|Publication number||US6855791 B2|
|Application number||US 10/267,197|
|Publication date||Feb 15, 2005|
|Filing date||Oct 8, 2002|
|Priority date||Jul 9, 2002|
|Also published as||CN1642706A, CN100404225C, EP1534494A1, EP1534494A4, US20040010068, WO2004004998A1|
|Publication number||10267197, 267197, US 6855791 B2, US 6855791B2, US-B2-6855791, US6855791 B2, US6855791B2|
|Inventors||John C. Van Doren, Richard Magill, Bruce Sellers, Tim Erickson, Scott Schnieder, Steve Courington, Lance Bethel|
|Original Assignee||Signature Control Systems|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (56), Non-Patent Citations (34), Referenced by (18), Classifications (28), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention relates to a new and improved process and apparatus for monitoring and controlling the vulcanization of natural and synthetic rubber compounds containing fillers such as carbon black, oils, clay, and the like. Typical base rubber polymers which may be employed include styrene-butadiene, polybutadiene, polyisoprene, ethylene-propylene, butyl, halobutyl, nitrile, polyacrylic, neoprene, hypalon, silicone, fluorcarbon elastomers, polyurethane elastomers, and mixtures thereof.
Heretofore methods of applying fixed process parameters to the processing of polymeric rubber compounds during vulcanization have resulted in both reduced productivity due to overly conservative cure times and poor product uniformity due to the inability of the fixed process parameters to accommodate the inherent variability in the process.
The relationship of dielectric properties and the state and rate of the cure of polymers well known. Related publications in this field include:
U.S. PATENT DOCUMENTS
Diehr,II et al.
Zsolnay, et al.
Senturia, et al.
Zsolnay, et al.
Yamaguchi, et al.
Hinrichs, et al.
Day, et al.
Harris, et al.
Persson, et al.
Lee, et al.
Keller, et al.
Stone, et al.
King, et al.
The prior art has clearly established the relationship between the dielectric (herein also referred to as “impedance”) properties of polymeric resins which exhibit rheometric and chemical behavior such as melt, volatile release, gelation, and crosslinking that can be recognized by dielectric means for those skilled both in the art and those resins' physical properties. However, unlike polymeric resins, polymeric rubber compounds do not melt or exhibit gelation during cure or vulcanization and are therefore much more difficult to characterize, monitor and control by dielectric means. Moreover, none of the prior art associated with polymeric rubber curing (also referred to as “vulcanization”) addresses the practical aspects of taking measurements directly in the production process, especially in the highly abrasive and high pressure environment of injection molding. Additionally the prior art does not show how to use the electrical data obtained to achieve closed-loop control of the curing or vulcanization process over a wide range of molding methods and conditions.
The prior art also does not show how to compensate the vulcanization process for variations in compound from batch to batch and within batches, and for differences in vulcanizate thickness. Additionally, the prior art does not compensate for additional variables, which are introduced into the process by the nature of the vulcanization equipment, tooling, and thermal history of the compound.
Moreover, the prior art uses dielectric or impedance measuring apparatus, which employ opposing and parallel electrodes of precise area and separation distance, and in which, the electrodes are in direct contact with the rubber compound. Although such electrodes and apparatus provide a means for measuring impedance properties during cure, they are entirely impractical for use in a production environment. For example, many rubber components are produced using injection molding technology which subjects the sensors to pressures up to 30,000 psi and temperatures up to 425° F. Moreover, due to the flow inside the mold during injection, in addition to the carbon and silica fillers present in many rubber compounds, the sensor must survive in a highly abrasive environment. Finally, the sensor must also be able to survive mold cleaning via typical cleaning methods such as CO2 and plastic bead blast.
Accordingly, it is desirable to have an apparatus and method for alleviating the above described drawbacks to using impedance data measurements for monitoring and controlling the vulcanization process. In this case, the impedance sensor provided at the vulcanization equipment is both extremely rugged and more easily used in that the electrodes need not be of precise area, need not be of precise separation distance from one another, need not be in direct contact with the material being vulcanized. In addition, a method is established for correlating the desired properties of the rubber product with the impedance measurements.
