US6806723B2 - Contactor having contact electrodes formed by laser processing - Google Patents
Contactor having contact electrodes formed by laser processing Download PDFInfo
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- US6806723B2 US6806723B2 US10/369,705 US36970503A US6806723B2 US 6806723 B2 US6806723 B2 US 6806723B2 US 36970503 A US36970503 A US 36970503A US 6806723 B2 US6806723 B2 US 6806723B2
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- contact electrode
- laser beam
- contact
- laser
- manufacturing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/07—Non contact-making probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Definitions
- the present invention generally relates to contactors for testing electronic devices and, more particularly, to a contactor having contact electrodes which make a contact with terminals of an electronic device such as a semiconductor substrate (wafer) or a wiring board so as to perform an electrical test on the electronic device.
- a contactor having contact electrodes which make a contact with terminals of an electronic device such as a semiconductor substrate (wafer) or a wiring board so as to perform an electrical test on the electronic device.
- LSI large-scaled integrated circuit chip
- LSI chip used by SIP (System In Package) may attain a pitch of about 20 ⁇ m.
- the thickness of LSI chips has been rapidly reduced from, for example, 500 ⁇ m to 100 ⁇ m, 50 ⁇ m or even 25 ⁇ m. Accordingly, the following subjects are imposed also to contactors (probes) used for testing such an LSI chip.
- the area array type LSI has been increasing as arrangement of LSI terminals (terminals are arranged like a lattice over the whole area of LSI chip), and the contactor must correspond to the area array type LSI. That is, not only the conventional peripheral type LSI (terminals are arranged in the periphery of an LSI chip) but also the area array type LSI (terminals are arranged like a lattice over the whole area of an LSI chip) has been increasing, and a contact probe used for such an area array type LSI must have a higher density of electrodes than a probe for the peripheral type LSI. Thus, generally it is difficult to arrange and form the needles of the contactor.
- probe card systems There are two kinds of probe card systems.
- A Cantilever System (for peripheral type)
- the cantilever system is a mainstream system in wafer probe cards.
- ends (unbent side) of rod-like conductive members (needles) having bent ends are joined to terminals of a wiring board so that the bent ends of the rod-like members are pressed manually using an elongated tool so as to locate the bent ends within a desired range of position accuracy.
- the pitch of the ends on the wiring board side tends to be larger than that of the chip contact (needle tip)
- a pitch of about 45 ⁇ m is a limit since it is difficult to attain a positional accuracy of the needle tips (XY accuracy: less than ⁇ 5 ⁇ m).
- the final adjustment of the position of the needle tips is carried out by a small displacement by mechanical contact pressurization.
- the needle tip accuracy ⁇ 10 ⁇ m
- the distance between the needles is so small that a tool for position adjustment cannot be inserted.
- the applicants considered manufacturing a contactor suitable for a purpose of a prove by deforming needles or pins of the contactor using a laser bending technique.
- Many materials used for needles of a probe card especially in 3) are special materials, and metal materials (a tungsten alloy such as tungsten or tungsten rhenium) having a high hardness and a high melting point are mainly used.
- metal materials a tungsten alloy such as tungsten or tungsten rhenium
- a large energy must be applied to a part to be deformed until the part becomes a temperature at which the part is in a melted or half-melted state (when heat radiation to atmosphere is taken in consideration).
- probe needles have a rod-like shape, and their surfaces to which a laser is irradiated are curved surfaces. For this reason, relationships between an amount of laser irradiation and each of a displacement and a direction of displacement were hardly predicted, and it was difficult to displace the probe needles to target positions.
- probe needles have a configuration in which a diameter decreases toward an end thereof, and, thus, a radius of curvature varies in response to a distance from a needle tip, which makes it difficult to positively displace with one's aim.
- a more specific object of the present invention is to provide a manufacturing method of a contactor in which contact electrodes having a predetermined shape are formed by irradiating a laser beam onto the contact electrodes that are formed of a conductive material.
