|Publication number||US6939735 B2|
|Application number||US 10/235,102|
|Publication date||Sep 6, 2005|
|Filing date||Sep 5, 2002|
|Priority date||Sep 13, 2001|
|Also published as||US20030075358, US20050205985|
|Publication number||10235102, 235102, US 6939735 B2, US 6939735B2, US-B2-6939735, US6939735 B2, US6939735B2|
|Inventors||John W. Smith, Mitchell Koblis|
|Original Assignee||Tessera Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (24), Non-Patent Citations (2), Referenced by (7), Classifications (32), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present application claims benefit of U.S. Provisional Patent Application No. 60/318,725 filed Sep. 13, 2001, the disclosure of which is incorporated by reference herein.
The present invention relates to microelectronic packaging and more particularly relates to connection components and methods for packaging microelectronic elements such as semiconductor chips, wafers, and other elements.
As illustrated in certain preferred embodiments of U.S. Pat. No. 5,518,964 (“the '964 Patent”) movable interconnections between a microelectronic elements such as a semiconductor chip or wafer and another element can be provided by providing a connection component incorporating a dielectric body and leads extending on the bottom surface of the dielectric body. The leads may have first or fixed ends permanently attached to the dielectric body and connected to electrically conductive features such as terminals, traces or the like on the dielectric body. The leads also may have second or tip ends releasably attached to the dielectric body. The dielectric body, with the leads thereon, may be juxtaposed with the microelectronic element and the second or tip ends of the leads may be bonded to contacts on the microelectronic element. After bonding, the dielectric body and the microelectronic element are moved away from one another, thereby deforming the leads to a vertically extensive disposition. A curable liquid material may be introduced between the dielectric body and the microelectronic element during or after the moving step and cured to form a compliant dielectric layer as, for example, an elastomer or a gel surrounding the leads.
The resulting packaged microelectronic element has terminals on the dielectric body of the connection component which are electrically connected to the contacts on the chip but which can move relative to microelectronic element so as to compensate for thermal effects. For example, a semiconductor chip packaged in this manner may be mounted to a circuit board by solder-bonding the terminals to conductive features of the circuit board. Relative movement between the circuit board and the chip due to thermal effects is taken up in the movable interconnection provided by the leads and the compliant layer. Many variations of these processes and structures are disclosed in the '964 patent and the entire disclosure of such patent is incorporated herein by reference. Merely by way of example, the package-forming process can be conducted on a wafer level, so that numerous semiconductor chips in unitary wafer are connected to connection components in one operation or in one sequence of operations.
Additional variations and improvements of the process taught in the '964 patent are disclosed in commonly assigned U.S. Pat. Nos. 5,578,286; 5,830,782; 5,688,716; and 5,913,109.
A further variant of the process taught in the '964 patent is described in certain embodiments of co-pending, commonly assigned U.S. patent application Ser. No. 09/271,688, filed Mar. 18, 1999. [136 II CIP] In these embodiments, a microelectronic component such as a wafer including one or more semiconductor chips and having contacts on a front surface may be provided with leads by forming the leads in place on the semiconductor element so that the leads overlie the front surface. The formed leads desirably have contact ends connected to the contacts and have tip ends releasably connected to the semiconductor element. The semiconductor element, with the leads thereon, is juxtaposed with a further element such as a support and/or dielectric element having pads thereon. The tip ends of the leads are bonded to the pads. Following the bonding step, the chip or wafer can be moved away from one another so as to bend the leads toward a vertically-extensive disposition. Most preferably, the pads are wider than the ends of the leads connected to the pads. For example, the pads may be in the form of linear features extending transverse to the tip ends of the leads. Where the leads on the chips are aligned to pads wider than the ends of the leads, the process can operate satisfactorily even with a relatively large alignment tolerance between the chip or wafer and the element bearing the pads.
