|Publication number||US5199879 A|
|Application number||US 07/840,212|
|Publication date||Apr 6, 1993|
|Filing date||Feb 24, 1992|
|Priority date||Feb 24, 1992|
|Publication number||07840212, 840212, US 5199879 A, US 5199879A, US-A-5199879, US5199879 A, US5199879A|
|Inventors||Harold Kohn, Kishor V. Desai, Ronald J. Romanosky, George J. Saxenmeyer, Jr., Reinhold E. Tomek, James R. Webb|
|Original Assignee||International Business Machines Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (15), Non-Patent Citations (6), Referenced by (132), Classifications (23), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The invention relates to electrical assemblies and particularly to such assemblies wherein a first circuit member (e.g., a circuit module) is adapted for being positioned on and electrically coupled to a second circuit member (e.g., printed circuit board). Even more particularly, the invention relates to such circuit assemblies wherein this first circuit member includes a plurality of pins for being positioned within the second, receiving circuit member in order to accomplish the electrical coupling thereto.
Electrical assemblies wherein circuit members such as thermal conduction modules (TCM's) are positioned on a larger, receiving second circuit member such as a multilayered printed circuit board are well known in the art. Typically, such TCM's include a ceramic member having at least one and preferably a plurality of individual layers of conductive circuitry therein/thereon, which circuitry in turn is selectively electrically connected to individual pins (e.g., copper) which project from one of the TCM's external surfaces. These conductive pins in turn are typically inserted within a receptive opening, such as a plated-through-hole (PTH) formed within the multilayered printed circuit board (PCB). Also typical, this multilayered PCB will in turn include a plurality of conductive layers (also known as conductive planes) therein which may be selectively connected to individual ones of the PTH's, depending on the operational requirements of the completed assembly. Such conductive planes, and layers of circuitry in the TCM serve to provide signal, power and/or ground functions, again depending on the assembly's operational requirements.
Electrical assemblies of the above described variety have found widespread utilization within the information handling systems (computer) field.
The present invention as defined herein provides an enhanced version of such an electrical assembly wherein higher density connections are possible over electrical assemblies such as defined above, such connections being attainable in a sound, effective manner. The assembly as defined herein is able to achieve such higher density without an increase in pin density over such known assemblies while simultaneously substantially reducing pin-to-pin electrical "cross-talk" (interference). Of further significance, the invention eliminates the need for individual electrical contacts typically required for placement within the aforementioned PTH's or similar apertures within the receiving printed circuit board, which contacts receive the male pin therein. Accordingly, the present invention provides a substantial cost savings over many of the above, known electrical assemblies which have heretofore required such pluralities of electrical contacts as part thereof.
It is believed that an electrical assembly possessing the above several advantageous features and others discernible from the teachings herein would constitute a significant advancement in the art.
It is, therefore, a primary object of the present invention to enhance the electrical assembly art and particularly such art wherein pinned circuit members are positioned in and electrically coupled to receiving circuit members.
It is another object of the invention to provide such an assembly with increased circuit density over known such assemblies.
It is yet another object of the invention to provide such an enhanced assembly which can be produced using mass production techniques, and is thus able to benefit from the several advantages (e.g., reduced cost) thereof.
In accordance with one aspect of the invention, there is provided an electrical assembly which comprises a first circuit member including a circuitized substrate and at least one (and preferably several) conductive pins projecting from the substrate, and a second circuit member for being electrically coupled to the first circuit member and including a dielectric substrate having an opening therein and circuit means located on or within the dielectric substrate and including at least one flexible portion which extends at least partly across the opening for frictionally and electrically engaging the conductive pin when positioned within the second circuit member's opening. Such frictional and electrical engagement serves to provide electrical coupling between the first and second circuit members.
FIG. 1 is a partial elevational view, in section and on a much enlarged scale, of an electrical assembly in accordance with one embodiment of the invention, illustrating the assembly's first circuit member about to be positioned within the invention's second circuit member;
FIG. 2 is a partial elevational view, in section, showing the assembly of FIG. 1 as assembled;
FIG. 3 is a perspective view of the invention's second circuit member in accordance with one embodiment of the invention; and
FIG. 4 is a much enlarged, partial sectional view of a terminal end of a flexible portion of the second circuit member's flexible circuit means, in accordance with one embodiment of the invention.
For a better understanding of the present invention, together with other and further objects, advantages and capabilities thereof, reference is made to the following disclosure and appended claims in connection with the above-described drawings.
In FIGS. 1 and 2, there is shown an electrical assembly 10 in accordance with one embodiment of the invention. Assembly 10 includes a first circuit member 11 designed for being positioned within and electrically coupled to a second circuit member 13. First circuit member 11 is preferably a thermal conductive module (TCM) including a dielectric (e.g., ceramic) portion 15 having therein a plurality of layers of circuitry 17 which function as signal, ground and/or power layers, depending on the operational requirements for assembly 10. First circuit member 11 further includes at least one conductive pin 19 which projects from an undersurface of the dielectric portion 15 and is designed for being inserted within a receiving opening 21 formed within second circuit member 13. In a preferred embodiment, first circuit member 11 includes a plurality of pins 19, and more preferably, from about 16 to about 3,800 such elements, but may include more, depending on operational requirements. In such an example, dielectric portion 15 preferably possesses an overall thickness of from about 0.125 inch to about 0.375 inch, with each of the layers of circuitry 17 possessing a thickness of from about 0.001 inch to about 0.003 inch.