- a manufacturing method of a contactor for making a contact with electrodes of an electronic component comprising a step of forming at least one contact electrode by irradiating a laser beam onto the contact electrode made of a conductive material so as to deform the contact electrode in a predetermined shape.
- the contact electrode of the contactor can be deformed not by mechanical processing but in a non-contact manner.
- a contactor having many contact electrodes arranged at a small pitch can be easily produced without physical restriction due to mechanical processing.
- the step of forming the contact electrode may include a step of irradiating a laser beam, after joining an end of the contact electrode opposite to a contact end to a contact board, so as to deform said contact electrode so that the contact end is located at a predetermined position. Additionally, the laser beam may be irradiated while heating or cooling a portion of the contact electrode opposite to a portion onto which the laser beam is irradiated.
- a plurality of the contact electrodes may be attached to a contactor board in an aligned and upright state, and thereafter the laser beam may be irradiated onto one of the contactor electrodes located at an end of a row in an upper oblique direction so as to bend the one of the contactor electrodes in the laser irradiating direction, and, then, the laser beam may be irradiated onto an adjacent contact electrode in the same row in the same direction as the direction of the laser beam irradiated onto the one of the contact electrodes located at the end of the row so as to bend the adjacent one of the contact electrodes, and repeats the laser irradiation until all of said contact electrodes are bent.
- a plurality of the contact electrodes may be attached to a contactor board, and, thereafter, the laser beam may be irradiated onto each of the contact electrodes in a state in which the contactor electrodes are pressed against a flat plate to deform the contact electrodes, thereby aligning ends of the contact electrodes at the same level.
- a contactor for making a contact with electrodes of an electronic component comprising: a contactor board; and at least one contact electrode having a portion deformed by laser processing.
- the contact electrode may have a flat portion, and the contact electrode may be deformed by a laser beam irradiated onto the flat portion. additionally, the contact electrode may have a center portion made of a first conductive material, the second conductive material having a melting point and a hardness higher than that of the first conductive material.
- a method of repairing a contact electrode of a probe card in a non-contact manner comprising the step of irradiating a laser beam onto the contact electrode, which has been deformed, so as to restore the contact electrode in an original shape before deformation.
- the deformed contact electrode can be restored to an original shape by only irradiating a laser beam, and, therefore, the contactor can be continuously used.
- a prober for testing an electronic component comprising: a probe card having at least one contact electrode; a placement stage on which a test material is placed, the test material being contacted by the contact electrode of the probe card; and a laser irradiating unit attached to the placement stage, wherein when said contact electrode is deformed, a laser beam is irradiated by the laser irradiating unit so as to deform the contact electrode, thereby restoring an original shape before deformation.
- the deformed contact electrode ca be repaired on the prober. Additionally, there is no need to provide separately a repair apparatus.
- FIGS. 1A and 1B are illustrations for explaining bending of a contact electrode according to a basic idea of the present invention
- FIGS. 2A and 2B are illustrations for explaining a laser-bending process in a state in which a contact electrode is attached to a board;
- FIGS. 3A and 3 b are illustrations for explaining a method of positional correction of the end of a slanting contact electrode by laser processing
- FIGS. 4A through 4D are illustrations for explaining a method of adjusting a position of the end of the contact electrode finally by laser processing after bending the end of the contact electrode in some degrees in the example shown in FIG. 3;
- FIG. 5 is an illustration for explaining a method of generating a high-temperature processing strain in a contact electrode
- FIG. 6 is an illustration for explaining a method of generating a high-temperature processing strain in a contact electrode
- FIG. 7 is an illustration for explaining a wavelength of a laser bream
- FIG. 8 is an illustration showing an example of irradiating a laser beam, converged by a lens, onto the contact electrode;
- FIG. 9 is an illustration showing an example which irradiates a laser while heating a contact electrode
- FIG. 10 is an illustration showing an example which controls the temperature of a contact electrode by a fluid
- FIG. 11 is an illustration for explaining an example which speeds up laser bending
