US6782026B2 - Semiconductor laser structure and method of manufacturing same - Google Patents
Semiconductor laser structure and method of manufacturing same Download PDFInfo
- Publication number
- US6782026B2 US6782026B2 US10/206,833 US20683302A US6782026B2 US 6782026 B2 US6782026 B2 US 6782026B2 US 20683302 A US20683302 A US 20683302A US 6782026 B2 US6782026 B2 US 6782026B2
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- laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/06226—Modulation at ultra-high frequencies
Definitions
- the present invention refers to semiconductor lasers and, more specifically, to semiconductor laser structures including a substrate and an active laser layer, and to a method of making same.
- FIG. 1 Exemplary of a prior art semiconductor laser including a substrate and an active laser layer, is the arrangement shown in FIG. 1, which is currently referred to as a Semi-Insulating Buried Heterojunction (SIBH) structure.
- SIBH Semi-Insulating Buried Heterojunction
- FIG. 1 is a cross section view including the mesa definition of an SIBH laser, including an n-type substrate 1 defining a mesa like structure laterally confined by an Fe—InP semi-insulating layer 2 .
- Multiple quantum well (MQW) active (i.e. lasing) layers 3 are covered by p layer 4 , in turn covered by SiO 2 mask 5 .
- an n-InP layer 6 is superposed onto the Fe—InP semi-insulating layers 2 and adjoins the sides of mask 5 as an anti-diffusion layer to prevent Zn—Fe interdiffusion.
- MQW multiple quantum well
- SIBH-DFB Distributed Feed Back
- High speed systems such as 10 Gbit/s Ethernet systems require uncooled laser sources capable of high temperature operation (above 80-90° C.) as well as fast direct modulation behaviour. To achieve this, laser structures with low leakage currents together with low parasitics are strongly required.
- Semi-insulating blocking layers (usually InP:Fe) are another possible solution, leading to a notable reduction of parasitics (capacitance values smaller than 1 pF have been demonstrated) and leakage currents at room temperature.
- a disadvantage of these prior art structures is leakage currents at high temperatures, due to the significant reduction in resistivity of the material with temperature; this may be about two orders of magnitude between 20 and 100° C.
- an optical semiconductor device comprising a stripe-mesa structure provided on a semi-insulating substrate.
- the stripe-mesa structure comprises an undoped light absorption layer sandwiched by cladding layers and by burying layers on both sides. This structure aims at reducing device capacitance to provide wide bandwidth and ultra-high operation properties.
- An object of the present invention is to satisfy such a need.
- such an object is achieved with a laser structure having an active region with at least one active layer, wherein the active region is in a ridge protruding from an exposed surface of a substrate carrying the region.
- Another aspect of the invention relates to making such a laser structure by growing plural layers forming the active region including the at least one active layer over the substrate, and selectively removing at least part of the layers grown on the substrate to produce an exposed face and a ridge that protrudes from the exposed surface of said substrate, whereby said active region is included in the ridge.
- leakage current is reduced by etching the laser structure to form the ridge that closely surrounds (about 10 micrometers away) the active region, thus reducing currents flowing in a lateral confinement layer.
- These currents are caused by recombination of carriers in the Fe-doped layer and by defects intrinsic to the technological process.
- the reduced lateral area of the device thus obtained also leads to a reduction of parasitic capacitance, typically from 6 pF to less than 2 pF (as required by a typical IC driver), while providing bonding pads large enough for accommodating two 50 micrometers tape or wire bonding arrangements.
- two bonding pads are longitudinally distributed or staggered along the ridge formation i.e. the active region or cavity of the laser device. Consequently, the laser structure is suitable for very high speed applications (in the 40 Gbit/s range), where modulation transit time plays a significant role.
- FIG. 1 related to the prior art, has been already described in the foregoing,
- FIGS. 2 to 6 are schematic drawings of subsequent steps in the manufacturing process of a semiconductor laser structure according to a preferred embodiment of the invention.
- FIG. 7 is a perspective view of a low parasitic capacitance laser structure according to a preferred embodiment of the invention.
- FIGS. 2 to 6 parts and components of a SIBH-DFB semiconductor laser structure which are identical or functionally equivalent to those already described in connection with FIG. 1 are designated by the same reference numerals appearing in FIG. 1 .
- FIGS. 2 to 4 are drawings of some standard regrowth steps which are typical of processes for manufacturing SIBH structures according to the general prior art arrangement shown in FIG. 1 .
- FIG. 2 a p layer 7 and an InGaAs layer 8 have been grown over layers 4 and 6 .
- a contact window in the InGaAs layer is defined as shown in FIG. 3 by using a photoresist 10 as a mask. After removing the mask, a SiO 2 layer 9 is deposited by plasma enhanced chemical vapour deposition (PECVD), a contact window is opened and a Ti—Au metallization layer 11 is evaporated on the upper faces of layers 8 and 9 with a thickness compatible with a following etching step (see FIG. 4 ).
- PECVD plasma enhanced chemical vapour deposition
- the p metal pattern is defined by conventional photolithography using a positive photoresist.
- the metals can be finally defined as shown in FIG. 5 by selective wet chemical etching, using the photoresist mentioned above as a mask.
- ridge 12 is formed by etching the structure including layers 2 - 4 , 6 - 9 and 11 down to the substrate 1 by using e.g. standard Reactive Ion Etching or wet chemical etching. After the photoresist 10 is removed, final passivation and contact window opening steps are then performed in a conventional manner.
