US3916366A - Thick film varistor and method of making the same - Google Patents

Thick film varistor and method of making the same Download PDF

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US3916366A
US3916366A US517880A US51788074A US3916366A US 3916366 A US3916366 A US 3916366A US 517880 A US517880 A US 517880A US 51788074 A US51788074 A US 51788074A US 3916366 A US3916366 A US 3916366A
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varistor
percent
weight
reacted
glass frit
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US517880A
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Clinton F Jefferson
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Dale Electronics Inc
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Dale Electronics Inc
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Assigned to NATIONAL ASSOCIATION, BANK HAPOALIM, B.M. AND BAN LEUMI, B.M., MANUFACTURERS BANK OF DETROIT, A NATIONAL BANKING ASSOCIATION AS AGENT FOR AND IN BEHALF OF MANUFACTURERS NATIONAL BANK OF DETROIT, FIRST PENNSYLVANIA BANK, N.A., PROVIDENT NATIONAL BANK, MELLON BANK (EAST), NA reassignment NATIONAL ASSOCIATION, BANK HAPOALIM, B.M. AND BAN LEUMI, B.M. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DALE ELECTRONICS, INC., A CORP. OF DE.
Assigned to MANUFACTURERS BANK, N.A. reassignment MANUFACTURERS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DALE ELECTRONICS, INC.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H01C7/108—Metal oxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making

Definitions

  • the varistor material is comprised of a reacted material consisting of nickel oxide and lithium carbonate.
  • the varistor material may also comprise glass frit material, solvent material and binder materials mixed with the reacted material. If desired, electrically conductive metal powders may be incorporated in the varistor material to vary the resistivity of the varistor material. The method of making varistor is also disclosed.
  • This invention relates to a thick film varistor and more particularly to a thick film varistor having the varistor film or material printed on a substrate material wherein the film is comprised of a reacted material consisting of nickel oxide and lithium carbonate.
  • a further object of the invention is to provide a method of producing a thick film varistor having improved operating characteristics.
  • a further object of the invention is to provide an economical method of producing a thick film varistor.
  • a further object of the invention is to provide a thick film varistor wherein the varistor characteristics may be modified by the incorporation of a metal powder so as to modify the resistivity thereof.
  • FIG. 1 is a perspective view of a varistor produced by the method of this invention:
  • FIG. 2 is a perspective view of a modified form of the varistor:
  • FIG. 3 is a perspective view of a still further modified form of the varistor.
  • FIG. 4 is a sectional view as seen along lines 4 4 of FIG. 2.
  • Varistor 10 comprises a pair of terminal conductors and 22 having the varistor material 18 sandwiched therebetween. Conductors 20 and 22 and material 18 are positioned on a ceramic substrate body or material 16.
  • Varistor 12 comprises electrical conductors 26 and 28 having the varistor material 19 electrically connected thereto and extending therebetween. Conductors 26,28 and material 19 are positioned on the ceramic substrate body or material 24.
  • the numerals 30 refer to terminal conductors which are electrically connected by the varistor material. Conductors 30 and varistor material 32 are positioned on substrate body or material 34.
  • the varistor is prepared by the following process.
  • Conductive nickel oxide powder is prepared by ball milling nickel oxide powder with lithium carbonate powder in an acetone solution to obtain a homogeneous mixture which is then dried.
  • the dried powders are then reacted at elevated temperatures between 1050-l 200C to obtain a conductive nickel oxide.
  • the amount of lithium carbonate in the mixture influences the conductivity of the resultant oxide powders, and percentages of l to 6 percent of lithium carbonate by weight have been found to be preferred.
  • the reacted material nickel oxide and lithium carbonate is then ball milled in acetone until a desired particle size is obtained.
  • the powders are then dried and screened through a 325 mesh sieve.
  • the nickel oxide-lithium carbonate mixture is then formulated into a thick film paste using procedures well known to those skilled in the art of formulating thick film resistor materials.
  • Glass frit in the lead borosilicate system may be used if desired, as can other glass systems, with the choice of the glass system depending on the subsequent firing temperatures at which the thick film varistor is to 'be fired- Solvents and thixotropic binders may be used, such as butyl carbitol acetate, and ethyl cellulose, but the solvents and binders may be se lected from other materials.
