US3849906A - Rotary fluid applicator - Google Patents

Rotary fluid applicator Download PDF

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Publication number
US3849906A
US3849906A US00413753A US41375373A US3849906A US 3849906 A US3849906 A US 3849906A US 00413753 A US00413753 A US 00413753A US 41375373 A US41375373 A US 41375373A US 3849906 A US3849906 A US 3849906A
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United States
Prior art keywords
disk
workpiece
fluid
chamber
flow
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US00413753A
Inventor
H Hansen
R Straub
E Tuczynski
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International Business Machines Corp
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International Business Machines Corp
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Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to US00413753A priority Critical patent/US3849906A/en
Priority to DE2442309A priority patent/DE2442309A1/en
Priority to IT27459/74A priority patent/IT1022104B/en
Priority to FR7433122A priority patent/FR2249717B1/fr
Priority to JP49113971A priority patent/JPS5074857A/ja
Priority to CA211,477A priority patent/CA1035574A/en
Priority to GB47076/74A priority patent/GB1482106A/en
Application granted granted Critical
Publication of US3849906A publication Critical patent/US3849906A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004Nozzle assemblies; Air knives; Air distributors; Blow boxes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Drying Of Solid Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Apparatus for applying a fluid medium to a workpiece, the apparatus comprising a chamber and a pair of rotatably mounted disks in the chamber. A workpiece is suspended in the chamber and the disks are provided with a plurality of apertures therein to create a flow of fluid media from one surface of the disk at an oblique angle to the workpiece. The disks are provided with blade-like scallops or notches along their periphery so that a fluid medium applied thereto will effect rotation thereof to create relative movement between the disk and the workpiece. The purpose of this abstract is to enable the public and the Patent Office to determine rapidly the subject matter of the technical disclosure of the application. This abstract is neither intended to define the invention of the application nor is it intended to be limiting as to the scope thereof.