- the final result thus obtained essentially leads to the active MQW layers of the laser structure being included in a ridge formation 12 protruding from a front, exposed (upper) surface 1 a of substrate 1 .
- the structure thus obtained is essentially parallel to the standard mesa structure of an SIBH laser, having been included in an outer mesa structure, thus leading to a sort of a general “mesa-in-the-mesa” structure.
- Typical values of the “width” (designated A in FIG. 6) of ridge formation 12 are in the range of 10 to 15 micrometers while the homologous dimension (designated B in FIG. 7) of the laser chip i.e. the substrate 1 , is in the range of 200 micrometers.
- the overall length of the laser chip (designated C in FIG. 7) substantially corresponds to the length of the laser cavity and is thus in the range of 300 micrometers.
- ridge structure 12 is shaped in plan view so metallization layer 11 forms metal bonding area 13 including at least one and preferably two bonding pads 14 and 15 .
- a portion of metal bonding area 13 referred to as link 16 , extends sidewise of ridge structure 12 to join pads 14 and 15 .
- Area 13 is preferably arranged to have a general “double-L” configuration as illustrated, but can also have an “S-shape” or “asymmetrical-butterfly” shape.
- Opposed bonding areas, such as pads 14 and 15 are distributed or staggered along the top of the laser structure, but do not contact semi-insulating layer 2 or substrate 1 .
- the presence of two bonding areas, such as pads 14 and 15 , distributed along the active laser stripe is beneficial in reducing modulation transit time.
- the structure of FIG. 7 is thus particularly suitable for very high speed applications (e.g. in the 40 Gbit/s range).
- the asymmetric pad configuration shown in FIG. 7 with bonding pads 14 and 15 located at opposite sides of the laser active stripe 3 is advantageous in that it allows two wire bonding towards the IC driver from both left and/or back sides of the laser.
- a high frequency signal source e.g., in the 40 Gbit/s range, is connected to the two wire bonds connected to pads 14 and 15 .
- the preferred embodiment shown in the drawings provides an excellent compromise in terms of the number of pads and the need to keep parasitic capacitance as low as possible depending on the IC characteristics.
- the length of link 16 (designated L in FIG. 7) between the adjacent, facing edges of pads 14 and 15 in the direction of the laser cavity can be set to a very low value (virtually to zero) in order to reduce the overall length C of the laser structure.
- the dimension L can however be optimised according to the laser cavity length.
- W denotes the lateral dimension (i.e. the length) of each of pads 14 and 15 (see FIG. 7 ).
- a preferred value of the distance L is about 70 micrometers which allows a uniform distribution of the microwave field.
Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01306520.6 | 2001-07-30 | ||
EP01306520A EP1282208A1 (en) | 2001-07-30 | 2001-07-30 | Semiconductor laser structure and method of manufacturing same |
EP01306520 | 2001-07-30 |
Publications (2)
Publication Number | Publication Date |
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US20030021321A1 US20030021321A1 (en) | 2003-01-30 |
US6782026B2 true US6782026B2 (en) | 2004-08-24 |
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US10/206,833 Expired - Lifetime US6782026B2 (en) | 2001-07-30 | 2002-07-29 | Semiconductor laser structure and method of manufacturing same |
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US (1) | US6782026B2 (en) |
EP (1) | EP1282208A1 (en) |
JP (1) | JP4335500B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003338664A (en) * | 2002-05-20 | 2003-11-28 | Mitsubishi Electric Corp | Semiconductor device |
JP2010272784A (en) * | 2009-05-25 | 2010-12-02 | Panasonic Corp | Semiconductor laser device |
Citations (22)
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US4516243A (en) * | 1981-10-29 | 1985-05-07 | Kokusai Denshin Denwa Kabushiki Kaisha | Distributed feedback semiconductor laser |
US4675074A (en) * | 1984-07-31 | 1987-06-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing semiconductor device |
US4731790A (en) * | 1984-03-16 | 1988-03-15 | Hitachi, Ltd. | Semiconductor laser chip having a layer structure to reduce the probability of an ungrown region |
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US5972730A (en) * | 1996-09-26 | 1999-10-26 | Kabushiki Kaisha Toshiba | Nitride based compound semiconductor light emitting device and method for producing the same |
US6052397A (en) * | 1997-12-05 | 2000-04-18 | Sdl, Inc. | Laser diode device having a substantially circular light output beam and a method of forming a tapered section in a semiconductor device to provide for a reproducible mode profile of the output beam |
US6058125A (en) * | 1996-01-27 | 2000-05-02 | Nortel Networks Corporation | Semiconductor lasers |
US6134368A (en) * | 1996-08-30 | 2000-10-17 | Nec Corporation | Optical semiconductor device with a current blocking structure and method for making the same |
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JPH02164089A (en) * | 1988-12-19 | 1990-06-25 | Nec Corp | Semiconductor laser element |
JPH03206678A (en) * | 1990-01-08 | 1991-09-10 | Nec Corp | Semiconductor laser |
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2001
- 2001-07-30 EP EP01306520A patent/EP1282208A1/en not_active Withdrawn
-
2002
- 2002-07-23 JP JP2002213798A patent/JP4335500B2/en not_active Expired - Fee Related
- 2002-07-29 US US10/206,833 patent/US6782026B2/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
EP1282208A1 (en) | 2003-02-05 |
JP4335500B2 (en) | 2009-09-30 |
JP2003115638A (en) | 2003-04-18 |
US20030021321A1 (en) | 2003-01-30 |
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