|Publication number||US6853778 B2|
|Application number||US 10/246,308|
|Publication date||Feb 8, 2005|
|Filing date||Sep 18, 2002|
|Priority date||Sep 18, 2002|
|Also published as||US20040052464|
|Publication number||10246308, 246308, US 6853778 B2, US 6853778B2, US-B2-6853778, US6853778 B2, US6853778B2|
|Inventors||Rene P. Helbing, Kenneth R. Wildnauer|
|Original Assignee||Agilent Technologies, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (9), Referenced by (3), Classifications (20), Legal Events (10)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention is generally related to integrated optical systems. More particularly, the present invention is related to systems and methods for optically aligning separate optical components with each other.
In the field of optics, manufacturers of optical modules may choose to integrate planar optical components with non-planar components. For example, many passive optical components, such as optical waveguides, may be formed on a planar substrate. The planar substrate may be further configured to physically support active optical components, such as laser diodes. However, active optical components typically cannot be easily formed on these planar substrates based on waveguide technology. Typically, active optical components have to be added in a separate step. The technology involved in forming passive and active optical components on a substrate is typically called hybrid integration.
In order to maximize the amount of light transmitted through the optical system, the manufacturer attempts to align a component with an adjacent component in the optical system so that light energy is not lost at the junctions between components. The solution for aligning adjacent components in the prior art involves physically moving the components with respect to each other until an optimum alignment is reached. In particular, light is transmitted through a fixed component while the other component is moved with respect to the fixed component. A light sensor measures the light energy received at the moveable component at different positions until an optimal light level is reached at a particular position. At this point, the components are secured by an adhesive material to avoid movement of one component relative to the other.
One inadequacy of the prior art solution is that the components may be inadvertently moved during the step of applying the adhesive material. Since a force is applied to the components during the application of the adhesive material, any displacement caused by the force may result in an undesirable misalignment. Furthermore, after the application of adhesive material, the components may experience physical forces that slightly alter the position of the components with respect to each other. With the use of extremely small optical components, the change in position on the order of a few microns may cause a significant loss in light transmission, thereby degrading the optical system.
Another inadequacy of the prior art alignment methods is that the process involved in physically moving components by slight incremental movements, measuring, re-measuring at more locations, and locating the optimum position for alignment can be an expensive and time-consuming procedure. Thus, a need exists in the industry to address the aforementioned perceived deficiencies and inadequacies.
The present disclosure defines methods and systems for aligning optical components in an optical module and methods of manufacturing an optical module. The optical module optically aligns optical components adjacently located within an optical system. The optical module includes a substrate and at least one groove formed in the surface of the substrate for pre-aligning the optical components. The optical module further includes a waveguide core that extends from a light-guiding portion of one optical component to a light-guiding portion of the other optical component.
The waveguide core is formed on the substrate and extends from one optical component to the other to guide light between the optical components more effectively than the prior art solutions. The custom waveguide core overcomes the deficiencies of the prior art by taking into account any misalignment between the coarsely-aligned optical components.
Other systems, methods, features, and advantages of the present invention will be apparent to one having skill in the art upon examination of the following drawings and detailed description. It is intended that all such additional systems, methods, features, and advantages be included within this description, be within the scope of the present invention, and be protected by the accompanying claims.
Many aspects of the invention can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present invention. Like reference numerals designate corresponding parts throughout the several views.
The present disclosure applies to the field of optics, optical modules, and optical systems wherein light and other types of radiation are conveyed along pre-determined paths. The term “optical” used herein may also refer to electro-optical systems. Disclosed are optical modules and methods of manufacturing such optical modules in which a custom waveguide is fabricated to guide light between two optical components. The manufacturing method includes a pre-alignment process of forming grooves within a substrate for providing a coarse pre-alignment of the two optical components. The pre-alignment process uses one or two grooves that accept and coarsely align the optical components. With the components pre-aligned by the pre-alignment grooves, a second portion of the process configures and fabricates a waveguide core that guides light across a gap between the two optical components. The waveguide core is shaped to account for residual mis-alignment of the optical components and transmits light from one optical component to the other.
The waveguide core is formed by applying a waveguide layer to the surface of the substrate. The waveguide layer may be added before grooves are formed in the substrate and the optical components are pre-aligned. In an alternative embodiment, the waveguide layer is added after a single groove has been formed in the substrate and the optical components have been pre-aligned. The unwanted portions of the waveguide layer are removed so that only the waveguide core remains. The unwanted portions may be removed by any number of techniques. For example, a positionally-controlled laser may be utilized to emit light waves to the unwanted portions. Alternatively, an electron or light beam may be applied to remove the unwanted portions. Other techniques may be used to remove the unwanted portions and to form the waveguide core between the optical components. The waveguide core is created with a shape that directs a maximum amount of light from one optical component to another, thereby providing fine alignment of the adjacent optical components. Additionally, a cladding material may be applied to the waveguide core to enhance light-guiding and for protection.
