|Publication number||US4953002 A|
|Application number||US 07/404,003|
|Publication date||Aug 28, 1990|
|Filing date||Sep 5, 1989|
|Priority date||Mar 31, 1988|
|Publication number||07404003, 404003, US 4953002 A, US 4953002A, US-A-4953002, US4953002 A, US4953002A|
|Inventors||Keith W. Nelson, James E. Lenz, Takeshi Kawai|
|Original Assignee||Honeywell Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (28), Non-Patent Citations (6), Referenced by (54), Classifications (20), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This is a continuation of application Ser. No. 07/175,702, now abandoned, filed Mar. 31, 1988.
1. Field of the Invention.
The present invention relates to housings for semiconductor devices and, more particularly, to housings for semiconductor devices having magnetic materials used therein which are to be protected from external magnetic fields.
Recently, the use of material layers which have high magnetic permeability in monolithic integrated circuits has provided a basis for magnetic field sensors and for magnetic cell memories. Typically, such a magnetically permeable layer is formed of a thin film of a metallic alloy composition which, as an example, might comprise nickle, cobalt and iron.
Such permeable thin films are fabricated in the course of the fabrication procedure for monolithic integrated circuits with some added steps, and are often provided by vacuum deposition methods, though other metheds can be used. The films so fabricated usually exhibit uniaxial anisotropy, magnetoresistance, and are usually chosen with such a composition of the foregoing elements that there is little magnetostriction.
Because very large demagnetizing fields would otherwise result, the magnetization of such thin films will always lie substantially in the plane of the film, that is, the magnetization vector for the material will be substantially in the plane of the film. The orientation of the easy axis of magnetization can be chosen if the film is deposited in the presence of a magnetic field oriented in the selected direction.
In integrated circuit devices having such permeable thin films, the orientation of the magnetization vector in the plane is usually important to the operation of the device. In accord with thermodynamics, the magnetization in such a film will arrange itself to minimize the magnetic energy. Fields external to the film will often be generated in and about the device as part of the device operation. These fields must be oriented to have components in the plane of the magnetic thin films to have a significant effect on the magnetization of such films in accord with minimizing the magnetic energy. Fields perpendicular to the films will have no effect on such magnetization.
On the other hand, for those magnetic fields which are generated from sources external to the film and to the integrated circuit device and its housing, there will be a desire in many instances that part or all of them have no significant effect on these permeable films. This is particularly true in the case of memory devices where the information contained in the memory is contained in the orientations of the magnetization vectors of the magnetic material used in each memory cell. Any such external magnetic field effects which would alter the orientations of the magnetization vectors in the memory cells could contribute to a loss of information or to erroneous information being provided by the memory.
Thus, such films need to be protected from external magnetic field disturbances but the integrated circuit structures must also be housed in such a way to minimize cost if they are to remain a viable product for the memory market. Therefore, a housing to protect such integrated circuit structures from significant external adverse influences, including external magnetic fields, and which can be economically provided, would be desirable.
The present invention provides an integrated circuit structure housing containing a pair of spaced apart layers, each of a high magnetic permeability, and with the integrated circuit structure located therebetween having its magnetic material magnetization vectors parallel to such spaced apart layers.
FIG. 1 shows an integrated circuit structure housing, and
FIGS. 2A and 2B show cross section views of the housing of FIG. 1.
FIG. 1 shows a "packaged" integrated circuit device, 10. The "package" or housing is formed by injecting any one of various well known plastic compounds into a mold around that which is to be housed including the leads and the integrated circuit device. This device is usually a monolithic integrated circuit but could be a hybrid integrated circuit. Although a molded plastic housing is provided for the integrated circuit structure in this example, other housing types may be used in connection with housing the structures of the present invention.
Housed device 10 has, as indicated, a molded plastic body, 11. Protruding out from either side thereof are electrically conductive leads, 12, which are available external to body 11 to permit interconnection of device 10 into a larger circuit assembly. Fabrication processes for making such a molded body 11 to house an integrated circuit and its external leads and other structures to result in a housed device 10 are well known.
A housed device in a system like device 10 can be subjected to many different magnetic fields acting at different strengths and in different orientations. However, permeable magnetic material thin film layers in the integrated circuit structures are generally constructed parallel to a plane, a plane which, as indicated above, also contains the magnetization vector for that material film. Since, again as indicated above, only fields in such a plane can affect the magnetization vectors in the materials, only those external magnetic fields parallel to that plane need be protected against in the structure of housed device 10. An arrangement for doing this is shown in FIGS. 2A and 2B, each of which are a cross section view taken of housed device 10 in FIG. 1, as indicated there, which housed device contains further protective structure.