Definitions and Terms
Numerous technical terms and abbreviations are used in the description below. Accordingly, many of these terms and abbreviations are described in this section for convenience. Thus, if a term is unfamiliar to the reader, it is suggested that this section be consulted to obtain a description of the unknown term.
The present invention is a method and system for controlling the vulcanization (herein also denoted “curing”) of rubber polymeric compounds. In particular, the present invention includes novel features for monitoring the polymerization and determining in real-time the optimum cure time for the production of parts made from rubber polymeric compounds (herein also denoted as merely “rubber compounds”). According to the present invention, during the curing of rubber polymeric compounds distinctive impedance property versus time graphs (herein also denoted “process curves”) may be obtained from one or more capacitor circuits operatively configured so that such a rubber polymeric compound for curing becomes part of each such capacitor circuit, and in particular, becomes a dielectric for such circuits. More specifically, the present invention utilizes, e.g., shape or curve characteristics of the impedance (Z), phase angle (ø), resistance (R), reactance (X), conductance (G), or capacitance (C) versus time graphs derived from the signal responses output by the activation of one or more of these capacitor circuits, wherein such activation is the result of at least one, and more generally, a plurality of different signals being input to such capacitor circuits. Thus, in some embodiments of the present invention, the shape (or other computational characteristics) of a corresponding process curve for each of a plurality of different signal frequencies input to the capacitor circuits may be used in monitoring, controlling and/or predicting an outcome of a curing process.
In some embodiments of the present invention, various time series capacitor circuit output data components (i.e., impedance (Z), phase angle (ø), resistance (R), reactance (X), conductance (G), or capacitance (C)) are separately processed, thereby resulting in a process curve with distinctive shape (or other features) for each of these components. Accordingly, it is an aspect of the present invention that such features from impedance (Z), phase angle (ø), resistance (R), reactance (X), conductance (G), or capacitance (C) graphs (e.g., plotted versus time) can be used for monitoring and controlling the cure time by measuring a portion of the process curve and calculating or predicting the optimum cure time. Thus, since a particular shape (or other computational feature) of such process curves may be substantially repeatable for curing a particular material, such features can be effectively utilized in a mass production environment for producing consistent high quality cured products (e.g., seals, gaskets, and tires).
Moreover, it is a further aspect of the present invention that for a given material to be cured, the invention can identify at least some of the computational features of these process curves substantially independently of the configuration of the product being produced via the use of a “witness cavity” incorporated into the runner system of the mold, as one skilled in the art will understand. In particular, such computational features can be correlated with the chemical and rheometric changes occurring during the curing process.
Thus, although such process curves may vary in amplitude and duration (e.g., due to cured part thickness, thermal history, mold temperature and heat rate, curative level, compound batch variations, and various other factors), the present invention may be used for monitoring, controlling and/or predicting cure states of products in a mass production environment wherein the products being produced may be subject to significant process and rubber compound variation.
For example, for a particular sample or product to be cured, properties of one or more of the above described process curves can be calculated for a specific measurement period wherein the portion of the data corresponding to the process curve of the sample may be correlated to a desired final cure state of the product, and accordingly, such a correlation can be used to establish a time for appropriately curing a part in production. In particular, the present invention predicts cure times as will be described more fully herein below. It is a further aspect of the present invention, that for certain rubber compounds, the corresponding shape of one or more of the above described process curves may exhibit a “maxima” and/or a “minima” at a given time which can also be used to infer useful information in monitoring, controlling and/or predicting the cure time.
It is a further aspect of the present invention that embodiments thereof include signal processing and other software and hardware (“components”) for both deriving such computational features of the process curves obtained from a rubber compound being cured, and utilizing such features to determine in real-time the optimum cure time for each production cure cycle.
Moreover, it is an aspect of the present invention that such cure times are determined to achieve a desired property such as tensile strength, dynamic stiffness, or compression set in the resulting cured part.
Additional aspects, features and benefits of the present invention will become evident from the accompanying drawings and the detailed description herein below.
