|Publication number||US6289678 B1|
|Application number||US 09/339,852|
|Publication date||Sep 18, 2001|
|Filing date||Jun 25, 1999|
|Priority date||Dec 3, 1998|
|Publication number||09339852, 339852, US 6289678 B1, US 6289678B1, US-B1-6289678, US6289678 B1, US6289678B1|
|Original Assignee||Phoenix Group, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (13), Referenced by (108), Classifications (18), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This is a continuation-in-part of Ser. No. 09/204,233 filed on Dec. 3, 1998, now abandoned.
1. Field of the Invention
This invention relates to an improved environment system for sealed hard disk assemblies, and more particularly to a system that extends the operating life of the hard disk assembly when subject to high operating temperatures.
2. Description of the Prior Art
FIG. 1 schematically illustrates a commercially available sealed, hard disk drive and its environment control enclosure that makes the disk drive suitable for use in rugged applications where it is subject to high temperature and mechanical shock and/or vibration. One such sealed hard disk and environment control enclosure is available from Miltope Corporation and referred to by Miltope as the LPC Series of rugged high capacity, low profile, shock and vibration resistant disk drives employing sealed, disk drive cartridges. These products are ruggedized for operation in severe field environment where extremes of temperature, shock, vibration, humidity and air pressure are common. They are designed for “on-the-move” operation in tracked and wheeled vehicles, as well as airborne and shipboard applications. As illustrated in FIG. 1, this prior art disk drive includes a commercially available sealed hard disk drive 10, such as the sealed hard disk drive available from Toshiba, IBM Corp., Seagate and others. Such hard disk drives include a disk housing 12, which is sealed except for a very small opening 14 that allows a small amount of gas sealed in the housing 12 to egress and ingress during disk start up and shut down respectively. A hard disk 16 within the housing 12 rides on a spindle 17 driven by a motor 18, both of which are also located within the housing 12. A flying head 20 is servo positioned over a desired track on the disk 16 in order to read from and write data onto the disk. The housing 12 is supported in a sealed environmental housing 22 by resilient mounts 24, i.e. device to mechanically isolate rapid acceleration due to shock or vibration, for example, of the environmental housing 22 from the disk housing 12. The environmental housing 22 is an air tight aluminum housing filled with an inert gas or, if desired, with dry or low humidity air. This sealed aluminum housing 22 can also house a control electronics module 30. An embedded closed loop servo system compensates for temperature variation, ensuring reliable head positioning. An air tight connector 32 provides a signal and power interface between the components inside the sealed environmental housing 22 and connections (not shown) outside of the housing. As will be appreciated by those skilled in the art, hard disk drives of the type shown schematically in FIG. 1, store multi-gigabytes of data on a 2.5 inch or 3.5 inch disk, with the environmental housing 22 having a foot print of approximately 5 inches by 8 inches by 1.5 inches deep for a 3.5 inch disk, or appropriately smaller for a 2.5 inch or smaller hard drive. The expected mean time between failures is normally in excess of 100,000 hours in a normal environment application.
While quite satisfactory in normal office type operation, the hard disk drive systems of the type shown in FIG. 1 have experienced a significant increase in failures when operating at very high temperatures.
An object of this invention is the provision of a hard disk drive system with a small footprint and rugged shock resistance (i.e. of the type described in connection with FIG. 1) but which can operate in a high temperature and/or high humidity environment without a significant decrease in mean time between failure.
