|Publication number||US5388030 A|
|Application number||US 07/959,982|
|Publication date||Feb 7, 1995|
|Filing date||Oct 13, 1992|
|Priority date||Oct 11, 1991|
|Also published as||DE59206544D1, EP0536560A1, EP0536560B1|
|Publication number||07959982, 959982, US 5388030 A, US 5388030A, US-A-5388030, US5388030 A, US5388030A|
|Inventors||Markus Gasser, Markus Hansli, Robert Schilling, Stefan Schneeberger|
|Original Assignee||Asea Brown Boveri, Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (22), Non-Patent Citations (2), Referenced by (24), Classifications (16), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is related to a co-pending application having Ser. No. 07/781,402, now U.S. Pat. No. 5,323,296.
1. Field of the Invention
The invention relates to an input and/or output device for process data. The device includes a mounting rack and at least one module fastened on the mounting rack. A process connector can be inserted into the at least one module on the front side thereof. The at least one module has at least one circuit board which is located in a housing and is electroconductively connected to a process connector and to a bus connector, as well as a terminal strip. The at least one circuit board is connected non-positively to the process connector, for receiving contact pins which interact with contacts of the process connector.
Such input and/or output devices have modules which are fastened on a mounting rack and are connected via process connectors and cables to a device for executing a process. The modules communicate with one another via a system bus. Each of the modules include at least one circuit board located in a housing. The modules pick up signals from signal transmitters of a process execution device, process the signals, taking signals output by other modules into account if appropriate, and/or feed signals to signal receivers of the process execution device. Depending on requirements, a module may perform input, output, input and output and/or processing functions. The features of the device are essentially determined by the functions of the individual modules. The device, and hence in particular also each individual module, must not be damaged by the effects of electromagnetic interference, nor must its functioning be impaired. This is generally achieved by diverting usually high-frequency interference currents flowing toward the device to ground by means of protective devices before the interference currents enter circuits provided in one of the modules. The circuits are protected against the coupling-in of non-line-related interference by a shielding device.
2. Discussion of Background
An input and/or output device of the type mentioned above is known, for example, from EP-A-165 434. In this device, or in comparable devices, the housings of the modules are usually made of plastic. Unwanted interference currents introduced into a module via the process connector are conducted by conductor tracks arranged on the circuit board, or by a ground wire inserted into the housing of the module, from the signal input on the front side to a ground terminal of the module in contact with the mounting rack. It is customary for additional metal coatings or insertion plates to be provided on the housing. As a result of these measures, circuits provided on the circuit board are shielded from unwanted electromagnetic radiation, and consequently the full functioning of the circuits is maintained.
Accordingly, one object of the invention is to provide a novel input and/or output device of the type described above, which has a high operational reliability even in the case of a high level of mechanical and electromagnetic stresses.
The input and/or output device according to the invention is characterized by an extremely high electromagnetic compatibility. Interference currents flowing toward the device via the process connectors can be carried immediately from the process connector to the large-area and hence low-impedance ground reference of the housing of a module formed from a metal plate, and can then flow away directly to ground. Only a small voltage drop results from the low-impedance grounding line. The device according to the invention has therefore a considerably greater immunity to interference than a device with a grounding line of comparatively small dimensions. In this connection, it is accordingly also advantageous that, as a result of the low current density of a possibly occurring interference current, at the same time the strength of the associated magnetic interference field coupled into the circuits is also very low. A further advantage is conferred by the fact that radiation-linked interference is already shielded by the metallic housing of each module. Thus, contact-requiring insertion plates and metal-coated plastic housings are unnecessary.
A more complete appreciation of the invention and many of the attendant advantages thereof will be readily apparent as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
FIG. 1 shows a perspective view of a simplified representation of an embodiment of the input and/or output device according to the invention,
FIG. 2 shows a perspective view of the essential components of a module of the input and/or output device according to FIG. 1,
FIG. 3 shows a side view of a module of the input and/or output device according to FIG. 1 in which parts of the module housing have been removed, and
FIG. 4 shows a plan view of a section through a module according to FIG. 3 along the line IV--IV.
Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the figures, the input and/or output device illustrated in FIG. 1 includes essentially box-shaped modules 2 mounted next to one another on a mounting rack 1, of which only identically designed modules are illustrated for reasons of simplicity. The mounting rack 1 includes a bus holder 3 and the modules 2 have process connectors located thereon. The process connectors 4 can be disconnected from the modules 2 and are connected via a cable 6 guided in a channel 5 to signal sources and signal receivers, not shown, of a device for executing a process, likewise not shown, such as a production or a machining process. A metal fastening element 7 and a bus connector which cannot be seen in FIG. 1 are located each case in the top part on the rear side of the modules 2. The fastening element 7 engages over a large area into the mounting rack 1 and also the housing 8 of the module 2. During mounting, each module 2 is inserted into the fastening element 7 and is pivoted with its rear side against the mounting rack 1 and is subsequently fully fixed by a screw, not shown. During pivoting, the bus connector and a bus coupling 9 provided on the bus holder 3 form a plug connection, via which signals are guided into the bus carried by the bus holder 3 and hence to other modules 2, and/or can be taken from the bus and hence from other modules 2. Mounting rack 1 and module 2 are made predominantly of metal and after the pivoting are electroconductively connected to one another directly and indirectly via the fastening element 7.
According to FIG. 2, each module contains a housing formed by a support part 10 and covers 11, 12. The support part 10 is essentially formed by two plates arranged in an L-shape perpendicular to one another, one of which is used as side wall 13 and the other of which is used as rear wall 14 of the module housing 8. A non-designated opening which receives the fastening element 7 is provided in the top part of the rear wall 14. Furthermore, the rear wall 14 has an opening 15 which serves for the passage of a bus connector 16. The bus connector 16 can be mounted on the support part 10 and has terminal pins, not shown, which are in contact with conductor tracks, likewise not shown, of a circuit board 17. The circuit board 17 is connected to a terminal strip 18 which can be supported on the support part 10 and has terminal pins, not shown, which interact with connection sockets of the process connector. The circuit board 17 is also connected to at least one circuit board 19 carrying indicating diodes, not shown. When the module 2 is assembled, the terminal strip 18 is fixed on the support part 10 and the circuit boards 17 and 19 connected thereto are enclosed in the module housing 8 formed in this way by snapping on the covers 11 and 12. An opening 20 provided in the cover 11 serves for the passage of the terminal strip 18.
The support part 10 and the cover 11 of the module housing 8 are formed from an electroconductive metal plate, in particular from a steel plate, whereas the cover 12 is formed from an insulating material. Lugs 21, 22, 23, 24 and 25 are formed into the metal plate of the support part 10 which serve to carry the circuit board 17 and form an opening through which electromagnetic radiation cannot penetrate. Some of these lugs, namely the lugs 22, 23 and 24, are electroconductively connected to a conductor track of the circuit board 17 after assembly of the module 2.
The more detailed design of a module 2 can be seen from FIGS. 3 and 4. Thus, it can be seen from FIG. 3 (side view after removal of the covers 11, 12) that the terminal strip 18 carries contact pins 26 and also a bearing element 27, which can also be provided on the support part 10 if necessary, and a clamping screw 28. On the side of the circuit board 17 facing the viewer, conductor tracks 29, circuits 30 and protective elements 31 are provided a conductor track 32 (shown with a dashed line) is situated, at least partly parallel to the terminal strip 18, on the side of the conductor track 17 remote from the viewer between the terminal strip and the circuits 30. A plurality of indicating diodes 33 are electroconductively connected to the contact pins 26 and are carried by circuit boards 19. In addition, hollow contacts 41, 42, 43 which have a large-area electrical contact with the conductor track 32 are let into the circuit board 17. The protective elements 31 are preferably designed as a capacitor, surge arrester or diode in each case, and are electroconductively connected to the conductor track 32 by a first current terminal and to one of the contact pins 26 in each case with a second current terminal.
