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Publication numberUS6182605 B1
Publication typeGrant
Application numberUS 09/551,004
Publication dateFeb 6, 2001
Filing dateApr 18, 2000
Priority dateApr 19, 1999
Fee statusLapsed
Also published asEP1047104A1
Publication number09551004, 551004, US 6182605 B1, US 6182605B1, US-B1-6182605, US6182605 B1, US6182605B1
InventorsJurgen Frosien
Original AssigneeAdvantest Corp.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Apparatus for particle beam induced modification of a specimen
US 6182605 B1
Abstract
Apparatus for particle beam induced modification of a specimen, comprising a source for generating a particle beam, nozzles for supplying a gas in the region of the specimen, and electrodes which can be supplied with a variable voltage. Said electrodes are forming a tube and the nozzles, being integrated in the electrodes, are leading into the tube.
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Claims(9)
What is claimed is:
1. Apparatus for particle beam induced modification of a specimen, comprising
a source (1) for generating a particle beam (2)
nozzles (3a, 3b . . . ) for supplying a gas in the region of the specimen (5), and
electrodes (4a, 4b . . . which can be supplied with a variable voltage,
characterized in that
said electrodes are forming a tube and the nozzles, being integrated in the electrodes, are leading into the tube.
2. Apparatus according to claim 1, characterised in that the electrodes (4a, 4b . . . ) are arranged in a multipole configuration.
3. Apparatus according to claim 2, characterised in that the multipole configuration is used as a deflector for the particle beam.
4. Apparatus according to claim 2, characterised in that the multipole configuration is used as a stigmator for the particle beam.
5. Apparatus according to claim 2, characterised in that the multipole configuration is used as a deflector and a stigmator for the particle beam.
6. Apparatus according to claim 1, characterised in that the electrodes (4a, 4b . . . ) are arranged and adapted to generate an axial acceleration or deceleration field.
7. Apparatus according to claim 1, characterised in that the electrodes are arranged in a quadrupole configuration.
8. Apparatus according to claim 1, characterised in that the electrodes are arranged in a hexapole configuration.
9. Apparatus according to claim 1; characterised in that the electrodes are arranged in an octupole configuration.
Description

The invention relates to an apparatus for a particle beam induced modification of a specimen, comprising a source for generating a particle beam, nozzles for supplying a gas in the region of the specimen and electrodes which can be Supplied with a variable voltage.

Particle beam induced processes are well known for precise modification approaches especially in the semiconductor industry. Here, device modification is performed on a micrometre and nanometre scale for chip and mask repair and fast chip prototyping. Two basic modification techniques are applied for local processing with high spatial resolution: material etching and material deposition.

Those techniques are mainly applied in focussed ion beam systems. However equivalent techniques are also known from electron beam systems (D. Winkler et al, “E-beam probe station with integrated tool for electron beam induced etching”, Microelectronic engineering 31 (1996) 141 to 147).

In such a particle beam apparatus a particle beam is generated and focussed onto a specimen to be modified. A deflection system in the particle beam system deflects the beam to or scans the beam in those areas in which the modification is to take place. Additionally, a gas is supplied in the modification area of the specimen by means or a gas nozzle, which creates a gas atmosphere in the beam interaction area of the specimen. Due to the interaction of the particle beam with the gas molecules, chemically active atoms and radicals will be generated, which can interact with the specimen in the area of the beam interaction. Basically, two processes can be performed depending on the gases supplied. The following table shows some examples of materials and corresponding modification gases:

Material to be
deposited Applied gas
Gold, Au Dimethyl-gold-trifluoro-
acetylacetonate
Platinum, Pt Trimethyl platinum
Tungsten, W Tungsten hexacarbonyl
Silicon oxide Tetramethoxysilane
Copper Hexafluoro-acetyo-acetonate
copper vinyl-trimethy-
silane
Material to be etched Etching gas
Silicon oxide, Silicon Xenon-difluoride
Aluminium Chlorine
Resist Water

The gas supply unit has to be placed after the final objective lens very close to the specimen in order to achieve a high-density gas atmosphere for a fast modification process. This placement of the gas supply unit next to the particle beam, however, can cause limitations regarding the beam performance. Especially in high end systems, in which high spatial resolution (fine probe size) is generated by electrical fields, the nozzle generates interferences. Since the nozzle is made of conductive material (in order to avoid charging), it distorts the electrical field and will consequently increase the probe diameter of the particle beam. This will reduce system resolution and, correspondingly, will increase the minimum feature size applicable for modification.

