B2 (en) 1998-07-10 2008-04-15 Semitool, Inc. Electroplating apparatus with segmented anode array
US20030062258A1 (en) * 1998-07-10 2003-04-03 Woodruff Daniel J. Electroplating apparatus with segmented anode array
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7147760B2 (en) 1998-07-10 2006-12-12 Semitool, Inc. Electroplating apparatus with segmented anode array
US7566386B2 (en) 1999-04-13 2009-07-28 Semitool, Inc. System for electrochemically processing a workpiece
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US20020125141A1 (en) * 1999-04-13 2002-09-12 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7267749B2 (en) 1999-04-13 2007-09-11 Semitool, Inc. Workpiece processor having processing chamber with improved processing fluid flow
US8475644B2 (en) 2000-03-27 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US7622024B1 (en) 2000-05-10 2009-11-24 Novellus Systems, Inc. High resistance ionic current source
US7967969B2 (en) 2000-05-10 2011-06-28 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US6890416B1 (en) 2000-05-10 2005-05-10 Novellus Systems, Inc. Copper electroplating method and apparatus
US20100032304A1 (en) * 2000-05-10 2010-02-11 Novellus Systems, Inc. High Resistance Ionic Current Source
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US6773571B1 (en) 2001-06-28 2004-08-10 Novellus Systems, Inc. Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources
US7682498B1 (en) 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
US7090751B2 (en) 2001-08-31 2006-08-15 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20040055873A1 (en) * 2002-09-24 2004-03-25 Digital Matrix Corporation Apparatus and method for improved electroforming
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US8308931B2 (en) 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US7799684B1 (en) 2007-03-05 2010-09-21 Novellus Systems, Inc. Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US7964506B1 (en) 2008-03-06 2011-06-21 Novellus Systems, Inc. Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8513124B1 (en) 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
US8703615B1 (en) 2008-03-06 2014-04-22 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US9309604B2 (en) 2008-11-07 2016-04-12 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8475637B2 (en) 2008-12-17 2013-07-02 Novellus Systems, Inc. Electroplating apparatus with vented electrolyte manifold
US8540857B1 (en) 2008-12-19 2013-09-24 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US10190230B2 (en) 2010-07-02 2019-01-29 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9394620B2 (en) 2010-07-02 2016-07-19 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US9464361B2 (en) 2010-07-02 2016-10-11 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10006144B2 (en) 2011-04-15 2018-06-26 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
US8575028B2 (en) 2011-04-15 2013-11-05 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9834852B2 (en) 2012-12-12 2017-12-05 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10662545B2 (en) 2012-12-12 2020-05-26 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US10301739B2 (en) 2013-05-01 2019-05-28 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9899230B2 (en) 2013-05-29 2018-02-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9677190B2 (en) 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
EP2907900A1 (en) * 2014-02-18 2015-08-19 Italfimet S.R.L. Electroplating process and apparatus, particularly for plating or forming parts made of electrically conducting materials by electrodeposition
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10923340B2 (en) 2015-05-14 2021-02-16 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11047059B2 (en) 2016-05-24 2021-06-29 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating

Similar Documents

Publication Publication Date Title
US3706651A (en) Apparatus for electroplating a curved surface
US2706173A (en) Apparatus for electro-plating crankshaft journals
EP0606610B1 (en) Multi-Compartment electro plating system
CN112695372A (en) Rotation type electrolytic polishing cleaning equipment
US4194957A (en) Apparatus for the electrolytic treatment of metallic parts
US2406956A (en) Apparatus for electroplating of bearing shells
GB1117831A (en) Improvements in or relating to coating articles with polymeric material by electrodeposition
CN102586813A (en) Microelectroforming machine tool
US11447883B2 (en) Wet substrate processing device
JP6704267B2 (en) Electroforming equipment
CN110952114A (en) High-uniformity electroforming equipment
US3462357A (en) Plating fixture
CN108827170B (en) Online double-sided copper thickness tester
US2931764A (en) Apparatus for electroplating bearing surfaces of a crankshaft
US2539502A (en) Electroplating anode and mount
CN111962103A (en) Revolving body part electroforming equipment
US2559926A (en) Anode basket
US1453419A (en) Electroplating apparatus
CN211420333U (en) High-uniformity electroforming equipment
US2605218A (en) Electrolytic method and apparatus for the manufacture of tapered conductors
US3161578A (en) Apparatus for carrying out electrolytic treatments on the entire surface
US3669867A (en) Optical surface generating apparatus
US3547796A (en) Apparatus for electropolishing spherical surfaces
USRE20675E (en) Conveyer driving control
US2055070A (en) Electroplating apparatus