|Publication number||US6921271 B2|
|Application number||US 10/822,099|
|Publication date||Jul 26, 2005|
|Filing date||Apr 9, 2004|
|Priority date||Apr 9, 2003|
|Also published as||US20040203264|
|Publication number||10822099, 822099, US 6921271 B2, US 6921271B2, US-B2-6921271, US6921271 B2, US6921271B2|
|Inventors||Fang-Jwu Liao, Ming-Lun Szu|
|Original Assignee||Hon Hai Precision Ind. Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (4), Referenced by (17), Classifications (12), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. Field of the Invention
The present invention relates to the art of electrical connectors, and more particularly to a socket electrically mounted on an electrical substrate such as a printed circuit board (PCB), and including terminals each having a resilient contact arm adapted to mechanically and electrically engage a corresponding conductive member arranged on the electrical substrate.
2. Description of the Prior Art
Conventionally, a socket is widely used to electrically interconnect two electrical interfaces such as an IC package and a PCB, for conveniently and economically replacing of the IC. Referring to
Before insertion of the terminal 94 into the base 92, one end of the retention body 940 of the terminal 94 is attached to a contact strip (not shown). After said insertion, the terminal 94 is cut off from the contact strip, the attached end 940A of the retention body 940 exposing outside of the passageway 96. A pressing tool 80 is applied to press or push the attached end 940A of the retention body 940, thereby to push the terminal 94 in the passageway 96.
However, in most occasions, after pressing or pushing, the attached end 940A still projects beyond the upper surface 95 from the passageway 96, or at most flushes with the upper surface 95. Consequently, after compressing of the upper and lower arms 942, 944 to respectively engage the pad 91 of the IC package 90A and the trace 93 of the PCB 90B, specifically in the case of that the upper and lower arms 942, 944 are over-compressed, the pad 91 is prone to electrically touch or engage the attached end 940A of an adjacent terminal 94 when the pad 91 has a relatively larger bottom mating face to engage the upper arm 942. If this happens, a short circuit is established between the two adjacent terminals 94. Consequently, a predetermined function of the IC package 90A is changed, even destroyed. U.S. Pat. No. 6,296,495 has the above disadvantages.
A new socket is, therefore, desired in light of the above problems.
Accordingly, an object of the present invention is to provide a socket able to avoid short circuits between pads of an IC package or traces of a PCB and terminals of the socket, even when contacting arms of the terminals are over-compressed or urged to engage said pads or said traces respectively.
To fulfill the above-mentioned object, the present invention applies a socket having a dielectric rectangular base and a plurality of terminals planted in the base. The base defines upper and lower surfaces, and an array of terminal-passageways between the upper and lower surfaces for corresponding terminals therein. A plurality of upper projections is symmetrically applied on the upper surface, a predetermined number of projections being positioned round one corresponding terminal-passageways. A plurality of lower protrusions is symmetrically applied on the lower surface, a predetermined number of protrusions being situated round one corresponding terminal-passageways. The upper projections each extend upwardly a uniform height h1 in a thickness direction of the base relative to the upper surface and the lower protrusions each project downwardly a uniform distance h2 in said direction relative to the lower surface.
Each terminal is configured with a retention body and upper and lower cantilever-shaped arms extending from opposite ends of the retention body. A contacting portion is formed at a topmost part of the upper arm. Said contacting portion extends outside a corresponding terminal-passage, thereby to mechanically and electrically engage a pad of an IC package. At a lowermost part of the lower arm is formed with an engaging section. The engaging section projects beyond the lower surface of the base, for mating with a trace of a PCB. The retention body is secured in a corresponding terminal-passageway, one upper end thereof flushing with the upper surface and one lower end thereof projecting beyond the lower surface a distance h3 in said direction. The distance h3 is lower than the distance h2 of the lower protrusions and the upper projections extend above the upper end of the retention body.
Accordingly, when the upper and lower arms are compressed to establish electrical engagement of the contacting portion and the engaging section with the pad and the trace, the pad and the trace are respectively prevented from electrically touching with the retention bodies of adjacent terminals, even if the upper and lower arms are over-compressed or urged toward each other. Reliability of electrical engagement of the socket with the IC package and the PCB is assured.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
The features of the present invention which are believed to novel are set forth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following detailed description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements and in which:
Reference will now be made to the drawings to describe the present invention in detail.
The socket 20 includes a generally rectangular housing 30 and a plurality of terminals 40 secured in the housing 30. The housing 30 is formed from dielectric material, and configured with a bottom wall 32 and four side walls 34 extending upwardly from edges of the bottom wall 32. The side walls 34 and the bottom wall 32 cooperatively define a cavity 36 for receiving the IC package 50A therein.
A pair of resilient cantilevers 340 extends integrally from inner sides of two adjacent side walls 34 respectively, in a direction perpendicular or horizontal to the side walls 34. A projection 342 is formed at a distal end of each cantilever 340, for positioning the IC package 50A in the cavity 36.
Referring also to
Referring best to
Referring also to
In assembly, referring to
To facilitate further securing of the pre-inserted terminals 40 in the terminal-passageways 320, a pressing tool 60 is provided. The pressing tool 60 has a rectangular plate 62 and a plurality of parallel ribs 64 depending perpendicularly from a side of the plate 62. A slot 66 is defined between two adjacent ribs 64, for receiving the upper arms 44 of a corresponding row of terminals 40. The slot 66 has a width wider than that of the upper arms 44, and a height higher than a vertical height of the upper arms 44 relative to the upper surface 322.
