|Publication number||US6839013 B1|
|Application number||US 09/639,197|
|Publication date||Jan 4, 2005|
|Filing date||Aug 15, 2000|
|Priority date||Feb 6, 1998|
|Also published as||EP0935195A2|
|Publication number||09639197, 639197, US 6839013 B1, US 6839013B1, US-B1-6839013, US6839013 B1, US6839013B1|
|Inventors||Timothy J. Cummins, Eamonn Joseph Byrne, Dara Joseph Brannick, Patrick Michael Mitchell|
|Original Assignee||Analog Devices, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (50), Non-Patent Citations (10), Referenced by (39), Classifications (6), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a divisional of application Ser. No. 09/020,021, filed Feb. 6, 1998, entitled AN INTEGRATED CIRCUIT WITH A HIGH RESOLUTION ANALOG TO DIGITAL CONVERTOR, A MICROCONTROLLER AND HIGH DENSITY MEMORY AND AN EMULATOR FOR AN INTEGRATED CIRCUIT, now abandoned.
The present invention relates to an integrated circuit and an emulator for an integrated circuit.
There is a need for precision analog circuitry to be integrated on the same chip as a microcontroller and memory. To date this has proved difficult not least because of difficulties fabricating the different devices required using a semiconductor process which provides good yield and which is not extravagant in its use of die area and/or number of masks.
Furthermore, these is a need to provide convenient emulation of such devices without the need for special versions of the integrated circuit to be produced or cumbersome clip pods to be used.
A first aspect of the invention provides, an emulator couplable to an integrated circuit, the integrated circuit including a microcontroller, a DMA controller, memory means and an ADC and the emulator being operable to read a block of data stored in a plurality of memory locations of the memory means and graphically to display a representation of at least a portion of the block of data.
The memory means may be internal or external memory means.
In this way, the emulator may, for example, display the portion in an oscilloscope or spectrum analyzer representation.
A second aspect of the invention provides an integrated circuit including an ADC and reprogrammable non-volatile memory means, the ADC being arranged to read calibration values from the non-volatile memory means.
This allows the characteristics of the ADC to be altered, for example, to accommodate a non-linear transducer or to null out offset or other errors in the ADC or external circuitry. It is particularly suitable for a circuit which is expected to be mounted in an inaccessible position since the calibration values may be altered with the circuit in situ.
A third aspect of the invention provides an integrated circuit including a microcontroller, a DAC selected from a group consisting of a string DAC and a current source DAC and an operational amplifier coupled to the DAC output.
According to a fourth aspect of the invention an integrated circuit includes analog and digital circuitry, and has only two polysilicon layers on a C-MOS substrate.
The present invention will now be described by way of example with reference to the drawings in which:
With reference to
The ADC is a successive approximation converter having a charge redistribution digital-to-analog converter (DAC) 2, a track and hold circuit 4 both coupled to a comparator 6. The design includes a reference voltage generator 8 connected via a buffer 10 to the input of the DAC 2.
Conventional microcontroller integrated circuits have required a DAC to be implemented using a timer to generate a pulse-width-modulated (PWM) signal which is fed into a large capacitor to smooth the PWM signal and to produce a signal having a voltage which varies depending on the mark-space ratio of the PWM signal. This at the very least is inconvenient since it uses up a timer/counter which could otherwise be used for other functions and requires microcontroller intervention. In the embodiment described below, two dedicated DACs have been provided.
An analog multiplexer 12 is used to select either the output from a temperature sensor 14 or one of the eight analog inputs P1.0 to P1.7.
A register block 16 is coupled to ADC logic 18, DMA logic 20 and port control logic 22. The register block 16 contains DMA address SFRs 16A, 16B, 16C which are 8 bit SFRs containing the low byte, high byte and page address of the address in external memory which is being written to or read from during DMA operation. Thus, these registers form a 24 bit address pointer. Initially, these registers are loaded with the start address in external memory from which a channel id is first read and to which the corresponding conversion result is subsequently written during DMA continuous conversion. The address stored in these registers is incremented during DMA operation.
The register block 16 also includes two bit ADC data registers 16D, 16E which store temporary results of ADC conversions before storage in memory or are used to hold the result of a single conversion. The sixth register 16F is an 8 bit control register for the ADC. The ADC SFRs are described in more detail below.
An 8051 compatible microcontroller 24 is coupled to the port control logic 22 to provide external data and address buses and also to the register block 16. The microcontroller's interaction with the DMA logic and the ADC is achieved via the register block 16.
External memory 26 is connected to port 0 and port 2. These ports in conjunction with the write (WR), read (RD) and address latch enable (ALE) lines enable the microcontroller and the DMA logic 20 to read and write to the external memory.
The three ADC registers 16D, 16E, 16F of the register block are shown in more detail in FIG. 2.