More particularly, the grooves 16 are formed such that the light-guiding portions 20 of the optical components 14 are axially-aligned. When the external topologies of the two optical components 14 differ or when the optical axes of the light-guiding portions 20 of the two optical components 14 are offset, the grooves 16 are formed to minimize the mis-alignment. The grooves 16 in this case are formed separately with different physical dimensions to account for the topological differences of the optical components 14. Thus, when optical components 14 having axially-offset light-guiding portions 20 are seated in the grooves 16, the differences in the physical dimensions of the grooves 16 compensate for the offset and coarsely pre-align the two optical components 14.
It should be noted that the grooves 16 may incidentally be formed having some degree of error, causing a slight misalignment of the optical components 14. Furthermore, the optical components 14 themselves may be slightly deformed such that an axis of the optical components placed in the grooves 16 are not parallel to the axes of the grooves 16. This too will result in an undesirable misalignment between the optical components. Another cause of misalignment may be an optical component 14 improperly seated within the groove 16. Regardless of the cause of misalignment, a waveguide core 18 is formed between the optical components 14 in accordance with the present invention in order to correct any misalignment and to maximize the amount of light transmitted from one component to another. The waveguide core 18 extends from the light-guiding portion 20 of one optical component 14 to the light-guiding portion 20 of the other optical component 14. Illustrated in
The substrate 12 supports a waveguide layer 22, which is affixed to the substrate 12. The embodiment of
Alternatively, the waveguide layer 22 may comprise a photosensitive material. The photosensitive material has a refractive index that changes when exposed to light. The exposed region changes such that light is guided through the exposed portion of the waveguide layer. The refractive index of the unexposed region remains unchanged such that it confines the light to the waveguide portion. To form a waveguide core from the photosensitive waveguide layer 22, the waveguide region of the photosensitive waveguide layer 22 is exposed to light.
The grooves 16 are further formed having an alignment face 24 that is orthogonal to a plane of a top surface 25 of the waveguide layer 22 and orthogonal to the long axis of the grooves 16. The term “top surface” is used herein to refer to a surface of layers or substrates oriented as shown in the drawings. However, it should be understood that the “top surface” may actually be a side surface or a bottom surface if the optical module 10 is oriented in space in a manner that is different from the orientation shown.
The alignment face 24 has a surface against which an optical component 14 is abutted when the optical component 14 is inserted in the groove 16. Preferably, the alignment face 24 is shaped similarly to the shape of the end of the optical component 14, thus providing more positive and repeatable alignment. Shaping the alignment face 24 similarly to the end may additionally prevent stray particles from entering the space between the optical component 14 and the alignment face 24, thus interfering with the transmission of light.
In this embodiment, the waveguide layer 22 is applied to the substrate 12 at a later time in the manufacturing process, after the optical components have been coarsely pre-aligned on the substrate 12. In this case, the waveguide layer 22 more easily fills the gap between the optical components and provides a continuous path from one optical component to the other. The continuous path lacks undesirable gaps between the optical components and the waveguide layer 22.
Each optical component 14 is inserted within a respective groove 16 such that an end 30 of the optical component 14 faces the opposite component and abuts the alignment face 24. If the optical component 14 does not have a face that is orthogonal to the axis of the optical component 14, then the respective groove 16 may be formed such that the alignment face 24 conforms to the shape of the end 30 of the optical component 14 or a portion of the end 30. When the optical components 14 are placed in the grooves 16, the light-guiding portions 20 are directed toward each other through the interposed portion of the waveguide layer 22. At this stage, the optical components 14 are coarsely pre-aligned so that a substantial amount of light is transmitted between the optical components 14.
The optical components 14 are secured within the grooves 16 using an adhesive material, solder, or other suitable fixing material. A force-applying fixture (not shown) may be used to press the optical component 14 into the groove 16 until the fixing material takes hold. At this stage, the two optical components 14 are secured to the substrate 12 and are coarsely pre-aligned with each other. The waveguide core 18, illustrated in
In this alternative embodiment, it may be desirable if the two optical components 14 are identical or similar to form the groove transversing the length of the substrate 12. A single groove enhances the pre-alignment of identical optical components 14 since the optical components 14 are placed in the same groove. With the optical components 14 pre-aligned in this configuration, the waveguide layer 22 may be added by filling part of the single groove between the ends 30 of the optical components 14 with the waveguide material. In this case, it may also be desirable to form a deep groove as shown in
The waveguide forming apparatus 50 is made up of an image-capturing device 52 for capturing an image of the region at least between the ends 30 of the optical components 14. The image-capturing device 52 may include a camera or other type of optical detecting device and may include charge coupled devices (CCDs), for example. The image-capturing device 52 may be configured to additionally view a region around the ends 30 of each of the optical components 14. Image data representing the image received by the image-capturing device 52 is transmitted to an image recognition circuit 54. The image recognition circuit 54 analyzes the image data from the image-capturing device 52 to determine the physical features of each optical component 14, the light patterns emitted from the optical components 14, or both.