Description

United States Patent Hansen et al.
[ Nov. 26, 1974 ROTARY FLUID APPLICATOR International Business Machines Corporation, Armonk, NY.
Nov. 7, 1973 Inventors:
Assignee:
Filed:
Appl. No:
[56] References Cited UNITED STATES PATENTS l2/l950 Hensler 34/105 7/l952 Wellborn 34/229 Primary ExaminerKenneth W. Sprague Assistant Examiner.lames C. Yeung Attorney, Agent, or Firm William J. Dick [57] ABSTRACT Apparatus for applying a fluid medium to a workpiece, the apparatus comprising a chamber and a pair of rotatably mounted disks in the chamber. A workpiece is suspended in the chamber and the disks are provided with a plurality of apertures therein to create a flow of fluid media from one surface of the disk at an oblique angle to the workpiece. The disks are provided with blade-like scallops or notches along their periphery so that a fluid medium applied thereto will effect rotation thereof to create relative movement between the disk and the workpiece.
The purpose of this abstract is to enable the public and the Patent Office to determine rapidly the subject matter of the technical disclosure of the application. This abstract is neither intended to define the invention of the application nor is it intended to be limiting as to the scope thereof.
10 Claims, 2 Drawing Figures PATENTEL HUVZS I974 FIG. I
ROTARY FLUID APPLICATOR SUMMARY OF THE INVENTION AND STATE OF THE PRIOR ART The present invention relates to apparatus for applying a fluid medium to a workpiece, and more particu larly relates to a rotary drier.
Driers for small workpieces to dispel fluid or the like therefrom are old in the art, and range from the simple expedient of the application of heated air or nitrogen, depending upon the surface coating of the workpiece or the composition thereof, to very elaborate schemes for the application of a drying medium to the work piece.
In view of the above it is a principal object of the present invention to provide novel apparatus for applying a fluid to a workpiece in which the surface of the workpiece is treated uniformly by the fluid.
Another object of the present invention is to provide a novel drier for drying workpiece in which the flow of drying medium against the workpiece is oblique to the surface thereof.
Yet another object of the present invention is to provide a novel drier for semiconductor wafers which more efficiently and in less time is able to dispel liquids from the surface of the wafer by providing a flow of drying medium against the surface thereof oblique to the surface of the wafer.
Yet another object of the present invention is to pro vide novel apparatus for applying a fluid medium to a workpiece which apparatus may be oriented in either the vertical or horizontal plane so as to easily accommodate any desired placement of the article.
Yet another object of the present invention is to provide a novel apparatus which may be duplicated on the opposite side of the workpiece so as to uniformly dry or apply other fluid media to opposite sides of the workpiece.
Other objects and a more complete understanding of the invention may be had by referring to the following specification and claims taken in conjunction with the accompanying drawings in which:
FIG. 1 is a fragmentary sectional view in side elevation of apparatus constructed in accordance with the present invention; and
FIG. 2 is a fragmentary sectional view taken along line 2-2 of FIG. 1.
Referring now to the drawing and especially FIG. 1 thereof, apparatus for applying a fluid medium such as air or nitrogen to a workpiece is illustrated therein. As shown the apparatus comprises a chamber 11 having a workpiece entry port 12 at one end thereof and a fluid medium discharge port 13 at the other end thereof. Means 14, in the illustrated instance a three point holder, acts to suspend a workpiece 15, in the present instance a silicon wafer, within the chamber 11.
In accordance with the invention, means are provided for effecting a flow of fluid medium at an oblique angle onto at least one surface of the workpiece 15. To this end, and as best illustrated in FIG. 1, the means comprises a wheel or disk 16 having a first major surface 16A and second major surface 168 coupled to and mounted for rotation on an axle 17. As shown, the first major surface 16A of the wheel or disk 16 includes a plurality of angulated slots or apertures 17 therein which are connected through passageways 18 to a conduit 19 centrally located in the axle 17. The axle 17, as shown, is mounted for rotation :in the side wall of a housing 20 as by a sleeve bearing 21. A supply of fluid media, such as air or nitrogen, is applied to the conduit 19 by suitable piping 22 which passes through a conduit extension 23 located in a housing extension 24.
The coupling of the conduit extension 23 to the conduit 19 is such as to allow a small amount of the fluid media to escape and pass through and out a media drain 25, located in the housing extension 24.
In order to provide a scrubbing; or swirling action of the media being provided against the workpiece from the slots 17 in the disk 16, means are provided to effect rotation of the disk. To this end, the peripheral edge 16C of the second major surface 168 of the disk 16 is provided with spaced scallops 26 which are aligned for registration with a nozzle 27 through the housing 20, to permit impingement of a second source of fluid media (not shown) against the scallops 26 thereby effecting rotation of the disk 16. Thus the scallops in effect are small blades forming part of a turbine wheel thereby causing the necessary rotation to the disk. This struc ture also permits the wheel or disk 16 to be fitted into the chamber without elaborate labyrinth seals, and permits the discharge of the fluid media, after impingement upon the blade-like scallops, about the periphery of the wheel 16 and into the chamber.