Before entering DMA mode, the microcontroller 24 is programmed to write to external memory specifying the ADC channels to convert. This is achieved by writing for each channel to be converted, a byte containing a 4 bit channel id in its top 4 bits to external memory. Each of these bytes is written to consecutively alternate bytes in external memory. An ‘all ones’ channel id is used to signify the end of continuous conversion.
With reference to
Since the channel id is not corrupted by the DMA operation, if the same sequence of channels is repeatedly to be converted, there is no need for the pre-seeding operation to be performed more than once. All that is required to convert the same sequence again is to reset the DMA SFRs to the start address and to initiate DMA continuous conversion.
Before continuous conversion occurs, the microcontroller is caused to load the start address (402000H in the example) into the SFRs 16A, 16B and 16C and to set the CCONV flag in the ADCCON2 SFR 16F which requests continuous conversion and the DMA bit which starts DMA.
Once DMA mode has been initiated in this way, the microcontroller may continue to execute code without using any processing time to deal with the ADC conversion process. For extremely high precision ADC conversions, it may be desirable to reduce digital noise present on the substrate by putting the microcontroller into an idle mode for the duration of the DMA continuous conversion operation. When the DMA operation is complete, and interrupt is generated by the DMA controller to signal to the microcontroller that the ADC conversion results may now be processed. If the microcontroller is in idle mode when the interrupt is generated, the interrupt has the effect of ‘waking up’ the microcontroller.
Thus, for example, the microcontroller may initiate a continuous conversion of, say, 4000 values, leave the DMA controller performing the conversions, carry on with housekeeping tasks using internal EEPROM and RAM and then once the conversions are complete, process the results using an FFT for example.
During continuous conversion, a DMA stat machine is initiated which generates internal and external signals. The external signals which are controlled by the state machine are those present on port 0, port 2 and the ALE, WR and RD signals mentioned above.
It will be noted that the DMA operation is arranged to interleave the memory reading and writing operations of a previous conversion such that these operations occur simultaneously with the next ADC conversion. In this way, no timing overhead is introduced by the DMA mode and therefore the ADC can convert at its maximum rate.
The state machine also generates internal signals ‘busy’ which is high during ADC conversion, ADCDATAL and ADCDATAH which represents data flowing into the 2 SFRs 16D and 16E and a WRADC signal which causes writing of the conversion result into the SFRs 16D and 16E.
As will be seen from
Since a channel id for the next conversion is read in from the external memory during the present analog-to-digital conversion, the first conversion is performed on the channel specified by the ADCCON2 SFR (register 16F of FIG. 1). The first channel converted is that specified in the 4 bits CS0 to CS3 of FIG. 2. This data is not stored in external data memory and therefore the WR signal is not active until the third conversion. Thus to convert n DMA channels, n+1 conversions are performed.
With particular reference to
Thus the sequence of operations after the first three conversions is:
When a channel id of all ones is read, the state machine flags an interrupt using the ADCI bit of SFR 16F and clears the DMA and CCONV bits of that register.
With reference to
Preferably, at least some of the DMA SFRs 16A, 16B, 16C are shared with registers used by the microcontroller 24 as data pointers. In the case of an 8051 compatible microcontroller, the microcontroller has two registers DPL and DPH forming the low and high bytes respectively of a sixteen bit data pointer which is used for accessing external memory. In one preferred embodiment, in DMA mode, the registers DPL and DPH are the same registers as the DMAL and DMAH registers. The addition of the DMAP register increases the address range of the DMA controller from the microcontroller's 16 bit range to a 24 bit range. Alternatively, the three DMA address registers may be separate registers from the DPL and DPH registers. This alterative arrangement allows the microcontroller to be put into an idle mode during DMA operation without disabling the DMA address registers. Either way, it is important, that the microcontroller should not access ports 0 or 2 or the ALE line during DMA since these are driven by the DMA controller (and not the microcontroller core) during DMA operation.
In this way, port 0 is used to provide multiplexed address (A0 to A7) and data (D0 to D7) and port 2 is used to provide multiplexed addresses (A8 to A15) and (A16 to A23). This allows the microcontroller to address memory using 24 bit addressing using only 8 bit ports. The timing of writing to external data memory and reading from external data memory is shown in
It will be appreciated that during normal operation, the microcontroller core drives the ALE, WR and RD signals and ports 0 and 2 to achieve 24 bit addressing. In DMA mode, the DMA controller (in the form of the state machine described above) is responsible for generating the necessary signals on these lines and ports to achieve writing and reading in a 24 bit address space. In each case, the timing is as shown in
If only 16 bit addressing is desired, the latch 42 may be omitted. No other changes are required. This is possible because it has been chosen to output the high 8 address bits (A16-23) in the first half of the cycle. Thus when WR or RD become active (towards the end of the second half of the cycle), it is the values A8-15 which are available on port 2. Since WR or RD are not active in the first half of the cycle, any data output on port 2 and not latched) is ignored by any memory-mapped devices such as external memory.