The image recognition circuit 54 may be programmed to identify structural features of the optical components 14. For example, the image recognition circuit 54 may recognize the external dimensions or physical features of the optical components 14 to determine any misalignment of the components. Alternatively, the image recognition circuit 54 may recognize alignment marks located on the top or sides of the optical components 14. The alignment marks indicate the direction of a beam of light entering or leaving the optical component 14. The alignment marks also indicate the position at which the beam of light enters or leaves the optical component 14.
The image recognition circuit 54 may be configured in another alternative embodiment to recognize light patterns in the image data. In this embodiment, a light source (not shown) is connected to an outside end of one of the optical components 14 to transmit light therethrough. The optical component 14 transmits a beam of light in the direction of the other optical component 14. The image-capturing device 52 may capture an image of the misalignment of one of the beams of light 38 or 44 shown in
When an active optical component, such as a laser diode, is to be aligned according to this embodiment, the active optical component may be activated to emit the light that is detected by the image-capturing device 52. In this embodiment involving active optical components, the image-capturing device 52 may capture an image of one of the light beams 38 or 44 shown in
From the signals output from the image recognition circuit 54, the waveguide configuring circuit 56 determines the dimensions and location of the waveguide core to be created. The waveguide configuring circuit 56 configures the waveguide core using an algorithm that maximizes the amount of light transmitted from one optical component 14 to another. For example, one algorithm may be used that models a straight waveguide core extending from the end of the light-guiding portion 20 of one optical component 14 to the end of the light-guiding portion 20 of the other component. An alternative algorithm may be used in which the waveguide configuring circuit 56 models a waveguide core having sections that start in the direction of the beams of light entering or leaving each of the optical components 14 and configures a curved middle section having maximum radii of curvature that connects the outer sections. The curved middle section may be configured as an S-shaped middle section 42 as shown in
When the waveguide configuring circuit 56 has determined a configuration of a waveguide core, the waveguide core is formed. Configuration signals are transmitted to a laser controller 58, which controls a laser 60 to create a waveguide core pattern according to the configuration determined by the waveguide configuring circuit 56. The laser controller 58 and laser 60 may be replaced by an alternative waveguide core forming apparatus, such as an apparatus for directing an electron beam at portions of the waveguide layer 22. In addition, the waveguide core forming apparatus operates according to the material that is applied as the waveguide layer 22. For instance, when the waveguide layer 22 constitutes a transparent layer, the laser 60 removes the unwanted portions of the waveguide layer 22 using a technique such as laser ablation. In the example in which the waveguide layer 22 constitutes a photosensitive layer, the laser controller 58 controls the laser 60 to direct light toward the portions of the waveguide layer 22 that are to become the waveguide core. Since the exposed portions of the photosensitive layer become transparent, the exposed portions create the light-guiding portion of the waveguide. The portions that are not exposed remain opaque.
Other techniques may be used to form the waveguide core according to the configuration created by the waveguide configuring circuit 56. For example, a photoresist layer and a mask defined by waveguide configuring circuit 56 may be formed on the waveguide layer 22. Using known pattern forming methods, the photoresist layer and mask are used to define the shape of the waveguide core.
The image recognition circuit 54 and waveguide modeling circuit 56 can be implemented in hardware, software, firmware, or a combination thereof. In the disclosed embodiments, the image recognition circuit 54 and waveguide modeling circuit 56 are implemented in software or firmware that is stored in a memory and that is executed by a suitable instruction execution system. If implemented in hardware, as in an alternative embodiment, the image recognition circuit 54 and waveguide modeling circuit 56 can be implemented with any or a combination of the following technologies, which are all well known in the art: a discrete logic circuit having logic gates for implementing logic functions upon data signals, an application specific integrated circuit (ASIC) having appropriate combinational logic gates, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.
In block 76, a waveguide layer is applied in the groove between the optical components. Different materials may be applied as the waveguide layer. One material that may be applied is a layer of a material that has a material that effectively conducts light. Another material that may be applied is a photosensitive layer that has a refractive index that changes when exposed to light. Layers of a photoresist and a mask may be applied as the waveguide layer.