It can be seen from FIG. 4 (plan view of a section through the module 2 along the line IV--IV, in which in contrast to FIG. 3 the covers 11 and 12 have been inserted and the process connector 4 has been pivoted into the module 2) that the circuit board 17 is connected electrically and mechanically to the circuit boards 19 via contact parts 34. The terminal strip 18 is secured to the support part 10 of the housing of the module 2 by screws 35. The circuit board 17 is fastened on the lugs 21-25 for instance, by screws which are guided in each case through an eye in the hollow contacts, e.g. 41, let into the circuit board 17 and provided in each lug, e.g. 22. The pivoted-in process connector 4 is covered by a door 36 which is pivotably attached to the cover 12 snapped into the support part 10. It can furthermore be seen that the contact pins 26 contain bent, elastically deformable connection parts 37, on which the circuit board 17 is supported, preferably by a press-in connection.
The input and/or output device according to the invention functions as follows: for starting operation, after the module 2 has been pivoted in and fixed by the fastening element 7 and the clamping screw 28 on the mounting rack 1, the process connector 4 is placed with a bearing element on the bearing element 27 of the terminal strip 18 and is guided by a rotational movement performed in the plane of the drawing according to FIG. 3 into the position illustrated in FIG. 4. Contacts, not shown, of the process connector 4 that are electroconductively connected to the cables 6 thereby make contact with the contact pins 26 and thus establish via the conductor tracks 29 and the circuits 30 an electrical linkage between the signal transmitters and/or signal receivers of the device for executing the process and the bus or other modules 2, respectively.
Since mechanical forces might also be transmitted via the cables 6, the pivoted-in process connector 4 is protected against unwanted movement by a screw connection, for example, which is covered by the door 36 and acts on the terminal strip 18. The mechanical forces stemming from the cables 6 are transmitted via the process connector 4, the terminal strip 18 and the support part 10 to the mounting rack 1. The circuit board 17 is therefore largely spared mechanical stresses during operation of the device.
The circuits 30 arranged on the circuit board 17 remain largely unaffected by electromagnetic interference. Predominantly high-frequency interference currents introduced via the process connector 4 are coupled out of the current path to the circuits 30 by the protective elements 31 arranged directly at the contact pins 26 and are conducted over a short path into the support part 10 of the grounded module housing 8 via the large-area conductor track 32 and the lugs 22, 23 and 24. The current path for the interference currents has an extremely low impedance since all current conductors have a short and large-area design. The interference current density flowing to ground is therefore low, and accordingly virtually no magnetic field caused by the interference currents is coupled into the circuits 30 even in the case of large interference currents. A particularly favorable guidance of the interference current is achieved if the lugs, such as the lugs 22 and 24 for instance, have a U-section, since the interference currents from the conductor track 32 are then guided preferably into the outer area of the support part 10 of the module housing, and the inner area of the module housing facing the circuit board 17 remains free of current and hence performs an additional shielding function. In general, however, a design of the lugs, such as the lug 23 for instance, with a Z-section is adequate to ensure a sufficiently good guidance of the interference currents. Moreover, the housing made of a metal plate shields the radiation-linked interference particularly effectively. Additional metal insertion plates and/or metal coatings of the module housing are therefore unnecessary.
As can be seen from FIG. 3, for example, the support part 10 of the module housing 8 is drawn forward so far into the side accessible to a user of the input and/or output device that the conductive part lying closest to the touchable surface is not a current terminal of an operating and/or display element accessible from the operator side of the device, such as the indicating diode 33 for instance, but is always a part of the housing. As a consequence, with a large degree of certainty, interference currents caused by electrostatic discharges flow directly to ground via the module housing 8 and not through the circuits 30. Suppressor circuits for the operating and display elements are therefore unnecessary. High-frequency interference currents caused by electrostatic discharges flow via the cover 12, made of insulating material, of the module housing 8 into the outer areas of the support part 10 and of the cover 11 over a large area, and hence to ground with low impedance. Due to the skin effect, the high-frequency current flows here only on the outer surface of the module housing 8. Current does not flow through the inner side and hence the latter acts as a shield for electrical and magnetic fields caused by the current flowing on the outer side.