The ADC described above may be designed in accordance with the teachings of commonly assigned U.S. Pat. No. 5,621,409, filed 15 Feb. 1995, application Ser. No. 08/235,087, filed 29 Apr. 1994 and application Ser. No. 08/274,169, filed 18 Jan. 1995 which are incorporated herein by reference. Briefly, these documents disclose an ADC with multiple charge balance conversions and having a calibration facility.
A schematic view of the successive approximation (SAR) DAC portion of the ADC is shown in FIG. 30. With reference to that figure, the eight MSBs are calibratible using calibratible capacitances 50. The capacitances are arranged as a binary trim array. The calibration value of each of those capacitances is adjusted according to digital values loaded from a calibration register 52. The register is constructed using a RAM register which may for example be constructed using D-type flip flop for each capacitance 50. The D input of each flip flop would be connected to the microcontroller 24 and each Q output would be connected to a respective calibratible capacitance 50.
The microcontroller 24 may read factory or in situ values from the EEPROM block 54 and write these to the register 52 for adjusting the calibration coefficients of the DAC portion of the ADC (thereby changing the calibration of the ADC). The ADC may be calibrated for accuracy or even to implement a non-linear characteristic perhaps to linearise a non-linear transducer.
Similarly the offset and gain of the ADC may be adjusted using calibratible capacitances 56, 58. In the preferred embodiment, these capacitances have a value of 16C (arranged as a plus or minus 8C adjustment). The whole array has a value of 256C and thus an adjustment of gain and/or offset of over 3% is available. In this way, the offset of transducers may be nulled out and/or an analogue multiplication may be applied to any input analogue values. This can obviate the need for any separate hardware or software multiplication or manipulation of the results with consequent cost and time savings.
In the preferred embodiment, the 4LSBs are not calibratible and a scaling capacitance 56 is used to scale the two segments together.
Typically, the calibration coefficients are loaded into the register 52 during the execution of a power-up loader in bootstrap memory.
Typically, the ADC is calibrated in the factory and the resulting coefficients loaded into the EEPROM 54. However, since the non-volatile memory is reprogrammable under control of the microcontroller (as described elsewhere in the present application), the user has complete freedom to adjust the performance/characteristics of the ADC and to store the chosen settings for future use in non-volatile memory. The freedom to adjust is provided by the ability of the microcontroller to write to the read/write RAM register 52.
As a further enhancement, the microcontroller may load a different set of calibration coefficients into the register 52 for different conversion channels so that the ADC operates in a different way depending on which channel is being converted. This allows for example, for different transducers to be linearised in different ways. This may alternatively be implemented in hardware using a register having more than one set of coefficients and which can be commanded to load those different sets into the ADC either by the microcontroller or based on the selected channel.
This ability to change the calibration data with the circuit in situ and without any additional external components or even physical contact with the circuit is particularly useful for applications where the ADC is inaccessible, for example in a hostile environment such as a chimney stack.
The two DACs shown in
As shown in
The data processor having an emulator according to the present invention performs emulation under software control. In order to achieve this a reserved memory containing emulation instructions is provided as an integral part of the data processor. As shown in
The emulation request controller is responsive to three inputs. A first input is responsive to a voltage transition on a single pin of the data processor package. In the preferred embodiment, the pin is a “EA” pin which is used to tell the data processor and it should execute from internal (EA=high) or external (EA=low) memory during the power up. The state of the pin is latched by the data processor at power up or reset and thereafter it can be used as the emulation control pin. The EA pin is also used, when emulation has been initiated, as a bi-directional serial communications pin.
The emulation request controller is also responsive to a single step flag 42 which ensures that an emulation request occurs after execution of a single instruction of the user program code. Preferably, the emulation controller 132 is responsive to a break point instruction whose occurrence in the user code causes the emulation controller 132 to issue an emulation request.
As shown in
The sixth bit is an emulation single step, ESS bit which causes the data processor to only execute single instructions between emulator program operations.
The final two bits EA-in and EA-out enable the status of the EA pin to be read and written to respectively.
Thus as shown in
The data processor has a data processing core supporting the 8051 instruction set. The 8051 instruction set has a unused instruction code of A5. The A5 instruction has been implemented as the break point instruction.
It is known to initiate a software emulation or debug by including a jump instruction to the emulation code. However there is a significant problem with this approach since the jump instruction is a 3 byte instruction and if this was inserted at address 0120, as shown in
By adding a single byte break point instruction, only one address of program is over written. Thus in the example in
The interface element 103 may provide a local buffer such that as the block of program code (usually two rows of the internal non-volatile reprogrammable user code memory of the data processor), is buffered in the interface element and the local data processor modifies he data to change instructions or insert the breakpoint, and then represents the data to the target data processor in order that it can rewrite the data into its internal memory.