The scope of the invention can fundamentally be broken into five key elements, which together form the equipment and tools necessary for use of the impedance property monitoring in injection and other rubber molding environments such as compression molding, transfer molding, and the like. These elements are described as follows:
Element 1: Production-Capable Sensor
The prior art uses dielectric or impedance measuring apparatus that employ opposing and parallel electrodes of precise area and separation distance. Additionally, the metallic electrodes are typically in direct contact with the rubber compound. Although such electrodes and apparatus provide a means for measuring impedance properties during cure, they are entirely impractical for use in a production environment. For example, many rubber components are produced using injection-molding technology that subjects the sensors to pressures up to 30,000 psi and temperatures up to 425° F. Moreover, due to the flow inside the molds during injection, and the carbon and silica fillers present in many rubber compounds, the sensor must survive in a highly abrasive environment. Finally, the sensor must be able to survive mold cleaning via the use of CO2 bead blast, plastic bead blast, and the like.
Accordingly, it is desirable to have a sensor for alleviating the above described drawbacks to using in-situ impedance data for monitoring and controlling the vulcanization process, wherein the impedance sensor provided at the vulcanization equipment is both extremely rugged and more easily used in that the electrodes need not be of precise area, need not be of precise separation distance from one another, and need not be in direct contact with the material being vulcanized. Thus, as will be described hereinbelow, the impedance measuring components of the present invention not only includes a production capable sensor, but also may include at least portions of the vulcanization equipment and its associated tooling, wherein such vulcanization equipment can include: injection molding machines, compression and transfer molding presses, belt making presses, autoclaves, tire molding machines, and the like. Additionally, such associated tooling can include: injection molds, compression and transfer molds, mandrels, platens, tire molds, and the like, as one skilled in the art will understand.
The impedance sensor that meets these requirements includes a primary electrode 10 that serves as a capacitor plate. An additional capacitor, acting as a guard electrode 11, rings the primary electrode of each sensor. The guard electrode 11, which is excited along with the electrode 10 helps to preclude the field induced at the primary electrode 10 of the sensor from fringing or becoming non-linear. Both electrodes may be a low CTE metallic material, such as Kovar, embedded in a layered ceramic circuit using methods developed by Lamina Ceramics of Princeton, N.J. or in another embodiment shown in
Therefore the production-ready sensor is an extremely rugged device, capable of survival in a high pressure, high abrasion, and high temperature environment. The fundamental electrical function of the sensor is to act as a guarded or shielded electrode, forming a single plate of a capacitor.
Any other planar or semi-planar conductive surface within the interior of the vulcanizing equipment can serve as the opposing electrode plate of the capacitor. Note that the opposing plate acts as the third electrode of the capacitor, and thus the opposing plate electrically couples with the primary electrode. Further note that the opposing plate is grounded 25 to provide a common signal reference point.
The vulcanizing rubber compound 16 in the injection mold 18 then becomes the dielectric within the formed capacitor, as it is sandwiched between the sensor 17 and the surface of the mold 18 or metallic insert within the part being molded (the opposing electrode). Since the dielectric properties of the rubber change as the rubber vulcanizes, the impedance of the formed capacitor changes as well, which allows for a non-invasive method of monitoring and controlling vulcanization in the mold 18.
The sensor may be flush mounted in the mold in contact with the part being molded or located in contact with the runner system feeding the part cavity, or alternately may be located in contact with a “witness cavity”. A witness cavity is a small cavity that is machined into the mold to allow the sensor to measure rubber cure without the sensor being in direct contact with the curing part. In some applications, the parts are too small or the dimensional specifications are too strict to allow sensor placement directly on the part. In these cases, a witness cavity is machined into available space in the mold and the sensor monitors curing in the witness cavity. For example, the witness cavity may be placed in the injection runner system of a mold. Since this rubber is from the same batch, sees the same mold temperature, and experiences the same heat history, it provides a good representation of curing behavior observed in the part itself. In addition, more than one sensor can be used to monitor the process, and the lagging sensor from cycle to cycle can be used to control the end point of any given cure cycle.
Element 2: Sensor Circuit (Non-Bridged)
The second key element in this invention involves the method by which the electrical circuit is completed. Electrical circuits described in prior art typically involve the use of bridge circuits, which are often complex and poorly suited for automation, in that the bridge circuits typically require an operator to manually balance the bridge.