In practice, if it is desired to apply a fluid medium to both sides of the workpiece 15, an identical structure including a wheel or disk 30 may be mounted on the opposite side of the workpiece, the disk including a rear major surface having scallops 31 thereon to impart rotation to the wheel, while providing a source of fluid media as described above against the rear surface of the workpiece 15. In this connection, it may be desirable to effect counter rotation between the two wheels and/or a differential fluid pressure of the fluid medium against opposite surfaces of the workpiece.
Additionally, it may be desirable to provide a differential pressure between the inlet or entry port 12 and the fluid discharge port 13 so as to create a natural flow of fluid media from the chamber 11.
Also, it may be desirable, under certain circumstances, to locate the housing in the horizontal plane as opposed to the vertical plane illustrated in FIG. 1. In this connection the workpiece holder 14 may take one of several forms, none of which are critical to the proper operation of the apparatus. When operated in horizontal plane the flow of media will aid in suspending the workpiece and thus only means to prevent inadvertent displacement along the axis of the chamber Ill is required.
As shown in FIG. 2, the holder for silicon wafers may comprise a pair of arms 14A and 148 which may be separated and brought together to clamp the wafer 15 along its periphery in the present instance at three points.
In operation, the rotation of one or more disks or wheels when used as a drier, effects rapid and uniform drying of the surface of a workpiece such as a semiconductor wafer inasmuch as the provision of a fluid source to create a flow of fluid against the workpiece oblique to the surface thereof tends to drive off any liquids or fluid on the workpiece surface.
Thus the apparatus of the present invention provides for a uniform and quick application of fluids to a workpiece.
Although the invention has been described with a certain degree of particularly, it is understood that the present disclosure has been made only by way of example and that numerous changes in the details of construction and the combination and arrangement of parts and the mode of operation may be made without departing from the spirit and the scope of the invention as hereinafter claimed.
What is claimed is:
1. Apparatus for applying a fluid medium to a workpiece, said apparatus comprising: a chamber; a rotatably mounted disk in said chamber; means for suspending a workpiece in said chamber adjacent said disk, a plurality of angulated slots in the surface of said disk to provide a flow of fluid media from one surface of said disk at an oblique angle to said workpiece, and scallops on said disk, and means to provide a flow of fluid me dium against said scallops to effect a rotation of said disk as said fluid is ejected from said one surface thereof.
2. Apparatus in accordance with claim 1 including internal passageways in said disk and connected to said slots, and conduit means connected to said passageways to provide said fluid medium to said slots.
3. Apparatus in accordance with claim 1 wherein said disk is mounted on one side of said workpiece, and a second disk mounted for rotation on the opposite side of said workpiece, said second disk including a plurality of angulated slots in one surface thereof for providing a flow of fluid media from said one surface thereof at an oblique angle to said workpiece.
4. Apparatus in accordance with claim 3 including scallops on said second disk, and means to provide a flow of fluid medium against said scallops to effect rotation of said second disk.
5. Apparatus for applying a fluid to a workpiece, said apparatus comprising: a chamber having a workpiece entry port and a fluid discharge port; means for suspending a workpiece in said chamber; a disk including an axle and mounted for rotation in said chamber; said disk'having a first major surface and a second major surface; a plurality of angulated slots in said first major surface thereof, and means providing a source of fluid medium through said slots directed towards said worpiece, nozzle means, and means on said disk in registry with said nozzle means whereby a flow of fluid through said nozzle means effects rotation of said wheel to thereby create a flow of fluid against said workpiece oblique to the surface thereof.
6. Apparatus in accordance with claim 5 including internal passageways in said disk and connected to said slots, and conduit means connected to said passageways to provide said fluid medium to said slots.
7. Apparatus in accordance with claim 6 wherein said conduit means extends into and through said axle.
8. Apparatus in accordance with claim 5 wherein said means on said disk includes scallops on said disk.
9. Apparatus in accordance with claim 5 wherein said disk is mounted on one side of said workpiece, and a second disk mounted for rotation on the opposite side of said workpiece, said second disk including means for providing a flow of fluid media from one surface thereof at an oblique angle to said workpiece.
10. Apparatus in accordance with claim 9 including scallops on said second disk, and means to provide a flow of fluid medium against said scallops to effect rotation of said second disk.
* a a l