A monolithic integrated circuit chip structure, 13, is shown supported at a major surface thereof on a metal support pad, 14. Integrated circuit chip 13 has at least one magnetic thin film portion therein, and for a memory chip typically thousands of such portions, with the film portion or portions being substantially contained in a plane which is parallel to the upper and lower major surfaces of integrated circuit chip 13. Thus, such magnetic thin film portion or portions extend parallel to support pad 14.
Further shown in FIGS. 2A and 2B are an upper shield layer, 15. Shield 15 is provided in housed device 10 in molded body 11 parallel to support pad 14. In addition, as can be seen in FIG. 2A, electrically conductive interconnection wires, 16, are shown extending from interconnection pads or regions in integrated circuit chip structure 13 to corresponding ones of conductive leads 12.
Each of support pad 14 and shield 15 is formed of a metal having a relatively high permeability, at least several times that of air or silicon. One such metal which is well known for use in magnetic shielding has a high initial permeability, and is known as the alloy mumetal having approximately 77% nickel, 4.8% copper, 1.5% chromium and 14.9% iron. Such an alloy is usually hydrogen annealed to provide its high initial permeability. Other satisfactorily high permeability metals are available from several sources and are well known under such designations as Alloy 42, Hypernik, etc.
The resulting structure has the magnetic thin film in integrated circuit chip 13 substantially parallel to both support pad 14 and shield layer 15 which, of course, are also parallel to one another. As a result of this arrangement, magnetic field portions oriented toward the sides of chip 13, and so in the plane of the magnetic film portions therein, will tend to pass through support pad 14 and shield 15 rather than through chip 13 because of the high permeability of this pair of layers on either side of chip 13. If each of these layers extends well past chip 13 or at least past the magnetic thin film portions provided in the chip, and are positioned as close to one another as possible while keeping chip 13 between them, very little fringing of portions of the magnetic field will occur in chip 13 as opposed to being in the permeable material pair of layers 14 and 15.
On the other hand, magnetic field portions which are oriented perpendicular to pad 14 and shield layer 15 will pass through integrated circuit chip structure 13 to a substantial extent and without significant deviation in direction or magnitude from what they would be in the absence of the housed chip. However, as already indicated, such magnetic fields are not in the plane of the magnetic thin film portion or portions used in integrated circuit chip structure 13, and so will not significantly affect the magnetization vectors of such film portion or portions. Thus, no shield structures along the sides of integrated circuit chip structure 13 between its major surfaces need be provided to protect against such perpendicular magnetic field portions, and the cost of forming an enclosed magnetic shield can, in this situation, be avoided.
To further reduce cost and ease the fabrication process, support pad 14 and leads 12 can all be formed in a common lead frame so that they are the same material, that is, a material which is both electrically conductive and of a high magnetic permeability such as mumetal. A further possibility is to form upper shield 15 in the same lead material and have it bent to the position shown in FIGS. 2A and 2B.
Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US2463778 *||Dec 15, 1943||Mar 8, 1949||Rca Corp||Magnetic shielding|
|US2488710 *||Sep 23, 1946||Nov 22, 1949||Allegheny Ludlum Steel||Enclosing shield for electrical applications|
|US3271638 *||Nov 4, 1963||Sep 6, 1966||Emil M Murad||Encased semiconductor with heat conductive and protective insulative encapsulation|
|US3341102 *||May 13, 1965||Sep 12, 1967||Morsink Robert C||Cartons for protection and storage of magnetically sensitive materials|
|US3390226 *||Oct 18, 1965||Jun 25, 1968||Siemens Ag||Encapsulated semiconductor element|
|US3469017 *||Dec 12, 1967||Sep 23, 1969||Rca Corp||Encapsulated semiconductor device having internal shielding|
|US3500440 *||Jan 8, 1968||Mar 10, 1970||Interamericano Projects Inc||Functional building blocks facilitating mass production of electronic equipment by unskilled labor|
|US3546362 *||Apr 25, 1969||Dec 8, 1970||Us Navy||Electronic module|
|US3614546 *||Jan 7, 1970||Oct 19, 1971||Rca Corp||Shielded semiconductor device|
|US3648108 *||Jan 27, 1971||Mar 7, 1972||Gti Corp||Molded shunts for integrated circuits|
|US3684464 *||Nov 4, 1970||Aug 15, 1972||Texas Instruments Inc||Composite metal laminate material and lead frame|
|US3786444 *||Aug 27, 1971||Jan 15, 1974||Us Army||Magnetic thin film memory packaging design|
|US3809233 *||Jul 14, 1972||May 7, 1974||Western Electric Co||Method of and package for transporting articles|
|US3820152 *||Apr 24, 1973||Jun 25, 1974||Du Pont||Circuit package with fugitive shorting bar|
|US4004194 *||Sep 23, 1974||Jan 18, 1977||Siemens Aktiengesellschaft||Module for supporting circuit boards|
|US4209848 *||Jun 16, 1978||Jun 24, 1980||International Business Machines Corporation||Magnetic domain device shield|
|US4323405 *||Dec 19, 1979||Apr 6, 1982||Narumi China Corporation||Casing having a layer for protecting a semiconductor memory to be sealed therein against alpha particles and a method of manufacturing same|
|US4327832 *||Jun 26, 1980||May 4, 1982||Thielex Plastics Corporation||Container for packaging semiconductor components|
|US4331285 *||Mar 24, 1980||May 25, 1982||Hewlett-Packard Company||Method for fabricating a magnetic shielding enclosure|
|US4370700 *||Nov 13, 1981||Jan 25, 1983||Motorola Inc.||RF Package including RF shielding for a multiple PC board|
|US4412093 *||Sep 16, 1981||Oct 25, 1983||Isotronics, Inc.||Microcircuit flat pack with integral shell|
|US4539621 *||Dec 20, 1982||Sep 3, 1985||Motorola, Inc.||Integrated circuit carrier and assembly|
|US4567317 *||Jul 7, 1983||Jan 28, 1986||Computer Products, Inc.||EMI/RFI Protected enclosure|
|US4575747 *||Aug 18, 1983||Mar 11, 1986||Siemens Aktiengesellschaft||Device for protecting film-mounted integrated circuits against destruction due to electrostatic charges|
|US4592015 *||Jul 5, 1984||May 27, 1986||Hitachi, Ltd.||Magnetic bubble memory module|
|US4630095 *||Jun 29, 1984||Dec 16, 1986||Vlsi Technology Research Association||Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering|
|JPS5651076A *||Title not available|
|JPS60186040A *||Title not available|
|1||"Magnetic Permeable and Adhesive Joined Shield Structures", IEEE Transactions on Magnetics, vol. MAG-13, No. 5, Sep. 1977, W. J. DeBontie and A. D. Butherus, Bell Laboratories.|
|2||"Magnetically Permeable Adhesives and Adhesive-Joined Shield Structure", I.E.E.E. Transactions on Magnetics, vol. MAG. 13, No. 5, Sep. 1977, W. J. LeBonte and A. D. Butherus.|
|3||Bertin, IBM T.D.B., vol. 8, No. 3, Aug. 85, p. 441, "Magnetic Film Storage Configuration".|
|4||*||Bertin, IBM T.D.B., vol. 8, No. 3, Aug. 85, p. 441, Magnetic Film Storage Configuration .|
|5||*||Magnetic Permeable and Adhesive Joined Shield Structures , IEEE Transactions on Magnetics, vol. MAG 13, No. 5, Sep. 1977, W. J. DeBontie and A. D. Butherus, Bell Laboratories.|