- FIG. 12 is an illustration showing an example which performs a reverse-direction bending
- FIG. 13 is a perspective view of a contact electrode having a laser-irradiated portion formed as a flat surface
- FIG. 14 is a perspective view of a contact electrode having a flat surface to correct a position of an end of the contact electrode which is previously bent:
- FIG. 15 is a perspective view of the conductive electrode shown in FIG. 14 which is provided with a plurality of flat surfaces;
- FIG. 16 is a cross-sectional view of the contact electrode shown in FIG. 15 taken along a portion provided with the flat surfaces;
- FIG. 17 is cross-sectional view of the contact electrode shown in FIG. 14 which is provided with a plurality of flat surfaces in different positions;
- FIG. 18 is a perspective view showing an example in which a contact electrode is formed of a plate material
- FIG. 19 is an illustration for explaining a condition of laser irradiation to a contact electrode having a rod shape
- FIG. 20 is a cross-sectional view of a contact electrode having a central part and a peripheral part formed by different conductive materials
- FIGS. 21A and 21B are illustrations for explaining a method of forming a probe for an area array by laser bending
- FIG. 22 is an illustration for explaining an example of a method of making the contact electrodes in the same height
- FIG. 23 is an illustration for explaining another example of the method of making the contact electrodes in the same height
- FIG. 24 is a side view showing a basic structure of a wafer prober
- FIG. 25 is a side view of a chuck top table provided with a laser irradiation unit
- FIG. 26 is a side view of a variation of the chuck top table shown in FIG. 25.
- FIG. 27 is a side view of another variation of the chuck top table shown in FIG. 25 .
- the present invention provides a highly accurate bending process using laser irradiation to a probe needle, and enables laser processing or working applicable to processing of a probe needle by the following method. It should be noted that, the following items 1)-4) correspond to 1)-4) of the subject when the above-mentioned conventional laser technique is applied to processing of a probe.
- the energy to be received is maximum in a well-focused state, and the energy to be received decreases in response to the distance when the distance is changed from the well-focused state. (It is in inverse proportion to the square of distance.)
- Bend occurs normally toward the irradiation side, however, bending toward a side opposite to the irradiation side can be achieved by varying the energy efficiency of the laser beam to irradiate.
- the approaches of (3) and (4) can achieve the inversion of the direction in bending easier than when the approach of (1) or (2) is carried out sorely.
- the bending direction depends on a balance between a force to return to an original shape when receiving a small energy since a working strain remains in a portion mechanically bent at a high temperature, a state where a tension stress and a compression stress are opposed to each other is maintained, or a tension strain remains.
- the deformation rate according to laser irradiation can raise efficiency by providing a peculiar wavelength and pulse width to the material.
- a laser having a long wavelength, which can obtain a large amount of heat, is preferable for the conditions of the laser which is irradiated onto a tungsten alloy such as tungsten or tungsten rhenium.
- tungsten alloy such as tungsten or tungsten rhenium.
- a correspondence table may be prepared for an amount of offset and a deformation rate for each radius of curvature, or it may be useful to irradiate a laser beam with multiplication of a correction factor when an amount of offset is input.
- FIGS. 1A and 1B are illustrations for explaining bending of a contact electrode according to a basic idea of the present invention.
- the contact electrode By irradiating a laser beam onto a portion of a needle-like conductive material 1 A which turns to a contact electrode 1 as shown in FIG. 1A, the contact electrode, which is bent toward the laser irradiation side, can be formed as shown in FIG. 1 B.
- the laser beam may be irradiated onto a portion of the contact electrode to be bent a plurality of times along the direction of width, or the laser beam may be irradiated by being scanned in the direction of width.
- the above-mentioned laser processing is a processing method using a melted deformation which occurs when the material solidifies by being cooled after the laser irradiated surface is heated and turn to a half-melted state. There is less influence than a bending process according to normal mechanical processing (bending, pressing), and a contact electrode 1 having an excellent spring characteristic.
- the contact electrode is deformed in a predetermined shape.
- shape means the configuration of the electrode which is accurately bent by a laser beam, and also means the configuration of the end of the contact electrode obtained after a laser beam is irradiated onto the previously shaped contact electrode so as to accurately adjust the position of the end of the contact electrode.