During execution of the user program, the program counter will eventually point to the address 0120 which has the A5 emulation break point instruction written therein in place of the “clear A” instruction. The instruction decoder of the data processor decodes the break point instruction and causes the emulation request controller 132 to issue a priority interrupt. Thus the data processing core 154 discontinues execution of the user's program and starts executing instructions from the emulation memory provided that the EEs bit in the EMUCON register cleared. Assuming that the EES bit is cleared, the data processing core executes the emulation instructions using the reserved EMU1 register, and outputs data concerning the status of the various program registers to the emulation data processor 102. Once the data has been sent to the emulation data processor, the emulation data processor toggles the EES bit and issues a command causing the emulation to continue. The emulator then returns control to the user program. Because the break point instruction is interrupt driven, the control is returned to address 0120 which holds the A5 break point instruction. This time the EES bit indicates that emulation should not be recommenced, but in fact that the instruction in the EMU2 register should be executed. The data processing core executes the instruction in the EMU2 register and returns control to the user program at the address following the break point instruction.
It is thus possible to provide a data processor having a software driven emulator embedded therein which uses dedicated registers, thereby ensuring that registers used in execution of a user's program do not become altered once the emulation mode is commenced. It is also possible to provide a development system for use with such a microprocessor in order that the internal registers may be inspected, or blocks of memory may be inspected and analysis performed thereon.
For example, a block of memory may hold values resulting from analogue to digital conversions. These typically are placed in memory using the continuous conversion DMA technique described above.
The magnitude of the values may be displayed by the emulation control data processor in order to form an oscilloscope trace of the analogue channel or channels sampled by the ADC, or additionally or alternatively may be Fourier transformed in order to perform frequency domain analysis. As a further enhancement, the emulation control data processor may take account of the channel ids stored in the memory block to provide a multi-channel oscilloscope-type display with one channel of the display representing a respective conversion channel. Similarly, X, Y and Z inputs of a conventional oscilloscope may be simulated and mapped to different conversion channels based on the channel ids stored in the memory block.
The emulator may display a plurality of windows, with each displaying the status of and/or controlling the function of a respective target data processor within a multi processor target board. Thus the operation of master and slave processors may be analyzed, possibly on a single step bases, in order to check their data exchange operation and mutual performance.
The emulator has authority to modify the internal memory contents of program and data memory within the target data processor. Thus the target data processor may be re-programmed whilst it is in situ in the target board making use of its self re-programming capability. Similarly, calibration coefficients in digital or hybrid-analogue systems may be modified as described elsewhere in the present specification. It is also possible, when the interface element communicates using a radiative link, to leave the interface element attached to the target board permanently, thereby allowing for the target data processor to be reprogrammed even after it has been installed in a working environment. The provision of an emulator as an integral part of the target data processor has the additional advantage that the board and processor being debugged/developed are identical to the final system. This contrasts with prior art emulators of the type shown in
U.S. Pat. No. 5,242,848 describes a floating gate memory cell and a method for making such a cell. The memory cell described therein is of the type used in the preferred embodiment of the present invention and the teachings of U.S. Pat. No. 5,242,848 are incorporated herein by reference. Briefly, each memory cell, as shown in
In order to erase memory cells of this type, the drain D and source S regions are connected to ground and the gate electrode taken to a relatively high voltage, say around +15 volts, as shown in
The physical space occupied by the memory can be reduced if adjacent rows of memory share a common source conductor. As shown in
The memory cells are individually programmable, although care must be taken to ensure that the voltages on the drain terminals of cells which are not to be programmed but are in the same row as a cell selected for programming are high (Vcc), otherwise they could be inadvertently programmed.
In order to read a memory cell, as shown if
The address decoder is split into a X address decoder 252 controlling the row lines within the memory array and a Y address multiplexer 254 controlling the column lines within the array. The Y address multiplexer is arranged to enable eight columns of memory at a time in order to address all eight bits of a single byte word. The X address decoder is positioned intermediate the memory array 246 and a further smaller memory array 254 which functions as a non-volatile data memory. This allows the X address decoder to be shared by, and be adjacent to, the two arrays 246 and 254. The fact that the arrays cannot logically be used at the same time allows the address decoder to be shared between them. This is because the microcontroller can only access one memory at a time. The memory blocks 254, 248 and 150 perform different tasks, have different access control rights but share the same architecture and address decoder. This represents a considerable saving in space on the silicon substrate. High voltage couplers 256 are provided on either side of the memory segment 240 for controlling connection of the high voltages to the gate connections and/or source connections (both of which run in the row direction) of the transistors forming the memory cells. A plurality of sense amplifiers for reading the contents of the memory cells and for providing a buffered output are provided in region 258.