As described in certain preferred embodiments of the co-pending, commonly assigned U.S. Pat. No. 6,117,694; U.S. patent application Ser. No. and 09/317,675, filed May 24, 1999, and U.S. Pat. No. 6,228,686, a connection component may be provided as a sheet of a dielectric material with a main region and with lead regions defined by slots extending through the sheet. Such slots extend partially around each such lead region, so that a tip end of each lead region is movable relative to the main region. Where terminals on the main region of the sheet are connected to one element and the tip ends of the leads are connected to another element, the lead regions can be bent out of the plane of the sheet to form vertically extensive leads by moving the elements away from one another. As described in certain preferred embodiments of U.S. Provisional Application No. 60/204,735 filed May 16, 2000, and the corresponding non-provisional U.S. patent application Ser. No. 09/858,770 filed May 16, 2001, such a sheet can be formed in whole or in part on the surface of a microelectronic element such as a wafer. The disclosures of all of the aforesaid patents and applications are hereby incorporated by reference herein.
Despite these improvements in the art, still further improvements and variations would be desirable.
One aspect of the invention includes methods of providing leads on a first microelectronic element such as a wafer having a body with a top surface and a plurality of contacts exposed at the front surface. The method according to this aspect of the invention desirably includes assembling a carrier sheet formed separately from the microelectronic element to the top surface of the microelectronic element. The carrier sheet has a bottom surface and a top surface. The carrier sheet is assembled to the first microelectronic element so that the bottom surface of the carrier sheet faces toward the top surface of the first microelectronic element. At the time the carrier sheet is assembled to the microelectronic element, the carrier sheet desirably has leads overlying its top surface. The leads have tip ends that are displaceable upwardly with respect to the carrier sheet.
The method desirably further includes securing the carrier sheet to the top surface of the microelectronic element and electrically connecting at least some of said the leads to at least some of the contacts on said first microelectronic element. The net result is to provide a subassembly including the first microelectronic element and the carrier sheet, with the leads thereon.
A method of making microelectronic assemblies according to a further aspect of the invention uses such a subassembly. The method according to this aspect of the invention includes the additional steps of connecting at least some of the tip ends of the leads on the carrier sheet to a second microelectronic element overlying the top surface of said carrier sheet, and then moving the second microelectronic element vertically relative to the carrier sheet and first microelectronic element so as to move the tip ends of the leads upwardly away from the carrier sheet.
Using a subassembly of the carrier sheet and microelectronic element or wafer avoids the need to align the first and second microelectronic elements with one another with the precision required to make connections to the contacts on the wafer. Although precision is required when connecting the leads to the contacts during formation of the subassembly, it is considerably easier to achieve the required level of precision at this stage of the process, when the second element is not present.
By providing the leads in a carrier sheet separate from the microelectronic element or wafer, processes according to this aspect of the invention eliminate any need to put the wafer through lead-forming processes, and allow fabrication of the leads in a separate process that can be performed without constraints imposed by presence of the wafer. Processes according to preferred embodiments of the foregoing aspects of the invention can be performed using simple and economical carrier sheets, as, for example, carrier sheets having metallic features on only the top surface of the dielectric layer. Structures having metallic features on only a single surface of a dielectric layer commonly are referred to as “one-metal” structures; they are considerably less expensive than comparable structures with features such as metal leads on two surfaces and/or metal-lined holes extending through the dielectric layer.
At least some of the leads which are on the carrier sheet when it is assembled to the first microelectronic element may be full leads having anchor ends remote from the tip ends of the leads, and the step of electrically connecting at least some of the leads to the contacts may include bonding the anchor ends of at least some of said full leads to at least some of the contacts.
The step of bonding the anchor ends the leads to the contacts may be performed by bonding plural anchor ends to plural contacts simultaneously. For example, when the carrier sheet is assembled to the first microelectronic element, a bonding material may be present on at least some of the contacts; on at least some of said anchor ends; or both. In this case, the step of bonding the anchor ends to the contacts desirably includes activating the bonding material. The bonding material may include solder or may include gold bumps on the contacts or on the anchor ends. As further discussed below, gold bumps can be provided on closely-spaced contacts of a wafer, using conventional technology during or after production of the wafer.