  • the resistivity of the material may be modified by the addition of conductive metal powder such as silver powder or nickel powder.
  • the metal powders may be used in various amounts depending upon the value of k required. Silver powders are found to be the most effective in controlling the low-current valueof the resistivity and weight ratios of Ni -xLi ozAg of :0.0' to 50:50 have been found to produce excellent thick film varistor pastes.
  • the thick film varistor paste prepared according to the method described above is then printed on the substrate bodies 16, 24 or 34 (and conductors) in FIGS. 1, 2 and 3 respectively (such as Al O in a manner familiar to the thick film industry. It should be understood that other suitable substrate materials known to the industry may also be used.
  • the terminal conductors illustrated in FIGS. 1, 2 and 3 are used to terminate the varistor and may be comprised of such materials as Pt- Au, Pd-Au, Pd-Ag or Pt-Ag. It has been found that silver bearing conductors result in the best terminations and are the preferred embodiment.
  • the thick film varistors are then dried and fired at temperatures of 600 to 950C peak temperatures. The total furnace profile may vary from 20 minutes to 1 hour depending on the peak furnace temperature and the composition of the glass frit selected in the formulation.
  • the pattern used to print the thick film varistor may be varied and any conventional pattern currently used to print thick film varistors may be used.
  • the selection of the pattern is based on the desired varistor characteristics. It has been found that for high current, low voltage applications, the pattern or embodiment shown in FIG. 1 is preferred while the design illustrated in FIG. 2 is preferred for low current applications.
  • the parallel combination of varistors shown in FIG. 3 may be used when the current voltage characteristics of the parallel varistors are closely matched.
  • varistor configuration of FIG. 1 requires less conductive varistor paste than do the configurations of FIGS. 2 and 3.
  • varistor formulations which have been found to be useful for the different varistor designs are shown in Table 1 below.
  • varistor material being comprised of a reacted material Consisting of nickel oxide and lithium carbonate.
  • said lithium carbonate comprises 1 to 6 percent by weight of the said material.
  • nickel oxide comprises 94 to 99 percent by weight of the reacted material.
  • varistor of claim 1 wherein said varistor material also comprises a glass frit material mixed with said reacted material.
  • varistor of claim 3 wherein said varister material also comprises solvent and binder materials mixed with said glass frit material and said reacted material.
  • varistor of claim 3 wherein said varistor material also comprises electrically conductive metal powders mixed with said glass frit material and said reacted 6.
  • the varistor of claim is silver powder.
  • nickel oxide-lithium carbonate 17.06 percent by weight nickel powder; 22.75 percent by weight glass frit; 7.84 percent'by weight ethyl cellulose; and 35.29 percent by weight butyl carbitol acetate.
  • varistor of claim 1 wherein said varistor material approximately comprises 34.12 percent by weight nickel oxide-lithium carbonate; 22.75 percent by weight glass frit; 7.84 percent by weight ethyl cellulose; and 35.29 percent by weight butyl carbitol acetate.

Abstract

A thick film varistor comprising a substrate material having a varistor film or material printed thereon. Terminal conductors are electrically connected to the varistor film to terminate the varistor. The varistor material is comprised of a reacted material consisting of nickel oxide and lithium carbonate. The varistor material may also comprise glass frit material, solvent material and binder materials mixed with the reacted material. If desired, electrically conductive metal powders may be incorporated in the varistor material to vary the resistivity of the varistor material. The method of making varistor is also disclosed.

Description

United States Patent Jefferson 5] Oct. 28, 1975 THICK FILM VARISTOR AND METHOD OF 3,689,863 9/1972 Matsuoka a a1. 338/20 MAKING THE SAME 3,760,318 9/1973 Masuyama et a1 338/20 Inventor: Clinton F. Jefferson, Norfolk, Nebr.
Dale Electronics, Inc., Columbus, Nebr.
