|Publication number||US4907035 A|
|Application number||US 06/842,145|
|Publication date||Mar 6, 1990|
|Filing date||Mar 21, 1986|
|Priority date||Mar 30, 1984|
|Publication number||06842145, 842145, US 4907035 A, US 4907035A, US-A-4907035, US4907035 A, US4907035A|
|Inventors||Daniel N. Galburt, Jere D. Buckley|
|Original Assignee||The Perkin-Elmer Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (9), Referenced by (53), Classifications (5), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a continuation, division, of application Ser. No. 595,188 , filed Mar. 30, 1984 now abandoned.
In the fabrication of integrated circuits it is necessary to prealign the silicon wafers prior to delivery to the work station. At the work station the wafer is then fine aligned prior to a circuit pattern being imprinted thereon. Prealignment is important inasmuch as the the wafer must be accurately enough positioned to be within the range of the fine alignment mechanism.
Presently available prealigners have the requirement that the wafer be centered, i.e., positioned in the X-Y direction before it can be angularly oriented. This is so inasmuch as the wafer can be delivered to the prealigner stage off-center by as much as half an inch which places it out of the range of any presently available angular orientation scheme.
The present invention overcomes the above problem and provides an accurate prealigner wherein the wafer may be angularly oriented without the necessity of first centering the wafer in the X-Y direction. In other words, the present invention is a prealigner which can angularly orient a wafer without the requirement of a integral X-Y centering stage.
The present invention comprises a shaft, means to rotate the shaft, vacuum means associated with the shaft for holding a wafer during rotation of the shaft. A light source and photo sensitive device are disposed on opposite sides of the wafer. As the wafer is rotated through one full revolution, the sensor detects the edge of the wafer to provide a signal representative of the eccentricitly, i.e., distance of the wafer from center in the X-Y direction. The signal also provides an indication of the angular position of the wafer by sensing the flat or notch of the wafer. The type of sensor used has a linear dimension which assures the shadow produced by the light source with the edge of the wafer is within the field of view of the sensor. The signal provided by the sensor is provided to a computer where it is used to calculate the X-Y position and angular orientation of the wafer.
Since the angular orientation of the wafer is known, the shaft is then rotated to orient the wafer to the desired angular orientation. The information representative of the X-Y position of the wafer may be used to center the wafer when it is transferred to the next stage.
FIG. 1 is a block diagram, partly in schematic, of an embodiment of the present invention, and
FIG. 2 is a graphical representation useful in understanding the present invention.
Referring to FIG. 1 there is shown the wafer prealignment apparatus of the present invention. It comprises a shaft assembly 11. The shaft assembly 11 comprises a housing 12. A shaft 13 is rotatively mounted within housing 12 with the aid of conventional bearings 14
One end of the shaft 13 comprises a cup-shaped element 15. The shaft 13 has a conduit 16 formed therein which communicates with a tube 18 via conduit 17 formed in housing 12. Thus, a wafer 19 transferred to element 15 may be secured thereto by vacuum applied to the center of cup-shaped element 15 via conduits 16 and 17 and tube 18.
A servo motor 20 is disposed at the other end of shaft 13 and is used to rotate the shaft 13 when energized by motor drive 21. Also disposed at the other end of shaft 13 is a resolver 22 which provides a signal representative of the angular orientation of the shaft 13. This signal is provided to signal processor 23 where it is digitized into a precise number for discrete angular positions of the shaft 13, i.e., a number identifying the angular position of the shaft 13 for each 10 to 20 arcseconds position of the shaft is determined and provided as input to computer 27. Such a resolver and processing electronics are well known commercially available items.
On one side of the wafer 19 is a light source 24 which may be a light emitting diode, a laser diode or any other convenient source of light. On the other side of the wafer 19 located substantially in the path of the light beam from light source 24 is a light sensor 25 which may be a charge coupled device array. The light source 24 and light sensor 25 are disposed at the approximate expected position of the edge of the wafer 19 so that the light source 24 casts the shadow of the edge of the wafer 19 either directly onto the light sensor 25 or indirectly thru imaging optics.
The light sensor 25 is chosen to have a length so that it captures the edge shadow of the wafer 19 over a wide range of eccentricity, e.g., the wafer 19 may be half an inch or more off center when it is delivered to the shaft 13. One such sensor is a charge coupled device array manufactured by Texas Instruments, e.g., the TC103. Such a charge coupled device has a sensitive length of an inch or more and comprises two thousand or more individual elements. It is, therefore, capable of accommodating large variations, for example, half an inch or more variation in eccentricity, i.e., the amount that the wafer is off-center when it is delivered to the prealignment stage.