With this configuration, the pressing tool 60 is urged downwardly, the slots 66 thereof receiving the upper arms 44 of corresponding rows of terminals 40 and the ribs 64 standing on the upper ends 422 of the terminals 40. Exterior force is averted on the plate 62 of the pressing tool 60, thereby the ribs 64 are actuated to push the bodies 40 into the terminal-passageways 320. Consequently, the terminals 40 are steadily arranged in the terminal-passageways 320, the upper ends 422 of the bodies 42 flushing with the upper surface 322 and the lower ends 424 thereof projecting beyond the lower surface 324 a vertical distance h3 shorter than the distance h2 (best seen in FIG. 7).
In use, referring to
In the preferred embodiment, the upper ends 422 of the bodies 42 of the terminals 40 flush with the upper surface 322 of the housing 30, and the upper protrusions 321 project the distance hi relative to the upper surface 322. Thereby the pads 51 of the IC package 50A have no chance to touch the upper ends 422 of the bodies 42. Furthermore, the lower ends 424 of the bodies 42 of the terminals 40 extend beyond the lower surface 324 of the housing 30 the distance h3 lower than the height h2 of the lower projections 323 with respect to the lower surface 324. The traces 53 of the PCB SOB are prevented from electrically engaging corresponding lower ends 424 of the bodies 40.
Furthermore, although the present invention has been described with reference to a particular embodiment, it is not to be construed as being limited thereto. Various alterations and modifications can be made to the embodiment without in any way departing from the scope or spirit of the present invention as defined in the appended claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US6196852 *||Mar 3, 1998||Mar 6, 2001||Siemens Nixdorf Informationssysteme Aktiengesellschaft||Contact arrangement|
|US6296495||Mar 23, 2000||Oct 2, 2001||Hon Hai Precision Ind. Co., Ltd.||Land grid package connector|
|US6604950 *||Apr 26, 2001||Aug 12, 2003||Teledyne Technologies Incorporated||Low pitch, high density connector|
|US6705876 *||Jul 13, 1998||Mar 16, 2004||Formfactor, Inc.||Electrical interconnect assemblies and methods|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7008237 *||May 25, 2005||Mar 7, 2006||Hon Hai Precision Ind. Co., Ltd.||Electrical connector having protecting protrusions|
|US7121845 *||Jul 5, 2005||Oct 17, 2006||Hon Hai Precision Ind. Co., Ltd.||IC socket with improved housing|
|US7128580 *||Jul 5, 2005||Oct 31, 2006||Hon Hai Precision Ind. Co., Ltd.||Socket connector with supporting housing protrusions|
|US7291021 *||Aug 11, 2005||Nov 6, 2007||Tyco Electronics Amp K.K.||IC socket and IC socket assembly|
|US7442049 *||Aug 1, 2005||Oct 28, 2008||International Business Machines Corporation||Electrical connecting device and method of forming same|
|US7497696 *||Mar 29, 2007||Mar 3, 2009||Intel Corporation||Socket for land grid array package|
|US7699619||Jan 26, 2006||Apr 20, 2010||Molex Incorporated||Socket for camera module|
|US8366453||Nov 12, 2010||Feb 5, 2013||Hon Hai Precision Ind. Co., Ltd.||Contact terminal having foothold arrangement capable of interlocking via of printed circuit board|
|US8425263 *||Jul 14, 2011||Apr 23, 2013||Lotes Co., Ltd.||Electrical connector|
|US8460011 *||Jul 9, 2012||Jun 11, 2013||Molex Incorporated||Substrate connector|
|US20050245108 *||Jul 5, 2005||Nov 3, 2005||Hon Hai Precision Ind. Co., Ltd.||Socket connector with supporting housing prtorusions|
|US20060035539 *||Aug 11, 2005||Feb 16, 2006||Hiroshi Shirai||IC socket and IC socket assembly|
|US20060040518 *||May 25, 2005||Feb 23, 2006||Hon. Hai Precision Ind. Co., Ltd.||Electrical connector having protecting protrusions|
|US20060040524 *||Jul 5, 2005||Feb 23, 2006||Hon Hai Precision Ind. Co., Ltd.||IC socket with improved housing|
|US20070004239 *||Aug 1, 2005||Jan 4, 2007||International Business Machines Corporation||Electrical connecting device and method of forming same|
|US20120270451 *||Jul 14, 2011||Oct 25, 2012||Lotes Co., Ltd.||Electrical connector|
|US20120276790 *||Nov 1, 2012||Molex Incorporated||Substrate connector|
|International Classification||H01R12/16, H01R12/04, H05K7/10, G01R31/26|
|Cooperative Classification||H01R12/7076, H05K7/1061, H01R12/714, H01R12/52|
|European Classification||H05K7/10F2, H01R23/72B, H01R23/68A|
|Jan 15, 2009||FPAY||Fee payment|
Year of fee payment: 4
|Jan 18, 2013||FPAY||Fee payment|
Year of fee payment: 8