Applicant has identified the cause of an increase in failure rate of hard disk systems operating in high temperature environments as the lubricant used to lubricate the disk drive motor 18. Oil from the spindle motor has been found to wick and/or vaporize out of the motor bearing when operated at high temperatures. The lubricant has been found to form a deposit on the flying head and disk surface, eventually causing it to contact the disk and cause permanent damage as well as cause spindle motor bearing failure which causes permanent damage. In addition, when the hard drive is turned on, internal air is expelled as the air is heated through the breathing hole/filter generally used in disk drives of the magnetic media type due to the high speed rotation of the disk platter. When a drive is powered off, and cools down, make-up air is drawn in. If humidity is present, the make-up air can contain humidity or other contaminants which can deposit residue on the read/write head and disk platters, which can cause unstable flying of the read/write head and cause damage to the unit which can result in permanent failure. In addition, the disk drive electronics have caused circuit drifts and failures at temperatures above 135° F. Applicant's solution to the problem that applicant has identified is to provide arrangement inside the environmental housing to transfer heat away from the hard disk drive without necessarily increasing the overall footprint of the system or coupling shock or vibration from the environmental housing to the disk drive. In some embodiments of the invention, the arrangement includes a thermoelectric heat pump module that uses the Peltier effect to move heat. As will be appreciated by those skilled in the art, such solid state heat pumps are commercially available, for example from Melcor corporation. These heat pumps consist of a number of p type and n type pairs connected electrically in series and sandwiched between two ceramic plates. When connected to a d.c. source, current causes heat to move from one plate to the other, creating a relatively hot side and a relatively cool side. In one embodiment of the invention, the cool side of the solid state heat pump engages the hard disk housing, and resilient heat conductors thermally connect the hot side to the environmental housing without materially coupling shock or vibration. In another embodiment, the hot side of the solid state heat pump contacts the inside wall of the environmental housing, and a fan circulates the gas in the environmental housing across the cool side of the heat pump and the hard disk housing. In yet another embodiment, a fan circulates the gas along a wall of the environmental housing, and the cold side of the heat pump is in heat conducting contact with an exterior surface of the wall. The hot side of the heat pump is in heat conducting contact with a heat sink.
In still another embodiment, the heat pump is omitted in favor of a heat pipe. Heat pipes have been used to cool aircraft power supplies and densely packed electronics in portable computers. One particular type of heat pipe, manufactured by Thermacore, Inc. of Lancaster, Pa., consists primarily of a porous material soaked in a low vapor-point liquid, such as acetone or methanol. When the liquid is heated, it vaporizes and is forced to the center of the pipe. It then travels to one end, where it condenses and releases its heat. At that point, the cooled liquid is wicked back to where it started, and the process repeats. The heat pipe can be generally U-shaped, with one side being secured to the hard disk housing, and the other side being secured to an interior surface of the environmental housing. Flexibility is provided in the heat pipe by, for example, a flexible bellows between the two sides of the heat pipe. Heat from the side in contact with the hard disk housing flows through the heat pipe to the side in contact with the environmental enclosure.
The foregoing and other objects, aspects and advantages will be better understood from the following detailed description of a preferred embodiment of the invention, in which like reference numbers have been used to identify like part in different figures, and in which:
FIG. 1 is a schematic illustration of a prior art environmentally protected hard disk system.
FIG. 2 is a plan view showing the top of the environmental housing of a disk drive system in accordance with one embodiment of the invention.
FIG. 2A is a sectional view along the line A—A of FIG. 2.
FIG. 2B is a left side view, with parts broken away, of the system shown in FIG. 2.
FIG. 2C is a right side view of the system shown in FIG. 2.
FIG. 3 is a plan view showing the top of the environmental housing of a disk drive system in accordance with another embodiment of the invention.
FIG. 3A is a sectional view along the line A—A of FIG. 3.
FIG. 3B is a left side view, with parts broken away, of the system shown in FIG. 3.
FIG. 3C is a right side view of the system shown in FIG. 3.
FIG. 4 is a sectional view of yet another embodiment of the present invention.
FIG. 5 is a perspective view of the environmental housing of a disk drive system in accordance with still another embodiment of the invention, with a part of the housing removed.
Referring now to FIGS. 2, 2A, 2B and 2C, it shows a disk drive system similar to that shown in FIG. 1 with a hard disk drive 10 supported in an environmental housing 22 by a resilient mounting system 24. The housing 22 includes fins or ribs 23 in order to increase the outer surface area of the housing and to thereby increase the rate of heat transfer from the outer surface of the housing by connections. The mounting system 24 shown here is a molded visco-elastic pad that partially surrounds the disk drive housing 12 and fits tightly in the environmental housing 22 in order to protect the hard drive 10. The thermally sealed connector 32 has a flex circuit interface to the hard disk drive 10.