Filed: Oct. 25, 1974 Appl. No.: 517,880
Assignee:
US. Cl. 338/21; 29/610; 252/516; 252/519; 338/306; 338/307;
Int. Cl. H01C 7/12 Field of Search 338/20, 21, 306-309, 338/325, 328; 252/516, 519; 29/610 References Cited UNITED STATES PATENTS 4/1965 Murphy et a1. 252/516 X 2/1969 Garfinkel et aL... 8/1972 Matsuoka et a1. 252/518 Primary Examiner-C. L. Albritton Attorney, Agent, or Firm-Zarley, McKee, Thomte & Voorhees [57] ABSTRACT A thick film varistor comprising a substrate material having a varistor film or material printed thereon. Terminal conductors are electrically connected to the varistor film to terminate the varistor. The varistor material is comprised of a reacted material consisting of nickel oxide and lithium carbonate. The varistor material may also comprise glass frit material, solvent material and binder materials mixed with the reacted material. If desired, electrically conductive metal powders may be incorporated in the varistor material to vary the resistivity of the varistor material. The method of making varistor is also disclosed.
10 Claims, 4 Drawing Figures U.S. Patent Oct. 28, 1975 THICK FILM VARISTOR AND METHOD OF MAKING THE SAME BACKGROUNDOF THE INVENTION This invention relates to a thick film varistor and more particularly to a thick film varistor having the varistor film or material printed on a substrate material wherein the film is comprised of a reacted material consisting of nickel oxide and lithium carbonate.
The 'art of making thick film resistors is well known and is described in the prior art. This invention relates to an improved process and the formulations thereof for the preparation of thick film symmetrical nonohmic resistors, known to'the industry as symmetrical varistors.
Therefore, is a principal object of the invention to provide an improved thick film varistor.
A further object of the invention is to provide a method of producing a thick film varistor having improved operating characteristics.
. A further object of the invention is to provide an economical method of producing a thick film varistor.
. A further object of the invention is to provide a thick film varistor wherein the varistor characteristics may be modified by the incorporation of a metal powder so as to modify the resistivity thereof.
These and other objects will be apparent to those skilled in the art.
BRIEF DESCRIPTION OF THE DRAWINGS This invention consists in the construction, arrangements and combination of the various parts of the device, whereby the objects contemplated are attained as hereinafter more fully set forth, specifically pointed out in the claims, and illustrated in the accompanying drawings, in which:
FIG. 1 is a perspective view of a varistor produced by the method of this invention:
FIG. 2 is a perspective view of a modified form of the varistor:
FIG. 3 is a perspective view of a still further modified form of the varistor; and
FIG. 4 is a sectional view as seen along lines 4 4 of FIG. 2.
DESCRIPTION OF THE PREFERRED EMBODIMENT In FIG. 1, the numeral refers to one form of the varistor while the numerals 12 and 14 refer to other forms of the varistors in FIGS. 2 and 3 respectively. Varistor 10 comprises a pair of terminal conductors and 22 having the varistor material 18 sandwiched therebetween. Conductors 20 and 22 and material 18 are positioned on a ceramic substrate body or material 16.
Varistor 12 comprises electrical conductors 26 and 28 having the varistor material 19 electrically connected thereto and extending therebetween. Conductors 26,28 and material 19 are positioned on the ceramic substrate body or material 24.
With respect to FIG. 3, the numerals 30 refer to terminal conductors which are electrically connected by the varistor material. Conductors 30 and varistor material 32 are positioned on substrate body or material 34.
The varistor is prepared by the following process. Conductive nickel oxide powder is prepared by ball milling nickel oxide powder with lithium carbonate powder in an acetone solution to obtain a homogeneous mixture which is then dried. The dried powders are then reacted at elevated temperatures between 1050-l 200C to obtain a conductive nickel oxide. The amount of lithium carbonate in the mixture influences the conductivity of the resultant oxide powders, and percentages of l to 6 percent of lithium carbonate by weight have been found to be preferred. The reacted material nickel oxide and lithium carbonate is then ball milled in acetone until a desired particle size is obtained. The powders are then dried and screened through a 325 mesh sieve.