|6||*||Magnetically Permeable Adhesives and Adhesive Joined Shield Structure , I.E.E.E. Transactions on Magnetics, vol. MAG. 13, No. 5, Sep. 1977, W. J. LeBonte and A. D. Butherus.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US5003363 *||Jan 30, 1990||Mar 26, 1991||Siemens Aktiengesellschaft||Circuit arrangement and apparatus for non-contacting reference value prescription for an integrated circuit enveloped within non-magnetic material|
|US5216405 *||Jan 14, 1991||Jun 1, 1993||General Motors Corporation||Package for the magnetic field sensitive device|
|US5223739 *||Sep 13, 1990||Jun 29, 1993||Kabushiki Kaisha Toshiba||Plastic molded semiconductor device having waterproof cap|
|US5233220 *||Feb 24, 1992||Aug 3, 1993||Texas Instruments Incorporated||Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer|
|US5317195 *||Nov 19, 1991||May 31, 1994||Mitsubishi Denki Kabushiki Kaisha||Semiconductor device improved in light shielding property and light shielding package|
|US5394014 *||Nov 10, 1993||Feb 28, 1995||Mitsubishi Denki Kabushiki Kaisha||Semiconductor device improved in light shielding property and light shielding package|
|US5406117 *||Dec 9, 1993||Apr 11, 1995||Dlugokecki; Joseph J.||Radiation shielding for integrated circuit devices using reconstructed plastic packages|
|US5559306 *||Oct 11, 1995||Sep 24, 1996||Olin Corporation||Electronic package with improved electrical performance|
|US5834850 *||Aug 26, 1996||Nov 10, 1998||Nitto Denko Corporation||Encapsulated semiconductor device having metal foil covering, and metal foil|
|US5840599 *||Oct 27, 1994||Nov 24, 1998||Texas Instruments Incorporated||Process of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuit|
|US5933364 *||Jan 27, 1999||Aug 3, 1999||Matsushita Electric Industrial Co., Ltd.||Semiconductor device with a metal layer for supplying a predetermined potential to a memory cell section|
|US5939772 *||Oct 31, 1997||Aug 17, 1999||Honeywell Inc.||Shielded package for magnetic devices|
|US6048754 *||Jun 15, 1994||Apr 11, 2000||Mitsui Chemicals, Inc.||Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package|
|US6261508||Aug 17, 1999||Jul 17, 2001||Maxwell Electronic Components Group, Inc.||Method for making a shielding composition|
|US6262362||Jul 2, 1998||Jul 17, 2001||Maxwell Electronic Components Group, Inc.||Radiation shielding of three dimensional multi-chip modules|
|US6317359||Jun 28, 2000||Nov 13, 2001||Iowa State University Research Foundation, Inc.||Non-volatile magnetic circuit|
|US6343032||Jul 6, 2000||Jan 29, 2002||Iowa State University Research Foundation, Inc.||Non-volatile spin dependent tunnel junction circuit|
|US6368899||Mar 8, 2000||Apr 9, 2002||Maxwell Electronic Components Group, Inc.||Electronic device packaging|
|US6429044||Aug 28, 2001||Aug 6, 2002||Micron Technology, Inc.||Method and apparatus for magnetic shielding of an integrated circuit|
|US6452253||Aug 31, 2000||Sep 17, 2002||Micron Technology, Inc.||Method and apparatus for magnetic shielding of an integrated circuit|
|US6455864||Nov 30, 2000||Sep 24, 2002||Maxwell Electronic Components Group, Inc.||Methods and compositions for ionizing radiation shielding|
|US6468678||Oct 22, 1997||Oct 22, 2002||3M Innovative Properties Company||Conformable magnetic articles for use with traffic bearing surfaces methods of making same systems including same and methods of use|
|US6515352||Sep 25, 2000||Feb 4, 2003||Micron Technology, Inc.||Shielding arrangement to protect a circuit from stray magnetic fields|
|US6542000||Jul 28, 2000||Apr 1, 2003||Iowa State University Research Foundation, Inc.||Nonvolatile programmable logic devices|
|US6613978||Jun 9, 2001||Sep 2, 2003||Maxwell Technologies, Inc.||Radiation shielding of three dimensional multi-chip modules|
|US6625040||Aug 31, 2000||Sep 23, 2003||Micron Technology, Inc.||Shielded PC board for magnetically sensitive integrated circuits|
|US6693826||Jul 29, 2002||Feb 17, 2004||Iowa State University Research Foundation, Inc.||Magnetic memory sensing method and apparatus|
|US6717241||Aug 31, 2000||Apr 6, 2004||Micron Technology, Inc.||Magnetic shielding for integrated circuits|
