|Publication number||US6951583 B2|
|Application number||US 10/688,258|
|Publication date||Oct 4, 2005|
|Filing date||Oct 16, 2003|
|Priority date||May 1, 2000|
|Also published as||DE60134970D1, EP1278701A2, EP1278701B1, US6660241, US20020006511, US20040076572, WO2001083371A2, WO2001083371A3|
|Publication number||10688258, 688258, US 6951583 B2, US 6951583B2, US-B2-6951583, US6951583 B2, US6951583B2|
|Inventors||Thomas M. Clere, Séverine M. Labouré|
|Original Assignee||Saint-Gobain Ceramics & Plastics, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (79), Non-Patent Citations (3), Referenced by (27), Classifications (27), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a Continuation claiming benefit under 35 U.S.C. §120 of U.S. patent application Ser. No. 09/842,452, filed Apr. 26, 2001, which now U.S. Pat. No. 6,660,241 claims benefit under §119 of U.S. Provisional Patent Application Ser. No. 60/200,846, filed May 1, 2000.
The present invention relates to highly delaminated hexagonal boron nitride powders, a process for making such powders, and the use of the resulting powders.
Several methods for milling boron nitride, in particular, hexagonal boron nitride (“h-BN”) are known in the art. One conventional process for milling h-BN is disclosed in Hagio et al., J. Am. Cer. Soc. 72:1482-84 (1989) (“Hagio”). According to Hagio, a virgin h-BN powder (characterized by a particle size of about 10 μm, a surface area of about 5 m2/g, and a thickness of about 100 nm) is milled by grinding with tungsten carbide mortar (WC) in air. The apparent purpose of Hagio's milling operation is to increase the surface area of the h-BN powder, thereby increasing its reactivity. When milled in this manner for 24 hours, the resultant h-BN powder has a lower particle diameter (2 μm), a higher surface area (54 m2/g), and is slightly thinner (71 nm). The data reported by Hagio suggests that the final geometry of the milled powder is not dependent upon the starting powder purity. Although Hagio reports a reduction in the platelet thickness, Hagio's milling operation primarily results in BN particle fracture, thereby reducing the particle diameter, resulting in an increased surface area.
In U.S. Pat. No. 5,063,184 to Tsuyoshi et al. (“Tsuyoshi”), it is reported that high surface area, highly reactive h-BN powders are useful in providing high density, pressureless sintered h-BN components. In each example in Tsuyoshi, the virgin h-BN is milled in either air or nitrogen.
The present invention is directed towards providing an improved milling method for producing h-BN powders.
The present invention relates to a powder comprising hexagonal boron nitride particles having an aspect ratio of from about 50 to about 300.
The present invention also relates to a method of making delaminated hexagonal boron nitride powder. This method involves providing hexagonal boron nitride powder and milling the hexagonal boron nitride powder in a mixture under conditions effective to produce delaminated hexagonal boron nitride powder having an aspect ratio of from about 50 to about 300.
The method of the present invention produces more highly delaminated, high aspect ratio boron nitride powder. Whereas the dry milling procedures of the prior art increase the surface area of the BN particle essentially by particle fracture (i.e., by reducing the particle diameter), the method of the present invention provides similar increases in surface area but does so by particle delamination (i.e., by reducing particle thickness). The resulting boron nitride powder has a high aspect ratio (a large particle diameter and a small particle thickness) which is useful in certain applications, e.g., as a processing aid for the extrusion of polymers. In particular, the delaminated BN powders of the present invention are more effective at lowering the die wall/polymer interfacial friction during extrusion, leading to a decrease in extrusion pressures and delaying further the onset of gross melt fracture to higher effective shear rates.
The present invention relates to a powder comprising hexagonal boron nitride particles having an aspect ratio of from about 50 to about 300. The aspect ratio of a particle is determined by dividing particle diameter by particle thickness.