The nickel oxide-lithium carbonate mixture is then formulated into a thick film paste using procedures well known to those skilled in the art of formulating thick film resistor materials. Glass frit in the lead borosilicate system may be used if desired, as can other glass systems, with the choice of the glass system depending on the subsequent firing temperatures at which the thick film varistor is to 'be fired- Solvents and thixotropic binders may be used, such as butyl carbitol acetate, and ethyl cellulose, but the solvents and binders may be se lected from other materials.
The resistivity of the material may be modified by the addition of conductive metal powder such as silver powder or nickel powder. The conductive metal powders control the value of k in the formula I kV" where I I= Current in amperes, k constant, V Voltage and N an exponent. The metal powders may be used in various amounts depending upon the value of k required. Silver powders are found to be the most effective in controlling the low-current valueof the resistivity and weight ratios of Ni -xLi ozAg of :0.0' to 50:50 have been found to produce excellent thick film varistor pastes.
The thick film varistor paste prepared according to the method described above is then printed on the substrate bodies 16, 24 or 34 (and conductors) in FIGS. 1, 2 and 3 respectively (such as Al O in a manner familiar to the thick film industry. It should be understood that other suitable substrate materials known to the industry may also be used. The terminal conductors illustrated in FIGS. 1, 2 and 3 are used to terminate the varistor and may be comprised of such materials as Pt- Au, Pd-Au, Pd-Ag or Pt-Ag. It has been found that silver bearing conductors result in the best terminations and are the preferred embodiment. The thick film varistors are then dried and fired at temperatures of 600 to 950C peak temperatures. The total furnace profile may vary from 20 minutes to 1 hour depending on the peak furnace temperature and the composition of the glass frit selected in the formulation.
The pattern used to print the thick film varistor may be varied and any conventional pattern currently used to print thick film varistors may be used. The selection of the pattern is based on the desired varistor characteristics. It has been found that for high current, low voltage applications, the pattern or embodiment shown in FIG. 1 is preferred while the design illustrated in FIG. 2 is preferred for low current applications. The parallel combination of varistors shown in FIG. 3 may be used when the current voltage characteristics of the parallel varistors are closely matched.
Depending on the configuration used for the varistor pattern, different varistor formulations are found to be desirable. The varistor configuration of FIG. 1 requires less conductive varistor paste than do the configurations of FIGS. 2 and 3. varistor formulations which have been found to be useful for the different varistor designs are shown in Table 1 below.
Table l Compositions, For design For, design of Ingredients FIG. I FIGS. 2 and 3 Ni, ,Li 0,powder 34.12 17.06 Ag or Ni powders v 17.06 Glass Frit 22.75 22.75 Ethyl-Cellulose 7.84 7.84 Butyl Carbitol 35.29 35.29 Acetate Thus it can be seen that a method has been provided for making'athick film varistor having improved operqsating characteristics. Thus it can be seen that the varistor and method ofvmaking the same accomplishes all of 'its stated objectives.
.-.- I said varistor material being comprised of a reacted material Consisting of nickel oxide and lithium carbonate. I 2. The-varistor of claim 1 wherein said lithium carbonate comprises 1 to 6 percent by weight of the said material. 1
reacted material and .wherein said nickel oxide comprises 94 to 99 percent by weight of the reacted material.
3. The varistor of claim 1 wherein said varistor material also comprisesa glass frit material mixed with said reacted material.
4. The varistor of claim 3 wherein said varister material also comprises solvent and binder materials mixed with said glass frit material and said reacted material.
5. The varistor of claim 3 wherein said varistor material also comprises electrically conductive metal powders mixed with said glass frit material and said reacted 6. The varistor of claim is silver powder. I
7. The varistor ofv claim 5 wherein said metal powder is nickel powder. i
8. The varistor of claim 4 wherein said solvent material is butyl carbitol acetate and wherein said binder material is ethyl cellulose.
9. The varistor of claim 1 wherein said varistor mate- 5 wherein said metal powder rial approximately comprises 17.06 percent by weight. I
nickel oxide-lithium carbonate; 17.06 percent by weight nickel powder; 22.75 percent by weight glass frit; 7.84 percent'by weight ethyl cellulose; and 35.29 percent by weight butyl carbitol acetate.