Before the waveguide layer is applied, it may be desirable to add a shallow layer to a bottom portion of the groove. The shallow layer acts as a pedestal layer on which the waveguide layer rests. Thus, when the waveguide layer is applied, the shallow layer supports the waveguide layer at a level such that the waveguide layer is adjacent to the light-guiding portions of the optical components. With the optical components seated within the single groove and the waveguide layer formed between the optical components, flow proceeds to block 78.
In block 78, the configuration of a waveguide core is determined. The waveguide core configuration may be determined from images of a region of the optical module using a waveguide core customization algorithm. In block 80, the waveguide core is formed from the waveguide layer based on the waveguide core configuration determined in block 78. If the waveguide layer is a transparent layer, the forming procedure may include etching, laser ablation, or other suitable material-removing technique. If the waveguide layer is a photosensitive layer, a pattern of light may be emitted on the photosensitive layer to form the waveguide core. If the waveguide layer is a photoresist, portions of the waveguide layer may be exposed through a mask defined in block 78 and developed according to known manufacturing techniques. In block 82, a cladding material is added.
In block 92, the configuration of a waveguide core is determined. The waveguide core configuration may be determined from images of a region of the optical module. Using a waveguide core customization algorithm, for example, the images may be analyzed to determine the configuration of the waveguide core. In block 94, the waveguide core is formed from the waveguide layer based on the waveguide core configuration determined in block 92. If the waveguide layer is a transparent layer, the forming procedure may include etching, laser ablation, or other suitable material-removing technique. If the waveguide layer is a photosensitive layer, a pattern of light may be emitted on the photosensitive layer to form the waveguide core. If the waveguide layer is a photoresist, portions of the photoresist may be exposed through a mask defined in block 92. The photoresist is then developed according to known manufacturing techniques to remove all but the waveguide core. In block 96, a cladding material is added.
In block 100, features or portions of the captured image are recognized to extract significant features that may help in defining a waveguide configuration that efficiently and effectively transmits light from one optical component to another. After recognizing portions of the detected image, the procedure shown in block 102 is performed in which the waveguide core configuration is determined. A custom algorithm may be used to determine the waveguide core configuration from the features recognized in block 100.
It should be emphasized that the above-described embodiments of the present invention are merely examples of possible implementations, set forth for a clear understanding of the principles of the invention. Many variations and modifications may be made to the above-described embodiments of the invention without departing from the principles of the invention. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5046808||Dec 18, 1989||Sep 10, 1991||Litton Systems, Inc.||Integrated optics chip and method of connecting optical fiber thereto|
|US5359687 *||Aug 23, 1993||Oct 25, 1994||Alliedsignal Inc.||Polymer microstructures which facilitate fiber optic to waveguide coupling|
|US5533156 *||May 12, 1995||Jul 2, 1996||British Telecommunications, Plc||Integrated opitcal fibre and substrate supported optical waveguide having directly connected optical cores|
|US5600745 *||Feb 8, 1996||Feb 4, 1997||Industrial Technology Research Institute||Method of automatically coupling between a fiber and an optical waveguide|
|US5854868 *||Aug 9, 1996||Dec 29, 1998||Fujitsu Limited||Optical device and light waveguide integrated circuit|
|US6157759 *||Jun 30, 1998||Dec 5, 2000||Samsung Electronics Co., Ltd.||Optical fiber passive alignment apparatus and method therefor|
|US6300151||Sep 23, 1999||Oct 9, 2001||Lg Cable & Machinery, Ltd.||Method for manufacturing laser diode chip, optical transmitting/receiving module and method for aligning positions thereof|
|US6316281||Sep 10, 1999||Nov 13, 2001||Electronics And Telecommunications Research Institute||Method for fabricating a hybrid optical integrated circuit employing SOI optical waveguide|
|US6782170 *||Jan 5, 2001||Aug 24, 2004||Triquint Technology Holding Co.||Optical device having a reference mark system|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8830466||Nov 12, 2012||Sep 9, 2014||Cisco Technology, Inc.||Arrangement for placement and alignment of opto-electronic components|
|US8971679||Sep 13, 2013||Mar 3, 2015||Optonet Inc.||Apparatus and method for passive alignment of optical devices|
|US9417412||Jul 24, 2014||Aug 16, 2016||Cisco Technology, Inc.||Arrangement for placement and alignment of opto-electronic components|
|U.S. Classification||385/49, 385/97|
|International Classification||G02B6/42, G02B6/30, G02B6/13, G02B6/36|
|Cooperative Classification||G02B6/42, G02B6/3692, G02B6/30, G02B6/3636, G02B6/3652, G02B6/423, G02B6/3688, G02B6/13, G02B6/4221|
|European Classification||G02B6/36M2G, G02B6/42, G02B6/13, G02B6/42C5A2, G02B6/30|
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