When constructing the module housing 8, it is advisable to design the support part 10 and cover 11 in such a way that they interlock with one another over a large area once the device has been assembled. This is advantageously achieved in accordance with FIG. 2 in that springy detent noses 51 and depressions 52 which fix the detent noses when interlocked are arranged at the edge of mutually opposite and parallel extending moldings of the support part 10 and of the cover 11. In addition, in each case a bearing element 53 and 54, respectively is formed into the support part 10 and into the cover 11, respectively. The bearing element forms a swivel joint which can be pivoted until the cover 11 and the support part 10 interlock.
Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described herein.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3052821 *||Feb 10, 1958||Sep 4, 1962||Scoville Ray R||Casing for modular units|
|US3794954 *||Sep 11, 1972||Feb 26, 1974||Gte Automatic Electric Lab Inc||Improved bus system for interconnecting subsystems of a communication switching system|
|US4628413 *||Dec 18, 1985||Dec 9, 1986||Ncr Corporation||Card cassette ejector apparatus|
|US4821145 *||Nov 17, 1987||Apr 11, 1989||International Business Machines Corporation||Pluggable assembly for printed circuit cards|
|US4926291 *||Jul 31, 1989||May 15, 1990||Western Digital Corporation||Data storage mounting assembly|
|US5070430 *||Sep 18, 1990||Dec 3, 1991||Siemens Aktiengesellschaft||Electrical installation composed of individual subassemblies|
|US5166864 *||May 17, 1991||Nov 24, 1992||Hughes Aircraft Company||Protected circuit card assembly and process|
|US5218518 *||Feb 3, 1992||Jun 8, 1993||Siemens Aktiengesellschaft||Rack mountable box shaped module with conical positioning elements|
|US5253140 *||Oct 8, 1991||Oct 12, 1993||Fanuc Ltd.||Connector unit for input/output module of programmable controller having disengagement lever|
|US5323296 *||Oct 23, 1991||Jun 21, 1994||Asea Brown Boveri Ltd.||I/O device including circuit board non-rigidly supported by elastically deformable terminal pins extending from a connector strip|
|*||DE228696C||Title not available|
|DE3412593A1 *||Apr 4, 1984||Oct 17, 1985||Kloeckner Moeller Elektrizit||Encapsulated assembly for electronic units|
|DE8628199U1 *||Oct 22, 1986||Jan 18, 1990||Siemens Ag, 1000 Berlin Und 8000 Muenchen, De||Title not available|
|DE8800430U1 *||Jan 13, 1988||Mar 10, 1988||Schleicher Gmbh & Co Relais-Werke Kg, 1000 Berlin, De||Title not available|
|EP0067757A1 *||Jun 1, 1982||Dec 22, 1982||Merlin Gerin||Electronic module pluggable into a bus-line|
|EP0165434A1 *||May 8, 1985||Dec 27, 1985||Siemens Aktiengesellschaft||Box-like printed circuit board module|
|EP0332909A2 *||Feb 25, 1989||Sep 20, 1989||BULL HN INFORMATION SYSTEMS ITALIA S.p.A.||Selective grounding device for electronic equipment|
|EP0536560A1 *||Sep 14, 1992||Apr 14, 1993||Asea Brown Boveri Ag||In- and/or output device for process data|
|GB2226706A *||Title not available|
|JPH02130895A *||Title not available|
|JPH02272797A *||Title not available|
|JPS6481399A *||Title not available|
|1||IBM Technical Disclosure Bulletin "Method for Retaining/Grounding An Electronic Card Within Card Covers" vol. 32 No. 1 Jun. 1989.|
|2||*||IBM Technical Disclosure Bulletin Method for Retaining/Grounding An Electronic Card Within Card Covers vol. 32 No. 1 Jun. 1989.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US5552965 *||Apr 4, 1994||Sep 3, 1996||Saia Ag||Control apparatus having a compact and accessible arrangement of printed circuit boards|
