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Publication numberUS3772133 A
Publication typeGrant
Publication dateNov 13, 1973
Filing dateNov 8, 1971
Priority dateNov 8, 1971
Also published asCA961973A, CA961973A1
Publication numberUS 3772133 A, US 3772133A, US-A-3772133, US3772133 A, US3772133A
InventorsSchmitt T
Original AssigneeIndustrial Research Prod Inc
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Backplate construction for electret transducer
US 3772133 A
An electret transducer having a perforate backplate wherein the side of the perforations or holes are coated with a dielectric material.
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Claims  available in
Description  (OCR text may contain errors)

United States Patent Schmitt Nov. 13, 1973 BACKPLATE CONSTRUCTION FOR [5 6] References Cited ELECTRET TRANSDUCER UNITED STATES PATENTS [75] Inventor: Thomas H. Schmitt, Elk Grove 3,105,729 10/1963 Rosenthal et al. 339/18 Village, 111. 3,226,274 12/1965 Tomoyuki Kohno....

3,354,542 11 1967 M 11' 156 252 X [73] Assignee: Industrial Research Products, Inc., I a la Elk Grove Village, 111. FOREIGN PATENTS OR APPLICATIONS Filed: Nov. 8 France 1 1 pp 196,677 Primary Examiner-William A. Powell Attorney-Wilfred S. Stone [52] US. Cl ..l61/112,156/253, 161/119,

307/88 [57] ABSTRACT [51] hit. Cl An eectret transducer i g a perforate backplate [58] Fleld of Search 161/112, 119; wherein the side of the perforations or holes are 156/252, 255, 513, 514; 264/154-156 coated with a dielectric materiaL 3 Claims, 6 Drawing Figures '(IIII VII/l,

BACKPLATE CONSTRUCTION FOR ELECTRET TRANSDUCER BACKGROUND OF THE INVENTION The present electret transducer relates to that type of transducer including a diaphragm, mounted adjacent a backplate. The backplate is perforated to permit air pulsations created by the vibrations of the diaphragm to pass therethrough to the associated acoustic chambers.

A principal object of the present invention is to provide an electret transducer having an improved backplate assembly construction wherein a dielectric film is formed such as to mechanically anchor to the backplate and to cover any irregularities on the surface of the backplate.

It is another object of the invention to provide an electret transducer wherein protrusions are formed on the backplate for supporting the diaphragm, thereby providing a discrete spacing between the diaphragm and the backplate to enhance the response characteristics of the transducer.

It is another object of the invention to provide a new method of coating a dielectric film on a perforated backplate to cover the upper surface of the backplate, and the surfaces of the holes, formed in the backplate.

The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of a preferred embodiment of the invention, as illustrated in the accompanying drawings wherein:

FIG. 1 is a view in cross-section of a length of sheet material from which the backplate of the invention is constructed showing the holes formed in the material and the protrusions formed on the upper surface of the material;

FIG. 2 is a view of the material of FIG. 1 with a film dielectric deposited on its surface;

FIG. 3 is a top view of the material of FIG. 1 showing the film dielectric covering part of the backplate material;

FIG. 4 is a view in cross-section of the material particularly showing the film material covering the sides of the holes;

FIG. 5 is a backplate formed in accordance with the invention, (note that in FIG. 5 the backplate is shown in a position relatively inverted with respect to FIG. 1-4 to more clearly show the peripheral flange construction); and,

FIG. 6 is a partial view in cross-section of a transducer assembly utilizing the structure of the invention.

DESCRIPTION OF THE INVENTION Referring first to FIG. 6, a partial cross-sectional view of an electret transducer including a casing and 27 is depicted. A bulkhead 31 of a suitable insulating material is mounted in casing 25 and supports the associated electronic components indicated generally as 32, and also an electret assembly and diaphragm assembly. A backplate 11, to be described more fully hcreinbelow, is mounted on the bulkhead 31 and a diaphragm 18 is positioned over the backplate.

The backplate ll of the electret transducer of FIG. 6 is shown in FIG. 5. The backplate 11 is perforated with holes indicated generally as 13, which, as is known, permit pulsations of air generated by the vibrations of diaphragm 18 to pass therethrough. Note, that bulkhead 31, also includes holes 34 for the same pur pose. Backplate 11 includes a rim 14 formed along its periphery, and rim l4 rests on bulkhead 31 to form a space between the lower surface of backplate l1 and the upper surface of the bulkhead 31. One surface 15 of the backplate 11 includes discrete protrusions !7 formed to provide a precise selected spacing between the surface 15 of the backplate 11 and the lower surface of the diaphragm.

A sheet, strip or plate of metal 11A can first be cut and formed into the shape of backplate 11 as shown in FIG. 5, and then a film material can be positioned and attached to on the backplate 11 as will be described. Alternatively, the film can first be positioned on and attached to the sheet of metal plate 11A and the assembly can be cut and formed into backplate 11 of FIG. 5.

In either case the following description of the construction is applicable. Referring to FIG. 14, the metal sheet 11A having a pattern of holes 13 formed therein is used to make backplate 11 of FIG. 5 and 6. The pattern of portrusions 17 is formed, as by stamping, on sheet 11A with the protrusions being intermediate the holes 13.

