|Publication number||US5768022 A|
|Application number||US 08/586,437|
|Publication date||Jun 16, 1998|
|Filing date||Jan 16, 1996|
|Priority date||Mar 8, 1995|
|Also published as||EP0826162A1, EP0826162A4, WO1996027815A1|
|Publication number||08586437, 586437, US 5768022 A, US 5768022A, US-A-5768022, US5768022 A, US5768022A|
|Inventors||Nabil M. Lawandy|
|Original Assignee||Brown University Research Foundation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (33), Non-Patent Citations (16), Referenced by (16), Classifications (27), Legal Events (7)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention was made with government support under grant number F49620-94-1-0013 awarded by AFOSR and grant number F49620-92-0312 awarded by AASERT. The government has certain rights in the invention.
This patent application is a continuation-in-part of commonly assigned and U.S. patent application Ser. No. 08/400,835, now U.S. Pat. No. 5,604,635 filed Mar. 8, 1995, entitled "MICROLENSES AND OTHER OPTICAL ELEMENTS FABRICATED BY LASER HEATING OF SEMICONDUCTOR DOPED AND OTHER ABSORBING GLASSES", by Nabil M. Lawandy.
This invention relates generally to optical elements and to methods for fabricating same and, in particular, relates to microlenses and devices that include microlenses.
Due to the increasing use of small-scale optical devices such as diode lasers, optical fibers and CCD pixel elements, optics on a micron scale has become increasingly more important in science and industry. Numerous techniques have been employed to fabricate small-scale optical elements, almost all of which involve complex patterning steps followed by etching or ablation.
So called microlenses, just as their larger counterparts, can be classified as being refractive or diffractive. Examples of the latter include Fresnel zone plates which are comprised of a series of concentric light-blocking rings separated by slits. Binary optics is one technology that is suitable for fabricating Fresnel zone plate analogs and other diffractive optical elements using techniques that were originally developed for fabricating integrated circuits (i.e., photolithographic techniques). Reference in this regard can be made to the article "Binary optics" by W. B. Veldkamp et al., Scientific American, May 1992, pps. 92-97.
In the LEOS '94 Conference Proceedings, Vol. 1, 1994, there are described several approaches to the fabrication of micro-optical components, in particular microlenses and arrays of same. In particular, reference can be had to the following four articles: W. R. Cox et al., "Microjet Fabrication of Micro-optical Components", pp. 52-53; Z. L. Liau et al., "Mass-Transport Efficient Microlenses in GaAs and GaP for Integration with High Power Diode Lasers", pp. 67-68; B. F. Aull et al., "Application of Smart-Pixel and Microlens Arrays to Early Vision", pp. 149-150; and S. S. Lee et al., "An 8×1 Micromachined Micro-Fresnel Lens Array for Free-Space Optical Interconnect", pp. 242-243.
In general, these and other known types of approaches rely on complicated multi-step processes such as surface micromachining or photolithography and etching to fabricate microlenses and microlens arrays. However, the fabrication of refractive-type microlenses is not readily accomplished by photolithographic techniques.
In U.S. Pat. Nos. 5,053,171 and 4,842,782 Portney et al. disclose the fabrication of an ophthalmic lens with an excimer laser. In this approach the laser is used ablate a surface of a plastic or glass blank.
One particular application for a microlens element is in a laser diode. Typically a laser diode is provided in a small package or enclosure having electrical leads and a transparent output window through which the output beam is emitted. However, in many cases the output beam is emitted as a diverging, stripe-type beam which requires subsequent shaping to form a round, point-like beam. As can be appreciated, the additional shaping component or components can add cost and complexity to an optical system that utilizes the laser diode.
It is an object of this invention to provide a simplified method for fabricating a laser diode package that includes an integral lens for shaping the emitted beam.
It is another object of this invention to provide an in-situ method for fabricating microlens upon an output window of a laser diode package.