In this embodiment of the invention, one side of a solid state heat pump 30 contacts the outer surface of the hard disk housing 12 and is secured thereto by means of a thermally conductive epoxy. Direct current power, which is coupled to the heat pump 30 via the connector 32, is of such a polarity that the side of the heat pump contacting the housing 12 is the cold side and the hot surface of the heat pump is on the side away from the hard disk housing 12. Flexible, thermally conductive members 36 conduct heat from the hot surface of the heat pump to the inner surface of the environmental housing, which in turn conducts the heat to the outside environment. Here it will be appreciated that the heat conductive members 36 can be any one of a wide variety of different designs with the purposes of conducting heat while providing little or no mechanical coupling between the environmental housing 22 and the hard disk housing 12. For example, curved ribbons of copper, resilient copper rings or copper spring fingers can be used.
FIGS. 3, 3A, 3B and 3C show an alternative embodiment of the invention. Here the hot side of the solid state heat pump 30 is secured by, for example, a thermally conductive epoxy, to the inner surface of the environmental housing 22. A fan 40 is secured to the cold side of the solid state heat pump 30. Heat is transferred by conduction directly from the hot side of the heat pump 30 to the environmental housing 22 and from the environmental housing 22 to the surrounding environment. The fan 40 circulates the gas in the environmental housing over the cold side of the solid state heat pump 30 and over the hard disk housing 12, cooling the hard disk housing by convection. The mounting system 24 has openings 25 to allow the circulation of gas around the disk drive housing 12 as within the environmental housing 22. Power is coupled for both the fan 40 and the heat pump 30 via the sealed connector 32 from outside the housing 22.
As can be seen from FIG. 4, in yet another embodiment of the invention, the fan 40 is positioned in a space between the hard disk drive 10 and a wall of the environmental housing 22 to produce a cooling flow of gas along an inner surface of the wall. The cold side of the solid state heat pump 30 is in heat conductive contact with an outer surface of the wall of the environmental housing 22, and the hot side of the heat pump 30 is in heat conductive contact with a heat sink 44, which can be, for example, a relatively large mass of metal having a cooler temperature than the hard disk drive 10.
FIG. 5 shows still another embodiment of the invention, in which half of the environmental housing 22 has been removed, so that internal parts can be seen. The internal parts include the hard disk drive 10 supported in the environmental housing 22 by the resilient mounting system 24 (not shown in FIG. 5), with a space provided between the top of the hard disk drive and an inside surface of the top of the environmental housing. The environmental housing 22 is filled with an inert gas. A heat pipe 50 is positioned in the space between the hard disk drive 10 and the environmental housing 22. The heat pipe 50 includes a first portion 52 having a large flat surface 54 in contact with the hard disk drive 10 for heat transfer from the hard disk drive to the heat pipe. The heat pipe 50 also has an opposite portion 56 having a large flat surface 58 in contact with an interior surface of the environmental enclosure 22 for heat transfer from the heat pipe to the environmental enclosure. The portions 52 and 56 of the heat pipe 50 can be secured to the hard disk drive 10 and the environmental enclosure 22, respectively, in a conventional manner, such as by an epoxy. The heat pipe 50 is flexible between the first and second portions 52 and 56, such as by the use of a flexible bellows portion 60 between the first and second portions. In the illustrated embodiment, the heat pipe 50 has a generally U-shape and includes an outer shell which can be made of, for example, stainless steel or copper. Heat transferred into the first portion 52 of the heat pipe 50 from the hard disk drive 10 vaporizes a low vapor-point liquid in that portion of the heat pipe and causes it to flow to the opposite portion 56 of the heat pipe, where the liquid transfers its heat through the outer shell of the heat pipe at the second portion 56 to the environmental enclosure 22 and condenses. The condensed, cooled liquid is wicked back to the first portion 52, and the process repeats.