- the root of the contact electrode 1 is joined to a contactor substrate 2 as shown in FIG. 2 B.
- the contact electrode 1 having a desired shape can be formed by bending by irradiating a laser beam onto the conductive material 1 A after joining the conductive material 1 A to the contactor board 2 as shown in FIG. 2 A. Additionally, the position of an end 1 a (a contacting portion) of the contact electrode 1 can be corrected by irradiating a laser beam.
- the conductive material 1 A is made of tungsten or a tungsten alloy including tungsten rhenium. Moreover, the conductive material 1 A may be made of an alloy including a platinum group metal such as platinum (Pt) or palladium (Pd).
- FIGS. 3A and 3B are illustrations for explaining a method of positional correction of the end of a slanting contact electrode by laser processing.
- the contact electrode 1 shown in FIG. 3A is bent beforehand at the root thereof, and is attached to the contactor board 2 in the state where it inclined to the contactor substrate 2 .
- the contact electrode 1 is brought into contact elastically due to an elasticity given by slanting, in the state shown in FIG. 3A, the positional accuracy of the end 1 a of the contact electrode 1 is low and cannot make a contact with a terminal 3 a of an LSI 3 which is an object to be contacted.
- a laser beam is irradiated near the end of the contact electrode 1 so as to perform a bending process so that the end 1 a is aligned with the terminal 3 a of the LSI 3 .
- the thus-formed contact electrode 1 can be accurately brought in contact with the terminal 3 a of the LSI 3 , and an oxide film or foreign matters on the terminal 3 a of the LSI 3 can be removed since the end of the contact electrode 1 moves forward slightly after the contact. In respect of adjusting an amount of such a forward movement, the high accuracy of bending provides effectiveness.
- FIGS. 4A through 4D are illustrations for explaining a method of adjusting a position of the end 1 a of the contact electrode 1 finally by laser processing after bending the end of the contact electrode in some degrees in the example shown in FIG. 3 . That is, the straight conductive material 1 A shown in FIG. 4A is bent previously as shown in FIG. 4B by a bending jig or the like. In the example shown in FIG. 4, the bending of the root which is fixed to the board 2 and the bending near the end 1 a which contacts an object to be contacted are achieved by mechanical processing. It is difficult to accurately position the end 1 a by mechanical processing due to a spring back of the bent portion.
- a laser beam is irradiated onto the bending part near the end 1 a , as shown in FIG. 4C, so as to perform laser processing to move the end 1 a to a desired position.
- the contact electrode 1 is attached to the board 2 to form a probe card as shown in FIG. 4 D.
- the laser bending may be performed before attaching the contact electrode 1 to the board 2 , or may be performed after the attachment.
- the machine bending applied near the end 1 a of the contact electrode 1 shown in FIGS. 4A through 4D is preferably performed under a high-temperature atmosphere (higher than a room temperature) as shown in FIG. 5 . That is, a hot working strain is generated in the contact electrode 1 by performing machine bending under a high-temperature atmosphere.
- the material having a hot working strain can be bent in a direction opposite to the direction of laser irradiation by appropriately controlling the conditions of laser irradiation. Therefore, even in a case where the degree of bending is too large, bending can be performed in the reverse direction of the laser irradiation direction by irradiating a laser beam, that is, deformation can be achieved in a direction to return the bent.
- Such laser bending process in the reverse direction is important.
- the adjacent contact electrodes may become obstructive and laser irradiation from opposite direction from bending may not be able to be performed. Even if it is such a case, it can bend or return the bend by irradiation in the same direction.
- the high-temperature working strain can be generated in the conductive material 1 A also by annealing the conductive material 1 A under a high-temperature atmosphere while applying a tension stress to the conductive material 1 A as shown in FIG. 6 .
- the contact electrode 1 can be bent in a reverse direction of the laser irradiating direction.
- an ultraviolet laser having a short wavelength is suitable as shown in FIG. 7 .