Although member 11 is shown to include only four internal layers of circuitry 17, it is understood that the invention is not limited to this number in that several additional such layers may be successfully utilized, again depending on the operation requirements for the invention. As stated, the preferred dielectric material for portion 15 is ceramic, several examples of which are known in the TCM art and further description is not believed necessary. The preferred layers of circuitry are copper and thus also of a conductive material known in the art. Such circuitry may be provided in accordance with known techniques. Although circuit member 11 is only partially shown in FIGS. 1 and 2, it is understood that the illustrated segmented sides extend outwardly and are preferably planar at the edge portions thereof. In one example, the first circuit member possessed an overall width of about four inches and a corresponding length of about four inches. This rectangular, box-like configuration is not meant to limit the invention, in that others are, of course, acceptable.
In addition to the defined layers of circuitry 17 located internally of member 11, the member as shown in FIGS. 1 and 2 also preferably includes at least one external layer of circuitry 17' located on the same external surface of the member's dielectric body as pin 19.
In accordance with the teachings herein, pin 19 includes first and second conductive portions 23 and 25, respectively. Portion 23 is substantially cylindrical and projects a preferred distance of about 0.125 inch from the undersurface of member 11, such as shown in FIGS. 1 and 2. Similarly, the second conductive portion 25 of pin 19 is, as shown, coaxially positioned about the upper part of the first conductive portion 23 and separated therefrom, physically and electrically, by a layer of electrically insulative material 27. Layer 27 and second conductive portion 25, as shown, are both also substantially cylindrical and lie about the internally located, cylindrically shaped first conductive portion 23. In such an arrangement, the preferred conductive material for pin 19 comprises a copper-nickel alloy, while the layer of insulative material 27 is preferably polyimide. Dimension-wise, pin 19 possesses an overall outer diameter (about second conductive portion 25) of about 0.045 inch, while the first conductive portion, also cylindrical, possesses an overall outer diameter of about 0.020 inch at the largest section thereof.
As seen in FIGS. 1 and 2, first conductive portion 23 is electrically coupled to a respective one of the internal layers of circuitry 17 by a column of metallic material 31 which, in a preferred embodiment, is solder. A preferred solder for column 31 is 63:37 tin:lead, a solder known in the art. During the manufacture of member 11, apertures 33 are formed within the member's dielectric 15 at desired locations and solder material is thereafter added to provide desired electrical connections as shown. Such solder connections may be formed from the member's outer surface to a prescribed depth within the member's dielectric, or as also shown in FIGS. 1 and 2, between designated internal layers of circuitry 17 to provide interconnection therebetween.
In addition to the central column of solder 31, two additional such columns are also shown in the drawings and represented by the numerals 31'.
The first conductive portion 23 is, as shown, electrically coupled to a corresponding layer of circuitry 17 through the centrally located solder column 31 in FIGS. 1 and 2. Pin 19 is preferably soldered or brazed to this column using known techniques and further description is not believed necessary. Additionally, the outer second conductive portion 25 is electrically coupled to the respective external layer of circuitry 17', also preferably using a known solder or brazing technique. It is thus seen that the outer, second conductive portion 25 is electrically coupled to a layer of circuitry separate from that layer coupled to the internal, first conductive portion 23. In such an example, the outer conductive circuitry 17' may function as a ground or power layer (e.g., to thus electrically ground the outer part of pin 19).
Significantly, utilization of two separate conductive portions for pin 19, in combination with electrically coupling of these portions to separate layers of circuitry within member 11, serves to substantially increase the density for such a member 11, particularly when several additional pins such as described above are utilized. The invention provides this significant advantage while utilizing conductive pins which in turn may be of substantially the same overall outer diameter as singular conductive pins of the prior art. Of further significance, utilization of a pin of the construction defined herein serves to substantially reduce electrical "cross-talk", delta I noise, and other adverse electrical characteristics during operation of the invention. This is also deemed to constitute a significant advantage over multi-pin assemblies such as known in the prior art.
Second circuit member 13 includes circuit means 41 in the form of at least one circuitized element 43 located on or within the dielectric substrate 45. In a preferred embodiment, two circuitized elements, as shown in FIGS. 1 and 2, are utilized. It is to be understood, however, that in the broader aspects of the invention, only one such element may be provided. Each circuitized element 43 preferably comprises a dielectric layer 47 with at least one conductor layer 49 located thereon. See also FIG. 4. In a preferred embodiment, as shown in FIG. 4, conductor layer 49 is located on at least two opposing sides 46 of the relatively planar dielectric layer (as well as along the outer edge 48) and includes first, second, third and fourth conductor layers 51, 53, 55 and 57, respectively. In one example, dielectric layer 47 is comprised of polyimide and possesses a thickness of about 0.002 inch. The conductor layers preferably possess a total thickness of only about 0.0005 inch and are comprised of copper, nickel, a nickel alloy (e.g., palladium-nickel), and a precious metal (e.g., gold), respectively. The purpose of the additional nickel and nickel alloy layers is to act as a diffusion barrier so that the final gold plating will not diffuse into the copper. These two layers also provide the primary spring properties for this flexible element. The purpose of the precious metal layer is to provide enhanced connection to the conductive pin 19 when elements 43 engage same.
