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Publication numberUS6344126 B1
Publication typeGrant
Application numberUS 09/662,723
Publication dateFeb 5, 2002
Filing dateSep 15, 2000
Priority dateAug 30, 1999
Fee statusLapsed
Also published asUS6217727, US6830666, US20010009226, US20050092610
Publication number09662723, 662723, US 6344126 B1, US 6344126B1, US-B1-6344126, US6344126 B1, US6344126B1
InventorsScott E. Moore
Original AssigneeMicron Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Electroplating apparatus and method
US 6344126 B1
Abstract
An electroplating apparatus is provided with a metal target and a device for supporting a semiconductor wafer (or other workpiece) in an electroplating solution. The target (anode) may be located relatively far from the wafer surface (cathode) at the beginning of the plating process, until a sufficient amount of metal is plated. When an initial amount of metal is built up on the wafer surface, the target may be moved closer to the wafer for faster processing. The movement of the target may be controlled automatically according to one or more process parameters.
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Claims(41)
What is claimed as new and desired to be protected by Letters Patent of the United States is:
1. A method of electroplating a surface of a semiconductor wafer, said method comprising the steps of:
locating said surface of said semiconductor wafer in an electroplating solution;
using an electrode to electroplate an initial amount of material on said surface of said semiconductor wafer;
subsequently, reducing the distance between said electrode and said surface of said semiconductor wafer; and
subsequently, using said electrode to electroplate an additional amount of material on said surface of said semiconductor wafer.
2. The method of claim 1, further comprising the step of providing a seed layer on said semiconductor wafer.
3. The method of claim 2, further comprising the step of supporting said wafer in said electroplating solution.
4. The method of claim 3, wherein the step of reducing the distance between said electrode and said wafer surface includes the step of moving said electrode toward said semiconductor wafer.
5. The method of claim 3, wherein the step of reducing the distance between said electrode and said wafer surface includes the step of moving said semiconductor wafer toward said electrode.
6. The method of claim 3, further comprising the step of agitating said electroplating solution in the vicinity of said semiconductor wafer surface.
7. The method of claim 3, wherein said electroplating solution contains copper.
8. The method of claim 3, wherein said electroplating solution contains platinum.
9. The method of claim 3, wherein said electroplating solution contains gold.
10. The method of claim 3, wherein said step of reducing the distance between said electrode and said semiconductor wafer surface occurs in response to elapsed time.
11. The method of claim 3, wherein said step of reducing the distance between said electrode and said surface occurs in response to measured characteristics.
12. A method of electroplating a semiconductor workpiece, said method comprising the steps of:
providing a seed layer on said workpiece;
causing a first electrical current to flow through a first length of electroplating solution to electroplate an initial amount of metal on said seed layer; and
causing a second electrical current to flow through a second length of said electroplating solution to electroplate an additional amount of metal on said initial amount of metal, said second length being less than said first length.
13. The method of claim 12, further comprising the step of removing said workpiece from said electroplating solution.
14. The method of claim 13, wherein said currents are applied through contacts, and wherein said contacts are used to support said workpiece in said electroplating solution.
15. The method of claim 14, further comprising the step of using an electrode in said electroplating solution.
16. The method of claim 15, further comprising the step of moving said electrode toward said semiconductor workpiece.
17. The method of claim 16, wherein said moving step occurs subsequent to said step of causing said first electrical current to flow through said electroplating solution.
18. The method of claim 17, wherein said moving step occurs responsive to a measured parameter.
19. The method of claim 18, wherein said measured parameter is elapsed time.
20. The method of claim 18, wherein said measured parameter includes an optical characteristic of said workpiece.
21. The method of claim 17, wherein said moving step occurs responsive to a signal representative of electroplated material on said workpiece.
22. The method of claim 21, further comprising the step of measuring an electrical characteristic of said workpiece.
23. A method of operating an electroplating apparatus, said method comprising the steps of:
locating a semiconductor product in an electroplating solution;
generating a signal correlated to metal electroplated on said semiconductor product; and
in response to said signal, changing the length through which electrical current flows through said electroplating solution.
24. The method of claim 23, further comprising the step of monitoring at least one parameter representative of the metal electroplated on said product.
25. The method of claim 24, wherein said parameter is time.
26. The method of claim 24, wherein said parameter is electrical resistance.
27. The method of claim 24, wherein said parameter is an optical characteristic of said product.
28. The method of claim 24, wherein said parameter is the surface capacitance of said product.
29. The method of claim 24, further comprising the step of measuring the electrical resistance of said product.
30. The method of claim 29, wherein said parameter is the electrical resistance of said semiconductor product.
31. The method of claim 30, wherein said semiconductor product includes at least one integrated circuit.
32. The method of claim 31, further comprising the step of providing a refractory seed layer on said semiconductor product.
33. The method of claim 32, further comprising the step of agitating said electroplating solution.
34. The method of claim 33, wherein said electroplating solution contains copper.
35. The method of claim 33, wherein said electroplating solution contains platinum.
36. The method of claim 33, wherein said electroplating solution contains gold.
37. A method of operating an electroplating apparatus, said method comprising the steps of:
locating a semiconductor product in an electroplating solution;
while said product is located in said electroplating solution, generating a signal correlated to the resistance of said semiconductor product; and
in response to said signal, changing the length through which electrical current flows through said electroplating solution.
38. The method of claim 37, further comprising the step of changing the voltage applied through said electroplating solution.
39. The method of claim 37, further comprising the step of changing the amount of current flowing through said electroplating solution.
40. The method of claim 37, wherein said length is changed in a step-wise manner.
41. The method of claim 37, wherein said length is changed continuously.
Description