- the heat energy at the time of irradiation is smaller as the wavelength of the laser is shorter.
- an ultraviolet-light laser having a wavelength of 355 nm is used, a fine needle can be bent without being melted by irradiating the ultraviolet laser beam onto the tine needle having a very small heat capacity.
- a contact electrode having a fine needle-like shape can be processed by irradiating a laser beam while cooling the contact electrode if necessary.
- an amount of deformation obtained by one time irradiation can be small.
- a resolution of bending can be small, which result in a fine control of a bending angle.
- FIG. 8 is an illustration showing an example of irradiating a laser beam, converged by a lens, onto the contact electrode 1 .
- a laser beam is converged by a convergent lens 4 and is irradiated onto a desired portion of the contact electrode 1 .
- the opposition of the contact electrode 1 is intentionally shifted from a focal distance F of the convergent lens 4 be an offset distance D (defocused) so as to a power density of the laser beam being irradiated.
- a power density is maximum when the contact electrode 1 is in at the position of the focal distance F, the power density decreases as the offset distance D increases. It is necessary to determine an optimum value of the offset distance D in consideration of conditions such as a kind of laser beams, a material and a diameter of the contact electrode and a bending angle.
- the bending process can be controlled with a higher accuracy by controlling a temperature of an opposite portion of the laser-irradiated portion of the contact electrode while adjusting the power density of the laser beam.
- the reverse direction bending is achieved by irradiating a focused laser beam while blowing high-temperature controlled gas onto the opposite portion of the laser-irradiated portion.
- FIG. 9 is an illustration showing an example which irradiates a laser while heating a contact electrode.
- a control is performed so that a temperature difference between laser-irradiated portion and the opposite portion is reduced by contacting a heating member 5 such as a heater with the opposite portion, which is opposite to the laser-irradiated portion.
- a heating member 5 such as a heater
- an amount of bents will become small.
- FIG. 10 is an illustration showing an example which controls the temperature of a contact electrode by a fluid.
- an inert gas (nitrogen) of which temperature is controlled is used as a fluid for controlling the temperature of the contact electrode 1 . That is, the temperature difference between the laser-irradiated portion and the opposite portion is controlled by blowing an inert gas from a nozzle 6 to the opposite portion of the laser-irradiated portion of the contact electrode 1 . If the temperature of the inert gas is higher than a room temperature, the amount of bents become small, and if it is lower, the amount of bents become large.
- the reason for using an inert gas is for preventing oxidization of the contact electrode 1 at the time of being heated by laser irradiation. When there is no need to prevent oxidization, air may be used instead of an inert gas.
- FIG. 11 is an illustration for explaining an example which speeds up laser bending.
- a laser beam is irradiated onto the contact electrode 1 while converging the laser beam using the convergent lens 4 as shown in FIG. 8 .
- the contact electrode 1 is positioned at the focal distance F of the convergent lens 4 .
- a state where the convergent lens 4 is located at a position A in FIG. 11 corresponds to the state where the contact electrode 1 is positioned at the focal distance F.
- the convergent lens 4 is moved away from the contact electrode 1 so as to locate at a position B.
- the focal position of the convergent lens 4 moves to a position ahead of the contact electrode (defocused), and the focal position is shifted by the offset distance D as shown in FIG. 8 . Consequently, the power density of the laser beam irradiated onto the contact electrode 1 is reduced, thereby reducing an amount of bents.
- the laser beam is irradiated at a maximum power density by setting the distance between the convergent lens 4 and the contact electrode 1 to be the focal distance F so as to bend the contact electrode 1 with a maximum amount of bending (maximum bending rate), and, then, after the bending has progressed to a certain degree, the convergent lens 4 is moved so as to defocus the laser beam so that the power density is reduced, which results in reduction in the amount of bending (bending rate).
- the bending rate can be made small which achieve a fine control of a final bending angle.
- the temperature control as shown in FIG. 9 or FIG. 10 may be used. That is, the temperature difference between the laser-irradiated portion and the opposite portion is set large initially, and after the bending has progressed to a certain degree, the temperature difference is set smaller, which can achieve reduction in the bending rate.