The series of lenses shown disposed between the light source 24 and the wafer 19 direct light on a radial line across the wafers edge. Optional lenses between the wafer and light sensor provide telecentric imaging of the light beam onto the light sensor. This provides a substantially collimated beam of light onto the sensitive area so that the shadow of the edge which is cast upon the sensitive surface of the light sensor 25 is sharply defined. Other lens arrangements may be used to accomplish this purpose.
As the shaft turns, the light sensor 25 is periodically electronically scanned producing an analog output signal.
The analog output signal of the light sensor 25 is provided to the linear array signal processing circuit 26 where it is digitized and reduced to a series of numbers each representative of the wafer edge position at a given shaft angle which is provided as an input to computer 27.
The digitized information from linear array signal processor 26 is provided to computer 27 which may be the Intel 8088 available from the Intel Corporation.
The digitized linear output and relevant resolver shaft angle data is stored in the computer 27 until the revolution of the wafer is complete. The computer 27 then has sufficient information to calculate the X-Y position and angular orientation of the wafer.
Since the desired angular orientation of the wafer 19 is a known quantity and may be permanently stored in the computer, motor drive 21 may be energized to rotate the wafer to the desired angular orientation.
Since the eccentricity or deviation in the X-Y position from center has also been calculated by the computer 27, this information may be supplied to an X-Y stage to position it to cause the wafer to be centered when it is transferred to it. As aforesaid, the use of a light sensor capable of capturing a wafer edge over a wide range of eccentricity eliminates the need for an integral X-Y stage and provides a universal wafer prealigner which is hardware independent of the wafer geometry. Since in a typical system the wafer is transferred to a prealigner at an unknown angle and up to half an inch off center, the present invention provides a method for accurately aligning the wafer in angular orientation without first centering the wafer.
FIG. 2 is an illustration of the signal resulting from an edge scan of the wafer 19 by light sensor 25.
Curve A represents the signal from light sensor 25 of a wafer which happened to be transferred to shaft 13 in an accurately centered condition, i.e., with no eccentricity and which has no flat or notch.
Curve B on the other hand represents the signal when the wafer is off center and has a notch or flat. This curve approaches a sinusoid the amplitude of which at various points along the curve is representative of the eccentricity or off-center condition of the wafer at various angles as the wafer is rotated. The deviation S in the signal indicates the position of the flat or notch in the wafer and, therefore, its angular orientation.
On the curve B, the value 0 indicates the flat or notch angular location. D is a measure of the wafer's diameter. E is a measure of the eccentricity of the wafer and S is a measure of the flat or notch depth which in conjunction with diameter D determines flat or notch width. Thus, it may be seen that the signal from the light sensor 25 provides sufficient information to determine the angular position of the wafer. Since desired position of the wafer is also known, the wafer may be easily positioned to the desired angular position.
Since the signal from light sensor 25 also contains deviations of the wafer from center, this information may be used to pre-position the stage to which the wafer is transferred so that on transfer the wafer is centered thereon.