Significantly, each of the circuitized elements 43 of circuit means 41 includes a flexible portion 61 which extends at least partly across opening 21 provided within the second circuit member's dielectric substrate 45. This opening 21, as shown, is preferably substantially cylindrical and may include two different diameters, as shown. Additionally, the lower portion 21' of opening 21 is preferably of a greater depth within substrate 45 than the wider, upper portion 21". In a preferred embodiment, upper portion 21" includes a diameter of 0.070 inch while lower portion 21' possesses a diameter of 0.050 inch. Portion 21" extends a depth of 0.020 inch within member 43 while portion 21' extends a depth of 0.070 inch.
As shown in FIG. 3, each flexible portion 61 includes a plurality (e.g., four) of tabs 63 which project across at least part of the respective portion of opening 21 located thereunder. That is, the tabs 63 of the upper circuitized element 43 extend partly across the upper, wider portion 21" while the tabs 63 (shown hidden in FIG. 3) of the lower circuitized element 43 (also shown hidden) extend partly across the lower, lesser diameter portion 21' (also hidden). It is also seen in FIGS. 1-3 that the opening provided by the upper circuitized element 43 between the inwardly projecting tabs 63 is substantially larger than the corresponding opening provided between the lower tabs 63. This is to allow the smaller diameter forward portion of pin 19 to pass through the upper circuitized element without engagement by tabs 63 thereof. Accordingly, this smaller diameter projecting portion will frictionally and electrically engage only the lower tabs 63 substantially within the smaller diameter, lower portion 21' of opening 21, as best seen in FIG. 2. Concurrently, the larger diameter upper portion of pin 19 (the outer conductor 25) will engage the upper tabs 63 of upper circuitized element 43. More specifically, the described conductor layer(s) 49 of the flexible portion 61 of each circuitized element will engage, concurrently, a respective conductive portion of pin 19 to provide the unique, dual form of electrical connection shown therein. It is understood that engagement by the flexible portions (tabs) of each circuitized element causes downward depression of the respective flexible portions, to the extent shown in FIG. 2. Further, this frictional connection results in a "locking" of the pin in position such that removal thereof from the second circuit member is substantially prevented. Should such removal be desired, the pin may be further inserted within the respective opening 21 until the flexible end portions 61 engage respective rounded edges 71, whereupon release (withdrawal) of pin 19 may occur.
It is understood that the tabs 63 of each flexible portions 61 include the described conductor layer(s) on both upper and lower surfaces thereof, as well as on the end (or edge) surface thereof (FIG. 4), to thereby assure positive connection with the metallic outer surfaces of the respective portions of pin 19. Such metal-to-metal type of contact (where a relatively sharp edge of each tab engages a respective side of the pin) further assures the described locking of the pin in the frictional manner defined herein. As stated, pin 19 is preferably of a copper-nickel alloy, several types of which are known in the art. Use of four inwardly projecting tabs in the arrangement shown herein (especially FIG. 3) further assures the described locking type of engagement with pin 19. Preferably, four such tabs are utilized, but the invention is not limited to this number. At a minimum, two such tabs are preferred.
As further seen in FIGS. 1 and 2, second circuit member 13 may include additional conductive planes 81 therein. As stated above, second circuit member 13 is preferably a multilayered printed circuit board (PCB). Such boards, as known, include a plurality of layers of dielectric (e.g., epoxy resin reinforced with fiberglass, also known in the art as FR-4 material) separated by various conductive planes which in turn may function as signal, power and/or ground elements. Two such planes are represented internally of the circuit member, as shown in FIGS. 1 and 2. Additionally, another conductive plane 81' may be located on an external surface of the circuit member, as also shown in FIGS. 1 and 2. In a preferred embodiment of the invention, each of the circuitized elements 43 is electrically coupled to at least one additional conductive plane within circuit member 13. In the embodiment of FIGS. 1 and 2, the upper circuitized element 43 is electrically coupled to the conductive plane 81' to thus provide an electrical path from one of the signal conductors 17 in first member 11, through pin 19 (conductive portion 23), the upper element 43, and through a plated conductive aperture 91 formed within member 13. In a preferred embodiment, conductive aperture 91 is a plated-through-hole (PTH) formed within member 13 in accordance with known techniques. Typically, such conductive apertures are drilled within the substrate during formation thereof and thereafter plated with a sound layer of conductive material (e.g., copper). This conductive material is then electrically connected (e.g., soldered) to the respective circuitized element 43, again using acceptable soldering techniques. Significantly, the conductive aperture 91 shown to the right in FIGS. 1 and 2 passes through a clearance hole 93 provided within the lower circuitized element so as not to be electrically coupled thereto. Such a hole may be provided within lower element 43 during formation thereof, prior to positioning on the dielectric as shown. The lower circuitized element 43 is electrically connected, similarly to the conductive aperture 91 to upper circuitized element 43, to a second conductive aperture 95 which in turn is electrically coupled to an outer conductive portion 97 (e.g., contact pad or the like).