During the step of moving the first and second elements away from one another after bonding the tip ends, at least some of the full leads may be entirely detached from the carrier sheet. This provides a vertically-extensive lead that is free to flex in service over its entire length, between its anchor end and its tip end.
The step of bonding the anchor ends of the leads to at least the contacts may include bending the anchor ends of the leads downwardly into apertures in the carrier sheet towards the contacts. For example, the anchor ends of the leads may be bonded to the contacts on the wafer using processes such as sonic or thermosonic bonding. Where the lead is entirely detached from the carrier sheet, the downwardly-bent portion of the lead resulting from the bonding process forms a part of the vertically-extensive lead which desirably is free to flex relative to the first microelectronic element in the finished product.
Most preferably, the second microelectronic element is not present at the time the anchor ends are bonded to the contacts on the first microelectronic element. Thus, the step of bonding the anchor ends to the first microelectronic element may be performed readily.
A further aspect of the present invention provides additional methods of making microelectronic assemblies. A method in accordance with this aspect of the invention includes the step of providing a sheet overlying a front surface of a first microelectronic element. The sheet has leads on a top surface facing away from the first microelectronic element. The sheet and leads according to this aspect of the invention may be provided separately or may be formed in situ, on the surface of the first microelectronic element. At least some of the leads have anchor ends which project downwardly into apertures in the sheet and which are bonded to contacts of the first microelectronic element within such apertures. A method according to this aspect of the invention desirably further includes the step of connecting at least some of the tip ends of the leads to a second microelectronic element and then moving the microelectronic element vertically relative to the subassembly of the sheet and first microelectronic element so as to move the tip ends of the leads upwardly away from the sheet and the first microelectronic element. Most preferably, at least some of the leads are entirely detached from the sheet during the moving step. Thus, after the moving step, the full lengths of these leads, between their tip ends and anchor ends are detached from the microelectronic elements and hence are available for flexing to accommodate relative movement of these elements. As further explained below, the detached and deformed leads may include elongated conductive strips with a unique, multi-section configuration incorporating a bend point adjacent the anchor end of the lead and the contact of the first microelectronic element.
A further aspect of the present invention provides a microelectronic assembly incorporating first and second microelectronic elements, the second microelectronic element overlying a front surface of the first element, along with a plurality of leads having anchor ends connected to contacts on the first microelectronic element and having tip ends electrically connected to the second microelectronic element. At least some of the leads are multi-section leads, each including a unitary elongated strip sloping in the vertical direction towards the second microelectronic element from its anchor end to its tip end and having a bend point at which the slope changes more rapidly than in surrounding regions, such bend point being disposed adjacent the anchor end of the strip. Stated another way, the magnitude of the second derivative of vertical position with horizontal distance from the contact increases at the bend point and then decreases. Most preferably, each of these leads is entirely detached from the sheet, so that the entire elongated strip, on both sides of the bend point is substantially unconstrained in bending.
Yet another aspect of the invention provides further methods of making microelectronic assemblies. Here again, a method according to this aspect of the invention includes the step of providing a sheet overlying a front surface of a first microelectronic element, the sheet, having leads on a top surface facing away from the first microelectronic element. In this aspect of the invention as well, the sheet may be provided as a separate element with the leads thereon or may be formed in situ on the front face of the first microelectronic element. At least some of the leads, and preferably all of the leads, have tip ends that are releasably connected to the sheet, and have anchor ends remote from the tip ends. A method according to this aspect of the invention desirably includes the step of connecting the anchor ends of the leads to the contacts on the chip by engaging individual ones of the anchor ends with a tool as, for example, a sonic or thermosonic bonding tool and bonding each anchor end to a contact. This step may be performed by engaging each of the leads with the bonding tool individually, so that the various leads are engaged by the tool seriatim. Preferably, the step of bonding each anchor end to a contact includes bending the anchor end downwardly into the aperture in the sheet. A method according to this aspect of the invention desirably includes the further step of connecting at least some of the tip ends of the leads to a second microelectronic element and moving the second microelectronic element relative to the subassembly of the sheet and first microelectronic element as discussed above. In a method according to this aspect of the invention, connections between the anchor ends of the leads and the contacts of the first microelectronic element can be made readily before assembling the second microelectronic element with the subassembly.