|US6720493||Dec 8, 1999||Apr 13, 2004||Space Electronics, Inc.||Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages|
|US6858795||Aug 18, 2003||Feb 22, 2005||Maxwell Technologies, Inc.||Radiation shielding of three dimensional multi-chip modules|
|US6906396||Jan 15, 2002||Jun 14, 2005||Micron Technology, Inc.||Magnetic shield for integrated circuit packaging|
|US6916668 *||Dec 6, 2002||Jul 12, 2005||Micron Technology, Inc.||Methods for providing a magnetic shield for an integrated circuit having magnetoresistive memory cells|
|US6936763||Jun 28, 2002||Aug 30, 2005||Freescale Semiconductor, Inc.||Magnetic shielding for electronic circuits which include magnetic materials|
|US6962833||Nov 21, 2003||Nov 8, 2005||Micron Technology, Inc.||Magnetic shield for integrated circuit packaging|
|US6963125||Feb 13, 2002||Nov 8, 2005||Sony Corporation||Electronic device packaging|
|US7078243||Feb 10, 2005||Jul 18, 2006||Micron Technology, Inc.||Shielding arrangement to protect a circuit from stray magnetic fields|
|US7459769||Feb 8, 2005||Dec 2, 2008||Sony Corporation||Magnetic shield member, magnetic shield structure, and magnetic memory device|
|US7489015||Aug 20, 2007||Feb 10, 2009||Samsung Electronics Co., Ltd.||Magnetic shielding for magnetic random access memory|
|US7569915||Jun 26, 2006||Aug 4, 2009||Micron Technology, Inc.||Shielding arrangement to protect a circuit from stray magnetic fields|
|US7772679||Jun 23, 2008||Aug 10, 2010||Industrial Technology Research Institute||Magnetic shielding package structure of a magnetic memory device|
|US8018739||Mar 8, 2010||Sep 13, 2011||Maxwell Technologies, LLC||Apparatus for shielding integrated circuit devices|
|US8736030||Apr 28, 2010||May 27, 2014||Siliconware Precision Industries Co., Ltd.||Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same|
|US8766401||Oct 1, 2010||Jul 1, 2014||Semiconductor Components Industries, Llc||Method of manufacturing a semiconductor component and structure|
|US8963298||Apr 28, 2010||Feb 24, 2015||Siliconware Precision Industries Co., Ltd.||EMI shielding package structure and method for fabricating the same|
|US8999807||May 27, 2010||Apr 7, 2015||Semiconductor Components Industries, Llc||Method for manufacturing a semiconductor component that includes a common mode choke and structure|
|US9070692||Jan 12, 2013||Jun 30, 2015||Avalanche Technology, Inc.||Shields for magnetic memory chip packages|
|US9111758||Jul 25, 2014||Aug 18, 2015||Semiconductor Components Industries, Llc||Semiconductor component and method of manufacture|
|US20040119095 *||Nov 21, 2003||Jun 24, 2004||Tuttle Mark E||Magnetic shield for integrated circuit packaging|
|US20040150091 *||Jul 30, 2003||Aug 5, 2004||Stobbs Colin A.||Magnetic shielding for magnetic random access memory|
|US20050130327 *||Feb 10, 2005||Jun 16, 2005||Micron Technology, Inc.||Shielding arrangement to protect a circuit from stray magnetic fields|
|US20050230788 *||Feb 8, 2005||Oct 20, 2005||Yoshihiro Kato||Magnetic shield member, magnetic shield structure, and magnetic memory device|
|US20060019422 *||Sep 23, 2005||Jan 26, 2006||Tuttle Mark E||Magnetic shield for integrated circuit packaging|
|DE4424549A1 *||Jul 12, 1994||Jan 19, 1995||Korea Electronics Telecomm||Verfahren zum Gehäusen eines Leistungshalbleiterbauelements und durch dieses Verfahren hergestelltes Gehäuse|
|EP1575054A2 *||Feb 18, 2005||Sep 14, 2005||Sony Corporation||Magnetic shield member, magnetic shield structure, and magnetic memory device|
|U.S. Classification||257/659, 257/787, 174/353, 365/53, 365/209, 174/551, 174/559, 257/E23.114|
|International Classification||H01L23/58, H01L23/552|
|Cooperative Classification||H01L2924/00014, H01L24/48, H01L2924/3025, H01L2224/48247, H01L2924/01014, H01L23/585, H01L23/552, H01L2224/48091|
|European Classification||H01L23/552, H01L23/58B|
|Dec 15, 1993||FPAY||Fee payment|
Year of fee payment: 4
|Dec 15, 1997||FPAY||Fee payment|
Year of fee payment: 8
|Apr 28, 2001||AS||Assignment|
|Sep 28, 2001||AS||Assignment|
|Feb 7, 2002||FPAY||Fee payment|
Year of fee payment: 12