The thin film 19 of a suitable dielectric material such as, for example, a fluorocarbon material, is positioned on surface 15 of sheet 11A by applying to the film air pressure in order of a fraction of a pound per square inch. Film 19 will settle onto the surface and conform to the protrusions 17 and the general contours of the surface 15.

FIG. 3 shows, on the left side of the drawing, the surface 15 of sheet 11A, and on the right side of the drawing, the dielectric film 19 positioned on surface 15.

As the next step, the heated film 19 is subjected to a blast of air under pressure, say lbs per square inch pressure which ruptures the film in the area of the holes 13. The forming action is enhanced by preheating the air. The ruptured film material is forced to flow as at 16 through the holes 13 and thereby coats the sides of the holes as shown in FIG. 4. A portion of the flowing material tends to flow over the lower surface 23 of backplate 11 as shown as at 26 in FIG. 4.

The foregoing construction provides a means of securely anchoring the film 19 to the backplate 11. Such anchoring tabs or fingers 26 of particular importance for certain types of films such as, for example, certain fluorocarbon films which do not readily adhere to the metallic surface of backplate 11.

Also, the film 19 covers any irregularities on the surface of backplate 11 such as burrs which may be caused in the forming or manufacturing process. Due to the small sizes of the components in the transducer 20, any such irregularities on the backplate 11 might cause undesirable effects.

The inventive structure is positioned in the transducer 20 of FIG. 6 where, as mentioned, the backplate 11 is mounted on bulkhead 31. The diaphragm is positioned over the backplate 11 in contact with the protrusions 17. A portion 30 of diaphragm 18 extends over backplate 11 and is supported on bulkhead 31. Suitable electrical conductors 33 and 35 provide electrical connection between the diaphragm 18 and the electret film material 19 through known electronic units, not shown.

While the invention has been particularly showii and described with reference to a preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be made face.

2. A backplate assembly as in claim 1 wherein the film extending over the edge of said perforations on the second surface provides stable anchoring tabs to securely anchor the film on the backplate.

3. A backplate assembly as in claim 1 wherein the film tends to cover any irregularities on the surfaces of said plate and on the surfaces of said perforations.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US3105729 *Apr 1, 1960Oct 1, 1963Rosenthal HerbertElectrical connecting apparatus
US3226274 *Sep 25, 1961Dec 28, 1965Mitsumi Electric CoMethod of manufacturing electrodes of variable condenser
US3354542 *May 10, 1965Nov 28, 1967Western Electric CoEnclosing a metal support with a printed circuit containing envelope
FR683029A * Title not available
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US3894243 *Jun 6, 1974Jul 8, 1975Us NavyPolymeric transducer array
US3896274 *Oct 4, 1973Jul 22, 1975Thermo Electron CorpElectret earphone
US3970862 *Jun 25, 1974Jul 20, 1976The United States Of America As Represented By The Secretary Of The NavyPolymeric sensor of vibration and dynamic pressure
US4331840 *Feb 22, 1980May 25, 1982Lectret S.A.Electret transducer with tapered acoustic chamber
US4418246 *Oct 29, 1980Nov 29, 1983Tibbetts Industries, Inc.Cell assembly for electret transducer
US4442324 *Jun 24, 1982Apr 10, 1984Tibbetts Industries, Inc.Encapsulated backplate for electret transducers
US4567382 *Apr 10, 1984Jan 28, 1986Microtel B.V.Electret transducer and a method for manufacturing an assembly of backplate, electret foil and diaphragm plate
US4741941 *Nov 4, 1985May 3, 1988Kimberly-Clark CorporationNonwoven web with projections
US4764690 *Jun 18, 1986Aug 16, 1988Lectret S.A.Electret transducing
US5490220 *May 5, 1994Feb 6, 1996Knowles Electronics, Inc.Solid state condenser and microphone devices
US5870482 *Feb 25, 1997Feb 9, 1999Knowles Electronics, Inc.Miniature silicon condenser microphone
US7072482Sep 6, 2002Jul 4, 2006Sonion Nederland B.V.Microphone with improved sound inlet port
US8503699 *Jun 1, 2011Aug 6, 2013Infineon Technologies AgPlate, transducer and methods for making and operating a transducer
US9362853May 24, 2013Jun 7, 2016Infineon Technologies AgPlate, transducer and methods for making and operating a transducer
US20120308053 *Jun 1, 2011Dec 6, 2012Infineon Technologies AgPlate, Transducer and Methods for Making and Operating a Transducer
EP0147432A1 *May 22, 1984Jul 10, 1985BEVERIDGE, Harold NormanElectrode for electrostatic transducer and methods of manufacture
EP0147432A4 *May 22, 1984Jun 5, 1986Harold Norman BeveridgeElectrode for electrostatic transducer and methods of manufacture.
EP0561566A2 *Mar 11, 1993Sep 22, 1993Knowles Electronics, Inc.Solid state condenser and microphone
EP0561566A3 *Mar 11, 1993Dec 14, 1994Monolithic Sensors IncSolid state condenser and microphone
U.S. Classification428/137, 156/253, 428/161, 307/400
International ClassificationH04R19/00
Cooperative ClassificationH04R19/00
European ClassificationH04R19/00