Yet another aspect of the invention provides still further methods of making microelectronic assemblies. Methods according to this aspect of the invention include the step of providing a sheet overlying the front surface of the first microelectronic element. The sheet has stub leads on a top surface facing away from the first microelectronic element. Each stub lead includes a tip end and a bonding terminal offset from the tip end. The tip ends and, most preferably, the entirety of each stub lead are displaceable from the sheet. Here, again, the sheet may be provided as a separate element and assembled to the first microelectronic element, or may be formed in situ on the first microelectronic element. A method according to this aspect of the invention desirably includes the step of connecting additional lead portions separate from the sheet and the stub leads between the bonding terminals of at least some of the stub leads and at least some of the contacts of the first microelectronic element so as to form composite leads extending between the contacts and the tip ends. For example, the additional lead portions may be wires provided by a wire-bonding process. Methods according to this aspect of the invention desirably further include the step of connecting at least some of the tip ends of the stub leads to a second microelectronic element, thereby connecting the composite leads to the second microelectronic element, and then moving the second microelectronic element vertically relative to the subassembly of the sheet and the first microelectronic element, so as to move the tip ends of the composite leads upwardly away from the sheet and the first microelectronic element. Methods according to this aspect of the invention permit fabrication of subassemblies using wire bonding equipment that is already installed in numerous microelectronic packaging plants.
The step of connecting the tip ends of the leads to a second microelectronic element may include the step of advancing the second microelectronic element towards the sheet and the first microelectronic element, so that the second microelectronic element engages and deforms at least some of the additional lead portions during the advancing step. For example, the additional lead portions may be formed as wire bonds with loops projecting upwardly away from the stub leads and arcing downwardly towards the chip contacts. During the step of advancing the second element towards the first element and sheet, the second element may engage the upper portions of these loops and deform the same downwardly. This allows the use of relatively long wire bonds or other additional lead portions. As further explained below, in the completed assembly, such long additional lead portions remain slack and provide a connection with good resistance to failure during fabrication and use.
A related aspect of the present invention provides microelectronic assemblies. Microelectronic assemblies in accordance with this aspect of the invention include first and second microelectronic elements. The first element has a front surface and contacts exposed at the front surface. The second element overlies the front surface of the first element. The assembly in accordance with this aspect of the invention includes a plurality of leads. At least some of these leads are composite leads. Each such composite lead includes a stub end having a bonding terminal and a tip end electrically connected to the second microelectronic element. Each composite lead also includes an additional lead portion formed separately from the stub lead and bonded to the bonding terminal of the stub lead. The additional lead portion of each composite lead extends to a contact on the first microelectronic element. The stub leads are elevated above the first microelectronic element. Desirably, the stub leads are physically connected to the first microelectronic element only by the additional lead portions and by an encapsulant surrounding the composite leads. The preferred assemblies in accordance with this aspect of the present invention provide vertically extensive leads that incorporate additional lead portions in forms such as round wires that have substantial resistance to flex fatigue.
These and other objects, features and advantages of the present invention will be more readily apparent from the detailed description of the preferred embodiment set forth below, taken in conjunction with the accompanying drawings.