|US5579204 *||Aug 5, 1994||Nov 26, 1996||Emc Corporation||Disk carrier assembly|
|US5583750 *||Oct 18, 1995||Dec 10, 1996||Hitachi, Ltd.||Electronic device|
|US5675473 *||Feb 23, 1996||Oct 7, 1997||Motorola, Inc.||Apparatus and method for shielding an electronic module from electromagnetic radiation|
|US5687577 *||Apr 10, 1996||Nov 18, 1997||Motorola, Inc.||Apparatus and method for spray-cooling an electronic module|
|US5708568 *||Jun 17, 1996||Jan 13, 1998||Sundstrand Corporation||Electronic module with low impedance ground connection using flexible circuits|
|US5718117 *||Apr 10, 1996||Feb 17, 1998||Motorola, Inc.||Apparatus and method for spray-cooling an electronic module|
|US5731542 *||May 23, 1996||Mar 24, 1998||Motorola, Inc.||Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate|
|US5831824 *||Jan 31, 1996||Nov 3, 1998||Motorola, Inc.||Apparatus for spray-cooling multiple electronic modules|
|US5846852 *||Sep 15, 1997||Dec 8, 1998||Motorola, Inc.||Process for mounting an electronic component to a substrate and process for spray-cooling the electronic component mounted to a substrate|
|US6178091 *||Jul 9, 1998||Jan 23, 2001||Dell Usa, L.P.||Computer system having surface mount PWB grounding clips|
|US6181570 *||Mar 3, 1997||Jan 30, 2001||Siemens Nixdorf Informationssysteme Aktiengesellschaft||Electrical device module|
|US6250932 *||Sep 21, 1999||Jun 26, 2001||International Business Machines Corporation||Insulating divider and connector for hot plug adapter card slots|
|US6545877 *||Oct 27, 1998||Apr 8, 2003||Dell U.S.A., L.P.||Card retaining module for expansion slots|
|US6698060 *||Jun 10, 2002||Mar 2, 2004||Hando Industrial Co., Ltd.||Caster structure|
|US6700787 *||Feb 28, 2002||Mar 2, 2004||Garmin International, Inc.||Electronic equipment module apparatus and method|
|US6717818 *||Dec 24, 2002||Apr 6, 2004||Hon Hai Precision Ind. Co., Ltd.||Case for portable storage peripheral equipment having improved shielding effect|
|US6927983||Dec 24, 2003||Aug 9, 2005||Garmin International, Inc.||Electronic equipment module apparatus and method|
|US7188400||Jul 26, 2004||Mar 13, 2007||Garmin International, Inc.||Method for mounting units for an avionic display|
|US7417866||Nov 12, 2002||Aug 26, 2008||Garmin International, Inc.||Electronic equipment module mounting apparatus and method|
|US7473931||Feb 28, 2002||Jan 6, 2009||Garmin International, Inc.||System and method for mounting units for an avionic display|
|US9260946 *||Oct 1, 2012||Feb 16, 2016||Siemens Aktiengesellschaft||Power cell for deepwater application|
|US20150292304 *||Oct 1, 2012||Oct 15, 2015||Siemens Aktiengesellschaft||Power Cell for Deepwater Application|
|USRE36540 *||Feb 13, 1998||Feb 1, 2000||Methode Electronics, Inc.||Method of manufacturing a memory card package|
|U.S. Classification||361/818, 361/753, 174/350, 361/799, 174/51, 361/730, 361/796, 361/731, 361/800, 361/736, 361/785|
|Cooperative Classification||H05K7/1477, H05K7/1468|
|European Classification||H05K7/14P12B, H05K7/14P8|
|Oct 13, 1992||AS||Assignment|
Owner name: ASEA BROWN BOVERI, LTD., SWITZERLAND
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:GASSER, MARKUS;HANSLI, MARKUS;SCHILLING, ROBERT;AND OTHERS;REEL/FRAME:006254/0550
Effective date: 19920910
|Sep 1, 1998||REMI||Maintenance fee reminder mailed|
|Feb 7, 1999||LAPS||Lapse for failure to pay maintenance fees|
|Apr 20, 1999||FP||Expired due to failure to pay maintenance fee|
Effective date: 19990207