It is a further object of this invention to provide an in-situ method for fabricating microlens upon an output window of a laser diode package through the use of laser-induced surface structure formation in a semiconductor doped glass (SDG) material that forms at least a portion of the output window.
It is one further object of this invention to provide a laser diode package having an integral beam-shaping lens that is fabricated in accordance with the method of this invention.
The foregoing and other problems are overcome and the objects of the invention are realized by a method of preparing a refractive microlens in an output window of a laser diode package, utilizing laser-induced surface structure formation in semiconductor doped glasses (SDGs) and other materials that selectively absorb electromagnetic radiation within a first band of wavelengths, while being substantially transparent to electromagnetic radiation with a second band of wavelengths. By example, the SDG materials, in conjunction with above-bandgap wavelength laser sources, are used to fabricate lenses that operate with light of below-bandgap wavelengths.
In accordance with the teaching of this invention lenses on an approximately 5-1000 μm scale are fabricated individually or in arrays by laser irradiation of absorbing glasses. Semiconductor nanocrystallite or microcrystallite doped glasses, such as those that are commercially available, are particularly attractive since they are transparent at wavelengths longer than the bandgap of the semiconductors (e.g., CdSex S1-x).
By example, focused cw laser light at 5145 Angstroms can be used with a predetermined type of commercially available SDG to produce lenses which can be used at all wavelengths longer than 5500 Angstroms, i.e., the bandgap of the constituent semiconductor material. The lenses have controllable characteristics and can be fabricated to have focal lengths as short as tens of microns.
This invention thus teaches a method for fabricating a microlens within a window of a laser diode assembly, and a laser diode assembly fabricated in accordance with the method. The method includes the steps of (a) providing a laser diode assembly that includes a window that is substantially transparent at wavelengths emitted by a laser diode within the assembly, the window comprising a wavelength-selective absorber of electromagnetic radiation; and (b) irradiating a portion of a surface of the window with electromagnetic radiation having wavelengths within a range of wavelengths that are absorbed by the wavelength selective absorber such that a portion of the electromagnetic radiation is absorbed for heating and melting the material adjacent to the surface region, whereby the melted material rises up above the surface to form, when re-solidified, the microlens.
In one embodiment of this invention the step of irradiating includes a step of focussing the electromagnetic radiation to have a shape that corresponds to a shape of the microlens.
In another embodiment of this invention the step of irradiating includes a step of translating the window with respect to the electromagnetic radiation so as to form a generally cylindrical microlens. The microlens may be so formed to have a length and width in the range of micrometers to hundreds of micrometers.
The above set forth and other features of the invention are made more apparent in the ensuing Detailed Description of the Invention when read in conjunction with the attached Drawings, wherein:
FIG. 1 is simplified block diagram of a system suitable for practicing this invention;
FIG. 2 is a graph, generated from data obtained with a surface profilometer, that illustrates a lens profile with a 130 μm focal length;
FIG. 3 is an enlarged elevational view of a single refractive microlens having a diameter of approximately 9 μm;
FIG. 4 is an enlarged elevational view of a plurality of microlenses that form a portion of a two-dimensional array of microlenses;
FIG. 5 is a graph, generated from data obtained with an atomic force microscope, showing the profiles of a plurality of the microlenses of FIG. 4;
FIG. 6 is an enlarged planar view of the array of FIG. 4;
FIGS. 7A and 7B illustrate a far field pattern of a single-mode fiber output taken through the SDG substrate before the fabrication of a microlens shown in FIG. 3;
FIGS. 8A and 8B illustrate a far field pattern of the single-mode fiber output taken through the SDG substrate after propagation through the microlens shown in FIG. 3;
FIG. 9 is an enlarged cross-sectional view, not scale, of a plurality of microlenses fabricated in accordance with this invention;
FIG. 10 is a cross-sectional view of a laser diode package having an integral microlens for collimating an output beam of the laser diode; and
FIG. 11 illustrates an exemplary shape for the integral microlens of FIG. 10.