It is further understood that additional connections may be provided to the various elements of the invention (e.g., by using a male pin positioned within one or both of the circuitized apertures 91 and 95). Such additional connections may be desired to connect added components, including, for example, another circuit member such as a TCM or the like having pin constructions of the known prior art.
Second circuit member 13 is formed, as stated, using known PCB manufacturing techniques. Although the individual dielectric layers shown in the embodiment of FIGS. 1 and 2 are of different thicknesses, this is not meant to limit the invention in that such layers may be of substantially similar thicknesses. Further, it is also possible to utilize different dielectric materials for the upper two layers having a respective one of the circuitized elements 43 formed thereon. That is, it is possible to form the lower, multiplane portion of circuit member 13 (that portion containing the various conductive planes 81 therein) utilizing known PCB techniques and thereafter adding, individually, the respective dielectric layers designed to accommodate circuitized elements 43. Such additional layers may be added using known techniques (e.g., adhesive) and further description is not believed necessary. Once these two additional layers have been added, then the conductive apertures 91 may be provided (e.g., drilled and plated) within the composite structure. Alternatively, the conductive aperture 95 may be provided following the addition of the first of these added layers (for the lower circuitized element 43), following which this conductive aperture is connected (e.g., soldered) to said circuitized element. Thereafter, the upper dielectric layer and upper circuitized element 43 may then be added, following which the conductive aperture 91 is provided and connected (e.g., soldered) to the upper element 43.
To assure a predetermined depth of insertion of pin 19, spacer elements (not shown) may be provided on the upper surface of circuit member 13 or secured to the lower surface of member 11. Further, the two circuit members 11 and 13 may be positioned within a suitable housing or frame structure containing appropriate means (not shown) for holding the lower circuit member 13 and for defining the accurate positioning depth of the upper circuit member 11. Further description of these various additional members for use with the invention is not believed necessary.
Thus there has been shown and described an electrical assembly which provides high density connections using conductive pins which are inserted within one of the assembly's circuit members and coupled to a flexible portion of the lower circuit member's circuit means. In a preferred embodiment, the circuit means includes at least two flexible portions and the corresponding pin includes at least two separate conductive portions, each conductive portion designed for being frictionally and electrically connected to a respective one of the flexible portions. Thus, at least two different electrical connections are attainable with a singular pin insertion. The defined pin construction, including at least two conductive portions separated by a common layer of insulative material and coupled to a ground layer in the manner defined, serves to substantially prevent electrical cross-talk or other adverse electrical problems during assembly operation. The assembly is also adaptable for being produced using many known processing techniques and is also capable of being produced on a relatively large scale. As further defined, the electrical assembly eliminates the need for additional female contact pins or the like located within conductive apertures (e.g., PTH's) as are required in many prior art electrical assemblies. The invention thus represents a significant cost advantage to such prior assemblies.
While there have been shown and described what are at present considered the preferred embodiments of the present invention, it will be obvious to those skilled in the art that various changes and modifications may be made therein without departing from the scope of the invention as defined by the appended claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US1862275 *||May 11, 1927||Jun 7, 1932||Dubilier Condenser Corp||Terminal|
|US3209066 *||Aug 28, 1961||Sep 28, 1965||John W Toomey||Printed circuit with integral welding tubelets|
|US3340491 *||Apr 17, 1964||Sep 5, 1967||Sealectro Corp||Electrical socket connectors and other electrical contact devices|