The reading of the memory is directly under the control of the data processing core of the data processor incorporating the memory block 240. However, due to the necessity to provide high voltages for erase and write operations, these actions are controlled by a dedicated EEPROM controller which is implemented as a state machine. The interconnection between the EEPROM controller 70 and the memory block 240 is schematically illustrated in FIG. 26. EEPROM controllers are not new, but hitherto have typically been provided as asynchronous controllers, usually controlled by a ring oscillator based state machine. The data processing core has had to continuously poll a “busy” flag in the EEPROM controller to know when the erase or write cycle has finished in order to allow the core to resume normal program execution. The instructions to poll the busy bit have been stored in the bootstrap memory. The integration of the bootstrap and code memories into a single array mean that the instruction sequence for performing the poll of the “busy” bit is no longer available to the data processing core as in order to read the bootstrap memory it would become exposed to the erase/write voltages. However, by integrating the core and EEPROM controller onto the same ship and having them clocked by a common clock the EEPROM controller becomes synchronous with the data processing core. This means that the length of the erase/write cycles become predictable and consequently the core can b made to wait for the required time for the EEPROM controller to finish. Thus the core resumes executing the routine stored in the bootstrap memory exactly where it left off thereby eliminating the need to perform polling operations and pushing and popping of register contents onto and from the stack.
The EEPROM controller has a plurality of output signals which are used to control the charge pump and the connections to the gate and source electrodes. The “erase” signal is sufficient to initiate an erase sequence in its own right, as shown in
In a write cycle, as shown in
This arrangement allows the microcontroller to reprogram its own EEPROM.
The non-volatile data memory is provided as thin array, in the sense that the rows only correspond to a relatively small number of bits. The memory could be fabricated only one byte wide, thereby forming a true EEPROM. However in a preferred embodiment (
It is thus possible to integrate a plurality different memory types within a single memory architecture. This provides a space saving by avoiding the duplication of address decoders, sense amplifiers and charge pumps. Furthermore, by limiting the memory architecture to a single type, fabrication complexity is reduced as the memory type used herein and described in U.S. Pat. No. 5,242,848 carries only a modest processing overhead over formation of CMOS transistors. The integration of the EEPROM controller within the data processor and its interaction with the processor core by means of the idle condition and clock counting to determine when the EEPROM controller has finished erasing or writing memory enables the integration of bootstrap and code memory into a single physical memory array and also provides a simple and robust control scheme between the EEPROM controller and the data processing core. Thus the code memory 248, the data memory 254 and even the bootstrap memory 250 can modified/rewritten.
A traditional Flash EEPROM process can have up to 20 or 21 mask steps due to tunnel oxide formation, extra drain engineering to support high voltage and other complexities. The control gate and floating gate polysilicon layers typically cannot be used to make high quality capacitors since their spacings are optimized for cell coupling, and the floating gate may be thin and undoped. Therefore previous attempts to integrate high resolution analog circuits with EEPROM have been either impossible, or uneconomic if extra layers or masks have to be added.
Although some attempts have been made to add EPROM cells to analog mixed signal processes by using the Poly-Poly capacitor layers as a control gate, floating gate cell, these have also been impractical for anything more than a few tens of bits since the cell has to be quite large to get enough coupling ratio for programming. Also the lack of a tunnel oxide means they cannot be erased, i.e. they are typically programmable only once.
In the chip described herein, the split gate EEPROM cell does not need a tunnel oxide or drain engineering, therefore the process used for fabrication can be much simpler, requiring only a few extra masks over a regular CMOS process.
Although metal-Poly capacitors have lower capacitance and greater variability than Poly-Poly capacitors, their use in the analog circuits eliminates the need for any additional layers or mask steps. The lower capacitance and greater variability of the metal poly capacitors has been circumvented by the use of a calibration algorithm, matching and centroiding techniques, and liberal use of dummies.
Thus these combinations of processes and layouts have for the first time permitted the economic integration of a high resolution analog-to-digital converter on the same silicon as high density EEPROM and a microcontroller.