As employed herein a microlens is intended to encompass an optical structure that is suitable for redirecting (e.g., focussing, concentrating, diverging, or collimating) electromagnetic radiation, that is formed upon a surface of a substrate, that is integral with and comprised of a material that is substantially the same as a material of the substrate (except as is detailed below), and that has a diameter that is equal to or less than approximately one millimeter (i.e., less than approximately 103 micrometers).
FIG. 1 illustrates a system 10 suitable for practicing a microlens fabrication method of this invention. A laser 12 has an output coupled to a suitable beam delivery system 13, such as an articulated arm, mirrors and the like, which is positioned for directing the laser energy (indicated as a focussed beam A) to a surface 16a of a substrate 16. The laser light is preferably focussed by one or more optical elements 14. The surface 16a is the surface upon which at least one refractive microlens 18 is to be formed, and the substrate 16 is comprised of a wavelength-selective optical absorber.
In a presently preferred embodiment of this invention the wavelength-selective optical absorber is comprised of semiconductor particles (referred to herein interchangeably as semiconductor nanocrystallites and semiconductor microcrystallites) that are embedded within a transparent (at wavelengths of interest) glass matrix.
The focussed laser light, when generated with a wavelength that is equal to or greater than the bandgap wavelength of the semiconductor microcrystallites within the substrate 16, is absorbed and causes a localized heating and melting of the glass matrix adjacent to the surface 16a. As employed herein the bandgap wavelength of a semiconductor material is intended to mean a wavelength that corresponds to a photon having an energy sufficient to generate electron-hole pairs in the semiconductor material (i.e., an energy sufficient to raise an electron from the valence band to the conduction band).
The localized melting of the glass matrix, in turn, results in the formation of a raised `bump` of SDG material on the surface 16a. More particularly, the molten material of the substrate 16 exhibits a relatively large density change (e.g., 10-20%), which then wells up above the surface 16a before solidifying into a generally parabolic lens-like shape that forms, when re-solidified, the microlens 18.
In accordance with this invention the raised `bump` has been found to function as a refractive lens for light. The bump or lens is typically absorbing for light whose energy is above the bandgap of the semiconductor material. For some applications this absorption may be desirable (e.g., a filtering lens).
The substrate 16 is preferably mounted to a multi-degree of freedom positioning mechanism, such as an X-Y stage 20, so that the surface 16a of the substrate 16 can be located at a desired position relative to the focussed beam A. The use of the X-Y stage 20 is particularly advantageous when a plurality of microlenses 18 are to be fabricated as a one-dimensional or a two-dimensional array. If desired, a Z-axis stage 22 can also be employed for controlling the size of the focussed spot of laser light on the surface 16 and, hence, the diameter and profile of the microlens 18. A suitable controller 24 is provided for operating the positioning mechanisms 20 and 22 and, optionally, also the laser 12.
The substrate 16 is preferably comprised of a volume of silica-based glass host material having a plurality of semiconductor nanocrystallites embedded therein. By example, the substrate 16 is comprised of a borosilicate glass host material containing CdS.sub.(1-x) Sex nanocrystallites. The nanocrystallites are typically uniformly distributed throughout the glass host material and have a nominal spacing between them that is a function of the concentration (typically in a range of approximately 0.3 mole percent to approximately 50 mole percent or greater) of the nanocrystallites. The concentration of the microcrystallites should be adequate to cause enough of a localized heating effect, at a selected laser intensity, to induce the localized melting of the glass host.
In other embodiments of this invention the glass host may include, by example, PbS, CuCl, GaAs, InP, ZnSe, or ZnSeS semiconductor nanocrystallites.
As employed herein, a semiconductor nanocrystallite or microcrystallite is considered to be a single crystal or a polycrystalline aggregate of a semiconductor material having an energy band structure and an associated bandgap energy. The nanocrystallites are randomly oriented and have typical dimensions on the order of approximately 100 Angstroms to approximately 200 Angstroms. Commercially available glasses containing such semiconductor nanocrystallites are used as optical filters. By example, a series of such filters is available from Schott Glass, the filters being identified with a nomenclature that includes a number, such as 495, which gives the approximate semiconductor bandgap in nanometers. The teaching of this invention is, of course, not limited to use with only commercially available SDG substrate materials.