This is a divisional of U.S. patent application Ser. No. 09/385,381, filed Aug. 30, 1999, the entire disclosure of which is incorporated herein by reference now U.S. Pat. No. 6,217,727.

FIELD OF THE INVENTION

The present invention relates to a system for electroplating the surfaces of semiconductor wafers and other workpieces. More particularly, the present invention relates to an electroplating apparatus and method that achieves improved performance with respect to thickness uniformity and rate of metal deposition.

BACKGROUND OF THE INVENTION

It is known to electroplate the surfaces of semiconductor wafers. It has been difficult, however, to obtain an electroplated layer of uniform thickness. It has been especially difficult to achieve the desired thickness uniformity at a high rate of metal deposition. Known systems for electroplating semiconductor products are described in U.S. Pat. No. 5,833,820 (Dubin), U.S. Pat. No. 5,670,034 (Lowery), U.S. Pat. No. 5,472,592 (Lowery), and U.S. Pat. No. 5,421,987 (Tzanavaras).

SUMMARY OF THE INVENTION

The present invention relates to an apparatus for electroplating a semiconductor product. The apparatus includes a support device for supporting the product in an electroplating solution, an electrical circuit for applying an electrical potential across the electroplating solution, and a control device for reducing the current distance to the product through the solution after an initial amount of conductive material is electroplated on the product surface. The semiconductor product may be, for example, a semiconductor wafer or chip. Integrated circuits may be formed in the product if desired.

According to one aspect of the invention, the support device includes conductive contacts. The contacts may be used to connect the product to the electrical circuit.

According to another aspect of the invention, the control device includes a mechanism for moving a metal target (anode) toward the electroplated product. In an alternative embodiment of the invention, the product may be moved toward the anode.

According to another aspect of the invention, a processor is used to operate the control device in response to data correlated to the electroplating process. The input data may be functionally related or correlated to elapsed electroplating time, the resistance of the product in the electroplating solution, the optical characteristics of the product, the surface capacitance of the product, etc.

The present invention also relates to a method of electroplating the surface of a semiconductor wafer. The method includes the steps of using an electrode to electroplate an initial amount of conductive material on the wafer surface, then changing the distance between the electrode and the wafer surface, and then using the electrode to electroplate an additional amount of material on the wafer surface. According to a preferred embodiment of the invention, at the start of the process, while the resistance of the wafer is significant, thickness uniformity is promoted by locating the target far from the wafer. Then, when the wafer resistance is reduced by the initial amount of electrodeposited metal, higher plating efficiency may be obtained by moving the target closer to the wafer.

According to another aspect of the invention, the wafer may be provided with a refractory seed layer. The seed layer contains metal and adheres to the semiconductor wafer material. The resistance of the seed layer is greater than that of the electrodeposited metal.

Thus, according to a preferred embodiment of the invention, a metal target (anode) is located relatively far from the wafer (cathode) at the beginning of the plating process, until a sufficient amount of metal is plated on the wafer surface. Once the metal is built up on the wafer surface, the target is moved closer to the wafer for faster processing.

As explained in more detail below, before the metal is built up on the wafer surface, the high resistance of the seed layer is a significant factor. The electrical potential near the contacts on the edges of the wafer is greater than the potential at die center of the wafer. Consequently, according to the invention, the target and the wafer are separated from each other to increase the resistance of the electroplating solution (the bath). A relatively high bath resistance mutes the significance of the potential difference in the radial direction of the wafer. Metal built up on the wafer surface has less resistance than the seed layer, such that the difference in potential across the surface of the wafer becomes less significant. Eventually, the target can be moved closer to the wafer (to reduce the bath resistance and increase the deposition rate) without impairing plating uniformity.

