|Publication number||US6862804 B2|
|Application number||US 10/627,918|
|Publication date||Mar 8, 2005|
|Filing date||Jul 28, 2003|
|Priority date||Jul 29, 2002|
|Also published as||DE60330422D1, EP1387442A1, EP1387442B1, US20040068868|
|Publication number||10627918, 627918, US 6862804 B2, US 6862804B2, US-B2-6862804, US6862804 B2, US6862804B2|
|Inventors||Atsushi Nishio, Takashi Kawasaki|
|Original Assignee||Mitsumi Electric Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (12), Referenced by (38), Classifications (22), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention relates to a method of mounting a camera module (particularly provided with a cellular phone) on a wiring board (circuit board).
Examples of the related-art method of mounting a camera module on a wiring board will be described with reference to
Since the camera module 1 is not sufficiently heat-resistant to withstand a furnace temperature of about 230 to 240° C. used in a reflowing process, it is impossible to perform the soldering with the reflowing process. Therefore, the mounting operation of the camera module 1 is manually executed with a manual soldering.
Also in this case, since it is impossible to perform the reflowing process due to the same reason as described above, the mounting operation is manually executed with the manual soldering.
Consequently, productivity (working efficiency) is low, and camera placement accuracy is poor.
It is therefore an object of the invention to provide a method of mounting a camera module on a wiring board, in which the working efficiency and the mounting precision are enhanced.
In order to achieve the above object, according to the invention, there is provided a mounting method, comprising steps of:
providing a wiring board provided with a first terminal;
providing a connector provided with a second terminal;
providing a camera module provided with a third terminal;
soldering the first terminal and the second terminal to mount the connector on the wiring board; and
mounting the camera module on the connector to electrically connect the second terminal with the third terminal.
Preferably, the soldering step is performed in a non-manual manner. Here, it is further preferable that the soldering step is performed with a reflowing process.
Preferably, the wiring board is a printed wiring board. Here, it is further preferable that the wiring board is a flexible printed board.
With the above configuration, since the automatic mounting such as the reflowing process can be adopted in the soldering step, as compared with the manual soldering, the working efficiency can be greatly enhanced, and besides the mounting precision can be enhanced.
Preferably, the camera module is detachably mounted on the connector.
With such a configuration, the camera module can be easily exchanged when the camera module is found to be defective.
The above objects and advantages of the present invention will become more apparent by describing in detail preferred exemplary embodiments thereof with reference to the accompanying drawings, wherein:
As a first embodiment of the invention,
In this embodiment, since the camera module 11 is mounted on the printed wiring board 12 through the connector 14, the automatic mounting using the reflowing process can be adopted when mounting the connector 14 on the printed wiring board 12. Therefore, as compared with the manual mounting, the working efficiency can be greatly enhanced, and besides the mounting precision can be enhanced.
In addition, since the camera module 11 is detachably fitted into the connector 14, if the camera module 11 is found to be defective in an inspection process or the like, this camera module can be easily exchanged.
As a second embodiment of the invention,
Also in this embodiment, the same advantages as explained with the first embodiment can be attained.
In the present invention, various modifications can be made without departing from the spirits of the invention, and such modifications fall within the scope of the invention.
For example, although the above explanation has been made for the case of mounting a camera module, the mounting method of the invention can be used for mounting, another parts or module such as a Bluetooth module, instead of the camera module.
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|Citing Patent||Filing date||Publication date||Applicant||Title|
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|U.S. Classification||29/840, 29/740, 348/E05.027, 29/833, 29/834, 29/832|
|International Classification||H05K3/30, H01L23/32, H05K1/18, H04N5/225|
|Cooperative Classification||Y10T29/53178, Y10T29/49144, Y10T29/49133, Y10T29/4913, Y10T29/49131, Y10T29/49149, Y10T29/49169, H01R12/7076, H04N5/2253, H05K3/301|
|European Classification||H01R23/68A, H04N5/225C3|
|Jul 28, 2003||AS||Assignment|
Owner name: MITSUMI ELECTRIC CO., LTD., JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NISHIO, ATSUSHI;KAWASAKI, TAKASHI;REEL/FRAME:014356/0620
Effective date: 20030723
|Sep 3, 2008||FPAY||Fee payment|
Year of fee payment: 4
|Aug 8, 2012||FPAY||Fee payment|
Year of fee payment: 8