JP-A-01 169 858 discloses an apparatus for a particle beam induced modification of a specimen according to the preamble to claim 1. The deflecting means of this known apparatus is constituted of multiple deflecting electrodes arranged axially symmetrically with the optical axis of the charged particle beam. At least one of the deflecting electrodes is used as a gas pipe to guide the gas to the surface of the specimen.

The object of the invention is to improve the apparatus for particle beam induced modification so that it allows particle beam modification without the restriction of resolution loss due to the presence of the gas supply means.

The object is achieved by the features of claim 1 in that the electrodes are forming a tube and the nozzles, being integrated in the electrodes, are leading into the tube.

By arranging the electrodes in the form of a tube, it is possible to create a homogenous gas atmosphere within the tube which results in a more uniform material edging or material deposition.

This effect can be further improved, if the tube has a cover with an incident opening for the particle beam.

Further embodiments of the invention are the subject matter of the subordinate claims.

Further embodiments and advantages of the invention are explained in greater detail below with reference to the drawings, in which:

FIG. 1 shows a schematic representation of the apparatus,

FIG. 2 shows a schematic top view of the gas supply means and the electrodes and

FIG. 3 shows a sectional view along the line V—V of FIG. 2.

FIG. 1 shows an apparatus for particle beam induced modification of a specimen comprising a source 1 for generating a particle beam 2 and a component having means 3′ f or supplying a gas in the region of a specimen 5 and electrodes 4′ which can be supplied with a variable voltage.

Furthermore, the apparatus comprises a lens system 6 and an objective lens 7. Of course, the apparatus consists of further means which are not illustrated, such as, for instance, a deflector and a detector.

FIGS. 2 and 3 disclose the component, having means 3′ for supplying a gas and having electrodes 4′ which can be supplied with a variable voltage, in greater detail. The electrodes 4a, 4b, 4c, 4d are not formed by the nozzles themselves. On the contrary, the nozzles 3a, 3b, 3c, 3d are integrated in the electrodes. The electrodes are formed by parts of a tube as disclosed in FIGS. 2 and 3. Every electrode has integrated a nozzle which leads into the tube formed by all electrodes. By using all nozzles for supplying the same gas in the region of the specimen, it is possible to create a homogeneous gas atmosphere which results in a more uniform material etching or material deposition.

In order to further improve the homogenous gas atmoshpere, it is possible to close the tube with a cover 9 which has an incident opening 9 a for the particle beam (cf. FIG. 3).

In FIGS. 2 and 3 the electrodes are arranged in a quadrupole configuration. However, other multipole configurations as hexapole or octupole configurations are also possible.

According to the invention it is not at all necessary that every electrode is provided with a nozzle.

The electrodes may achieve additional functions or take over functions which are performed by other optical components. Accordingly, the electrodes can be used as a deflector for the particle beam or as a stigmator or both. Furthermore, they may be adapted to generate an axial acceleration or deceleration field.