With reference to
As described above, the provision of dedicated DACs means that the microcontroller 24 and its timer/counters are freed up for other uses during digital-to-analog conversions. Furthermore, this is achieved without requiring software modifications to be made to code which can run on existing 8051 compatible microcontrollers.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US4272760||Apr 10, 1979||Jun 9, 1981||Burr-Brown Research Corporation||Self-calibrating digital to analog conversion system and method|
|US5224070||Dec 11, 1991||Jun 29, 1993||Intel Corporation||Apparatus for determining the conditions of programming circuitry used with flash EEPROM memory|
|US5242848||May 5, 1992||Sep 7, 1993||Silicon Storage Technology, Inc.||Self-aligned method of making a split gate single transistor non-volatile electrically alterable semiconductor memory device|
|US5313618||Sep 3, 1992||May 17, 1994||Metalink Corp.||Shared bus in-circuit emulator system and method|
|US5319370 *||Aug 31, 1992||Jun 7, 1994||Crystal Semiconductor, Inc.||Analog-to-digital converter with a continuously calibrated voltage reference|
|US5375228||Feb 4, 1991||Dec 20, 1994||Analog Devices, Inc.||Real-time signal analysis apparatus and method for digital signal processor emulation|
|US5390317||Mar 18, 1994||Feb 14, 1995||Motorola, Inc.||Technique to support progressively programmable nonvolatile memory|
|US5426769||Aug 26, 1993||Jun 20, 1995||Metalink Corp.||System and method for producing input/output expansion for single chip microcomputers|
|US5467200||Nov 4, 1993||Nov 14, 1995||Asahi Kogaku Kogyo Kabushiki Kaisha||Data communication method between circuits|
|US5488688||Mar 30, 1994||Jan 30, 1996||Motorola, Inc.||Data processor with real-time diagnostic capability|
|US5504684||Dec 10, 1993||Apr 2, 1996||Trimble Navigation Limited||Single-chip GPS receiver digital signal processing and microcomputer|
|US5515320||Jul 28, 1995||May 7, 1996||Nec Corporation||Non-volatile memory|
|US5535357||Jun 5, 1995||Jul 9, 1996||M-Systems Flash Disk Pioneers Ltd.||Flash memory system providing both BIOS and user storage capability|
|US5581695||Jul 7, 1994||Dec 3, 1996||Applied Microsystems Corporation||Source-level run-time software code debugging instrument|
|US5627784||Jul 28, 1995||May 6, 1997||Micron Quantum Devices, Inc.||Memory system having non-volatile data storage structure for memory control parameters and method|
|US5630164||Mar 29, 1996||May 13, 1997||Associative Measurements Pty. Ltd.||Scientific instrument emulator having a computer and an analog signal interface for real-time signal processing|
|US5651128||Jun 7, 1995||Jul 22, 1997||Sgs-Thomson Microelectronics, S.A.||Programmable integrated circuit memory comprising emulation means|
|US5686917||Apr 19, 1995||Nov 11, 1997||National Instruments Corporation||System and method for demultiplexing data in an instrumentation system|
|US5752077||May 15, 1995||May 12, 1998||Motorola, Inc.||Data processing system having a multi-function input/output port with individual pull-up and pull-down control|
|US5758059||Apr 17, 1995||May 26, 1998||Intel Corporation||In-circuit emulator in which abrupt and deferred arming and disarming of several events on a microprocessor chip are controlled using a single-input pin|
|US5767729||Oct 31, 1996||Jun 16, 1998||Integrated Silicon Solution Inc.||Distribution charge pump for nonvolatile memory device|
|US5768194||Jun 7, 1995||Jun 16, 1998||Hitachi, Ltd.||Data line disturbance free memory block divided flash memory and microcomputer having flash memory therein|
|US5781750||Jan 11, 1994||Jul 14, 1998||Exponential Technology, Inc.||Dual-instruction-set architecture CPU with hidden software emulation mode|
|US5784284||Dec 29, 1995||Jul 21, 1998||Snap-On Tools Company||Technique for plotting a variable-width signal in a fixed-width plot area|
|US5796139||Feb 20, 1996||Aug 18, 1998||Sanyo Electric Co., Ltd.||Semiconductor device|
|US5805865||Sep 26, 1996||Sep 8, 1998||Matsushita Electric Industrial Co., Ltd.||Semiconductor device|
|US5835788||Sep 18, 1996||Nov 10, 1998||Electronics For Imaging||System for transferring input/output data independently through an input/output bus interface in response to programmable instructions stored in a program memory|
|US5848026||Dec 8, 1997||Dec 8, 1998||Atmel Corporation||Integrated circuit with flag register for block selection of nonvolatile cells for bulk operations|
|US5857094||Mar 28, 1997||Jan 5, 1999||National Semiconductor Corp.||In-circuit emulator for emulating native clustruction execution of a microprocessor|