10. The varistor of claim 1 wherein said varistor material approximately comprises 34.12 percent by weight nickel oxide-lithium carbonate; 22.75 percent by weight glass frit; 7.84 percent by weight ethyl cellulose; and 35.29 percent by weight butyl carbitol acetate.

Claims (10)

1. A THICK FILM VARISTOR, COMPRISING A SUBSTRATE MATERIAL, A VARISTOR MAERIAL POSITONED ON SAID SUBSTRATE MATERIAL, TERMINAL CONDUCTORS ELECTRICALLY CONNECTED TO SAID VARISTOR MATERIAL, SAID VARISTOR MATERIAL BEING COMPRISED OF A REACTED MATERIAL CONSISTING OF NICKEL OXIDE AND LITHIUM CARBONATE.
2. The varistor of claim 1 wherein said lithium carbonate comprises 1 to 6 percent by weight of the said reacted material and wherein said nickel oxide comprises 94 to 99 percent by weight of the reacted material.
3. The varistor of claim 1 wherein said varistor material also comprises a glass frit material mixed with said reacted material.
4. The varistor of claim 3 wherein said varister material also comprises solvent and binder materials mixed with said glass frit material and said reacted material.
5. The varistor of claim 3 wherein said varistor material also comprises electrically conductive metal powders mixed with said glass frit material and said reacted material.
6. The varistor of claim 5 wherein said metal powder is silver powder.
7. The varistor of claim 5 wherein said metal powder is nickel powder.
8. The varistor of claim 4 wherein said solvent material is butyl carbitol acetate and wherein said binder material is ethyl cellulose.
9. The varistor of claim 1 wherein said varistor material approximately comprises 17.06 percent by weight nickel oxide-lithium carbonate; 17.06 percent by weight nickel powder; 22.75 percent by weight glass frit; 7.84 percent by weight ethyl cellulose; and 35.29 percent by weight butyl carbitol acetate.
10. The varistor of claim 1 wherein said varistor material approximately comprises 34.12 percent by weight nickel oxide-lithium carbonate; 22.75 percent by weight glass frit; 7.84 percent by weight ethyl cellulose; and 35.29 percent by weight butyl carbitol acetate.
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Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4097834A (en) * 1976-04-12 1978-06-27 Motorola, Inc. Non-linear resistors
FR2513032A1 (en) * 1981-09-14 1983-03-18 Carreras Michelle INTEGRATED PROTECTION AGAINST OVERVOLTAGES OF AN ELECTRONIC CIRCUIT, AND ELECTRONIC CIRCUIT PROTECTED BY THIS DEVICE
FR2527039A1 (en) * 1982-05-14 1983-11-18 Inf Milit Spatiale Aeronaut DEVICE FOR PROTECTING AN ELECTRONIC DEVICE AGAINST THE VOLTAGES GENERATED BY AN ELECTROMAGNETIC FIELD
US4460624A (en) * 1981-09-04 1984-07-17 Thomson-Csf Process for the manufacture of thick layer varistors on a hybrid circuit substrate
EP0115638A2 (en) * 1983-01-10 1984-08-15 Hitachi, Ltd. Thick film circuit board
US4584553A (en) * 1983-06-07 1986-04-22 Nippon Soken, Inc. Coated layer type resistor device
US4657699A (en) * 1984-12-17 1987-04-14 E. I. Du Pont De Nemours And Company Resistor compositions
US4660017A (en) * 1985-03-04 1987-04-21 Marcon Electronics Co., Ltd. Chip-type varistor
WO1989003862A1 (en) * 1987-10-23 1989-05-05 Ray Andrews Glass enamel
US4888465A (en) * 1987-07-11 1989-12-19 Robert Krups Stiftung & Co. Kg. Hot beverage machine with thick film electric heater
US4959090A (en) * 1988-09-28 1990-09-25 Ciba-Geigy Corporation Glass enamel coating compositions
US5334412A (en) * 1991-12-23 1994-08-02 Ferro Corporation Enamel for use on glass and a method of using the same