Hexagonal boron nitride is an inert, lubricious ceramic material having a platey hexagonal crystalline structure (similar to that of graphite) (“h-BN”). The well-known anisotropic nature of h-BN can be easily explained by referring to
In one embodiment, the particles have a surface area of at least about 20 m2/g, preferably, at least about 40 m2/g, and, more preferably, at least about 60 m2/g. The specific surface area of the h-BN particle is typically measured by BET adsorption technique, e.g., using a Micromeretics, Flowsorb II 2300 (Norcross, Ga.).
Preferably, the particles have an average diameter of at least about 1 micron, typically between about 1 and 20 μm, more typically between about 4 and 9 μm.
As used herein, “particle size” or “diameter” of the h-BN particle platelet is the dimension shown as D in FIG. 1. This is typically measured by scanning electron microscopy and laser scattering techniques using, e.g., a Leeds & Northrup Microtrac X100 (Clearwater, Fla.). In addition, the particle diameter D10 is typically at least about 2 μm, more typically at least about 3 μm. As used herein, D10 diameter is the diameter at which 10% of the volume of BN particles is smaller than the indicated diameter.
Also, the particles preferably have a thickness of no more than about 50 nm, more preferably, between about 10 and 40 nm, and, most preferably, between about 10 and 20 nm. The particle thickness is the dimension shown as Lc in FIG. 1. This is typically measured by scanning electron microscopy (SEM), calculated indirectly from SEM diameter and surface area data and, if the particle platelets are not multi-crystalline, sometimes by x-ray diffraction line broadening technique (see Hagio et al., J. Am. Cer. Soc. 72:1482-84 (1989) (“Hagio”), which is hereby incorporated by reference) using, e.g., a SIEMENS Model D500 diffractometer.
The powder of the present invention may be a h-BN powder having a highly ordered hexagonal structure. Such powders have a crystallization index (Hubacek, “Hypothetical Model of Turbostratic Layered Boron Nitride,” J. Cer. Soc. of Japan, 104:695-98 (1996), which is hereby incorporated by reference) of at least 0.12 (quantification of highly hexagonal h-BN) and, preferably, greater than 0.15, Preferably, the h-BN powder has a crystallinity of about 0.20 to about 0.55, most preferably, from about 0.30 to about 0.55.
Delamination of the h-BN powder of the present invention exposes newly cleaved BN surfaces which are readily oxidized by an oxidizing agent, such as water or oxygen. The oxidizing agent reacts with these new surfaces to produce B2O3. Although it is believed that the presence of B2O3 during milling is associated with particle fracture as opposed to particle delamination, as described below, some B2O3 may be present in the resulting powder as an artifact of the washing and drying techniques used. It may be desirable to adjust the amount of B2O3 in the resulting powder based on the potential use of the resulting powder. In particular, for cosmetic applications, the h-BN powder of the present invention should have a low weight percentage of B2O3 to increase the hydroscopic nature of the resulting powder (will not dry the skin). Preferably, for cosmetic applications, the h-BN powder of the present invention has no more than 500 ppm B2O3, more preferably, from about 0 ppm to about 200 ppm B2O3. Low B2O3 content can be achieved by careful washing (such as solvent washing with, e.g., dry alcohol, cold water, etc) and drying (by, e.g., freeze drying).
Alternatively, for use as a processing aid in polymer extrusion, high residual B2O3 content may enhance particle dispersion within the melt. Thus, preferably, for extrusion applications, the h-BN powder of the present invention has at least 0.5 wt % B2O3, more preferably, from about 0.5. wt % to about 5 wt % B2O3. However, for process aids where food contact with the polymer is possible low B2O3 content, as described above for cosmetic applications, is desirable.
The present invention also relates to a method of making delaminated hexagonal boron nitride powder. This method involves providing hexagonal boron nitride powder and milling the hexagonal boron nitride powder in a milling mixture under conditions effective to produce delaminated hexagonal boron nitride powder having an aspect ratio of from about 50 to about 300.