While the invention has been described in terms of several preferred embodiments, those skilled in the art will recognize that the invention can be practiced with modification within the spirit and scope of the appended claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3757530 *||Apr 12, 1972||Sep 11, 1973||Control Data Corp||Cooling system for data processing apparatus|
|US4642715||Nov 1, 1984||Feb 10, 1987||Miltope Corporation||Environmental conditioning and safety system for disk-type mass memories|
|US4812733 *||Oct 27, 1987||Mar 14, 1989||Richard Tobey||Computer element performance enhancer|
|US5456081 *||Apr 1, 1994||Oct 10, 1995||International Business Machines Corporation||Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability|
|US5596483 *||Apr 18, 1996||Jan 21, 1997||Silent Systems, Inc.||Silent air cooled computer having a hard disk drive with an acoustic shield and a heat sink arranged exterior to the drive|
|US5623597 *||Jun 15, 1995||Apr 22, 1997||Elonex Ip Holdings Ltd.||Secure data storage system for a computer wherein a heat transfer apparatus cools a data storage unit in a fireproof safe in absence of a fire and ceases transfer in the event of a fire|
|US5676199 *||Nov 22, 1995||Oct 14, 1997||Lee; Richard M. L.||Thermostat controlled cooler for a CPU|
|US5704212 *||Sep 13, 1996||Jan 6, 1998||Itronix Corporation||Active cooling system for cradle of portable electronic devices|
|US5724818 *||Jul 25, 1996||Mar 10, 1998||Aisin Seiki Kabushiki Kaisha||Thermoelectric cooling module and method for manufacturing the same|
|US5757615 *||Jul 1, 1996||May 26, 1998||Compaq Computer Corporation||Liquid cooled computer apparatus and associated methods|
|US5827424 *||Sep 26, 1996||Oct 27, 1998||International Business Machines Corporation||Contaminant reduction system for disk drives|
|US5982616 *||Aug 20, 1997||Nov 9, 1999||Compaq Computer Corporation||Electronic apparatus with plug-in heat pipe module cooling system|
|US6069792 *||Sep 16, 1997||May 30, 2000||Nelik; Jacob||Computer component cooling assembly|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US6527227 *||Aug 16, 2001||Mar 4, 2003||The Boeing Company||Storage compartment with universal mounting capability|
|US6618246||Oct 9, 2001||Sep 9, 2003||General Dynamics Information Systems||Data storage housing|
|US6628521 *||Mar 12, 2001||Sep 30, 2003||Adc Telecommunications, Inc.||Mechanical housing|
|US6671178 *||Aug 16, 2001||Dec 30, 2003||Ciena Corporation||Module housing apparatus|
|US6721173 *||Nov 18, 2002||Apr 13, 2004||Kabushiki Kaisha Toshiba||Electronic apparatus comprising a housing including a hard-disk drive|
|US6762907 *||Jun 7, 2001||Jul 13, 2004||Hewlett-Packard Development Company, L.P.||Disc drive having integral base cooling|
|US6781830||Nov 5, 2002||Aug 24, 2004||Adc Dsl Systems, Inc.||Methods and systems of heat transfer for electronic enclosures|
|US6862180||May 24, 2002||Mar 1, 2005||Adc Dsl Systems, Inc.||Housings for circuit cards|
|US6865085||Sep 26, 2003||Mar 8, 2005||Adc Dsl Systems, Inc.||Heat dissipation for electronic enclosures|
|US6880345 *||Nov 4, 2003||Apr 19, 2005||Intel Corporation||Cooling system for an electronic component|
|US6894907||Jul 31, 2001||May 17, 2005||Adc Telecommunications, Inc.||Clamping case|
|US6897377||Jul 31, 2001||May 24, 2005||Adc Telecommunications, Inc.||Clamping receptacle|
|US6898043||Dec 6, 2002||May 24, 2005||Seagate Technology Llc||Dual stage enclosure for servo track writer utilizing low-density gas|
|US6992249||Apr 5, 2005||Jan 31, 2006||Adc Telecommunications, Inc.||Clamping receptacle|
|US7075789||Sep 29, 2003||Jul 11, 2006||Adc Telecommunications, Inc.||Mechanical housing|