These and other features and advantages of the invention will become apparent from the following detailed description of preferred embodiments of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an electroplating apparatus constructed in accordance with a preferred embodiment of the present invention.

FIG. 2 is another cross-sectional view of the electroplating apparatus of FIG. 1, showing the apparatus at a subsequent stage of operation.

FIG. 3 is a cross-sectional view of an electroplating apparatus constructed in accordance with another preferred embodiment of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Referring now to the drawings, where like reference numerals designate like elements, there is shown in FIG. 1 an electroplating apparatus 10 constructed in accordance with a preferred embodiment of the present invention. The apparatus 10 has a tank 12 containing electroplating solution 14, a wafer support 16 for supporting a wafer 18 in the solution 14, and a metal target (anode) 20. The wafer support 16 may have metal clips 22, 24 for holding the wafer 18 in the desired position. An electrically conductive seed layer 26 may be formed on the wafer surface 28. The seed layer 26 may be electrically grounded through the clips 22, 24 and suitable wires 30.

In operation, voltage is applied to the target 20 by a control device 32. The electrical potential causes current to flow from the target 20, through the solution 14, through the seed layer 26, and through the clips 22, 24 to the grounding wires 30. The electroplating process causes a metal layer 34 (FIG. 2) to form on the seed layer 26. The process may be continued until the metal layer 34 achieves the desired thickness. The electroplated wafer 18 may then be removed from the tank 12 for further processing.

The rate at which metal 34 is deposited on the wafer surface 28 is proportional to the combined resistance of the solution 14 and the seed layer 26, as follows:

I=A/(R 1 +R 2),

where I is the metal deposition rate, A is a constant, R1 is the resistance of the solution 14, and R2 is the resistance of the wafer 18. The solution resistance R1 depends on (1) the distance D between the target 20 and the wafer surface 28 and (2) the conductivity of the solution 14. For any particular point on the wafer surface 28, the wafer resistance R2 depends on (1) the distance from that point to the electrical contacts 22, 24 and (2) the conductivity of the wafer 18.

At the start of the electroplating process (that is, before any metal 34 is formed on the seed layer 26), the wafer resistance R2 is a significant factor with respect to the deposition rate I. The resistance of the seed layer 26 may be substantial. Consequently, at the start of the process, the value of R2 may vary substantially as a function of radial position on the wafer 18. That is, the value of R2 would tend to increase as distance increases from the clips 22, 24. To mute the significance of the wafer resistance R2 and to thereby improve the thickness uniformity of the initially deposited metal 34, the target 20 initially may be located relatively far from the wafer 18 (FIG. 1). As the conductive metal 34 is formed on the seed layer 26, the wafer resistance R2 becomes much less significant relative to the solution resistance R1. After the initial amount of metal 34 is formed on the wafer 18, the target may be moved closer to the wafer 18 to reduce the solution resistance R1 and to increase the deposition rate I.

The target 20 may be moved by a suitable mechanism 36 controlled by the control device 32. In an alternative embodiment of the invention, shown in FIG. 3, the wafer 18 may be moved closer to the target 20. In another alternative embodiment, (not shown) more than one anode may be employed—one relatively far away from the wafer 18 to form the initial amount of metal on the wafer 18 and the other located relatively close to the wafer 18 to form the rest of the metal layer 34 at a relatively high deposition rate.

The control device 32 (FIG. 2) may be operated by a suitable microprocessor 38 or the like. Signals 40 may be input to the processor 38 representative of elapsed electroplating time, the measured resistance of the wafer 18, the optical characteristics (e.g., reflectivity) of the wafer 18, and/or the surface capacitance of the wafer 18. The input signals 40 may be generated by a suitable input device 42, such as a clock or a suitable measuring device. The resistance of the wafer 18 may be determined by measuring the voltage between the contacts 22, 24. The bulk resistance of the wafer 18 also may be determined off-line, for example, by a four-point probe device (not shown).

The processor 38 may have a look-up table and/or an algorithm that correlates elapsed electroplating time to metal thickness and/or deposition rate for known solutions 14 and target positions. Feedback signals 46 representative of the position of the target 20 (and/or the distance D between the target 20 and the wafer 18) may be provided to the processor 38 by the controller 32. The processor 38 may be programmed to send operating signals 44 to the controller 32 to automatically move the target 20 closer to the wafer 18 when a predetermined amount of metal 34 is formed on the seed layer 26.

The motion of the target 20 toward the wafer 18 may be continuous or gradual, and, the motion may be programmed to optimize plating efficiency while achieving the desired uniformity. In an alternative embodiment of the invention, the target 20 may be moved in a stepwise fashion toward the wafer 18 at a predetermined time in the process or when a predetermined amount of metal 34 is determined to have been formed on the wafer 18.