|US3539965 *||Jun 28, 1968||Nov 10, 1970||Dale Electronics||Socket connector assembly|
|US3573707 *||Sep 5, 1969||Apr 6, 1971||Amp Inc||Mounting of components on metallic printed circuit boards|
|US3699495 *||Feb 1, 1971||Oct 17, 1972||Amp Inc||Electrical connector for vehicle instruments|
|US3924918 *||Oct 9, 1973||Dec 9, 1975||Du Pont||Daughter board contact|
|US4593959 *||Oct 21, 1983||Jun 10, 1986||Sangamo Weston Limited||Digital signature plug|
|US4627678 *||Feb 20, 1985||Dec 9, 1986||Thomas & Betts Corporation||Electronic package assembly and accessory component therefor|
|US4658104 *||Apr 19, 1985||Apr 14, 1987||Omron Tateisi Electronics Co.||Printed wiring board|
|US4688151 *||Mar 10, 1986||Aug 18, 1987||International Business Machines Corporation||Multilayered interposer board for powering high current chip modules|
|US4820171 *||Sep 14, 1987||Apr 11, 1989||A/S Modulex||Coupling plate having a plurality of electric coupling points, a method of producing such a plate and a use of the coupling plate as a planning board|
|US4867691 *||Oct 29, 1987||Sep 19, 1989||E. I. Du Pont De Nemours And Company||Connector having expansible barrel with a layer of reflowable solder material thereon|
|US4969259 *||Dec 14, 1988||Nov 13, 1990||International Business Machines Corporation||Pin with tubular elliptical compliant portion and method for affixing to mating receptacle|
|US5133669 *||Jul 23, 1990||Jul 28, 1992||Northern Telecom Limited||Circuit board pins|
|1||*||IBM Technical Bulletin, Reinhart, vol. 10, No. 12, p. 1985, May, 1968.|
|2||*||IBM Technical Bulletin, Roche, vol. 6, No. 8, p. 87, Jan. 1964.|
|3||IBM Technical Disclosure Bulletin vol. 33, No. 5, Oct., 1990, "Flexible Circuit Interconnection System", by Saxenmeyer et al., p. 418.|
|4||*||IBM Technical Disclosure Bulletin vol. 33, No. 5, Oct., 1990, Flexible Circuit Interconnection System , by Saxenmeyer et al., p. 418.|
|5||IBM Technical Disclosure Bulletin, 1987, p. 1416, "Compliant Through-Hole".|
|6||*||IBM Technical Disclosure Bulletin, 1987, p. 1416, Compliant Through Hole .|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US5266912 *||Aug 19, 1992||Nov 30, 1993||Micron Technology, Inc.||Inherently impedance matched multiple integrated circuit module|
|US5400003 *||Aug 12, 1993||Mar 21, 1995||Micron Technology, Inc.||Inherently impedance matched integrated circuit module|
|US5612657 *||Jul 15, 1996||Mar 18, 1997||Micron Technology, Inc.||Inherently impedance matched integrated circuit socket|
|US5802699 *||Jun 7, 1994||Sep 8, 1998||Tessera, Inc.||Methods of assembling microelectronic assembly with socket for engaging bump leads|
|US5810609 *||Aug 28, 1995||Sep 22, 1998||Tessera, Inc.||Socket for engaging bump leads on a microelectronic device and methods therefor|
|US5812378 *||Aug 4, 1995||Sep 22, 1998||Tessera, Inc.||Microelectronic connector for engaging bump leads|
|US5889364 *||Aug 22, 1997||Mar 30, 1999||Durel Corporation||Electrical, solderless snap connector for EL lamp|
|US5928005 *||Feb 25, 1998||Jul 27, 1999||Cornell Research Foundation, Inc.||Self-assembled low-insertion force connector assembly|
|US5934914 *||Apr 22, 1997||Aug 10, 1999||Tessera, Inc.||Microelectronic contacts with asperities and methods of making same|
|US5961349 *||Jul 14, 1995||Oct 5, 1999||Berg Technology, Inc.||Assembly of shielded connectors and a board having plated holes|
|US5980270 *||Nov 26, 1996||Nov 9, 1999||Tessera, Inc.||Soldering with resilient contacts|
|US5983492 *||Nov 26, 1997||Nov 16, 1999||Tessera, Inc.||Low profile socket for microelectronic components and method for making the same|
|US6086386 *||May 22, 1997||Jul 11, 2000||Tessera, Inc.||Flexible connectors for microelectronic elements|
|US6196876||Jul 10, 2000||Mar 6, 2001||Berg Technology, Inc.||Assembly of shielded connectors and a board having plated holes|
|US6200143||Jan 8, 1999||Mar 13, 2001||Tessera, Inc.||Low insertion force connector for microelectronic elements|
|US6202297 *||May 14, 1998||Mar 20, 2001||Tessera, Inc.||Socket for engaging bump leads on a microelectronic device and methods therefor|
|US6205660||Apr 22, 1997||Mar 27, 2001||Tessera, Inc.||Method of making an electronic contact|
|US6220877 *||May 5, 2000||Apr 24, 2001||Alcoa Fujikura Limited||Monolithic terminal interface|
|US6229100||Jan 21, 1999||May 8, 2001||Tessera, Inc.||Low profile socket for microelectronic components and method for making the same|
|US6286205||Dec 10, 1998||Sep 11, 2001||Tessera, Inc.||Method for making connections to a microelectronic device having bump leads|