- FIG. 12 is an illustration showing an example which performs a reverse-direction bending.
- the reverse-direction bending can bend the contact electrode 1 in a direction opposite to the direction in which a laser beam is irradiated, by irradiating a defocused laser beam by the convergent lens 4 while blowing a high-temperature controlled gas to a portion opposite to a portion where the defocused laser beam is irradiated.
- the reverse-direction bending may be achieved by setting a laser irradiation time (pulse width) shorter than that for a normal-direction bending, preferably equal to or less than one half.
- FIG. 13 is a perspective view of a contact electrode having a laser-irradiated portion formed as a flat surface.
- a flat surface 1 b is formed by cutting out a portion onto which a laser it irradiated to bend. Since the laser energy is absorbed more efficiently than irradiating onto a curved surface, an efficient bending process can be achieved. Moreover, since the laser-irradiated surface is a flat surface, a laser beam can be irradiated more uniformly than irradiating onto a curved surface, which achieves an accurate bending process.
- the laser bending may be used not only for bending a portion near the end 1 a of the contact electrode 1 but also for shaping the entire contact electrode.
- a plurality of flat surfaces may be provided at appropriate positions of the contact electrode.
- an adjustment of position of the end 1 a may be performed by irradiating a laser beam onto the flat surface 1 b after bending the contact electrode near the end 1 a.
- FIG. 15 is a perspective view showing an example in which a flat surface is further provided on each side of the flat surface 1 b of the contact electrode shown in FIG. 14 .
- the flat surfaces 1 c and 1 d are provided on both sides of the flat surface 1 b , respectively.
- the contact electrode 1 can be bent in a plurality of directions (upward and downward directions and rightward and leftward directions in FIG. 15) by irradiating a laser beam onto each of the flat surfaces if necessary.
- the plurality of flat surfaces can also be formed in different positions individually as shown in FIG. 17 . It should be noted that the number of flat surfaces is not limited to three, and a necessary number of flat surfaces may be formed.
- FIG. 18 is a perspective view showing an example in which the contact electrode is formed of a plate material.
- the conductive member which forms the contact electrode 1 is made of a metal plate material, a laser beam can be irradiated onto a flat surface without forming particularly a flat surface. In this case, although the laser bending is easy, if the thickness of a plate is small, there is a possibility that strength is insufficient. In such a case, it is needed to reinforce the contact electrode in a direction of width. However, if the contact electrode can be formed by punching a thick plate material, the contact electrode may be used without reinforcement.
- FIG. 19 is an illustration for explaining a condition of laser irradiation to a contact electrode having a rod shape.
- FIG. 19 cross-sectional views are indicated aside of a side view of the contact electrode 1 .
- the contact electrode 1 shown in FIG. 19 is formed of a rod-like material gradually thinned toward an end thereof.
- the laser to be irradiated is converged so as to be a beam diameter (spot) smaller than the diameter of the contact electrode, and irradiated on the contact electrode 1 .
- a beam diameter spot
- an energy absorption efficiency of the laser beam is increased.
- the laser beam is irradiated onto an eccentric position, it corresponds to a state where the laser beam is irradiated in an oblique direction, which reduces the energy absorption efficiency.
- an irradiation loss becomes larger as an angle ⁇ of a tangent of the contact electrode at a laser-irradiated point increases as shown in FIG. 19 .
- a standard of a correction factor is created based on an eccentricity ⁇ /D of the position of the laser-irradiated position.
- D is a diameter of the contact electrode 1 in at the laser-irradiated position
- ⁇ delta is the eccentricity of the laser-irradiated position.
- the laser beam irradiated onto one side end of the contact electrode 1 has a low energy absorption efficiency similar to that irradiated onto a slanting surface, the deformation may rapidly progresses depending on a size, a radius off curvature or material since a volume of the material to be heated on the side end is small. If the conditions of these bending conditions are beforehand checked by experiments and an efficiency table (conversion table) is produced for each condition, a laser-irradiated position for performing desired laser bending can be obtained easily.