When exposed to light having wavelengths equal to or shorter than a wavelength associated with the bandgap energy, the light is absorbed by the semiconductor nanocrystallites, thereby creating the localized heating of the surrounding glass host or matrix. Light having wavelengths longer than the wavelength associated with the bandgap energy is not appreciably absorbed, and is transmitted through the glass host.
FIG. 2 illustrates a surface profilometer scan of the surface 16a of the SDG substrate 16 after exposure to the focused beam A of laser light. The data shows that the laser 12 has produced a small bump on the surface 16a. This bump forms the refractive microlens 18 which transmits light having wavelengths longer than the bandgap wavelength. In addition, there is evidence for an index of refraction change in the affected SDG material of the microlens 18, as well as for a migration of the semiconductor nanocrystallites away from molten glass that forms the microlens 18 (as is illustrated in FIG. 9). Both of these effects are believed to contribute to the phase shift of light passing through the microlens 18.
In general, the reduction in the index of refraction within the microlens 18 is proportional to the reduction in the (final) density of the glass host material within the microlens 18, as compared to the density in the bulk of the substrate 16. By example, a 1% reduction in the final density of the material of the microlens 18 (after melting and re-solidification) results in an approximate 1% reduction in the index of refraction.
Threshold laser powers for microlens formation are on the order of hundreds of mW at room temperature, and decrease nearly linearly to tens of mW at temperatures near 300° C. This decrease in power requirements is due to an observed sharp rise in the SDG absorption with temperature. At or slightly above threshold intensities a microlens may take in excess of ten seconds to form, while at intensities significantly above threshold less than one second is required for microlens formation.
The diameter of the microlens 18 is a function of the size of the incident laser beam A, the wavelength of the beam, and the total exposure time to the beam. Lens diameters from approximately 8 μm to 170 μm have been demonstrated, with no observed impediment to increasing the diameter to greater than 170 μm (to, by example, at least 500 μm). The profile of the microlenses 18 fabricated in accordance with the method of this invention has been found to be generally well fitted by parabolic as well as spherical functions.
FIG. 3 is an enlarged elevational view of a single refractive microlens 18 having a diameter of approximately 9 μm. FIG. 4 is an enlarged elevational view of a plurality of microlenses 18 that form a portion of a two-dimensional array. FIG. 5 is a graph, generated from data obtained with an atomic force microscope, which shows the profiles of a plurality of the microlenses 18 of FIG. 4. FIG. 6 is an enlarged planar view of the array of FIG. 4. In FIG. 5 the points labeled 1-4 correspond to the dimensions shown in Table 1.
TABLE 1______________________________________ Distance Height______________________________________#1 9.44 μm 10.17 nm#2 4.72 μm 1758.18 nm#3 9.10 μm 15.98 nm#4 5.06 μm 1634.56 nm______________________________________
FIGS. 7A and 7B illustrate a far field pattern of a single-mode fiber output taken through the SDG substrate 16 before the fabrication of the microlens 18 shown in FIG. 3. In contrast, FIGS. 8A and 8B illustrate a far field pattern of the single-mode fiber output taken through the SDG substrate 16 after propagation through the microlens 18 shown in FIG. 3. In particular, FIGS. 8A and 8B illustrate the focusing of the output of the single mode fiber at a distance of 16 mm, with the microlens 18 being located 430 μm from the tip of the fiber. This degree of focusing was produced with the microlens 18 of FIG. 3 which had a diameter of 130 μm and a height of 60 μm.
It can be appreciated that the selection of a suitable laser is a function of the bandgap wavelength of the selected SDG substrate 16, which in turn is a function of the desired band of wavelengths which are desired to be transmitted through the microlens 18.
By example, focused cw laser light at 5145 Angstroms can be used with OG550 SDG to produce microlenses which can be used at all wavelengths longer than 5500 Angstroms.