Claims (10)

1. Apparatus for applying a fluid medium to a workpiece, said apparatus comprising: a chamber; a rotatably mounted disk in said chamber; means for suspending a workpiece in said chamber adjacent said disk, a plurality of angulated slots in the surface of said disk to provide a flow of fluid media from one surface of said disk at an oblique angle to said workpiece, and scallops on said disk, and means to provide a flow of fluid medium against said scallops to effect a rotation of said disk as said fluid is ejected from said one surface thereof.
2. Apparatus in accordance with claim 1 including internal passageways in said disk and connected to said slots, and conduit means connected to said passageways to provide said fluid medium to said slots.
3. Apparatus in accordance with claim 1 wherein said disk is mounted on one side of said workpiece, and a second disk mounted for rotation on the opposite side of said workpiece, said second disk including a plurality of angulated slots in one surface thereof for providing a flow of fluid media from said one surface thereof at an oblique angle to said workpiece.
4. Apparatus in accordance with claim 3 including scallops on said second disk, and means to provide a flow of fluid medium against said scallops to effect rotation of said second disk.
5. Apparatus for applying a fluid to a workpiece, said apparatus comprising: a chamber having a workpiece entry port and a fluid discharge port; means for suspending a workpiece in said chamber; a disk including an axle and mounted for rotation in said chamber; said disk having a first major surface and a second major surface; a plurality of angulated slots in said first major surface thereof, and means providing a source of fluid medium through said slots directed towards said worpiece, nozzle means, and means on said disk in registry with said nozzle means whereby a flow of fluid through said nozzle means effects rotation of said wheel to thereby create a flow of fluid against said workpiece oblique to the surface thereof.
6. Apparatus in accordance with claim 5 including internal passageways in said disk and connected to said slots, and conduit means connected to said passageways to provide said fluid medium to said slots.
7. Apparatus in accordance with claim 6 wherein said conduit means extends into and through said axle.
8. Apparatus in accordance with claim 5 wherein said means on said disk includes scallops on said disk.
9. Apparatus in accordance with claim 5 wherein said disk is mounted on one side of said workpiece, and a second disk mounted for rotation on the opposite side of said workpiece, said second disk including means for providing a flow of fluid media from one surface thereof at an oblique angle to said workpiece.
10. Apparatus in accordance with claim 9 including scallops on said second disk, and means to provide a flow of fluid medium against said scallops to effect rotation of said second disk.
US00413753A 1973-11-07 1973-11-07 Rotary fluid applicator Expired - Lifetime US3849906A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US00413753A US3849906A (en) 1973-11-07 1973-11-07 Rotary fluid applicator
DE2442309A DE2442309A1 (en) 1973-11-07 1974-09-04 DEVICE FOR DRYING SMALL OBJECTS
IT27459/74A IT1022104B (en) 1973-11-07 1974-09-19 EQUIPMENT FOR APPLYING A FLUID AGENT TO A WORKING PIECE
FR7433122A FR2249717B1 (en) 1973-11-07 1974-09-25
JP49113971A JPS5074857A (en) 1973-11-07 1974-10-04
CA211,477A CA1035574A (en) 1973-11-07 1974-10-16 Rotary fluid applicator
GB47076/74A GB1482106A (en) 1973-11-07 1974-10-30 Apparatus for applying fluid to a workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00413753A US3849906A (en) 1973-11-07 1973-11-07 Rotary fluid applicator

Publications (1)

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US3849906A true US3849906A (en) 1974-11-26

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US00413753A Expired - Lifetime US3849906A (en) 1973-11-07 1973-11-07 Rotary fluid applicator