|US7242580 *||Mar 13, 2006||Jul 10, 2007||Hitachi, Ltd.||Disk array apparatus|
|US7259961||Jun 24, 2004||Aug 21, 2007||Intel Corporation||Reconfigurable airflow director for modular blade chassis|
|US7269895||Apr 5, 2005||Sep 18, 2007||Adc Telecommunications, Inc.||Clamping case|
|US7353527||Mar 18, 2005||Apr 1, 2008||Intergraph Hardware Technologies, Co.||Holding apparatus for a storage medium|
|US7399719||Feb 24, 2005||Jul 15, 2008||Vaultstor Corporation||Protection apparatus and methods|
|US7414838 *||Apr 24, 2006||Aug 19, 2008||Hotway Technology Corp.||Heating dissipating structure of an external hard disk drive box|
|US7538973||Mar 24, 2006||May 26, 2009||Hitachi Global Storage Technologies Netherlands B.V.||Method and apparatus for providing a fluid damping structure with fuel cell for a hard disk drive and vibration sensitive electronic devices|
|US7633757||Dec 15, 2009||Adc Dsl Systems, Inc.||Mechanical housing|
|US7703291||Apr 15, 2005||Apr 27, 2010||March Networks Corporation||Contained environmental control system for mobile event data recorder|
|US7778031||Aug 17, 2010||Teradyne, Inc.||Test slot cooling system for a storage device testing system|
|US7848106||Dec 7, 2010||Teradyne, Inc.||Temperature control within disk drive testing systems|
|US7890207||Mar 18, 2010||Feb 15, 2011||Teradyne, Inc.||Transferring storage devices within storage device testing systems|
|US7904211||Mar 8, 2011||Teradyne, Inc.||Dependent temperature control within disk drive testing systems|
|US7908029||Mar 15, 2011||Teradyne, Inc.||Processing storage devices|
|US7911778||Apr 26, 2010||Mar 22, 2011||Teradyne, Inc.||Vibration isolation within disk drive testing systems|
|US7920380||Jul 15, 2009||Apr 5, 2011||Teradyne, Inc.||Test slot cooling system for a storage device testing system|
|US7929303||Apr 19, 2011||Teradyne, Inc.||Storage device testing system cooling|
|US7932734||Apr 26, 2011||Teradyne, Inc.||Individually heating storage devices in a testing system|
|US7940529||Apr 14, 2010||May 10, 2011||Teradyne, Inc.||Storage device temperature sensing|
|US7945424||May 17, 2011||Teradyne, Inc.||Disk drive emulator and method of use thereof|
|US7987018||Mar 18, 2010||Jul 26, 2011||Teradyne, Inc.||Transferring disk drives within disk drive testing systems|
|US7995349||Jul 15, 2009||Aug 9, 2011||Teradyne, Inc.||Storage device temperature sensing|
|US7996174||Dec 18, 2007||Aug 9, 2011||Teradyne, Inc.||Disk drive testing|
|US8031464 *||Sep 8, 2009||Oct 4, 2011||Intergraph Technologies Corporation||Ruggedized computer capable of operating in high-temperature environments|
|US8041449||Oct 18, 2011||Teradyne, Inc.||Bulk feeding disk drives to disk drive testing systems|
|US8050028 *||Oct 26, 2010||Nov 1, 2011||Apple Inc.||Heat dissipation in computing device|
|US8086343||May 29, 2009||Dec 27, 2011||Teradyne, Inc.||Processing storage devices|
|US8095234||Apr 17, 2008||Jan 10, 2012||Teradyne, Inc.||Transferring disk drives within disk drive testing systems|
|US8102173||Jan 24, 2012||Teradyne, Inc.||Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit|
|US8116079||Jun 14, 2010||Feb 14, 2012||Teradyne, Inc.||Storage device testing system cooling|
|US8117480||Apr 17, 2008||Feb 14, 2012||Teradyne, Inc.||Dependent temperature control within disk drive testing systems|
|US8140182||Mar 18, 2010||Mar 20, 2012||Teradyne, Inc.||Bulk feeding disk drives to disk drive testing systems|
|US8144458 *||Jun 13, 2008||Mar 27, 2012||Hewlett-Packard Development Company, L.P.||Component layout in an enclosure|
|US8160739||Apr 17, 2012||Teradyne, Inc.||Transferring storage devices within storage device testing systems|
|US8184439 *||May 22, 2012||Samsung Electronics Co., Ltd.||Semiconductor module|