The sensor circuit used in this invention involves only a simple RC voltage divider, wherein the current is driven to the grounded 25 mold 18 (the opposing capacitor plate) through the curing rubber. A load resistor 19 (typically 200 k-ohm) is placed in line with the flow of current, and the resultant voltage 20, V2 across the resistor 19 is measured with a high precision amplifier. By simultaneously measuring the applied voltage (also known as the excitation voltage), it is then possible to readily determine the amount of attenuation and phase shift resultant from the flow of complex current.
The following description assumes a voltage amplitude of 1 volt for the excitation V0. However, all the subsequent analysis remains the same if the voltage is not unity; in the non-unity cases, k becomes the ratio of the negative pin voltage and the positive pin voltage.
From the illustration above, the excitation voltage 21 (V0=sinωt) drives a complex current (I*) through the resistor 19, R to ground 25. V0 is a digitally generated sine wave, generated by a high-speed data acquisition card, such as the PCI-MIO-16E4 card manufactured by National Instruments of Austin, Tex., that produces high quality sinusoidal signals at frequencies varying from 10 Hz to 10 kHz (as specified by the user). A voltage drop occurs across the load resistor 19, leaving an attenuated and phase shifted signal at the negative pin 22, V1=ksin(ωt+θ)=k<θ, where < is used to denote the term “at a phase angle of.” The rubber compound 23 between the sensor 24 and electrically grounded 25 mold 18 provides a complex impedance of magnitude Z at phase angle Φ. However, it is within the scope of the present invention that the upper range of the frequencies used by embodiments of the present invention may extend to 100kHz.
Element 3: Demodulation of the Sensor Signal.
Calculating Z and Φ is done by simultaneously digitally capturing the excitation signal V0 (sin(ωt)) and the amplifier output voltage V2 20, where V2=sin(ωt)−ksin(ωt+θ). The previously referenced high-speed data acquisition card is used to digitize the signals V0 21 and V2 20, preserving the digital representation of the waveforms for further digital signal processing.
Provided with the digitally preserved signals V0 21 and V2 20, measurement of the quantities k and θ is done via standard demodulation practices, as is understood by one skilled in the art.
Once the quantities k and θ have been measured, determination of Z and Φ is done by analyzing the circuit described in FIG. 3.
Any of the data pairs (Z and Φ, R and X, G and C) can then be used to represent the resultant cure data (also referred to as “process curves”).
Element 4: Methodology for Establishing Control Algorithms
Given that impedance property data (Z and Φ, R and X, G and C) is observed and recorded during a cure, as depicted in
The process for algorithm development is outlined below:
Embodiment 1 (Algorithm Development using Production Mold and Rheometer):
5 F. below nominal
5 F. below nominal
5 F. below nominal
5 F. above nominal
5 F. above nominal
5 F. above nominal
Proper Cure Case Batch time (T90: number Mold temperature number seconds) 01 5 F. below nominal Batch A 120 02 5 F. below nominal Batch B 135 03 5 F. below nominal Batch C 142 04 nominal Batch A 100 05 nominal Batch B 110 06 nominal Batch C 115 07 5 F. above nominal Batch A 90 08 5 F. above nominal Batch B 95 09 5 F. above nominal Batch C 98
Fundamentally, the purpose of the rheometry is to establish the relative cure rates under various conditions. Since in-mold conditions will vary significantly from rheometric instrument conditions, the optimum production cure time may not be the same as the T90 time from the rheometer. However, the rheometer data does provide useful information regarding the relative cure rates and times observed due to rubber compound batch and cure variations.
5 F. below nominal
01, 02, 03
5 F. below nominal
04, 05, 06
5 F. below nominal
07, 08, 09
10, 11, 12
13, 14, 15
16, 17, 18
5 F. above nominal
19, 20, 21
5 F. above nominal
22, 23, 24
5 F. above nominal
25, 26, 27
time of max
5 F. below
5 F. below
5 F. below
5 F. below
5 F. below
5 F. below
5 F. below
5 F. above
5 F. above
(8) At this point the cure control equation is defined, with the exception that the equation is truly only responsive to changes in the process that effect cure rate, and it does not necessarily provide the specific cure state desired. This is due to the fact that the rheometric T90 times used in the correlation are only relative and may not provide the specific property desired in the production-molded product. In order to adjust the cure control equation to provide the true optimum cure time, it also has a linear adjustment (known as “the modifier”) that will allow it to operate at some multiple of its standard output. The modifier is factored into the cure control equation as follows:
In the example previously discussed, a customer may desire to consistently have compression set values of less than a certain amount (9%, for example). Given that specification, it is clear that a modifier of at least 0.8 would be required, and to include some safety factor, 0.9 may be more appropriate. Any higher modifier setting will simply extend cure time without improving compression set. Any lower modifier setting will not provide the specified compression set value. After choosing the appropriate modifier the algorithm is ready to be used to control the process 33.