|US5862073||Sep 15, 1997||Jan 19, 1999||Winbond Electronics Corp.||Floating gate memory array device with improved program and read performance|
|US5862148||Feb 11, 1997||Jan 19, 1999||Advanced Micro Devices, Inc.||Microcontroller with improved debug capability for internal memory|
|US5872954||Nov 1, 1995||Feb 16, 1999||Texas Instruments Incorporated||Method of monitoring registers during emulation|
|US5873112||Oct 15, 1996||Feb 16, 1999||Micron Technology, Inc.||System and method for encoding data to reduce power and time required to write the encoded data to a flash memory|
|US5898862||Apr 21, 1997||Apr 27, 1999||Texas Instruments Incorporated||Method for configuring an integrated circuit for emulation with optional on-chip emulation circuitry|
|US5900008||Dec 18, 1996||May 4, 1999||Hitachi, Ltd.||Semiconductor integrated circuit device|
|US5901330||Mar 13, 1997||May 4, 1999||Macronix International Co., Ltd.||In-circuit programming architecture with ROM and flash memory|
|US5937423||Dec 26, 1996||Aug 10, 1999||Intel Corporation||Register interface for flash EEPROM memory arrays|
|US5953255||Dec 24, 1997||Sep 14, 1999||Aplus Flash Technology, Inc.||Low voltage, low current hot-hole injection erase and hot-electron programmable flash memory with enhanced endurance|
|US5954813||Jan 24, 1997||Sep 21, 1999||Motorola, Inc.||Data processor with transparent operation during a background mode and method therefor|
|US5956277||Apr 16, 1997||Sep 21, 1999||Micron Technology, Inc.||Circuit and method for performing tests on memory array cells using external sense amplifier reference current|
|US5963473||Dec 12, 1997||Oct 5, 1999||Micron Technology, Inc.||Flash memory system and method for monitoring the disturb effect on memory cell blocks due to high voltage conditions of other memory cell blocks|
|US5989960||Nov 5, 1997||Nov 23, 1999||Sanyo Electric Co., Ltd.||Semiconductor device and method for fabricating the same|
|US6009496||Dec 30, 1997||Dec 28, 1999||Winbond Electronics Corp.||Microcontroller with programmable embedded flash memory|
|US6016555||Nov 19, 1997||Jan 18, 2000||Texas Instruments Incorporated||Non-intrusive software breakpoints in a processor instruction execution pipeline|
|US6230119||Feb 6, 1998||May 8, 2001||Patrick Michael Mitchell||Integrated circuit with embedded emulator and emulation system for use with such an integrated circuit|
|US6289300||Feb 6, 1998||Sep 11, 2001||Analog Devices, Inc.||Integrated circuit with embedded emulator and emulation system for use with such an integrated circuit|
|EP0592069A1||Jun 28, 1993||Apr 13, 1994||Fujitsu Limited||Electrically erasable, non-volatile semiconductor memory device for selective use in boot block type or normal type flash memory devices|
|EP0757356A1||Jul 31, 1995||Feb 5, 1997||SGS-THOMSON MICROELECTRONICS S.r.l.||Flash EEPROM with controlled discharge time of the word lines and source potentials after erase|
|JPH08293566A||Title not available|
|WO1997030452A1||Feb 14, 1997||Aug 21, 1997||Integrated Silicon Solution, Inc.||Page latch|
|1||"Data acquisition chip offers sensor-to-system solution", Electronic Products, Jan. 1999, pp. 39-40.|
|2||"Ikos Grabs Emulation Firm, VMW", Electronic Engineering Times, pp. 1, Mar. 18, 1996.|
|3||Babb et al, "Logic Emulation with Virtual Wires", IEEE Trans on Computer-Aided Design of Int. Circuits and Systems, vol. 16, Issue 6, pp. 609-626, Jun. 1997.|
|4||Babb et al, "The RAW Benchmark Suite: Computation Structures for General Purpose Computing", Proc. 5<th >Ann. IEEE Symp. on Field-Programmable Custom Computing Machines, pp. 134-143, Apr. 1997.|
|5||Babb et al, "Virtual Wires: Overcoming Pin Limitations in FPGA-based Logic Emulators", Proc. IEEE Workshop on FPGAs for Custom Comp. Machines, pp. 142-151, Apr. 1993.|
|6||Clinton Kuo et al., "A 512-kb EEPROM Embedded in a 32-b Microcontroller," IEEE, Journal of Solid State Circuits, vol. 2 No. 4, Apr. 1992, pp. 574-581.|
|7||Dahl et al, "Emulation of the SPARCLE Microprocessor with the MIT Virtual Wireless Emulation System", Proc. IEEE Workshop FPGAs for Custom Comp. Machines, pp. 14-22, Apr. 1994.|
|8||Leonard, Milt, "Self-programming microcontroller networks sensors and transducers", Electronic Design, Feb. 9, 1998, pp. 92,94.|
|9||Motorola, Digital Signal Processor (DSP), Application Development System (ADS) User's Manual, Sections 1-6, non date.|
|10||Motorola, DSP56100 Technical Data, Section 10, On-Chip Emulation (OnCE), non date.|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US6996488 *||Oct 15, 2002||Feb 7, 2006||Advanced Custom Sensors, Inc.||Sensor signal conditioner|
|US7071861 *||Nov 13, 2001||Jul 4, 2006||Harman Becker Automotive Systems Gmbh||Apparatus and method for transmitting a digitized signal, and a data source and data sink to implement the method|