Further by example, and if a broad range of visible light is desired to be transmitted through the microlens 18, then a SDG substrate containing CuCl nanocrystallites can be selected (CuCl has a bandgap wavelength in the ultra-violet (UV) range). An Argon-ion UV laser or a frequency tripled cw mode locked Nd:YAG laser having an output wavelength in the UV (above the bandgap wavelength of CuCl) can then be employed as the laser 12 in FIG. 1. Other suitable laser types (depending on the required wavelength) include, but are not limited to, frequency doubled Nd:YAG lasers, Argon lasers, and dye lasers.
Referring now to FIG. 9, it should also be realized that a relatively large diameter microlens 18a can be fabricated first, followed by one or more smaller diameter microlenses 18b that are formed on the larger microlens 18a. By example, the substrate 16 can be positioned along the z-axis so as to form a first focal spot size on the surface to fabricate the larger microlens 18a, after which the substrate 16 can be translated along the z-axis to reduce the diameter of the focal spot (and optionally also along the x and y axes) to fabricate the smaller microlens 18a. In this fashion a single microlens (or an array of microlenses) can be fabricated to have complex optical profiles and characteristics.
FIG. 9 also illustrates the depletion of the semiconductor nanocrystallites (indicated as 17) within the microlenses 18, 18a and 18b, as compared to the concentration within the glass host that does not experience the localized melting. FIG. 9 also illustrates the focussing to a focal point (FP) of below bandgap wavelength (λ) light by the microlens 18. Illumination of the substrate 16 can also be accomplished through the surface opposite the surface 16a upon which the microlens 18 is formed.
The thickness of the substrate 16 can be adjusted as desired either before or after microlens fabrication. In addition, a suitable anti-reflection coating can be applied to a radiation-receiving surface of the substrate 16.
After fabrication of the microlens 18 or an array of same the completed structure can be integrated as desired with other optical components, such as electromagnetic radiation emitters (e.g., an array of laser diodes) or electromagnetic radiation receivers (e.g., an array of photodetectors) so as to focus or collimate electromagnetic radiation having wavelengths longer than the bandgap wavelength of the semiconductor nanocrystallites that are embedded within the substrate 16. Free space optical interconnects can also be constructed using the microlenses of this invention.
Referring now to FIGS. 10 and 11, and in accordance with the teaching of this invention, there is shown a cross-sectional view of a laser diode package 30 that is constructed so as to have an integral collimating lens 42A. More particularly, the laser diode package includes a conventional enclosure 32 having leads 34 for coupling to a source of operating power. Within the enclosure is a header 36 that supports a laser diode chip 38. The chip 38 emits a beam 38A of coherent radiation in a manner well-known in the art. The beam 38A has a diverging, stripe-like, non-collimated shape.
In accordance with this invention a window 40 is comprised of one of the semiconductor-doped or other materials described above. The entire window 40 may be comprised of this material, or only an upper portion thereof. Formed upon a surface of the window 40 is a microlens 40A in accordance with this invention. In this embodiment of the invention the microlens 40A has a generally cylindrical shape, such as a shape illustrated in FIG. 11, for collimating the diverging beam 38A into the collimated beam 38B. Other lens shapes can be employed, depending on the desired beam shaping.
Further in accordance with this invention, the microlens 40A can be fabricated in-situ using the apparatus shown in FIG. 1. That is, one or more of the laser diode packages 30 can be provided and then placed on the stage 20. The lens 20 can be selected for providing a shape to the laser beam A that corresponds to the shape of the microlens 40A. Alternatively, the stage(s) 20, 22 can be used for translating the window 40 with respect to the beam A during the microlens fabrication process. The beam power and/or focus can also be adjusted as required in order to arrive at the desired shape for the microlens 40A.
In any event, the material of the window 40 is selected to be substantially transparent (non-absorbing) to the output wavelength of the laser diode 38, while strongly absorbing at the wavelength of the laser 12 of FIG. 1.