|US6332267 *||Oct 20, 2000||Dec 25, 2001||International Business Machines Corporation||Process of manufacturing a removably interlockable assembly|
|US6374487||Jun 8, 2000||Apr 23, 2002||Tessera, Inc.||Method of making a connection to a microelectronic element|
|US6392160 *||Nov 25, 1998||May 21, 2002||Lucent Technologies Inc.||Backplane for radio frequency signals|
|US6395997 *||Aug 22, 2000||May 28, 2002||Yazaki Corporation||Flat circuit with connector|
|US6428328||Oct 15, 2001||Aug 6, 2002||Tessera, Inc.||Method of making a connection to a microelectronic element|
|US6501176||Aug 14, 2001||Dec 31, 2002||Micron Technology, Inc.||Deflectable interconnect|
|US6503777 *||Aug 14, 2001||Jan 7, 2003||Micron Technology, Inc.||Deflectable interconnect|
|US6593535 *||Jun 26, 2001||Jul 15, 2003||Teradyne, Inc.||Direct inner layer interconnect for a high speed printed circuit board|
|US6621012||Feb 1, 2001||Sep 16, 2003||International Business Machines Corporation||Insertion of electrical component within a via of a printed circuit board|
|US6630738 *||Dec 18, 2002||Oct 7, 2003||Micron Technology, Inc||Deflectable interconnect|
|US6655969 *||Feb 25, 2003||Dec 2, 2003||Intel Corporation||Contact elements|
|US6664131 *||Dec 18, 2002||Dec 16, 2003||Micron Technology, Inc.||Method of making ball grid array package with deflectable interconnect|
|US6730859 *||Mar 27, 2001||May 4, 2004||Shinko Electric Industries Co., Ltd.||Substrate for mounting electronic parts thereon and method of manufacturing same|
|US6869290||May 26, 2004||Mar 22, 2005||Neoconix, Inc.||Circuitized connector for land grid array|
|US6916181||Jun 11, 2003||Jul 12, 2005||Neoconix, Inc.||Remountable connector for land grid array packages|
|US6938338||Apr 17, 2003||Sep 6, 2005||Tessera, Inc.||Method of making an electronic contact|
|US7025601||Jul 2, 2004||Apr 11, 2006||Neoconix, Inc.||Interposer and method for making same|
|US7045889||Aug 21, 2001||May 16, 2006||Micron Technology, Inc.||Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate|
|US7052288 *||Nov 12, 2004||May 30, 2006||Fci Americas Technology, Inc.||Two piece mid-plane|
|US7056131||Apr 11, 2003||Jun 6, 2006||Neoconix, Inc.||Contact grid array system|
|US7070419||May 26, 2004||Jul 4, 2006||Neoconix Inc.||Land grid array connector including heterogeneous contact elements|
|US7090503||Jul 20, 2004||Aug 15, 2006||Neoconix, Inc.||Interposer with compliant pins|
|US7094065||Nov 18, 2004||Aug 22, 2006||Micron Technology, Inc.||Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate|
|US7113408||Jun 11, 2003||Sep 26, 2006||Neoconix, Inc.||Contact grid array formed on a printed circuit board|
|US7120999||Sep 23, 2003||Oct 17, 2006||Micron Technology, Inc.||Methods of forming a contact array in situ on a substrate|
|US7172805 *||Jul 8, 2004||Feb 6, 2007||Viasytems Group, Inc.||Method for manufacturing a sequential backplane|
|US7244125||Dec 8, 2003||Jul 17, 2007||Neoconix, Inc.||Connector for making electrical contact at semiconductor scales|
|US7249338 *||May 17, 2004||Jul 24, 2007||Gateway Inc.||High speed bus with radio frequency microstrip|
|US7279788||Nov 18, 2004||Oct 9, 2007||Micron Technology, Inc.||Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate|
|US7347698||Jul 16, 2004||Mar 25, 2008||Neoconix, Inc.||Deep drawn electrical contacts and method for making|
|US7354276||Jul 17, 2006||Apr 8, 2008||Neoconix, Inc.||Interposer with compliant pins|
|US7357644||Dec 12, 2005||Apr 15, 2008||Neoconix, Inc.||Connector having staggered contact architecture for enhanced working range|
|US7371073||Jan 3, 2007||May 13, 2008||Neoconix, Inc.||Contact grid array system|
|US7383632||Mar 18, 2005||Jun 10, 2008||Neoconix, Inc.||Method for fabricating a connector|
|US7442046 *||May 15, 2006||Oct 28, 2008||Sony Ericsson Mobile Communications Ab||Flexible circuit connectors|
|US7449910 *||Feb 6, 2006||Nov 11, 2008||Micron Technology, Inc.||Test system for semiconductor components having conductive spring contacts|
|US7587817||Jul 24, 2006||Sep 15, 2009||Neoconix, Inc.||Method of making electrical connector on a flexible carrier|
|US7597561||Mar 18, 2005||Oct 6, 2009||Neoconix, Inc.||Method and system for batch forming spring elements in three dimensions|
|US7621756||Oct 29, 2007||Nov 24, 2009||Neoconix, Inc.||Contact and method for making same|
|US7625220||Dec 1, 2009||Dittmann Larry E||System for connecting a camera module, or like device, using flat flex cables|
|US7628617||Sep 22, 2006||Dec 8, 2009||Neoconix, Inc.||Structure and process for a contact grid array formed in a circuitized substrate|