The means 3′ for supplying a gas and the electrodes 4′ are placed between the objective lens 7 and the specimen 5. Preferably, they should be placed close to the specimen and should have their axis on the optical axis of the particle beam apparatus. By arranging the nozzles together with the electrodes in a multipole configuration a symmetry of the means 3′ for supplying the gas is created which decreases asymmetrical distortions of the particle beam. By arranging the electrodes in combination with the nozzles, it is possible to achieve additional functions or to take over functions which are performed by other optical components. This, in most cases, will reduce the working distance of the objective lens which additionally will improve the optical system performance.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US5342448 *Mar 31, 1993Aug 30, 1994Hitachi, Ltd.Apparatus for processing a sample using a charged beam and reactive gases
US5885354 *Dec 9, 1996Mar 23, 1999Act Advanced Circuit Testing Gesellschaft Fur Testsystement-Wicklung MbhMethod and apparatus for processing a specimen
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6900443 *Jan 14, 2004May 31, 2005Ict, Integrated Circuit Testing Geaellschaft FurCharged particle beam device for inspecting or structuring a specimen
US7112803Jul 23, 2004Sep 26, 2006Applied Materials, Israel, Ltd.Beam directing system and method for use in a charged particle beam column
US7170068 *May 12, 2005Jan 30, 2007Applied Materials, Israel, Ltd.Method and system for discharging a sample
US7435973Aug 7, 2006Oct 14, 2008Carl Zeiss Nts GmbhMaterial processing system and method
US7868290Sep 26, 2008Jan 11, 2011Carl Zeiss Nts GmbhMaterial processing system and method
US8247782Aug 21, 2012Carl Zeiss Sms GmbhApparatus and method for investigating and/or modifying a sample
US8623230Dec 18, 2008Jan 7, 2014Carl Zeiss Sms GmbhMethods and systems for removing a material from a sample
US9070533 *Jul 30, 2013Jun 30, 2015Fei CompanyEnvironmental scanning electron microscope (ESEM/SEM) gas injection apparatus with anode integrated with gas concentrating structure
US20040169140 *Jan 14, 2004Sep 2, 2004Hartmut SchlichtingCharged particle beam device for inspecting or structuring a specimen
US20040188380 *Mar 28, 2003Sep 30, 2004International Business Machines CorporationDry etch process to edit copper lines
US20050103272 *Aug 24, 2004May 19, 2005Leo Elektronenmikroskopie GmbhMaterial processing system and method
US20060016988 *Jul 23, 2004Jan 26, 2006Applied Materials Israel LtdBeam directing system and method for use in a charged particle beam column
US20060255288 *May 12, 2005Nov 16, 2006Applied Materials Israel LtdMethod and system for discharging a sample
US20060284090 *Aug 7, 2006Dec 21, 2006Carl Zeiss Nts GmbhMaterial processing system and method
US20080093565 *Oct 23, 2007Apr 24, 2008Hitachi High-Technologies CorporationCharged particle beam system and its specimen holder
US20090121132 *Sep 26, 2008May 14, 2009Carl Zeiss Nts GmbhMaterial processing system and method
US20100282596 *Dec 18, 2008Nov 11, 2010Nawotec GmbhMethods and systems for removing a material from a sample
US20110210181 *May 27, 2010Sep 1, 2011Carl Zeiss Sms GmbhApparatus and method for investigating and/or modifying a sample
US20150380205 *Jun 30, 2014Dec 31, 2015Fei CompanyIntegrated light optics and gas delivery in a charged particle lens
Classifications
U.S. Classification118/723.0EB, 118/723.0FI
International ClassificationH01J37/317, C23C16/48, H01L21/3065, H01L21/203, H01J37/305, H01L21/027, H01L21/302
Cooperative ClassificationH01J37/3056, H01J2237/047, H01J2237/12, H01J2237/15, H01J2237/006, H01J2237/1532, H01J37/3178
European ClassificationH01J37/317C, H01J37/305B2
Legal Events
DateCodeEventDescription
Nov 17, 2000ASAssignment
Owner name: ADVANTEST CORPORATION, JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FROSIEN, JURGEN;REEL/FRAME:011317/0261
Effective date: 20001106
Aug 25, 2004REMIMaintenance fee reminder mailed
Feb 7, 2005LAPSLapse for failure to pay maintenance fees
Apr 5, 2005FPExpired due to failure to pay maintenance fee
Effective date: 20050206