|US8238099||Apr 17, 2008||Aug 7, 2012||Teradyne, Inc.||Enclosed operating area for disk drive testing systems|
|US8279603||Oct 2, 2012||Teradyne, Inc.||Test slot cooling system for a storage device testing system|
|US8305751||Nov 6, 2012||Teradyne, Inc.||Vibration isolation within disk drive testing systems|
|US8405971||Apr 26, 2010||Mar 26, 2013||Teradyne, Inc.||Disk drive transport, clamping and testing|
|US8451608||Apr 16, 2009||May 28, 2013||Teradyne, Inc.||Temperature control within storage device testing systems|
|US8466699||Jul 15, 2009||Jun 18, 2013||Teradyne, Inc.||Heating storage devices in a testing system|
|US8467180||Apr 23, 2010||Jun 18, 2013||Teradyne, Inc.||Disk drive transport, clamping and testing|
|US8482915||Aug 13, 2010||Jul 9, 2013||Teradyne, Inc.||Temperature control within disk drive testing systems|
|US8547123||Jul 15, 2010||Oct 1, 2013||Teradyne, Inc.||Storage device testing system with a conductive heating assembly|
|US8549912||Dec 18, 2007||Oct 8, 2013||Teradyne, Inc.||Disk drive transport, clamping and testing|
|US8570719 *||Aug 21, 2008||Oct 29, 2013||John D. Brush & Co., Inc.||Fire resistant enclosure for a data storage device having heat sink capabilities and method for making the same|
|US8605426||Sep 23, 2011||Dec 10, 2013||Apple Inc.||Heat dissipation in computing device|
|US8628239||Jul 15, 2010||Jan 14, 2014||Teradyne, Inc.||Storage device temperature sensing|
|US8655482||Apr 17, 2009||Feb 18, 2014||Teradyne, Inc.||Enclosed operating area for storage device testing systems|
|US8687349||Jul 21, 2010||Apr 1, 2014||Teradyne, Inc.||Bulk transfer of storage devices using manual loading|
|US8687356||Feb 2, 2010||Apr 1, 2014||Teradyne, Inc.||Storage device testing system cooling|
|US8712580||Apr 16, 2009||Apr 29, 2014||Teradyne, Inc.||Transferring storage devices within storage device testing systems|
|US8755177 *||Sep 13, 2006||Jun 17, 2014||Xyratex Technology Limited||Method and apparatus for controlling the temperature of a disk drive during manufacture|
|US8773804||Jan 10, 2006||Jul 8, 2014||HGST Netherlands B.V.||Disk drive internal temperature control system|
|US8964361||Aug 23, 2012||Feb 24, 2015||Teradyne, Inc.||Bulk transfer of storage devices using manual loading|
|US9001456||Aug 31, 2010||Apr 7, 2015||Teradyne, Inc.||Engaging test slots|
|US9116674||Oct 16, 2013||Aug 25, 2015||Apple Inc.||Heat dissipation in computing device|
|US20020120732 *||Sep 25, 2001||Aug 29, 2002||Lee Daniel Joseph||Open internet protocol services platform|
|US20020186500 *||Jun 7, 2001||Dec 12, 2002||Patel Chandrakant D.||Disc drive having integral base cooling|
|US20030133260 *||Nov 18, 2002||Jul 17, 2003||Kabushiki Kaisha Toshiba||Electronic apparatus comprising a housing including a hard-disk drive|
|US20030214748 *||Dec 6, 2002||Nov 20, 2003||Seagate Technology Llc||Dual stage enclosure for servo track writer utilizing low-density gas|
|US20030218867 *||May 24, 2002||Nov 27, 2003||Adc Dsl Systems, Inc.||Housings for circuit cards|
|US20040085728 *||Nov 5, 2002||May 6, 2004||Barth Michael K.||Methods and systems of heat transfer for electronic enclosures|
|US20040163552 *||Sep 29, 2003||Aug 26, 2004||Adc Telecommunications, Inc.||Mechanical housing|
|US20050057849 *||Sep 12, 2003||Mar 17, 2005||Randolph Twogood||Encapsulated data storage system|
|US20050068743 *||Sep 26, 2003||Mar 31, 2005||Ferris Matthew D.||Heat dissipation for electronic enclosures|
|US20050091989 *||Nov 4, 2003||May 5, 2005||Leija Javier M.||Cooling system for an electronic component|
|US20050092727 *||Mar 22, 2004||May 5, 2005||Fraley Peter D.||Independent electronics equipment heater using phase width modulation|
|US20050099766 *||Mar 22, 2004||May 12, 2005||Fraley Peter D.||Transportable mass data storage system|