|US7645147||Apr 5, 2006||Jan 12, 2010||Neoconix, Inc.||Electrical connector having a flexible sheet and one or more conductive connectors|
|US7758351 *||Jul 20, 2010||Neoconix, Inc.||Method and system for batch manufacturing of spring elements|
|US7816781 *||Oct 2, 2007||Oct 19, 2010||Infineon Technologies Ag||Power semiconductor module|
|US7891988||Nov 6, 2009||Feb 22, 2011||Neoconix, Inc.||System and method for connecting flat flex cable with an integrated circuit, such as a camera module|
|US7989945||Feb 14, 2007||Aug 2, 2011||Neoconix, Inc.||Spring connector for making electrical contact at semiconductor scales|
|US8221132 *||Aug 25, 2010||Jul 17, 2012||Tyco Electronics Corporation||Electrical connector assembly|
|US8232496 *||Apr 18, 2006||Jul 31, 2012||Abb Technology Ag||Switch disconnector|
|US8303316 *||Dec 14, 2010||Nov 6, 2012||Dspace Digital Signal Processing And Control Engineering Gmbh||Contact fixture|
|US8584353||Jun 2, 2006||Nov 19, 2013||Neoconix, Inc.||Method for fabricating a contact grid array|
|US8586420 *||Sep 29, 2011||Nov 19, 2013||Infineon Technologies Ag||Power semiconductor arrangement and method for producing a power semiconductor arrangement|
|US8641428||Dec 2, 2011||Feb 4, 2014||Neoconix, Inc.||Electrical connector and method of making it|
|US20010023781 *||Mar 27, 2001||Sep 27, 2001||Shigetsugu Muramatsu||Substrate for mounting electronic parts thereon and method of manufacturing same|
|US20030040139 *||Aug 21, 2001||Feb 27, 2003||Canella Robert L.||Spring contact for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate, apparatus including same and method of use|
|US20030042595 *||Aug 29, 2001||Mar 6, 2003||Canella Robert L.||Substrate with contact array and substrate assemblies|
|US20030089985 *||Dec 18, 2002||May 15, 2003||Jackson Timothy L.||Deflectable interconnect|
|US20030092218 *||Dec 18, 2002||May 15, 2003||Jackson Timothy L.||Deflectable interconnect|
|US20030143877 *||Feb 25, 2003||Jul 31, 2003||Intel Corporation.||Contact elements|
|US20040058470 *||Sep 23, 2003||Mar 25, 2004||Canella Robert L.||Methods of forming a contact array in situ on a substrate and resulting substrate assemblies|
|US20040253845 *||Jun 11, 2003||Dec 16, 2004||Brown Dirk D.||Remountable connector for land grid array packages|
|US20040253846 *||May 26, 2004||Dec 16, 2004||Epic Technology Inc.||Land grid array connector including heterogeneous contact elements|
|US20040253875 *||May 26, 2004||Dec 16, 2004||Epic Technology Inc.||Circuitized connector for land grid array|
|US20040268287 *||May 17, 2004||Dec 30, 2004||Tze-Chuen Toh||High speed bus with radio frequency microstrip|
|US20050070133 *||Nov 18, 2004||Mar 31, 2005||Canella Robert L.|
|US20050073041 *||Nov 18, 2004||Apr 7, 2005||Canella Robert L.|
|US20050109532 *||Jul 8, 2004||May 26, 2005||Hermkens Gerald A.||Method for manufacturing a sequential backplane|
|US20050120553 *||Dec 8, 2003||Jun 9, 2005||Brown Dirk D.||Method for forming MEMS grid array connector|
|US20050124181 *||Dec 8, 2003||Jun 9, 2005||Brown Dirk D.||Connector for making electrical contact at semiconductor scales|
|US20050164527 *||Mar 18, 2005||Jul 28, 2005||Radza Eric M.||Method and system for batch forming spring elements in three dimensions|
|US20050204538 *||Jul 16, 2004||Sep 22, 2005||Epic Technology Inc.||Contact and method for making same|
|US20050205988 *||Jul 19, 2004||Sep 22, 2005||Epic Technology Inc.||Die package with higher useable die contact pad area|
|US20050208786 *||Jul 2, 2004||Sep 22, 2005||Epic Technology Inc.||Interposer and method for making same|
|US20050208787 *||Jul 20, 2004||Sep 22, 2005||Epic Technology Inc.||Interposer with compliant pins|
|US20050208788 *||Mar 18, 2005||Sep 22, 2005||Dittmann Larry E||Electrical connector in a flexible host|
|US20050227510 *||Oct 8, 2004||Oct 13, 2005||Brown Dirk D||Small array contact with precision working range|
|US20060000642 *||Jul 20, 2004||Jan 5, 2006||Epic Technology Inc.||Interposer with compliant pins|
|US20060032050 *||Sep 1, 2005||Feb 16, 2006||Canella Robert L||Methods of forming a contact array in situ on a substrate|
|US20060105596 *||Nov 12, 2004||May 18, 2006||Minich Steven E||Two piece mid-plane|
|US20060125107 *||Feb 6, 2006||Jun 15, 2006||Kirby Kyle K||Test system for semiconductor components having conductive spring contacts|
|US20060145353 *||Mar 2, 2006||Jul 6, 2006||Kirby Kyle K||Semiconductor interconnect having dome shaped conductive spring contacts|
|US20060189179 *||Apr 21, 2006||Aug 24, 2006||Neoconix Inc.||Flat flex cable (FFC) with embedded spring contacts for connecting to a PCB or like electronic device|