A method in accordance with one embodiment of the invention utilizes a first microelectronic element 50 in the form of a conventional semiconductor wafer. The wafer includes a passivation layer 52 defining the front surface 54 of the wafer. The passivation layer is a conventional dielectric material such as, for example, a polymer provided to protect the sensitive electrical components and conductive elements within wafer 50. The thickness of the passivation layer relative to the remaining portion of the wafer is greatly exaggerated in FIG. 1. The wafer has electrical contacts 56 exposed to top surface 54 through apertures 58 in the passivation layer. Only a small portion of the wafer is depicted in
In a first stage of the method, a metallic foil 62 (
After application of the bonding material, foil 64 is selectively etched so as to leave stub leads 70 (
The wire bonds may be applied by conventional wire bonding equipment. As is well known in the art, conventional wire bonding equipment includes a head which dispenses a fine wire as, for example, a gold or aluminum wire. The bonding head is applied so as to form a bond at the bonding pad 74 of the stub lead and then moved upwardly away from the stub lead and downwardly toward the contact 56 while dispensing wire, so as to form the dispensed wire into the arcuate configuration illustrated in FIG. 5. After bonding the wire to the contact, the bonding head is actuated to break or flame the wire, thereby detaching the wire in the head from the dispensed lead 76. The reverse direction of motion—starting at the contact 56 and ending at bonding terminals 74—also may be used.
The passivation layer 52 is then etched as, for example, by exposing the front surface 54 to a plasma etchant. During this process, those portions of polymeric layer 52 that are disposed below stub leads 70 are protected from the etchant. Thus, etching of those portions begins at the edges of the stub leads and progresses gradually towards the middle of the stub leads. The etching process is terminated before that portion of the polymeric layer underlying each stub lead is completely removed, so as to leave small polymeric connecting elements 78 connecting the various stub leads to the remaining portion of layer 52. Each such connecting element has horizontal dimensions smaller than the horizontal dimensions of the stub lead. Such a partial etching process may be substantially the same as that disclosed in copending, commonly assigned U.S. Pat. No. 6,423,907, the disclosure of which is hereby incorporated by reference herein. The etching process leaves each stub lead 70, and hence the tip end 72 of each composite lead 78, connected to the dielectric layer 52 by frangible connecting element 82 having horizontal dimensions smaller than the horizontal dimensions of the associated stub lead 70.
In the next stage of the process (FIG. 6), a second microelectronic element 84 is employed. Second element 84 has a bottom face 88 and has electrically conductive bonding pads 90 exposed at the bottom face 88. In the particular arrangement illustrated in
The second microelectronic element is juxtaposed with the first microelectronic element 50 so that the inner or bottom surface 88 of the second microelectronic element faces toward the front surface 54 of the first microelectronic element and so that the bonding pads 90 on the second microelectronic element are aligned with the tip end 72 of the composite leads and are aligned with the bonding material masses 68 on the tip ends.
Second element 84 is advanced downwardly relative to the first microelectronic element 50, so that the second microelectronic element approaches the first element from the front as indicated by arrows 86 in FIG. 6. The relative motion is significant to the process, but which element moves relative to the surroundings is unimportant; only the second element, only the first element, or both elements may move relative to the surroundings. As the second element is advanced toward the first element, the bottom surface of the second element encounters the upwardly projecting portions of wire bonds 76 incorporated in composite leads 78 and deforms the wire bonds and, hence, the composite leads to the position indicated at 76′ in FIG. 6. Thus, the wire bonds are squashed downwardly towards the front surface 54 of the first element. As the second element is moved downwardly toward the first element, the bonding pads 90 on the second element engage the bonding material 68 on the tip ends 72 of the leads. The bonding material may be activated as, for example, by heating it during this process. The activated bonding material forms bonds between the tip ends 72 of the leads and the contact pads 90 on the second element.