Preferably, the hexagonal boron nitride powder has a highly ordered hexagonal structure, as described above. Typically, this starting powder is produced by a “high fire” treatment of a raw, essentially turbostratic (amorphous) boron nitride powder (see Hagio et al., “Microstructural Development with Crystallization of Hexagonal Boron Nitride,” J. Mat. Sci. Lett. 16:795-798 (1997), which is hereby incorporated by reference). In a preferred embodiment, a fine turbostratic BN powder having a crystallization index of less than 0.12 is heat treated in nitrogen at about 1400 to 2300° C. for about 0.5-12 hours. This heat treatment typically acts to produce a more coarse h-BN powder, as the fine, <1 μm crystallites, of turbostratic powder particles become more ordered (crystallized) and larger (>1 micron) during the heat treatment. In typical embodiments, the high fired h-BN powder has a particle size of between 1 and 20 μm, more typically between 4 and 9 μm.
Typically, the virgin h-BN powder comprises between about 5 and 30 wt % of the milling mixture. If substantially less than 10 wt % is used, then production efficiencies decline. If more than 30 wt % is used, then the viscosity of the milling slurry increases, leading to less efficient milling.
Preferably, the milling mixture includes a milling media and a milling liquid.
The milling liquid may be water, methanol, ethanol, propanol, butanol, isomers of low molecular weight alcohols, acetone, and supercritical CO2. In one embodiment, the liquid is any liquid in which B2O3 is soluble.
Typically, the liquid milling medium comprises between about 70 and 95 wt % of the milling mixture. If less than 70 wt % is used, then the viscosity of the slurry is too high for efficient milling. If more than 95 wt % is used, then there is a sacrifice in productivity and the added burden of removing a larger volume of solvent if a dry powder is desired.
The milling media, according to the present invention, may have an average diameter of from about 1 mm to about 20 mm. Preferably, the milling media is coarse milling media having an average diameter of at least 3 mm. Suitable milling media include zirconia, steel balls, alumina, silicon nitride, silicon carbide, boron carbide, calcium oxide, and magnesium oxide. The size of the milling media can also be used to affect the aspect ratio of the milled material. In particular, milling with fine 1 mm zirconia produces an h-BN powder having a smaller particle diameter than an h-BN powder similarly milled with ⅛″ steel balls.
In some embodiments, a dispersant is used in order to lower the viscosity of the milling slurry. Suitable dispersants include Rohm & Haas Duramax 3019, Rhodapex CO/436, Nekal, and the Triton series.
In other embodiments, between about 1 and 20 wt % alcohol is used to assist in the wetting of the h-BN by the water.
Typically, the milling of the h-BN powder is undertaken by a wet milling approach, e.g., in a ball mill, attrition mill, or vibratory mill. If a ball mill is used, then the preferred milling media is steel or other suitably magnetic material to aid in the removal of milling debris by magnetic separation.
In situations in which high aspect ratio h-BN is desired, milling times of between 8 and 48 hours are preferred. If milling is performed for less than 8 hours, there is insufficient delamination. If milling is performed for more than 48 hours, there is the added cost of increased milling time. However, as milling time increases, surface area of the BN particles in the resulting powder increases.
It has been found that, in some embodiments, the temperature of the milling mixture increased significantly during the milling operation. Since the production of B2O3 increases according to an Arrhenius rate law with temperature, it is possible that this increase in temperature affects the ultimate B2O3 concentration. Therefore, in embodiments in which low B2O3 powders are desired, the temperature is maintained at or below about 30° C. Otherwise, the temperature of the milling mixture can be increased.
Although not wishing to be bound by theory, it is believed that the energy imparted by the milling media upon the h-BN particles acts to cleave the h-BN particles at their weakest points, i.e., the planes of BN (in the a-direction), as the stacked hexagonal crystal planes of h-BN are held together by very weak Van der Waals forces. It is believed that the initial phases of the milling operation of Hagio et al., J. Am. Cer. Soc. 72:1482-84 (1989) (“Hagio”), which is hereby incorporated by reference, result in some delamination of the BN particles along these planes. However, these initial delaminations expose expansive newly cleaved BN surfaces to air. The oxygen in the air reacts with these new reactive surfaces, thereby producing B2O3. It appears that this increased B2O3 content is associated with poorly controlled particle fracture.