While the invention has been particularly shown and described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that changes in form and details may be made therein without departing from the scope and spirit of the invention. By example, other wavelength-selective materials (other than semiconductor microcrystallites) can be employed, such as glasses doped with ions such as Cerium, Neodymium and Europium. Other matrix materials (other than glass) can also be employed, such as polymers (e.g., PMMA). In this latter case the matrix material may be employed without a dopant, and a suitable laser, such as an IR CO2 laser, is employed for forming the microlenses. Other types of optical devices can also be fabricated by the method of this invention, such as phase plates, phase masks, and anamorphic optics for diode laser collimation. It should further be realized that the microlens formation can occur in a vacuum or in an atmosphere selected for influencing the cooling rate and/or other parameters of the molten substrate material. Furthermore, the window 40 can be a multi-layered structure wherein only the upper layer or region is comprised of a material that is suitable for selectively absorbing electromagnetic radiation for forming a desired microlens structure.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3586816 *||Jul 25, 1968||Jun 22, 1971||American Optical Corp||Spot welding system and method|
|US3689264 *||Mar 19, 1970||Sep 5, 1972||Bell Telephone Labor Inc||Method for increasing index of refraction in transparent bodies and its application to light guides and the like|
|US3948660 *||Aug 2, 1973||Apr 6, 1976||Agfa-Gevaert, A.G.||Method for the manufacture of fresnel lenses using light-sensitive materials|
|US4229710 *||Jul 3, 1978||Oct 21, 1980||Itamar Shoshan||Wavelength selector for tunable laser|
|US4426708 *||Sep 2, 1981||Jan 17, 1984||Stichting Research En Techniek Van De Katholieke Universiteit||Laser device|
|US4439245 *||Jan 25, 1982||Mar 27, 1984||Rca Corporation||Electromagnetic radiation annealing of semiconductor material|
|US4478768 *||Mar 8, 1983||Oct 23, 1984||Tokyo Shibaura Denki Kabushiki Kaisha||Method for manufacturing optical type recording medium|
|US4561086 *||May 12, 1983||Dec 24, 1985||Eastman Kodak Company||Optical write/read unit with selective-transparency cover|
|US4729641 *||Apr 30, 1987||Mar 8, 1988||Canon Kabushiki Kaisha||Functional optical element having a non-flat planar interface with variable-index medium|
|US4734729 *||Aug 6, 1985||Mar 29, 1988||Eastman Kodak Company||Studded squeegee roller|
|US4775967 *||Oct 11, 1985||Oct 4, 1988||Hitachi, Ltd.||Beam spot control device using a thin micro lens with an actuator|
|US4842782 *||Oct 14, 1986||Jun 27, 1989||Allergan, Inc.||Manufacture of ophthalmic lenses by excimer laser|
|US4899048 *||Apr 27, 1987||Feb 6, 1990||Printware, Inc.||Focused optical beam encoder of position|
|US5053171 *||Mar 14, 1989||Oct 1, 1991||Allergan, Inc.||Manufacture of ophthalmic lenses by excimer laser|
|US5070509 *||Aug 9, 1990||Dec 3, 1991||Eastman Kodak Company||Surface emitting, low threshold (SELTH) laser diode|
|US5148322 *||Nov 9, 1989||Sep 15, 1992||Omron Tateisi Electronics Co.||Micro aspherical lens and fabricating method therefor and optical device|
|US5208698 *||Dec 19, 1990||May 4, 1993||The Mitre Corporation||Optically-neutral laser shield|