Other modifications of the present invention are possible in light of the foregoing description which should not be construed as placing limitations on the invention beyond those set forth in the claims which follow:
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3604940 *||Aug 4, 1969||Sep 14, 1971||Laser Systems Corp||Radiant energy inspection system for rotating objects|
|US3826576 *||Dec 20, 1972||Jul 30, 1974||Goodyear Aerospace Corp||Laser measuring or monitoring system|
|US4021119 *||Jun 24, 1975||May 3, 1977||Honeywell Inc.||Position gauge|
|US4328553 *||Sep 8, 1980||May 4, 1982||Computervision Corporation||Method and apparatus for targetless wafer alignment|
|US4402613 *||Mar 29, 1979||Sep 6, 1983||Advanced Semiconductor Materials America||Surface inspection system|
|US4425075 *||Apr 20, 1981||Jan 10, 1984||The Perkin-Elmer Corporation||Wafer aligners|
|US4457664 *||Mar 22, 1982||Jul 3, 1984||Ade Corporation||Wafer alignment station|
|US4676648 *||Sep 26, 1984||Jun 30, 1987||Gebr.Hofmann Gmbh & Co Kg Maschinenfabrik||Method and apparatus for non-contact determination of run-out of a rotating body|
|JPS53703A *||Title not available|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US5044752 *||Jun 30, 1989||Sep 3, 1991||General Signal Corporation||Apparatus and process for positioning wafers in receiving devices|
|US5125791 *||Dec 14, 1990||Jun 30, 1992||Cybeg Systems, Inc.||Semiconductor object pre-aligning method|
|US5194743 *||Apr 2, 1991||Mar 16, 1993||Nikon Corporation||Device for positioning circular semiconductor wafers|
|US5238354 *||Apr 24, 1992||Aug 24, 1993||Cybeq Systems, Inc.||Semiconductor object pre-aligning apparatus|
|US5289263 *||Jan 14, 1993||Feb 22, 1994||Dainippon Screen Mfg. Co., Ltd.||Apparatus for exposing periphery of an object|
|US5452078 *||Jun 17, 1993||Sep 19, 1995||Ann F. Koo||Method and apparatus for finding wafer index marks and centers|
|US5546179 *||Oct 7, 1994||Aug 13, 1996||Cheng; David||Method and apparatus for mapping the edge and other characteristics of a workpiece|
|US5648854 *||Apr 19, 1995||Jul 15, 1997||Nikon Corporation||Alignment system with large area search for wafer edge and global marks|
|US5684599 *||Jul 1, 1996||Nov 4, 1997||Shin-Etsu Handotai Co., Ltd.||Wafer notch dimension measuring apparatus|
|US5739913 *||Aug 2, 1996||Apr 14, 1998||Mrs Technology, Inc.||Non-contact edge detector|
|US5852300 *||Mar 19, 1997||Dec 22, 1998||Samsung Electronics Co., Ltd.||Device for sensing a flat zone of a wafer for use in a wafer probe tester|
|US6037733 *||May 15, 1998||Mar 14, 2000||Genmark Automation||Robot having multiple degrees of freedom|
|US6121743 *||Aug 4, 1998||Sep 19, 2000||Genmark Automation, Inc.||Dual robotic arm end effectors having independent yaw motion|
|US6164894 *||Nov 4, 1997||Dec 26, 2000||Cheng; David||Method and apparatus for integrated wafer handling and testing|
|US6307619||Mar 23, 2000||Oct 23, 2001||Silicon Valley Group, Inc.||Scanning framing blade apparatus|
|US6489741||Aug 9, 2000||Dec 3, 2002||Genmark Automation, Inc.||Robot motion compensation system|
|US6592673||May 27, 1999||Jul 15, 2003||Applied Materials, Inc.||Apparatus and method for detecting a presence or position of a substrate|
|US6862817||Nov 12, 2003||Mar 8, 2005||Asml Holding N.V.||Method and apparatus for kinematic registration of a reticle|
|US6900877||Jun 12, 2002||May 31, 2005||Asm American, Inc.||Semiconductor wafer position shift measurement and correction|
|US7008802||May 29, 2001||Mar 7, 2006||Asm America, Inc.||Method and apparatus to correct water drift|
|US7065894||Feb 15, 2005||Jun 27, 2006||Asml Holding N.V.||Apparatus for kinematic registration of a reticle|
|US7248931||Jul 15, 2004||Jul 24, 2007||Asm America, Inc.||Semiconductor wafer position shift measurement and correction|
|US7305158||Feb 1, 2005||Dec 4, 2007||Davidson Instruments Inc.||Interferometric signal conditioner for measurement of absolute static displacements and dynamic displacements of a Fabry-Perot interferometer|
|US7355684||Apr 15, 2005||Apr 8, 2008||Davidson Instruments, Inc.||Interferometric signal conditioner for measurement of the absolute length of gaps in a fiber optic Fabry-Perot interferometer|