US5837178A (en) * 1990-03-16 1998-11-17 Ecco Limited Method of manufacturing varistor precursors
US5973588A (en) * 1990-06-26 1999-10-26 Ecco Limited Multilayer varistor with pin receiving apertures
US6008719A (en) * 1994-07-01 1999-12-28 Thomson-Csf Electrical control device with crosstalk correction, and application thereof to magnetic write/read heads
US6183685B1 (en) 1990-06-26 2001-02-06 Littlefuse Inc. Varistor manufacturing method
US20020125985A1 (en) * 2001-03-09 2002-09-12 Rohm Co., Ltd. Chip resistor
US20030011026A1 (en) * 2001-07-10 2003-01-16 Colby James A. Electrostatic discharge apparatus for network devices
US20030025587A1 (en) * 2001-07-10 2003-02-06 Whitney Stephen J. Electrostatic discharge multifunction resistor
US6549114B2 (en) * 1998-08-20 2003-04-15 Littelfuse, Inc. Protection of electrical devices with voltage variable materials
US20050141166A1 (en) * 2003-12-25 2005-06-30 Hidenori Katsumura Method of manufacturing ESD protection component
US20060262477A1 (en) * 2005-05-23 2006-11-23 Fujitsu Limited Electronic circuit device and its manufacture method, varistor manufacture method and semiconductor device manufacture method
US20090085716A1 (en) * 2007-10-01 2009-04-02 Jung-Ho Kim Semiconductor device and method of fabricating the same
EP2337070A1 (en) * 2009-12-17 2011-06-22 ABB Technology AG Electronic device with non-linear resistive field grading and method for its manufacturing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3180841A (en) * 1962-08-28 1965-04-27 Int Resistance Co Resistance material and resistor made therefrom
US3429831A (en) * 1965-01-18 1969-02-25 Gen Electric Lithiated nickel oxide crystals
US3682841A (en) * 1970-12-01 1972-08-08 Matsushita Electric Ind Co Ltd Voltage dependent resistors in a bulk type
US3689863A (en) * 1969-12-08 1972-09-05 Matsushita Electric Ind Co Ltd Voltage dependent resistors in a surface barrier type
US3760318A (en) * 1971-08-27 1973-09-18 Matsushita Electric Ind Co Ltd Process for making a voltage dependent resistor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3180841A (en) * 1962-08-28 1965-04-27 Int Resistance Co Resistance material and resistor made therefrom
US3429831A (en) * 1965-01-18 1969-02-25 Gen Electric Lithiated nickel oxide crystals
US3689863A (en) * 1969-12-08 1972-09-05 Matsushita Electric Ind Co Ltd Voltage dependent resistors in a surface barrier type
US3682841A (en) * 1970-12-01 1972-08-08 Matsushita Electric Ind Co Ltd Voltage dependent resistors in a bulk type
US3760318A (en) * 1971-08-27 1973-09-18 Matsushita Electric Ind Co Ltd Process for making a voltage dependent resistor

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4097834A (en) * 1976-04-12 1978-06-27 Motorola, Inc. Non-linear resistors
US4460624A (en) * 1981-09-04 1984-07-17 Thomson-Csf Process for the manufacture of thick layer varistors on a hybrid circuit substrate
FR2513032A1 (en) * 1981-09-14 1983-03-18 Carreras Michelle INTEGRATED PROTECTION AGAINST OVERVOLTAGES OF AN ELECTRONIC CIRCUIT, AND ELECTRONIC CIRCUIT PROTECTED BY THIS DEVICE
WO1983001153A1 (en) * 1981-09-14 1983-03-31 Carreras, Michelle Integrated protection device against overvoltages in an electronic circuit and electronic circuit protected by such device
US4559579A (en) * 1982-05-14 1985-12-17 Thomson Csf Device for the protection of an electronic component and/or circuit against the disturbances (voltages) generated by an external electromagnetic field
FR2527039A1 (en) * 1982-05-14 1983-11-18 Inf Milit Spatiale Aeronaut DEVICE FOR PROTECTING AN ELECTRONIC DEVICE AGAINST THE VOLTAGES GENERATED BY AN ELECTROMAGNETIC FIELD