- FIG. 20 is a cross-sectional view of a contact electrode having a central part and a peripheral part formed by different conductive materials. Since the contact electrode is repeatedly brought into contact with an object to be contacted, a wear resistance is required for the contact electrode. If the entire contact electrode 1 is formed by a material having a high wear resistance and hardness, the contact electrode 1 may be hardly deformed by irradiation of a laser beam since a melting point is high. Thus, a contact electrode 1 is formed in a structure having a peripheral part 10 and a central part 11 , as shown in FIG. 20, and the central part 11 is formed by a material having a lower melting point than the peripheral part 10 . Thereby, the peripheral part 10 has a high wear resistance and the central part 11 is made of a material which can be easily deformed by laser processing, which enables formation of a contact electrode which can be easily processed by laser processing while maintaining a wear resistance.
- FIGS. 21A and 21B are illustrations for explaining a method of forming a probe for an area array by laser bending.
- needle-like conductive materials 1 A which are made into the contact electrodes 1 , are attached to the board 2 . Since the probe card for an area array must be provided with many contact electrodes 1 in a state where the contact electrodes is stood up and aligned, as shown in FIG. 21A, many conductive materials 1 A are provided in a stand up and aligned state. Then, as shown in FIG. 21B, the conductive materials 1 A are bent in a laser irradiating direction by irradiating a laser beam onto each of the conductive materials sequentially from the end.
- a space can be reserved for irradiating a laser beam onto the adjacent conductive material 1 A.
- the contact electrodes 1 which are bent in the same direction and the same angle, are obtained by sequentially irradiating a laser beam.
- FIG. 22 is an illustration for explaining an example of a method of making the contact electrodes in the same height.
- the contactor shown in FIG. 22 is of a peripheral type, and a plurality of contact electrodes 1 are provided as shown in FIG. 3 .
- the contact electrodes 1 can be deformed in a state in which the height of each of the contact electrodes is forcibly equalized by irradiating a laser beam onto each of the contact electrodes 1 through an opening 2 a of the contactor board 2 in a state where the contact electrodes 1 are pressed against a flat plate 12 so that the contactor board is parallel to the flat plate 12 .
- FIG. 23 is an illustration for explaining another example of the method of making the contact electrodes in the same height. Since the contactor board 2 shown in FIG. 23 does not have the opening 2 a in the center thereof, a laser beam cannot be irradiated from the side of the contactor board 2 . Thus, the flat plate 12 is formed by a laser transparent material so that a laser beam can be irradiated onto the contact electrodes by being passed through the flat plate 12 .
- the contactor such as a contactor for an area array, which requires many contact electrodes arranged with a small pitch, can be formed easily with high accuracy by applying a bending process to the contact electrodes using a laser processing technique.
- the above-mentioned laser bending process can be used for position correction or repair of the contact electrodes.
- the probe card can be restored in a usable state by repairing the unusually deformed contact electrode by the laser processing.
- FIG. 24 is an illustration showing a basic structure of a wafer prober.
- the wafer (LSI) W which is an object to be tested, is attached to a chuck top table 21 fixed on a XYZ ⁇ theta stage 20 .
- the probe card 22 provided with contact electrodes 22 a is attached to a probe card attachment part 23 which is provided above the chuck top table 21 .
- the chuck top table 21 is provided with a camera 24 for recognizing position of a needle tip, and sends position information of the contact electrodes of the probe card to a wafer alignment part.
- the wafer W conveyed by an arm 26 of a wafer conveyance mechanism (not shown in the figure) is placed on the chuck top table 21 , and is fixed by vacuum suction.
- the XYZ ⁇ stage 20 is driven so as to move the chuck top table 21 so that the contact electrodes 22 a of the probe card 22 are aligned with electrodes of the LSI of the wafer W.
- a wafer alignment part 25 controls XY movement of the XYZ ⁇ stage 20 while recognizing the needle tip position of the contact electrode 22 a by needle tip position recognition camera 24 , and finally moves XYZ ⁇ stage 20 in Z-direction so as to contact the contact electrodes 22 a of the probe card 22 with the electrodes of the LSI. Thereby, a test can be performed on the LSI of the wafer W.