|US20050170681 *||Apr 5, 2005||Aug 4, 2005||Adc Telecommunications, Inc.||Clamping case|
|US20050185366 *||Feb 24, 2005||Aug 25, 2005||Hanan Thomas D.||Protection apparatus and methods|
|US20050191884 *||Apr 5, 2005||Sep 1, 2005||Adc Telecommunications, Inc.||Clamping receptacle|
|US20050201133 *||Feb 10, 2005||Sep 15, 2005||Fujitsu Limited||Storage device unit including cooling device|
|US20050240950 *||Mar 18, 2005||Oct 27, 2005||Karl-Heinz Preis||Holding apparatus for a storage medium|
|US20050286222 *||Jun 24, 2004||Dec 29, 2005||Lucero Christopher D||Reconfigurable airflow director for modular blade chassis|
|US20060072241 *||Sep 30, 2004||Apr 6, 2006||Feliss Norbert A||System, method, and apparatus for a wireless hard disk drive|
|US20060232891 *||Apr 15, 2005||Oct 19, 2006||March Networks Corporation||Contained environmental control system for mobile event data recorder|
|US20060274505 *||Apr 24, 2006||Dec 7, 2006||Hotway Technology Corp.||Heating dissipating structure of an external hard disk drive box|
|US20070030649 *||Mar 29, 2006||Feb 8, 2007||Quanta Computer Inc.||Electronic device|
|US20070171607 *||Mar 13, 2006||Jul 26, 2007||Shigeaki Tanaka||Disk array apparatus|
|US20070223138 *||Mar 24, 2006||Sep 27, 2007||Feliss Norbert A||Method and apparatus for providing a fluid damping structure with fuel cell for a hard disk drive and vibration sensitive electronic devices|
|US20080239564 *||Sep 13, 2006||Oct 2, 2008||Xyratex Technology Limited||Method and Apparatus for Controlling the Temperature of a Disk Drive During Manufacture|
|US20080264610 *||Jul 14, 2008||Oct 30, 2008||Thomas Dixon Hanan||Protection apparatus and methods|
|US20090016010 *||Jun 13, 2008||Jan 15, 2009||Vinson Wade D||Component layout in an enclosure|
|US20100061053 *||Sep 8, 2009||Mar 11, 2010||Intergraph Technologies Company||Ruggedized Computer Capable of Operating in High-Temperature Environments|
|US20110019355 *||Aug 21, 2008||Jan 27, 2011||Cleveland Terri P||Fire Resistant Enclosure for a Data Storage Device Having Heat Sink Capabilities and Method for Making the Same|
|US20110032679 *||Feb 10, 2011||Baek Joong-Hyun||Semiconductor module|
|US20110038120 *||Feb 17, 2011||Apple Inc.||Heat dissipation in computing device|
|US20160135318 *||Nov 10, 2014||May 12, 2016||Julian Benedict Dean||Distributed Data Storage System and Method|
|EP1577895A2 *||Feb 9, 2005||Sep 21, 2005||Z/I Imaging GmbH||Device for supporting a storage medium|
|EP1872369A1 *||Apr 13, 2006||Jan 2, 2008||March Networks Corporation||Contained environmental control system for mobile event data recorder|
|EP1872995A1 *||Jun 25, 2007||Jan 2, 2008||Renk Aktiengesellschaft||Drive for a vehicle, in particular for a track vehicle or a vehicle with lateral wheel guides|
|WO2007031729A1 *||Sep 13, 2006||Mar 22, 2007||Xyratex Technology Limited||Method and apparatus for controlling the temperature of a disk drive during manufacture|
|U.S. Classification||62/3.2, 361/679.36, 361/679.48, 361/679.52, G9B/33.024, G9B/33.036|
|International Classification||F25B21/02, F25B23/00, G11B33/14, G11B33/08|
|Cooperative Classification||F25B21/02, G11B33/1406, G11B33/08, F25B23/006|
|European Classification||G11B33/14B, F25B21/02, F25B23/00C, G11B33/08|
|Aug 16, 1999||AS||Assignment|
Owner name: PHOENIX GROUP, INC., NEW YORK
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:PANDOLFI, RICHARD;REEL/FRAME:010166/0050
Effective date: 19990621
|Feb 23, 2005||FPAY||Fee payment|
Year of fee payment: 4
|Mar 30, 2009||REMI||Maintenance fee reminder mailed|
|Sep 18, 2009||LAPS||Lapse for failure to pay maintenance fees|
|Nov 10, 2009||FP||Expired due to failure to pay maintenance fee|
Effective date: 20090918