|US5243311 *||Sep 16, 1991||Sep 7, 1993||Jones Barbara L||Window comprising resin/diamond layer|
|US5260826 *||Jan 21, 1992||Nov 9, 1993||Physical Optics Corporation||Nonscanning sectioning microscope|
|US5294518 *||May 1, 1992||Mar 15, 1994||International Business Machines Corporation||Amorphous write-read optical storage memory|
|US5446719 *||Feb 3, 1993||Aug 29, 1995||Sharp Kabushiki Kaisha||Optical information reproducing apparatus|
|US5461239 *||Dec 3, 1993||Oct 24, 1995||Mikoh Pty Ltd||Method and apparatus for coding and reading information in diffraction gratings using the divergence of diffracted light beams|
|US5491762 *||Sep 9, 1994||Feb 13, 1996||Deacon Research||ATM switch with electrically-controlled waveguide-routing|
|US5500869 *||Mar 23, 1994||Mar 19, 1996||Mitsubishi Denki Kabushiki Kaisha||Semiconductor laser array device, semiconductor laser device, and production methods therefor|
|US5583843 *||Mar 6, 1995||Dec 10, 1996||Matsushita Electric Industrial Co., Ltd.||Compound holographic optical element with two superposition hologram patterns for converging and diffracting a light beam|
|DE3326092A1 *||Jul 20, 1983||Jan 31, 1985||Honeywell Gmbh||Laser|
|EP0523861A2 *||Jun 22, 1992||Jan 20, 1993||Mitsui Petrochemical Industries, Ltd.||Optical device and method of manufacturing the same|
|GB2001776A *||Title not available|
|GB2233334A *||Title not available|
|JPS6060791A *||Title not available|
|JPS61203689A *||Title not available|
|SU451155A1 *||Title not available|
|SU12523061A *||Title not available|
|1||"Binary Optics", W. Veldkamp and Thomas J. McHugh, Scientific American, May 1992, pp. 92-97.|
|2||"The topography of laser-irrudiated germanium", D.C. Emmony et al., Journal of Physics, D; Applied Physics, vol. 8, 1975, pp. 1472-1480.|
|3||B.F. Aull et al., "Application of Smart-Pixel and Microlens Arrays to Early Vision", LEOS '94 Conference Proceedings, vol. 1, 1994, pp. 149-150.|
|4||*||B.F. Aull et al., Application of Smart Pixel and Microlens Arrays to Early Vision , LEOS 94 Conference Proceedings, vol. 1, 1994, pp. 149 150.|
|5||*||Binary Optics , W. Veldkamp and Thomas J. McHugh, Scientific American, May 1992, pp. 92 97.|
|6||Petr A. Skiba et al., "Laser-stimulated local change of glass-ceramic optical properties", Optical Engineering, vol. 33, No. 11, Nov. 1994.|
|7||*||Petr A. Skiba et al., Laser stimulated local change of glass ceramic optical properties , Optical Engineering, vol. 33, No. 11, Nov. 1994.|
|8||R. Ludeke and E. P. Harris, "Single Mode GaAs Laser in External Cavity", IBM Technical Disclosure, vol. 15, No. 2, pp. 548-549, Jul. 1992.|
|9||*||R. Ludeke and E. P. Harris, Single Mode GaAs Laser in External Cavity , IBM Technical Disclosure, vol. 15, No. 2, pp. 548 549, Jul. 1992.|
|10||S.S. Lee et al., "AN 8×1 Micromachined Micro-Fresnel Lens Array for Free-Space Optical Interconnect", LEOS '94 Conference Proceedings, vol. 1, 1994, pp. 242-243.|
|11||*||S.S. Lee et al., AN 8 1 Micromachined Micro Fresnel Lens Array for Free Space Optical Interconnect , LEOS 94 Conference Proceedings, vol. 1, 1994, pp. 242 243.|
|12||*||The topography of laser irrudiated germanium , D.C. Emmony et al., Journal of Physics, D; Applied Physics, vol. 8, 1975, pp. 1472 1480.|
|13||W.R. Cox et al., "Microjet Fabrication of Micro-Optical Components", LEOS '94 Conference Proceedings, vol. 1, 1994, pp. 52-53.|
