|Publication number||US6188577 B1|
|Application number||US 09/442,451|
|Publication date||Feb 13, 2001|
|Filing date||Nov 18, 1999|
|Priority date||Nov 18, 1999|
|Also published as||DE29921218U1|
|Publication number||09442451, 442451, US 6188577 B1, US 6188577B1, US-B1-6188577, US6188577 B1, US6188577B1|
|Original Assignee||Yen-Wen Liu|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (8), Referenced by (20), Classifications (21), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention relates generally to a protective device for a central processing unit, and particularly to a protective device for mounting a heat sink on a central processing unit (CPU) in a stable manner for conducting the heat created from the CPU to the heat sink.
In view of the trend that design of computer and related products is moving towards minimization in weight and volume, and accordingly the chip of the central processing unit (CPU) is also made smaller, this invention provides an improved structure in compliance with this trend.
As shown in FIG. 1, combined structure of a prior heat sink and a central processing unit. A heat sink A is placed on a CPU C to contact a top face thereof by retaining in the way a fastener B of a fin set A1 being buckled to a fastening piece D1 in a socket D of the CPU C. However, as the chip of the CPU C becomes smaller and smaller, the contact area between an existing heat sink and the top face of the CPU C also becomes smaller too. Thus, when buckling the heat sink to the CPU C, an imbalance support force will cause the heat sink to slant and lose solid contact with the chip. This results in degraded heat dissipating and possible impairment of the CPU C which may become disabled or even burnt down finally.
From the abovesaid, the disadvantages of the existing combination structure may be summarized as the following:
1. The existing structure can no longer fit the smaller-sized CPU owing an imbalance in support force that causes a slant of the heat sink and failure of normal heat dissipating operation.
2. The imbalance support force will impair the CPU by an imbalance of pressure applied by the heat sink.
3. As the contact area of the structure is lessened, a careful buckling measure becomes necessary, which requires more time and cost.
4. A slight impact may result in a poor contact between the heat sink and the CPU.
For improvement, this invention mounts a supporter between the heat sink and the CPU to obtain a stable and constant contact at their junction for conducting away heat of the CPU efficiently.
The primary object of this invention is to provide a protective device for a central processing unit (CPU) by mounting an extra supporter on a CPU, wherein a window is formed in a central portion of the supporter, and a plurality of predetermined support spring pieces is disposed around the window for holding a heat sink in a stable position.
Another object of this invention is to provide a protective device that can conduct the heat created by the CPU to a heat sink efficiently.
FIG. 1 is an elevational view showing a combined structure of a conventional heat sink and a CPU;
FIG. 2 is an exploded perspective view of the CPU and the invention; and
FIG. 3 is an elevational view of a combined structure of the CPU and the invention.
As shown in FIG. 2, a fastener 2 is located in a fin forest 11 of a heat sink 1, and a central processing unit (CPU) 4 is plugged in a socket. A supporter 3 is placed on the top face of the CPU 4, wherein the chip 41 of the CPU 4 is located at a central portion in a window 31 surrounded by a rectangular supporter 3. The heat sink 1 is laid on the CPU 4 and fixed by buckling a buckle 21 of the fastener 2 to a fastening piece 51 on opposite sides of the socket 5.
A lateral view of a combined structure of a CPU and this invention is shown in FIG. 3. After the fastener 2 of the heat sink 1 is buckled with the fastening piece 51 of the socket 5, a contact face 12 of the heat sink 1 will contact with the top face of the chip 41 of the CPU 4 and a plurality of inwardly and upwardly directed support spring pieces 32 of the supporter 3 presses against the bottom contact face 12 of the heat sink 1.
The plurality of support spring member 32 is spaced around the window 31 and used to support and maintain the heat sink 1 in a stable position so that the contact face 12 of the heat sink 1 will remain in full contact with the top face of the chip 41 of the CPU 4 for conducting the heat produced by the CPU 4 efficiently to the heat sink 1, no matter how small the chip 41.
In short, this invention is to provide a protective device for a central processing unit by placing a supporter on a CPU so that stable and constant contact between a heat sink and the CPU chip is maintained to conduct heat of the CPU efficiently to a heat sink.
To conclude the abovesaid, the merits of this invention may be summarized as follows:
1. This invention is applicable to a small-sized chip of a CPU without creating an imbalance force to avoid slanting a heat sink on the chip of a CPU.
2. The plurality of support spring pieces of this invention are capable of balancing the support force without slanting the heat sink so that the chip of the CPU will not be impaired by the heat sink.
3. This invention requires no extra time for buckling in the case of a small contact area to thus save time and assembling cost.
4. After being assembled, no poor contact of the combined structure of the heat sink and the CPU will be incurred by a slight impact by virtue of the support spring pieces.
Although, this invention has been described in terms of preferred embodiments, it is apparent that numerous variations and modifications may be made without departing from the true spirit and scope thereof, as set forth in the following claims.
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|Citing Patent||Filing date||Publication date||Applicant||Title|
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|US20070165380 *||Jan 16, 2006||Jul 19, 2007||Cheng-Tien Lai||Memory module assembly including a clip for mounting a heat sink thereon|
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|US20080285238 *||Jul 31, 2008||Nov 20, 2008||International Business Machines Corporation||Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers|
|US20080291622 *||May 22, 2008||Nov 27, 2008||Hon Hai Precision Ind. Co., Ltd.||Electrical connector assembly having heat sink|
|US20120325431 *||Aug 23, 2011||Dec 27, 2012||Foxconn Technology Co., Ltd.||Heat dissipation device with fan holder|
|CN102843894A *||Jun 22, 2011||Dec 26, 2012||富瑞精密组件（昆山）有限公司||Radiator and fan fixing bracket thereof|
|CN102843894B *||Jun 22, 2011||Dec 21, 2016||富瑞精密组件（昆山）有限公司||散热装置及其风扇固定架|
|EP3200226A4 *||Oct 17, 2014||Sep 27, 2017||Huawei Tech Co Ltd||Heat dissipation shielding structure and communication product|
|U.S. Classification||361/704, 257/718, 257/E23.086, 361/707, 257/719, 165/80.3, 361/703, 361/710, 361/719, 361/717, 257/727, 174/16.3, 24/294|
|International Classification||G06F1/20, H01L23/40|
|Cooperative Classification||Y10T24/306, H01L23/4093, G06F1/20, H01L2924/0002|
|European Classification||G06F1/20, H01L23/40S|
|Sep 1, 2004||REMI||Maintenance fee reminder mailed|
|Feb 14, 2005||LAPS||Lapse for failure to pay maintenance fees|
|Apr 12, 2005||FP||Expired due to failure to pay maintenance fee|
Effective date: 20050213