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Publication numberUS6862804 B2
Publication typeGrant
Application numberUS 10/627,918
Publication dateMar 8, 2005
Filing dateJul 28, 2003
Priority dateJul 29, 2002
Fee statusPaid
Also published asDE60330422D1, EP1387442A1, EP1387442B1, US20040068868
Publication number10627918, 627918, US 6862804 B2, US 6862804B2, US-B2-6862804, US6862804 B2, US6862804B2
InventorsAtsushi Nishio, Takashi Kawasaki
Original AssigneeMitsumi Electric Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Method of mounting camera module on wiring board
US 6862804 B2
Abstract
A wiring board provided with a first terminal, a connector provided with a second terminal, and a camera module provided with a third terminal are provided. The first terminal and the second terminal are soldered to mount the connector on the wiring board. The camera module is mounted on the connector to electrically connect the second terminal with the third terminal.
Images(6)
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Claims(7)
1. A mounting method, comprising the steps of:
providing a wiring board provided with a first terminal;
providing a connector provided with a second terminal;
providing a camera module provided with a camera and a third terminal;
soldering the first terminal and the second terminal to mount the connector on the wiring board; and
mounting the camera module on the connector to electrically connect the second terminal with the third terminal.
2. The mounting method as set forth in claim 1, wherein the soldering step is performed in a non-manual maimer.
3. The mounting method as set forth in claim 2, wherein the soldering step is performed with a reflowing process.
4. The mounting method as set forth in claim 1, wherein the wiring board is a printed wiring board.
5. The mounting method as set forth in claim 1, wherein the wiring board is a flexible printed board.
6. The mounting method as set forth in claim 1, wherein the camera module is detachably mounted on the connector.
7. The mounting method as set forth in claim 1, wherein the camera is mounted so as to face away from the wiring board.
Description
BACKGROUND OF THE INVENTION

This invention relates to a method of mounting a camera module (particularly provided with a cellular phone) on a wiring board (circuit board).

Examples of the related-art method of mounting a camera module on a wiring board will be described with reference to FIGS. 4A through 5B.

FIGS. 4A and 4B show a method of mounting a camera module 1 on a printed wiring board (PWB) 2. As shown in FIG. 4A, terminals 3 of a printed circuit (not shown) are provided in an exposed manner on the printed wiring board 2. The camera module 1 is placed on the terminals 3, so that terminals 4 of the camera module 1 are connected respectively to the terminals 3 by solder 5 as shown in FIG. 4B.

Since the camera module 1 is not sufficiently heat-resistant to withstand a furnace temperature of about 230 to 240 C. used in a reflowing process, it is impossible to perform the soldering with the reflowing process. Therefore, the mounting operation of the camera module 1 is manually executed with a manual soldering.

FIGS. 5A and 5B show a method of mounting a camera module 1 on a flexible printed circuit (FPC) 6. As shown in FIG. 5A, terminals 7 of a printed circuit (not shown) are provided in an exposed manner on the flexible printed circuit 6. The camera module 1 is placed on the terminals 7, so that the terminals 4 of the camera module 1 are connected respectively to the terminals 7 by solder 8 as shown in FIG. 5B.

Also in this case, since it is impossible to perform the reflowing process due to the same reason as described above, the mounting operation is manually executed with the manual soldering.

Consequently, productivity (working efficiency) is low, and camera placement accuracy is poor.

SUMMARY OF THE INVENTION

It is therefore an object of the invention to provide a method of mounting a camera module on a wiring board, in which the working efficiency and the mounting precision are enhanced.

In order to achieve the above object, according to the invention, there is provided a mounting method, comprising steps of:

providing a wiring board provided with a first terminal;

providing a connector provided with a second terminal;

providing a camera module provided with a third terminal;

soldering the first terminal and the second terminal to mount the connector on the wiring board; and

mounting the camera module on the connector to electrically connect the second terminal with the third terminal.

Preferably, the soldering step is performed in a non-manual manner. Here, it is further preferable that the soldering step is performed with a reflowing process.

Preferably, the wiring board is a printed wiring board. Here, it is further preferable that the wiring board is a flexible printed board.

With the above configuration, since the automatic mounting such as the reflowing process can be adopted in the soldering step, as compared with the manual soldering, the working efficiency can be greatly enhanced, and besides the mounting precision can be enhanced.

Preferably, the camera module is detachably mounted on the connector.

With such a configuration, the camera module can be easily exchanged when the camera module is found to be defective.

BRIEF DESCRIPTION OF THE DRAWINGS

The above objects and advantages of the present invention will become more apparent by describing in detail preferred exemplary embodiments thereof with reference to the accompanying drawings, wherein:

FIG. 1 is a perspective view showing a mounting method of a camera module according to a first embodiment of the invention;

FIGS. 2A to 2D are perspective views showing each process of the mounting method;

FIG. 3 is a perspective view showing a mounting method of a camera module according to a second embodiment of the invention;

FIGS. 4A and 4B are perspective views showing a first related-art method of a camera module; and

FIGS. 5A and 5B are perspective views showing a second related-art method of a camera module.

DETAILED DESCRIPTION OF THE INVENTION

As a first embodiment of the invention, FIG. 1 shows a method of mounting a camera module 11 on a printed wiring board 12. Terminals 13 of a printed circuit (not shown) are provided in an exposed manner on the printed wiring board 12, and a connector 14 is fixedly secured onto the terminals 13 by soldering. The camera module 11 is then fitted into the connector 14, thereby mounting the camera module 11 on the printed wiring board 12.