The reason as to why increased B2O3 content promotes particle fracture is not presently clear. While not wishing to be bound by theory, it may be that the rigidity of B2O3 causes the fracture. Therefore, subsequent milling of the more brittle, B2O3-laden h-BN particle results substantially in more fracture of the particle (without substantially more delamination), resulting substantially in a reduction in the diameter of the particle (not its thickness).
Alternatively, it may be that the adhesive nature of the boron oxide produced during milling causes h-BN particles to stick together when they contact, forming a sort of rigid agglomerate which essentially locks each h-BN particle into a constrained position. When this agglomerate is eventually caught between the high velocity milling media, the individual platelets constrained within the agglomerate fracture in the c-direction (i.e., normal to the platelet axis).
Alternatively, when milling in the presence of a liquid medium, the liquid may cause the milling media to impact the particles in a manner that promotes shear forces parallel to the BN platelet, thereby promoting delamination.
Nonetheless, it is believed that the conventional dry milling process was self-limiting with respect to its ability to produce a high aspect ratio h-BN structure because the milling process was more by impact than by shear or the production of B2O3 promoted too much fracture of the platelets.
It is believed that the present invention solves the problem of uncontrolled fracture by using an aqueous medium or any other liquid medium that promotes shear impact between the milling media and the boron nitride or removes B2O3 from the surface of the BN. Is it further believed that the liquid medium has the effect of removing the B2O3 from the surface of the delaminated h-BN, thereby allowing more delamination to occur. As it is known that B2O3 is readily soluble in water, it is believed that, although B2O3 is produced during the cleavage of the h-BN platelets, a substantial fraction of that B2O3 is washed away from the h-BN particle by the aqueous medium, thereby leaving a relatively pure delaminated h-BN particle. Milling of these cleaned particles results substantially in more delamination (not fracture), thereby producing a high aspect ratio h-BN powder. Since any B2O3 produced during subsequent delamination is also washed away by the water, the cycle of delamination/B2O3 production/B2O3 washing can continue ad infinitum, thereby resulting in a highly delaminated, ultra-high aspect ratio h-BN powder.
Thus, the selection of the milling liquid should depend upon the desired aspect ratio of the h-BN. For example, if a highly delaminated, high aspect ratio h-BN powder is desired, then the liquid should be one which readily removes B2O3 from the h-BN particle (to prevent particle fracture and promote delamination). In these cases, the liquid should be one in which B2O3 is highly soluble (i.e., in which B2O3 has a solubility of at least 0.01 grams/cc). Given the B2O3 solubility in the selected milling liquid, a material balance calculation may be used to determine the minimum ratio of milling liquid volume to total B2O3 to achieve effective removal of B2O3 from the BN surface. On the other hand, if the mechanism for producing high aspect ratio BN platelets is shear milling, then any liquid of sufficient density can be used in combination with milling media.
It may also be desirable to produce tailored BN particles which are not only very thin, but also somewhat fine, e.g., a powder having thin platelets on the order of BN 1-2 microns in diameter. This may be achieved by combining the milling method of the present invention with dry milling (see, e.g., Hagio et al., J. Am. Cer. Soc. 72:1482-84 (1989), which is hereby incorporated by reference) in order to produce both delaminated and fractured h-BN particles. In particular, when the average particle size of the h-BN powder is between about 1 and 10 microns (μm), a change in the particle size (such as cutting the particle in half across the basal plane, as in
Another aspect of the present invention is a method for extruding a molten polymer. This method involves blending a powder comprising hexagonal boron nitride particles having an aspect ratio of from about 50 to about 300 with a polymer to form a blend and extruding the blend through an extruder under conditions effective to disperse the boron nitride particles throughout the polymer to form an extrusion product.