WO1983004157A1 (en) * 1982-05-14 1983-11-24 Compagnie D'informatique Militaire Spatiale Et Aer Device for the protection of an electronic device against voltages generated by an electromagnetic field
EP0115638A3 (en) * 1983-01-10 1986-03-26 Hitachi, Ltd. Thick film circuit board
EP0115638A2 (en) * 1983-01-10 1984-08-15 Hitachi, Ltd. Thick film circuit board
US4584553A (en) * 1983-06-07 1986-04-22 Nippon Soken, Inc. Coated layer type resistor device
US4657699A (en) * 1984-12-17 1987-04-14 E. I. Du Pont De Nemours And Company Resistor compositions
US4660017A (en) * 1985-03-04 1987-04-21 Marcon Electronics Co., Ltd. Chip-type varistor
US4888465A (en) * 1987-07-11 1989-12-19 Robert Krups Stiftung & Co. Kg. Hot beverage machine with thick film electric heater
WO1989003862A1 (en) * 1987-10-23 1989-05-05 Ray Andrews Glass enamel
GB2227484A (en) * 1987-10-23 1990-08-01 Ray Andrews Glass enamel
GB2227484B (en) * 1987-10-23 1991-12-18 Ray Andrews Glass enamel
US4959090A (en) * 1988-09-28 1990-09-25 Ciba-Geigy Corporation Glass enamel coating compositions
US5837178A (en) * 1990-03-16 1998-11-17 Ecco Limited Method of manufacturing varistor precursors
US6334964B1 (en) 1990-03-16 2002-01-01 Littelfuse, Inc. Varistor ink formulations
US6743381B2 (en) 1990-03-16 2004-06-01 Littlefuse, Inc. Process for forming varistor ink composition
US5973588A (en) * 1990-06-26 1999-10-26 Ecco Limited Multilayer varistor with pin receiving apertures
US6183685B1 (en) 1990-06-26 2001-02-06 Littlefuse Inc. Varistor manufacturing method
US5334412A (en) * 1991-12-23 1994-08-02 Ferro Corporation Enamel for use on glass and a method of using the same
US6008719A (en) * 1994-07-01 1999-12-28 Thomson-Csf Electrical control device with crosstalk correction, and application thereof to magnetic write/read heads
US6549114B2 (en) * 1998-08-20 2003-04-15 Littelfuse, Inc. Protection of electrical devices with voltage variable materials
US6856233B2 (en) * 2001-03-09 2005-02-15 Rohm Co., Ltd. Chip resistor
US20020125985A1 (en) * 2001-03-09 2002-09-12 Rohm Co., Ltd. Chip resistor
US20030025587A1 (en) * 2001-07-10 2003-02-06 Whitney Stephen J. Electrostatic discharge multifunction resistor
US20030011026A1 (en) * 2001-07-10 2003-01-16 Colby James A. Electrostatic discharge apparatus for network devices
US7034652B2 (en) 2001-07-10 2006-04-25 Littlefuse, Inc. Electrostatic discharge multifunction resistor
US7035072B2 (en) 2001-07-10 2006-04-25 Littlefuse, Inc. Electrostatic discharge apparatus for network devices
US20050141166A1 (en) * 2003-12-25 2005-06-30 Hidenori Katsumura Method of manufacturing ESD protection component
US7189297B2 (en) * 2003-12-25 2007-03-13 Matsushita Electric Industrial Co., Ltd. Method of manufacturing ESD protection component
US20060262477A1 (en) * 2005-05-23 2006-11-23 Fujitsu Limited Electronic circuit device and its manufacture method, varistor manufacture method and semiconductor device manufacture method
US7570149B2 (en) 2005-05-23 2009-08-04 Fujitsu Limited Electronic circuit device including electric element and varistor on substrate and its manufacture method
US20090085716A1 (en) * 2007-10-01 2009-04-02 Jung-Ho Kim Semiconductor device and method of fabricating the same
EP2337070A1 (en) * 2009-12-17 2011-06-22 ABB Technology AG Electronic device with non-linear resistive field grading and method for its manufacturing
WO2011080093A1 (en) * 2009-12-17 2011-07-07 Abb Technology Ag Power electronic module with non-linear resistive field grading and method for its manufacturing

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