In the next stage of the process, the second element 84 is moved upwardly relatively to the first element 50. Here, again, the relative motion of the elements, rather than the motion of any particular element relative to the surroundings, is significant. Desirably, movement of the first and second elements towards and away from one another is controlled so that the elements move through a controlled, pre-determined displacement away from one another. For example, the elements may be constrained by fixtures such as platens moved by conventional mechanical linkages. The upward motion of the second element moves the tip ends 70 away from the first element 50, thereby bending the composite leads, and particularly the wire bonds 76 to a vertically extensive configuration indicated at 76″ in FIG. 7. The vertical motion desirably does not bring the wire bonds to a completely taut condition. Rather, each wire bond desirably has some slack after the vertical motion. During this process, the stub leads 70 are detached from the front face 54 of the first element, breaking the small polymeric connectors 82 or by detaching these from the stub leads or from the remainder of the polymeric layer 52. Because each connector 82 has a relatively small horizontal area, only a limited force is required to detach the stub leads from the first element. For example, the dimensions of connectors 82 may be selected so that about 0.25 to about 4 grams (0.25×103 to 4×103 dynes) of upwardly directed force is required to detach each stub lead from first element 50. As the second element moves upwardly away from the first element through a controlled pre-selected displacement, the composite leads are bent to the vertically extensive dispositions illustrated in FIG. 7. Each additional lead portion or wire bond 76″ remains curved and hence slack. The anchor ends 80 of the composite leads remain connected to contacts 56. In the deformed condition illustrated in
An encapsulant 100 may be introduced into the space between the elements so as to surround the composite leads 78 during or after movement of the second element away from the first element. The encapsulant may be cured to form a layer surrounding the leads. For example, such a layer may be a compliant layer such as a gel or elastomer. The encapsulant may be introduced under pressure so that the pressure of the encapsulant impels the first and second elements away from one another during the movement step. After the leads have been deformed to the vertically extensive disposition shown in
The process can be varied in numerous ways. For example, bonding material 96 may be omitted, yielding packaged chips that have no bonding material thereon. The bonding material may be applied to terminals 94 at a later stage of processing, or else may be applied to the circuit board during mounting of the packaged chip. In a further variant, the motion of the wire bonding head is controlled, during application of wire bonds 76 to form the composite leads so as to provide wire bonds that are initially curved in the horizontal direction. Such horizontal curvature can be used in lieu of or in addition to the vertical curvature illustrated in FIG. 5. Where the wire bonds are curved in the horizontal direction, the vertical movement of the second element towards the first element (
A process in accordance with a further embodiment of the invention begins with a first element 150 incorporating a semiconductor wafer having a passivation layer 152 and contacts 156 exposed to the front surface 154 of the first element through apertures 158 in the passivation layer. These structures may be similar to the corresponding structures discussed above with reference to
After application of the bonding material, resist 164 is further patterned so as to leave portions of the resist overlying regions of the sheet that are to constitute leads and to leave the remaining areas of the sheet exposed. Alternatively, resist 164 may be entirely removed and replaced by a further resist that is patterned in this manner. The foil 104 is then etched so as to form individual leads 178 (FIG. 13). Leads 178 have anchor ends 180 extending over the apertures 156 in passivation layer 152 and dielectric layer 102 and have tip ends 172 remote from the anchor ends. As best seen in
After formation of the leads, dielectric layer 102 is etched as, for example, by a plasma etching process so as to form small polymeric connecting elements 182 (
In the next stage of the process, the anchor ends 180 are bonded to contacts 156 by displacing the anchor ends downwardly into apertures 158 as indicated at 180′ in FIG. 14. This process may be performed on the various leads in sequence, as by engaging the anchor end 180 of each lead with a tool such as an ultrasonic or thermosonic bonding tool 110 and forcing the engaged anchor end downwardly. During this process, the bonding tool constrains and guides the anchor end. This operation may be similar to the processes used to engage connections sections of leads with contacts on chips as taught, for example, in U.S. Pat. Nos. 6,054,756 and 5,915,752, the disclosures of which are incorporated by reference herein. Prior to engagement by the bonding tool, the anchor end of each lead is held in position by the associated retainer 181 and by the main portion 176 and tip end of the lead, so that the anchor ends of the leads may be engaged reliably by the bonding tool. As each anchor end is displaced to the position indicated at 180′, the anchor end is detached from the associated retainer 181 by breaking the associated frangible section 183.