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US (1) US3849906A (en)
JP (1) JPS5074857A (en)
CA (1) CA1035574A (en)
DE (1) DE2442309A1 (en)
FR (1) FR2249717B1 (en)
GB (1) GB1482106A (en)
IT (1) IT1022104B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4429983A (en) 1982-03-22 1984-02-07 International Business Machines Corporation Developing apparatus for exposed photoresist coated wafers
EP0189855A2 (en) * 1985-01-30 1986-08-06 Carl Prof.Dr.-Ing. Kramer Apparatus for evenly directing a gas towards a flat surface
US4767317A (en) * 1985-01-26 1988-08-30 Carl Kramer Apparatus for mixing a gas main flow with at least one gas subflow
CN110603628A (en) * 2017-02-06 2019-12-20 平面半导体公司 Removal of treated wastewater
CN110603629A (en) * 2017-02-06 2019-12-20 平面半导体公司 Sub-nanometer optical-based substrate cleaning mechanism
CN110622290A (en) * 2017-02-06 2019-12-27 平面半导体公司 Sub-nanometer substrate cleaning mechanism
US20210402424A1 (en) * 2020-06-30 2021-12-30 Universal Circuit Board Equipment Co., Ltd. Surface treatment device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417640A (en) * 1977-07-08 1979-02-09 Mitsubishi Electric Corp Malfunction preventive device for integrated circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2532494A (en) * 1946-11-23 1950-12-05 Mcgraw Electric Co Method of making paper tubes
US2602003A (en) * 1946-10-30 1952-07-01 Willard Storage Battery Co Rotating apparatus for blowing loose foreign material from articles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2602003A (en) * 1946-10-30 1952-07-01 Willard Storage Battery Co Rotating apparatus for blowing loose foreign material from articles
US2532494A (en) * 1946-11-23 1950-12-05 Mcgraw Electric Co Method of making paper tubes

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4429983A (en) 1982-03-22 1984-02-07 International Business Machines Corporation Developing apparatus for exposed photoresist coated wafers
US4767317A (en) * 1985-01-26 1988-08-30 Carl Kramer Apparatus for mixing a gas main flow with at least one gas subflow
EP0189855A2 (en) * 1985-01-30 1986-08-06 Carl Prof.Dr.-Ing. Kramer Apparatus for evenly directing a gas towards a flat surface
US4736529A (en) * 1985-01-30 1988-04-12 Carl Kramer Device for the uniform application of gas on a plane surface
EP0189855A3 (en) * 1985-01-30 1988-09-21 Carl Prof.Dr.-Ing. Kramer Apparatus for evenly directing a gas towards a flat surface
EP3577682A4 (en) * 2017-02-06 2020-11-25 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
US11069521B2 (en) 2017-02-06 2021-07-20 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
CN110622290A (en) * 2017-02-06 2019-12-27 平面半导体公司 Sub-nanometer substrate cleaning mechanism
CN110603628A (en) * 2017-02-06 2019-12-20 平面半导体公司 Removal of treated wastewater
EP3577681A4 (en) * 2017-02-06 2020-11-25 Planar Semiconductor, Inc. Removal of process effluents
US10892172B2 (en) * 2017-02-06 2021-01-12 Planar Semiconductor, Inc. Removal of process effluents
US10985039B2 (en) 2017-02-06 2021-04-20 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
CN110603629A (en) * 2017-02-06 2019-12-20 平面半导体公司 Sub-nanometer optical-based substrate cleaning mechanism
US20210313173A1 (en) * 2017-02-06 2021-10-07 Planar Semiconductor Corporation Pte. Ltd. Subnanometer-level light-based substrate cleaning mechanism
US11830726B2 (en) * 2017-02-06 2023-11-28 Planar Semiconductor Corporation Pte. Ltd. Subnanometer-level light-based substrate cleaning mechanism
TWI770115B (en) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 Removal of process effluents
CN110603628B (en) * 2017-02-06 2023-11-07 平面半导体公司 Removal of treated sewage
CN110622290B (en) * 2017-02-06 2023-11-07 平面半导体公司 Sub-nanometer substrate cleaning mechanism
US20210402424A1 (en) * 2020-06-30 2021-12-30 Universal Circuit Board Equipment Co., Ltd. Surface treatment device

Also Published As

Publication number Publication date
IT1022104B (en) 1978-03-20
FR2249717A1 (en) 1975-05-30
JPS5074857A (en) 1975-06-19
GB1482106A (en) 1977-08-03
DE2442309A1 (en) 1975-05-22
FR2249717B1 (en) 1976-12-31
CA1035574A (en) 1978-08-01

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