|14||*||W.R. Cox et al., Microjet Fabrication of Micro Optical Components , LEOS 94 Conference Proceedings, vol. 1, 1994, pp. 52 53.|
|15||Z.L. Liau et al., "Mass-Transport Efficient Microlenses In GaAs And GaP For Integration with High Power Diode Lasers", LEOS '94 Conference Proceedings, vol. 1, 1994, pp. 67-68.|
|16||*||Z.L. Liau et al., Mass Transport Efficient Microlenses In GaAs And GaP For Integration with High Power Diode Lasers , LEOS 94 Conference Proceedings, vol. 1, 1994, pp. 67 68.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US6052230 *||Jul 10, 1998||Apr 18, 2000||Northrop Grumman Corporation||Optical blurring filter which is resistant to digital image restoration|
|US6083429 *||Mar 31, 1998||Jul 4, 2000||Intel Corporation||Microlens formation through focal plane control of a aerial image|
|US6307680||Oct 13, 1999||Oct 23, 2001||Northrop Grumman Corporation||Optical blurring filter which is resistant to digital image restoration|
|US6507439||Apr 28, 2000||Jan 14, 2003||Intel Corporation||Microlens formation through focal plane control of an aerial image|
|US6733266 *||Aug 15, 2000||May 11, 2004||General Electric Company||System for fabricating anti-scatter x-ray grid|
|US7062135||Mar 19, 2003||Jun 13, 2006||Corning Incorporated||Method for fabricating curved elements|
|US8904822 *||Nov 6, 2012||Dec 9, 2014||Corning Incorporated||Thickness control of substrates|
|US20030179994 *||Mar 19, 2003||Sep 25, 2003||Caracci Stephen J.||Method for fabricating curved elements|
|US20050200961 *||Jun 17, 2003||Sep 15, 2005||Michael Rosenbluh||Microlens and method of marking same|
|US20140123703 *||Nov 6, 2012||May 8, 2014||Philip Robert LeBlanc||Thickness control of substrates|
|WO2000003294A2 *||Jun 30, 1999||Jan 20, 2000||Northrop Grumman Corporation||An optical blurring filter which is resistant to digital image restoration|
|WO2000003294A3 *||Jun 30, 1999||Feb 24, 2000||Northrop Grumman Corp||An optical blurring filter which is resistant to digital image restoration|
|WO2003048824A2 *||Dec 6, 2002||Jun 12, 2003||Optek Limited||Improvements relating to the coupling of optical waveguides|
|WO2003048824A3 *||Dec 6, 2002||Dec 4, 2003||Optek Ltd||Improvements relating to the coupling of optical waveguides|
|WO2003107041A2 *||Jun 17, 2003||Dec 24, 2003||Bar-Ilan University||Microlens and method of making same|
|WO2003107041A3 *||Jun 17, 2003||Mar 11, 2004||Yuri Kaganovskii||Microlens and method of making same|
|U.S. Classification||359/620, 264/1.37, 359/619, 372/103|
|International Classification||C03B23/02, C03B29/00, C03B29/02, C03B23/00, B23K26/00, G02B3/00|
|Cooperative Classification||C03B2201/58, G02B3/0056, C03B29/00, G02B3/0012, C03B23/006, C03B23/02, C03B29/025, G02B3/04, G02B3/0018|
|European Classification||G02B3/00A3S, G02B3/04, C03B23/02, C03B23/00G, C03B29/00, C03B29/02B, G02B3/00A1F, G02B3/00A1|
|Jan 16, 1996||AS||Assignment|
Owner name: BROWN UNIVERSITY RESEARCH FOUNDATION, RHODE ISLAND
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LAWANDY, NABIL M.;REEL/FRAME:007845/0919
Effective date: 19960112
|Jul 3, 2001||CC||Certificate of correction|
|Dec 14, 2001||FPAY||Fee payment|
Year of fee payment: 4
|Jan 9, 2002||REMI||Maintenance fee reminder mailed|
|Jan 4, 2006||REMI||Maintenance fee reminder mailed|
|Jun 16, 2006||LAPS||Lapse for failure to pay maintenance fees|
|Aug 15, 2006||FP||Expired due to failure to pay maintenance fee|
Effective date: 20060616