|US7492463||Apr 14, 2005||Feb 17, 2009||Davidson Instruments Inc.||Method and apparatus for continuous readout of Fabry-Perot fiber optic sensor|
|US7495757 *||Jun 26, 2006||Feb 24, 2009||Samsung Electronics Co., Ltd.||Semiconductor manufacturing apparatus and wafer processing method|
|US7639368||Sep 11, 2006||Dec 29, 2009||Halliburton Energy Services, Inc.||Tracking algorithm for linear array signal processor for Fabry-Perot cross-correlation pattern and method of using same|
|US7684051||Apr 18, 2007||Mar 23, 2010||Halliburton Energy Services, Inc.||Fiber optic seismic sensor based on MEMS cantilever|
|US7743661||Feb 12, 2007||Jun 29, 2010||Halliburton Energy Services, Inc.||Fiber optic MEMS seismic sensor with mass supported by hinged beams|
|US7782465||Feb 4, 2009||Aug 24, 2010||Halliburton Energy Services, Inc.||High intensity fabry-perot sensor|
|US7787128||Jan 24, 2008||Aug 31, 2010||Halliburton Energy Services, Inc.||Transducer for measuring environmental parameters|
|US7835598||Dec 21, 2005||Nov 16, 2010||Halliburton Energy Services, Inc.||Multi-channel array processor|
|US7864329||Dec 21, 2005||Jan 4, 2011||Halliburton Energy Services, Inc.||Fiber optic sensor system having circulators, Bragg gratings and couplers|
|US7940400||Feb 16, 2009||May 10, 2011||Halliburton Energy Services Inc.||Method and apparatus for continuous readout of fabry-perot fiber optic sensor|
|US7963736||Apr 3, 2008||Jun 21, 2011||Asm Japan K.K.||Wafer processing apparatus with wafer alignment device|
|US8041450||Oct 4, 2007||Oct 18, 2011||Asm Japan K.K.||Position sensor system for substrate transfer robot|
|US8115937||Aug 16, 2007||Feb 14, 2012||Davidson Instruments||Methods and apparatus for measuring multiple Fabry-Perot gaps|
|US8273178||Feb 26, 2009||Sep 25, 2012||Asm Genitech Korea Ltd.||Thin film deposition apparatus and method of maintaining the same|
|US8347813||Dec 10, 2008||Jan 8, 2013||Asm Genitech Korea Ltd.||Thin film deposition apparatus and method thereof|
|US20040151574 *||May 29, 2001||Aug 5, 2004||Zhimin Lu||Method and apparatus to correct wafer drift|
|US20040258514 *||Jul 15, 2004||Dec 23, 2004||Ivo Raaijmakers||Semiconductor wafer position shift measurement and correction|
|US20050168718 *||Feb 15, 2005||Aug 4, 2005||Asml Holding N.V.||Apparatus for kinematic registration of a reticle|
|US20050231729 *||Apr 14, 2005||Oct 20, 2005||Lopushansky Richard L||Method and apparatus for continuous readout of Fabry-Perot fiber optic sensor|
|US20050231730 *||Apr 15, 2005||Oct 20, 2005||Jeffers Larry A||Interferometric signal conditioner for measurement of the absolute length of gaps in a fiber optic fabry-perot interferometer|
|US20050244096 *||Feb 1, 2005||Nov 3, 2005||Jeffers Larry A||Interferometric signal conditioner for measurement of absolute static displacements and dynamic displacements of a fabry-perot interferometer|
|US20060139652 *||Dec 21, 2005||Jun 29, 2006||Berthold John W||Fiber optic sensor system|
|US20060241889 *||Dec 21, 2005||Oct 26, 2006||Lopushansky Richard L||Multi-channel array processor|
|US20060292714 *||Jun 26, 2006||Dec 28, 2006||Seok-Bae Kim||Semiconductor manufacturing apparatus and wafer processing method|
|US20070064241 *||Sep 11, 2006||Mar 22, 2007||Needham David B||Tracking algorithm for linear array signal processor for fabry-perot cross-correlation pattern and method of using same|
|US20080043245 *||Aug 16, 2007||Feb 21, 2008||Needham David B||Methods and apparatus for measuring multiple fabry-perot gaps|
|US20080186506 *||Jan 24, 2008||Aug 7, 2008||Davidson Instruments, Inc.||Transducer for measuring environmental parameters|
|US20090093906 *||Oct 4, 2007||Apr 9, 2009||Asm Japan K.K.||Position sensor system for substrate transfer robot|
|WO1995000819A1 *||Jun 16, 1994||Jan 5, 1995||Koo Ann F||Method and apparatus for finding wafer index marks and centers|
|U.S. Classification||356/150, 356/400|
|Aug 9, 1990||AS||Assignment|
Owner name: SVG LITHOGRAPHY, INC., A CORP OF DE
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:PERKIN-ELMER CORPORATION, THE,;REEL/FRAME:005424/0111
Effective date: 19900515
|Aug 3, 1993||FPAY||Fee payment|
Year of fee payment: 4
|Aug 8, 1997||FPAY||Fee payment|
Year of fee payment: 8
|Aug 13, 2001||FPAY||Fee payment|
Year of fee payment: 12
|Jun 16, 2004||AS||Assignment|