- correction of needle tip positions of the contact electrodes 22 a can be made on the wafer prober by irradiating a laser beam onto the contact electrodes 22 a of the probe card 22 . That is, as shown in FIG. 25, by attaching a laser irradiation device unit 30 to the chuck top table 21 and irradiating a laser beam onto the contact electrodes 22 a of the probe card 22 fixed to the probe card attachment part 23 , the contact electrodes 22 a are deformed to as to correct the needle tip positions thereof.
- the correction of the needle tip positions of the contact electrode 22 a is performed by irradiating a laser beam onto a desired position while driving the XYZ ⁇ stage 20 based on the position information supplied from the needle tip position recognition camera 24 .
- the laser irradiation device unit may be provided with an optical system so as to be a laser irradiating unit 30 B, which can change a direction of irradiation of a laser beam.
Abstract
Description
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-236526 | 2002-08-14 | ||
JP2002236526A JP4088121B2 (en) | 2002-08-14 | 2002-08-14 | Contactor manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
US20040032272A1 US20040032272A1 (en) | 2004-02-19 |
US6806723B2 true US6806723B2 (en) | 2004-10-19 |
Family
ID=31492472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/369,705 Expired - Lifetime US6806723B2 (en) | 2002-08-14 | 2003-02-21 | Contactor having contact electrodes formed by laser processing |
Country Status (5)
Country | Link |
---|---|
US (1) | US6806723B2 (en) |
JP (1) | JP4088121B2 (en) |
KR (1) | KR20040016374A (en) |
CN (2) | CN100555594C (en) |
TW (1) | TWI257137B (en) |
Cited By (5)
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US20040037011A1 (en) * | 2002-08-26 | 2004-02-26 | Nhk Spring Co., Ltd. | Thin plate formation method, thin plate and suspension correction apparatus, and correction method |
US20060119376A1 (en) * | 2004-12-03 | 2006-06-08 | K&S Interconnect, Inc. | Method of shaping lithographically-produced probe elements |
US20060267251A1 (en) * | 2005-05-31 | 2006-11-30 | Jorg Melcher | Method of making a structure having an optimized three-dimensional shape |
US20110149363A1 (en) * | 2008-08-18 | 2011-06-23 | Qinetiq Limited | Lidar Mean Power Reduction |
US20150192614A1 (en) * | 2012-11-28 | 2015-07-09 | Technoprobe S.P.A. | Cantilever contact probe for a testing head |
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JP4927391B2 (en) | 2005-11-25 | 2012-05-09 | 東京エレクトロン株式会社 | Joining method |
US7583098B2 (en) * | 2006-02-08 | 2009-09-01 | Sv Probe Pte. Ltd. | Automated probe card planarization and alignment methods and tools |
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JP2008034569A (en) * | 2006-07-28 | 2008-02-14 | Matsushita Electric Ind Co Ltd | Semiconductor integrated circuit checking probe card and its manufacturing method |
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DE102016100561A1 (en) * | 2016-01-14 | 2017-07-20 | Pac Tech - Packaging Technologies Gmbh | Method for placing and contacting a test contact |
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CN109633225A (en) * | 2018-12-27 | 2019-04-16 | 深圳市海维光电科技有限公司 | A kind of production technology of circuit board detecting testing needle |
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Also Published As
Publication number | Publication date |
---|---|
US20040032272A1 (en) | 2004-02-19 |
TWI257137B (en) | 2006-06-21 |
JP4088121B2 (en) | 2008-05-21 |
CN1476068A (en) | 2004-02-18 |
CN100555594C (en) | 2009-10-28 |
CN1290169C (en) | 2006-12-13 |
JP2004077242A (en) | 2004-03-11 |
KR20040016374A (en) | 2004-02-21 |
TW200402815A (en) | 2004-02-16 |
CN1933119A (en) | 2007-03-21 |
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