The process for developing a control algorithm described in Embodiment 1 is also shown in FIG. 9.
Embodiment 2 (Algorithm Development using Rheometer Only):
In an alternate embodiment of the invention, a production press need not be used for the initial stages of the algorithm development. Instead, a sensor can be installed directly into the rheometer, and the impedance data and rheometry can be collected simultaneously. A production press is still required to set the modifier, as described in Step 8 of Element 4.
Element 5: Real-Time Control Application
The control system and its relationship to the vulcanization equipment 45 is shown in FIG. 10. The control unit is equipped with:
The actual control of the production press is a relatively straight-forward process as shown in FIG. 11. The process can be summarized as follows:
While various embodiments of the present invention have been described in detail, it is apparent that modifications and adaptations of those embodiments will occur to those skilled in the art. It is to be expressly understood, however, that modifications and adaptations are within the scope of the present invention, as set forth in the following claims.
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|US20050064196 *||Aug 5, 2004||Mar 24, 2005||Jean Martin||Low-friction sliding member and low-friction sliding mechanism using same|
|US20050100701 *||Aug 6, 2004||May 12, 2005||Nissan Motor Co., Ltd.||Sliding member and production process thereof|
|US20050118426 *||Jan 12, 2005||Jun 2, 2005||Shojiro Miyake||Slidably movable member and method of producing same|
|US20050119785 *||Mar 11, 2004||Jun 2, 2005||Signature Control Systems||Process and apparatus for improving and controlling the vulcanization of natural and synthetic rubber compounds|
|US20050213854 *||May 6, 2005||Sep 29, 2005||Nissan Motor Co., Ltd.||Low-friction sliding mechanism|
|U.S. Classification||526/335, 156/338, 73/861.14, 264/331.13, 264/171.1, 374/1, 264/216|
|International Classification||B29D30/06, G01N11/00, B29C35/02, G01N27/22, G01N27/02, G01N33/44, B29C65/00, B29C39/00, C08F36/00, C08K3/34|
|Cooperative Classification||B29L2030/00, B29D30/0601, B29L2031/265, B29L2031/26, B29D2030/0677, B29K2021/00, G01N33/445, B29C35/0288|
|European Classification||B29D30/06B, B29C35/02R, G01N33/44B|
|Oct 8, 2002||AS||Assignment|
Owner name: SIGNATURE CONTROL SYSTEMS, COLORADO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:VAN DOREN, JOHN C.;MAGILL, RICHARD;SELLERS, BRUCE;AND OTHERS;REEL/FRAME:013427/0951
Effective date: 20021004
|Nov 19, 2007||AS||Assignment|
Owner name: GEF CLEAN TECHNOLOGY FUND, L.P.,MARYLAND
Free format text: SECURITY AGREEMENT;ASSIGNOR:SCS FOREST PRODUCTS, INC.;REEL/FRAME:020134/0139
Effective date: 20071108
Owner name: GEF CLEAN TECHNOLOGY FUND, L.P.,MARYLAND
Free format text: SECURITY AGREEMENT;ASSIGNOR:SIGNATURE CONTROL SYSTEMS, INC.;REEL/FRAME:020134/0146
Effective date: 20071108
|Aug 15, 2008||FPAY||Fee payment|
Year of fee payment: 4
|Oct 1, 2012||REMI||Maintenance fee reminder mailed|
|Feb 15, 2013||LAPS||Lapse for failure to pay maintenance fees|
|Apr 9, 2013||FP||Expired due to failure to pay maintenance fee|
Effective date: 20130215