|US20060211296 *||Apr 5, 2006||Sep 21, 2006||Dittmann Larry E||Electrical connector in a flexible host|
|US20060258182 *||Jul 17, 2006||Nov 16, 2006||Dittmann Larry E||Interposer with compliant pins|
|US20060258183 *||Jul 24, 2006||Nov 16, 2006||Neoconix, Inc.||Electrical connector on a flexible carrier|
|US20060276059 *||Apr 21, 2006||Dec 7, 2006||Neoconix Inc.||System for connecting a camera module, or like device, using flat flex cables|
|US20060278430 *||Jul 8, 2004||Dec 14, 2006||Viasystems Group, Inc.||Method for manufacturing a midplane|
|US20070050738 *||Aug 31, 2005||Mar 1, 2007||Dittmann Larry E||Customer designed interposer|
|US20070134949 *||Dec 12, 2005||Jun 14, 2007||Dittmann Larry E||Connector having staggered contact architecture for enhanced working range|
|US20070141863 *||Jan 3, 2007||Jun 21, 2007||Williams John D||Contact grid array system|
|US20070218710 *||Sep 22, 2006||Sep 20, 2007||Brown Dirk D||Structure and process for a contact grid array formed in a circuitized substrate|
|US20070259539 *||Apr 18, 2007||Nov 8, 2007||Brown Dirk D||Method and system for batch manufacturing of spring elements|
|US20070264845 *||May 15, 2006||Nov 15, 2007||Simonsson Olof S||Flexible circuit connectors|
|US20070275572 *||Feb 14, 2007||Nov 29, 2007||Williams John D||Connector for making electrical contact at semiconductor scales|
|US20080030210 *||Aug 2, 2007||Feb 7, 2008||Hon Hai Precision Ind. Co., Ltd.||Test socket|
|US20080134502 *||Oct 30, 2007||Jun 12, 2008||Dittmann Larry E||Connector having staggered contact architecture for enhanced working range|
|US20090085189 *||Oct 2, 2007||Apr 2, 2009||Infineon Technologies Ag||Power semiconductor module|
|US20090193654 *||Oct 29, 2007||Aug 6, 2009||Dittmann Larry E||Contact and method for making same|
|US20090314745 *||Apr 18, 2006||Dec 24, 2009||Abb Technology||Switch Disconnector|
|US20100055941 *||Mar 4, 2010||Neoconix, Inc.||System and method for connecting flat flx cable with an integrated circuit, such as a camera module|
|US20100075514 *||Mar 25, 2010||Neoconix, Inc.||Method of making electrical connector on a flexible carrier|
|US20100167561 *||Dec 7, 2009||Jul 1, 2010||Neoconix, Inc.||Structure and process for a contact grid array formed in a circuitized substrate|
|US20110151691 *||Jun 23, 2011||Peter Scheibelhut||Contact Fixture|
|US20120052695 *||Aug 25, 2010||Mar 1, 2012||Tyco Electronics Corporation||Electrical connector assembly|
|US20130082387 *||Apr 4, 2013||Infineon Technologies Ag||Power semiconductor arrangement and method for producing a power semiconductor arrangement|
|US20140190732 *||Jul 9, 2012||Jul 10, 2014||Osram Gmbh||Carrier Device, Electrical Device Having a Carrier Device and Method for Producing Same|
|US20150208502 *||Jan 22, 2014||Jul 23, 2015||International Business Machines Corporation||Through printed circuit board (pcb) vias|
|DE19739011A1 *||Sep 6, 1997||Mar 18, 1999||Telefunken Microelectron||Electronic assembly with optimized component carrier, especially for antilock braking system|
|EP0764352A1 *||Jun 7, 1995||Mar 26, 1997||Tessera, Inc.||Microelectronic contacts and assemblies|
|EP1645175A1 *||Jul 9, 2004||Apr 12, 2006||Arka Technologies Limited||Printed circuit board assembly|
|WO1997044859A1 *||May 22, 1997||Nov 27, 1997||Tessera, Inc.||Connectors for microelectronic elements|
|WO1998038700A1 *||Feb 25, 1998||Sep 3, 1998||Cornell Research Foundation, Inc.||Self-assembled low-insertion force connector assembly|
|WO2001045212A1 *||Feb 15, 2000||Jun 21, 2001||High Connection Density, Inc.||High density, high frequency linear and area array electrical connectors|
|U.S. Classification||439/63, 439/82|
|International Classification||H01R12/58, H01R24/58, H05K1/14, H05K3/00, H05K3/32, H05K3/30, H05K3/46, H05K1/11|
|Cooperative Classification||H05K2201/091, H05K3/4691, H05K2201/1059, H05K2201/09809, H01R24/58, H05K3/326, H05K2201/10704, H01R2103/00, H05K1/118, H05K3/306, H01R9/091|
|European Classification||H01R24/58, H05K3/32C2|
|Feb 24, 1992||AS||Assignment|
Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:KOHN, HAROLD;DESAI, KISHOR V.;ROMANOSKY, RONALD J.;AND OTHERS;REEL/FRAME:006026/0637;SIGNING DATES FROM 19920214 TO 19920218
|Sep 3, 1996||FPAY||Fee payment|
Year of fee payment: 4
|Sep 18, 2000||FPAY||Fee payment|
Year of fee payment: 8
|Oct 20, 2004||REMI||Maintenance fee reminder mailed|
|Apr 6, 2005||LAPS||Lapse for failure to pay maintenance fees|
|May 31, 2005||FP||Expired due to failure to pay maintenance fee|
Effective date: 20050406