|US7271758 *||Jun 29, 2005||Sep 18, 2007||Silicon Laboratories Inc.||Gain adjust for SAR ADC|
|US7280051 *||Jul 3, 2006||Oct 9, 2007||Harman Becker Automotive Systems Gmbh||Transmission and reception of a decomposed digitized signal|
|US7567894 *||Sep 5, 2006||Jul 28, 2009||Eric Durand||Monitoring physical parameters in an emulation environment|
|US7848914||Jul 15, 2009||Dec 7, 2010||Mentor Graphics Corporation||Monitoring physical parameters in an emulation environment|
|US7983893||Jan 8, 2008||Jul 19, 2011||Mentor Graphics Corporation||Fault support in an emulation environment|
|US8195446||Nov 17, 2010||Jun 5, 2012||Mentor Graphics Corporation||Monitoring physical parameters in an emulation environment|
|US8214192||Feb 27, 2008||Jul 3, 2012||Mentor Graphics Corporation||Resource remapping in a hardware emulation environment|
|US8214195||Mar 21, 2008||Jul 3, 2012||Mentor Graphics Corporation||Testing in a hardware emulation environment|
|US8429114||Sep 29, 2010||Apr 23, 2013||Nokia Corporation||Method and apparatus for providing low cost programmable pattern recognition|
|US8473273||Jul 18, 2011||Jun 25, 2013||Mentor Graphics Corporation||Fault support in an emulation environment|
|US8473275 *||May 22, 2008||Jun 25, 2013||Cypress Semiconductor Corporation||Method for integrating event-related information and trace information|
|US8645118||Jun 24, 2013||Feb 4, 2014||Mentor Graphics Corporation||Fault support in an emulation environment|
|US8666721||Jun 4, 2012||Mar 4, 2014||Mentor Graphics Corporation||Resource remapping in a hardware emulation environment|
|US8994569 *||Sep 11, 2013||Mar 31, 2015||Renesas Electronics Corporation||Semiconductor integrated circuit device|
|US9026423||Dec 26, 2013||May 5, 2015||Mentor Graphics Corporation||Fault support in an emulation environment|
|US9047270||Jan 18, 2013||Jun 2, 2015||Freescale Semiconductor Inc.||DMA-assisted irregular sampling sequences|
|US9262567||Feb 12, 2014||Feb 16, 2016||Mentor Graphics Corporation||Resource mapping in a hardware emulation environment|
|US9300313 *||Mar 24, 2015||Mar 29, 2016||Renesas Electronics Corporation||Semiconductor integrated circuit device|
|US9323632||May 10, 2012||Apr 26, 2016||Mentor Graphics Corporation||Monitoring physical parameters in an emulation environment|
|US9331865||Dec 3, 2013||May 3, 2016||Nxp B.V.||Comparator circuit|
|US20020087513 *||Nov 13, 2001||Jul 4, 2002||Andreas Stiegler||Apparatus and method for transmitting a digitized signal, and a data source and data sink to implement the method|
|US20040070495 *||Oct 15, 2002||Apr 15, 2004||Advanced Custom Sensors, Inc.||Sensor signal conditioner|
|US20060129374 *||Dec 15, 2004||Jun 15, 2006||Larson Lee A||Apparatus and method for apparatus mediating voltage levels between an emulation unit and a target processor|
|US20070001890 *||Jun 29, 2005||Jan 4, 2007||Douglas Piasecki||Gain adjust for SAR ADC|
|US20070063878 *||Jul 3, 2006||Mar 22, 2007||Andreas Stiegler||Transmission and reception of a decomposed digitized signal|
|US20070198816 *||Nov 10, 2005||Aug 23, 2007||Chuan-Po Ling||Emulation system for a single-chip multiple-microcontroller and emulation method thereof|
|US20070203687 *||Sep 5, 2006||Aug 30, 2007||Eric Durand||Monitoring physical parameters in an emulation environment|
|US20080222453 *||May 22, 2008||Sep 11, 2008||Cypress Semiconductor Corporation||Method for integrating event-related information and trace information|
|US20090177459 *||Jan 8, 2008||Jul 9, 2009||Eric Durand||Fault support in an emulation environment|
|US20090182544 *||Jan 15, 2008||Jul 16, 2009||Eric Durand||Multiple chassis emulation environment|
|US20090216514 *||Feb 27, 2008||Aug 27, 2009||Eric Durand||Resource remapping in a hardware emulation environment|
|US20090240457 *||Mar 21, 2008||Sep 24, 2009||Eric Durand||Testing in a hardware emulation environment|
|US20090248390 *||Mar 31, 2008||Oct 1, 2009||Eric Durand||Trace debugging in a hardware emulation environment|
|US20090299723 *||Jul 15, 2009||Dec 3, 2009||Eric Durand||Monitoring physical parameters in an emulation environment|
|US20110119045 *||Nov 17, 2010||May 19, 2011||Mentor Graphics Corporation||Monitoring physical parameters in an emulation environment|
|US20140085121 *||Sep 11, 2013||Mar 27, 2014||Renesas Electronics Corporation||Semiconductor integrated circuit device|
|US20150194977 *||Mar 24, 2015||Jul 9, 2015||Renesas Electronics Corporation||Semiconductor integrated circuit device|
|U.S. Classification||341/155, 714/E11.216, 341/120|
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