In a preferred embodiment of the invention, the target 20 may be located about five centimeters from the wafer surface 28 in the start position (FIG. 1), and about one to two centimeters in the high efficiency plating position (FIG. 2). The present invention should not be limited, however, to the preferred embodiments described and illustrated in detail herein.

The solution 14 may be arranged to deposit copper, platinum, gold or another suitable material on the wafer 18. The seed layer 26 may be formed by a known chemical vapor deposition (CVD) process. The seed layer 26 may be, for example, a refractory and metal composite material that adheres to the wafer surface 28. The metal component of the seed layer 26 may be the same as or different than the plated metal material 34.

If desired, the tank 12 may be provided with a cascade structure (not shown) to ensure that fresh solution 14 is made available to the wafer (cathode) 18. Other suitable means, such as a diffuser or baffle plate, for agitating and flowing the solution 14 against the wafer 18 may be employed, if desired. Although the tank 12 is shown with only one support device 16, the invention may be employed with more than one support device 16 per tank 12. If desired, a number of wafers 18 may be electroplated in the same solution 14 simultaneously. Suitable electrodes 20, 22, 24 may be provided for each wafer 18.

The above descriptions and drawings are only illustrative of preferred embodiments which achieve the features and advantages of the present invention, and it is not intended that the present invention be limited thereto. Any modification of the present invention which comes within the spirit and scope of the following claims is considered part of the present invention.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US3746633Mar 26, 1971Jul 17, 1973Nippon Kokan KkApparatus for electroplating workpieces including means to vary the position of the workpieces
US3887452Oct 31, 1972Jun 3, 1975Hitachi LtdOptimum electroplating plant control device
US4098666Aug 18, 1975Jul 4, 1978Olin CorporationApparatus for regulating anode-cathode spacing in an electrolytic cell
US4287043Feb 13, 1980Sep 1, 1981Siemens AktiengesellschaftApparatus for electrodepositing a metallic layer of predetermined thickness
US4497695Feb 16, 1983Feb 5, 1985Mitsubishi Denki Kabushiki KaishaPlating current automatic switching method and apparatus
US5421987Aug 30, 1993Jun 6, 1995Tzanavaras; GeorgePrecision high rate electroplating cell and method
US5472592Jul 19, 1994Dec 5, 1995American Plating SystemsElectrolytic plating apparatus and method
US5670034Jun 17, 1996Sep 23, 1997American Plating SystemsReciprocating anode electrolytic plating apparatus and method
US5833820Jun 19, 1997Nov 10, 1998Advanced Micro Devices, Inc.Electroplating apparatus
US6217727 *Aug 30, 1999Apr 17, 2001Micron Technology, Inc.Electroplating apparatus and method
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6830666 *Mar 21, 2001Dec 14, 2004Micron Technology, Inc.Electroplating apparatus and method
US6861355Aug 29, 2002Mar 1, 2005Micron Technology, Inc.Metal plating using seed film
US6979165Nov 12, 2002Dec 27, 2005Fsi International, Inc.Reduced footprint tool for automated processing of microelectronic substrates
US7122105Oct 24, 2002Oct 17, 2006Enpirion, Inc.Use of siderophores to increase the current efficiency of iron plating solutions
US7134827Sep 28, 2004Nov 14, 2006Fsi International, Inc.Reduced footprint tool for automated processing of microelectronic substrates
US7144489Oct 24, 2002Dec 5, 2006Enpirion, Inc.Photochemical reduction of Fe(III) for electroless or electrodeposition of iron alloys
US7189611Feb 9, 2005Mar 13, 2007Micron Technology, Inc.Metal plating using seed film
US7262132Feb 9, 2005Aug 28, 2007Micron Technology, Inc.Metal plating using seed film
US7759187Nov 21, 2006Jul 20, 2010Micron Technology, Inc.Metal plating using seed film
US8431240Jun 17, 2010Apr 30, 2013Micron Technology, Inc.Metal plating using seed film
US8734957Dec 21, 2012May 27, 2014Micron Technology, Inc.Metal plating using seed film
Classifications
U.S. Classification205/123, 205/157, 205/266, 205/291, 205/264
International ClassificationC25D7/12, C25D21/12
Cooperative ClassificationC25D7/123, C25D17/001, C25D21/12
European ClassificationC25D7/12, C25D21/12
Legal Events
DateCodeEventDescription
Jul 13, 2005FPAYFee payment
Year of fee payment: 4
Jul 8, 2009FPAYFee payment
Year of fee payment: 8
Sep 13, 2013REMIMaintenance fee reminder mailed
Feb 5, 2014LAPSLapse for failure to pay maintenance fees
Mar 25, 2014FPExpired due to failure to pay maintenance fee
Effective date: 20140205