US 6885277 B2
An externally adjustable RF impedance matching mechanism comprises an upper lid and a base containing a circuit element board therebetween. One or more than one precise adjustment device for adjusting impedance value are provided under the upper lid. Impedance adjustment is carried out by manually turning setting screws associated with the aid of spring force. Heat conductive material is coated between the circuit board and the base so that the device is able to operated at a high power. The expensive material such as ceramic is used in forming the coil board only so that material and the production cost are low.
1. An externally adjustable RE impedance matching mechanism comprising:
a) a base and an upper lid;
b) a circuit element board located between the base and the upper lid; and
c) at least one precise adjustment device having:
i) a plurality of springs; and
ii) at least one adjustment screw located between the plurality of springs and adjustably connecting one of the precise adjustment device to the upper lid, wherein each adjustment screw selectively moves one precise adjustment device to a predetermined distance from the circuit element board to adjust an RF impedance of the circuit element board, each of the plurality of springs pressing the at least one precise adjustment device away from the upper lid.
2. The externally adjustable RF impedance matching mechanism according to
3. The externally adjustable RF impedance matching mechanism according to
4. The externally adjustable RF impedance matching mechanism according to
5. The externally adjustable RF impedance matching mechanism according to
6. The externally adjustable RF impedance matching mechanism according to
7. The externally adjustable RF impedance matching mechanism according to
1. Field of the Invention
The present invention relates to an externally adjustable RF impedance matching mechanism and more particularly, to a dexterously constructed RF substrate layout and impedance matching mechanism design enable to manual adjust the impedance value from outside of the enclosure.
2. Description of the Prior Art
In supplying electric power from a source to a load with a favorable impedance matching state, it is important to use an effective impedance network or mechanism. Thereby adjusting the line inductance to match the load capacitance in the most optimistic condition is the crucial task for the RF power transmission.
In a conventional impedance matching structure shown in
Besides, the circuit element 81 constructed as such is then secured mounting to the base 82 with fixing saddles 84 at two sides thereof such that the electric board entraining the circuit element 81 will be deformed owing to thermal expansion. Further, such thermal expansion of the circuit board leads to loosening of the engagement between the circuit board and the thermal conductive base 82. As a result, from worse to worst, the accumulated heat inside the circuit element 81 raises up the temperature to the extent causing cracks in the inductance coil portion of the ceramic substrate shown in FIG. 5.
Such is the case that is always experienced by any conventional product. Therefore, aiming at the above depicted defects, the present invention is to propose a newly urbanized externally adjustable RF impedance matching mechanism capable of operating at high power with better impedance coupling result.
The major object of present invention is aimed to solve the heat dissipation problem. It is designed to separate handling the heated inductance device of the RF high power transmission network. Through the dedicated mechanism design, the circuit element board 3, divides into the heated coil board and auxiliary board, two parts. As to prevent the heat deform of the coil board in the present invention, a plurality of elastic studs is provided at four corner which is made by silicon rubber material can sustain the high power without affect elasticity. With this constant press force, its enable the coil board and base maintain the best thermal conductivity and resulting the best power dissipation condition. For the non-heating element, auxiliary board, thus can be changed to the regular fiber glass printing circuit board and reduce the material and production cost as well. Further more, through the external adjustment mechanism design enable turning the whole RF power transmission network into the best impedance (or inductance) matching condition. It will maintain the heat loss and residue in the coil board during the RF power transmission process. Therefore, the root cause of the over heating, deforming and cracking problems of the conventional products have essentially solved by the present invention.
Accordingly, to achieve the above mentioned object, the RF impedance mechanism of the present invention comprises an upper lid and a base containing a circuit element (impedance or inductance coil) board therein. One or more than one precise adjustment device is secured to the upper lid by several setting screws 4. Each of the screws is interposed through the upper lid and then screw down to the precise adjustment devices 5. And the several spirally coiled springs 6 setting between the upper lid and the precise adjustment device 5 will build up the spring force against the setting screws to screw up the precise adjustment device with the aid of the spring force so as to obtain a relevant value of impedance (or inductance) of the circuit element 31. Moreover, for easily dissipating internally accumulated heat, a heat conductive material is provided by coating between the board of circuit element and the base so that the product of the present invention has better thermal conductance and also can sustain the device operated at high power for a long time. The expensive ceramic substrate is used only to form the coil board 31 part and the reset auxiliary board 32 using the regular fiber glass printed circuit board so that the material and production cost are low.
The above objects and other advantages of the present invention will become more apparent by describing in detail the preferred embodiments of the present invention with reference to the attached drawings in which:
One or more than one precise adjustment device 5 for severing as the RF tuning block to change the proximate impedance (or inductance) of the coil board 31 is provided at an appropriate position under the upper lid 1 by several setting screws4. Each of the screws is interposed through the upper lid 1 and then screw down to the precise adjustment devices 5. And the several coil spring 6 between the upper lid 1 and the precise adjustment device 5 which will build up the spring force against the setting screws to seven up the precise adjustment device 5. With this structure, the setting screw 4 can be turned externally to control the clearance adjustment device 5 and the coil board 31 with the aid of elasticity of the spring 6 so as to tune the impedance (or inductance) to a relevant value and achieve the optimistic RF impedance matching condition. Alternatively, the screw 4 can be fitted to the center portion of the spring 6 such that the two components thereof can act as an integral unit.
Moreover, for easily dissipating internally accumulated heat, a heat conductive material is provided by coating between the circuit element board 3 and the base 2 so that the present invention has better thermal conductance with the optimistic impedance matching condition resulting the less power transmission loss residue in the coil board, enabling the present invention can operate at a high power for a long time.
Similar to the first embodiment, one or more than one precise adjustment device 5 is provided at the appropriate position under the upper lid 1. This or these precise adjustment device 5 is secured to the upper lid 1 by several setting screws 4. Each of the screws 4 is interposed at the center a spirally coiled spring 6 and can be turned externally control the clearance between the precise adjustment device 5 and the coil board 31 with the aid of elasticity of the spring 6 so as to tune the impedance (or inductance) to a relevant value and achieve the optimistic RF impedance matching condition.
It is clear from the above detailed description of the present invention has several features which are distinctly superior to any other conventional techniques, and are as follows:
1. The mechanism of the present invention can be produced with minimum cost by using expensive ceramic material only in the essential coil board and the rest auxiliary board could de replaced by the regular fiber glass printing circuit board.
2. The RF impedance (or inductance) can be adjusted very relevantly by means of the precise adjustment device 5. Thus allows the optimistic impedance matching condition can be easily achieved and the power loss during the power transmission will maintain in the minimum status resulting the coil board working in the lower temperature situation. Also it makes the present invention capable to operation at the high power for a long time.
3. The installation of elastic studs at four corners of the coil board applies a uniform pressing force onto the ceramic coil board, to ensure with the base has batter thermal conductance, so that it does not deform concave upwardly after being heated, and thus also allows the device to operate at the term high power more reliable.
Although the invention has been described in terms of preferred embodiments, it is apparent that numerous variations and modifications may be made without departing from the true spirit and scope thereof as set forth in the following claims.