After the anchor ends have been bonded to the contacts, a second microelectronic element 184, which may be similar to the second element discussed above with reference to
After movement, the completed leads may have a configuration as illustrated in FIG. 16. Each such lead 178 is formed as a substantially unitary strip that slopes upwardly in the vertical direction toward the second element 184 from its anchor end 180 to its tip end 172. Each such lead has a bend point 185 between the anchor end and the tip end. The vertical slope of the lead changes relatively rapidly at this bend point. Thus, between the bend point 185 and the anchor end of the lead, the vertical slope per unit length of the strip is relatively large. Between the bend point and the tip end 172, the vertical slope is relatively small. There is a substantial change in slope per unit length at the bend point 185.
A process in accordance with a further embodiment of the invention (
As shown in
A process in accordance with yet another embodiment of the invention uses a carrier sheet 302 substantially identical to the carrier sheet 202 discussed above with reference to
In the next stage of the process, second element body 384 is moved upwardly away from the subassembly 309 of the first element 350 and carrier sheet 302, thereby deforming the composite leads. Each lead 378 originally provided on the carrier sheet is bent upwardly, away from the carrier sheet, whereas each lead portion 307 originally provided on the second element body is bent downwardly away from the second element body. The mobile ends of lead portions 307 are displaced downwardly away from the second element body, whereas the tip ends 372 of the leads originally provided on sheet 302 are bent upwardly, away from the sheet and away from the first element. In this process, the conjoined tip ends and mobile ends may move horizontally relative to the first element 350 and relative to the second element body. Such horizontal movement, in the direction indicated by arrow H in
Numerous variations and combinations of the features described above can be utilized. For example, as seen in
In a further variant, stub leads similar to the stub leads 70 discussed above with reference to
In the embodiments discussed above, the tip ends of the leads on the first elements and carrier sheets and the mobile ends of the leads on the second element body (
In the embodiments discussed above, the first element is illustrated as a section of a wafer. However, the same techniques can be used to form assemblies from microelectronic elements such as individual chips. The second element need not be a connection component having terminals suitable for connection to a circuit panel. For example, the second microelectronic element may be another semiconductor chip or wafer, or a passive electronic component.
As these and other variations and combinations of the features discussed above can be utilized without departing from the present invention, as defined by the claims. The foregoing description of the preferred embodiments should be taken by way of illustration rather than by way of limitation of the invention as defined by the claims.
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|U.S. Classification||438/106, 438/617, 257/692, 438/127, 257/E23.069, 438/118, 257/E23.068, 438/739, 257/E23.065, 257/674, 257/784|
|International Classification||H01R12/57, H01L23/498, H01L23/31|
|Cooperative Classification||H01L24/45, H01L2224/45144, Y10T29/49144, Y10T29/49126, H01L24/48, H01L2924/19107, H01L23/4985, H01L2924/09701, H01L23/3114, H01L23/49816, H01L2224/48472, H01L2924/01322, H01L2224/45124, H01L2924/3025, H01L2924/01079|
|European Classification||H01L23/498C4, H01L23/498J, H01L23/31H1|
|Dec 23, 2002||AS||Assignment|
Owner name: TESSERA, INC., CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SMITH, JOHN W.;KOBLIS, MITCHELL;REEL/FRAME:013601/0286;SIGNING DATES FROM 20021112 TO 20021118
|Feb 21, 2006||CC||Certificate of correction|
|Mar 16, 2009||REMI||Maintenance fee reminder mailed|
|Jul 22, 2009||FPAY||Fee payment|
Year of fee payment: 4
|Jul 22, 2009||SULP||Surcharge for late payment|
|Feb 26, 2013||FPAY||Fee payment|
Year of fee payment: 8