FIGS. 2A to 2D show each process of mounting the camera module 11 on the printed wiring board 12. In FIG. 2A, solder 15 is placed on the exposed terminals 13 provided on the printed wiring board 12. The connector 14 is placed on the terminals 13 through the solder 15, and the automatic mounting of this connector is performed with a reflowing process as shown in FIG. 2B. Then, as shown in FIG. 2C, the camera module 11 is fitted into the connector 14, so that the camera module 11 is mounted on the printed wiring board 12 as shown in FIG. 2D.

In this embodiment, since the camera module 11 is mounted on the printed wiring board 12 through the connector 14, the automatic mounting using the reflowing process can be adopted when mounting the connector 14 on the printed wiring board 12. Therefore, as compared with the manual mounting, the working efficiency can be greatly enhanced, and besides the mounting precision can be enhanced.

In addition, since the camera module 11 is detachably fitted into the connector 14, if the camera module 11 is found to be defective in an inspection process or the like, this camera module can be easily exchanged.

As a second embodiment of the invention, FIG. 3 shows a method of mounting a camera module 11 on a flexible printed circuit 16. In this embodiment, solder 18 is first placed on terminals 17 of a not-shown printed circuit provided in an exposed manner on the flexible printed circuit 16. The connector 14 is then placed on the terminals 17 through the solder 18, and the automatic mounting of this connector is performed with the reflowing process. Finally, the camera module 11 is fitted into the connector 14, thereby mounting the camera module 11 on the flexible printed circuit 16. The flexible printed circuit 16 has sufficient heat-resistance to withstand the reflowing process.

Also in this embodiment, the same advantages as explained with the first embodiment can be attained.

In the present invention, various modifications can be made without departing from the spirits of the invention, and such modifications fall within the scope of the invention.

For example, although the above explanation has been made for the case of mounting a camera module, the mounting method of the invention can be used for mounting, another parts or module such as a Bluetooth module, instead of the camera module.

Patent Citations
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US5046953 *May 25, 1990Sep 10, 1991Hewlett-Packard CompanyMethod and apparatus for mounting an integrated circuit on a printed circuit board
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Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7112083 *Jun 30, 2004Sep 26, 2006Mitsumi Electric Co., Ltd.Connector for camera module use
US7121864 *Sep 30, 2005Oct 17, 2006Hon Hai Precision Ind. Co., Ltd.Module connector
US7179126 *May 11, 2006Feb 20, 2007Hon Hai Precision Ind. Co., Ltd.Electrical connector with improved terminals
US7241160Oct 3, 2006Jul 10, 2007Hon Hai Precision Ind. Co., LtdShielded electrical connector for camera module
US7255600Dec 30, 2005Aug 14, 2007Hon Hai Precision Ind. Co., Ltd.Module assembly and equipment for fitting the same
US7422482 *Aug 1, 2007Sep 9, 2008Hon Hai Precision Inc. Co., Ltd.Electrical connector having improved shield
US7435139 *Apr 3, 2007Oct 14, 2008Hon Hai Precision Ind. Co., Ltd.Electrical connector having improved shield
US7656593Jun 13, 2007Feb 2, 2010Satoshi DoImaging lens
US7682159 *Sep 27, 2007Mar 23, 2010Hon Hai Precision Industry Co., Ltd.Electrical connector and camera device having the same
US7699619Jan 26, 2006Apr 20, 2010Molex IncorporatedSocket for camera module
US7768720Apr 12, 2007Aug 3, 2010Satoshi DoImaging lens
US7830619Aug 29, 2007Nov 9, 2010Satoshi DoImaging lens
US7880981Dec 18, 2007Feb 1, 2011Satoshi DoImaging lens
US7918671 *Jul 13, 2004Apr 5, 2011Research In Motion LimitedMounting structure with springs biasing towards a latching edge
US8014083Aug 29, 2007Sep 6, 2011Satoshi DoImaging lens
US8023202 *Aug 29, 2007Sep 20, 2011Milestone Co., Ltd.Imaging lens
US8149525Mar 28, 2007Apr 3, 2012Satoshi DoImaging lens
CN100435430C *Jul 21, 2006Nov 19, 2008Smk株式会社Socket for electronic component mounting and contact tray therefor
Classifications
U.S. Classification29/840, 29/740, 348/E05.027, 29/833, 29/834, 29/832
International ClassificationH05K3/30, H01L23/32, H05K1/18, H04N5/225
Cooperative ClassificationH01R12/7076, H04N5/2253, H05K3/301
European ClassificationH01R23/68A, H04N5/225C3
Legal Events
DateCodeEventDescription
Aug 8, 2012FPAYFee payment
Year of fee payment: 8
Sep 3, 2008FPAYFee payment
Year of fee payment: 4
Jul 28, 2003ASAssignment
Owner name: MITSUMI ELECTRIC CO., LTD., JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NISHIO, ATSUSHI;KAWASAKI, TAKASHI;REEL/FRAME:014356/0620
Effective date: 20030723
Owner name: MITSUMI ELECTRIC CO., LTD. 2-11-2, TSURUMAKI, TAMA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NISHIO, ATSUSHI /AR;REEL/FRAME:014356/0620