In one embodiment, the polymer is a thermoplastic polymer. Examples of thermoplastic polymers which can be used in accordance with the present invention include the polyolefins such as polypropylene, e.g. isotactic polypropylene, linear polyethylenes such as high density polyethylenes (HDPE), linear low density polyethylenes (LLDPE),e.g. having a specific gravity of 0.89 to 0.92. The linear low density polyethylenes made by the INSITE® catalyst technology of Dow Chemical Company and the EXACT® polyethylenes available from Exxon Chemical Company can also be used in the present invention; these resins are generically called mLLDPE. These linear low density polyethylenes are copolymers of ethylene with small proportions of higher alpha monoolefins, e.g. containing 4 to 8 carbon atoms, typically butene or octene. Any of these thermoplastic polymers can be a single polymer or a blend of polymers. Thus, the EXACT® polyethylenes are often a blend of polyethylenes of different molecular weights.
Other thermoplastic polymers include fluoropolymers. Examples of fluoropolymers include the melt-fabricable copolymers of tetrafluoroethylene with one or more fluorinated monomers such as fluoroolefins containing 1 to 8 carbon atoms, such as hexafluoropropylene, and fluoro(vinyl ethers) containing three to ten carbon atoms, such as perfluoro(alkyl vinyl ether), wherein the alkyl group contains 3 to 8 carbon atoms. Specific such monomers include perfluoro(ethyl or propyl vinyl ether). Preferably the fluoropolymer is perfluorinated and has a melt viscosity of 0.5×103 to 5×106 Pa.s at 372° C. These fluoropolymers are perfluorinated, but less than perfluorination can be used. For example, the fluorine content of the fluoropolymer is preferably at least 35 wt %. Examples of such polymers which are not perfluorinated and can be used include tetrafluoroethylene/ethylene and chlorotrifluoroethylene/ethylene copolymers.
From the diversity of the thermoplastic polymers, ranging from polyolefins to fluoropolymers, it is apparent that many other thermoplastic polymers are useful in the present invention. All such thermoplastic polymers have melt viscosities such that they are melt-extrudible.
As is known in the art, the polymer may contain various other additives and modifiers, such as UV stabilizers, antiblocking agents, foaming agents, and fillers (e.g., minerals), to adjust the properties of the polymer.
Preferably, the amount of boron nitride powder in the blend is from about 0-5000 ppm, more preferably, from about 100-1000 ppm, and, most preferably, from about 200-500 ppm.
Blending is carried out in a mixer, such as a v-blender (see Examples below).
Suitable extruders include single screw or twin screw extruders, as are known in the art (see U.S. Pat. No. 5,688,457 to Buckmaster et al., which is hereby incorporated by reference).
Extrusion methods are well known to those of ordinary skill in the art and will not be explained in detail herein (see, e.g., U.S. Pat. Nos. 2,991,508; 3,125,547; 5,688,457 to Buckmaster et al.; Yip et al., ANTEC 1999, Tech. Papers, 45, New York (1999), which are hereby incorporated by reference). Briefly, the boron nitride powder and polymer powder are blended in a mixer. The blend is fed to a hopper, which feeds the extruder. The polymer is melted in the extruder which imparts sufficient shear to disperse the boron nitride particles throughout the melted polymer.
In one embodiment, the method of extrusion of the present invention further includes mixing the extrusion product with virgin polymer to achieve a desired concentration of boron nitride powder in the extrusion product.
In yet another embodiment, the boron nitride powder of the present invention may be combined with other polymer process aids, such as fluoroelastomer process aids (e.g., Dynamar® by Dynecon, Viton® by DuPont Dow Elastomers). Such a combination may provide a synergistic effect.
This comparative Example demonstrates the inability of the conventional dry milling procedure to produce high aspect ratio h-BN.
Three milling experiments were performed on a 4-inch, laboratory, high g-force, cyclomill (Dayton Tinker Company, Dayton, Ohio.). All experiments began with a high graphitization index (>0.4) powder having a surface area of approximately 8 m2/g and a mean volume particle platelet diameter of approximately 6 microns. The charge to the mill was 225 grams of boron nitride and ¼″ steel media filling the volume of the mill almost half full. The first experiment was performed dry for 30 minutes at 500 rpm. The resultant powder was highly contaminated and difficult to disperse for laser scattering analysis. However, the particle size was found, by SEM, to be submicron, estimated to be about 0.25 microns (see FIGS. 2-3). The surface area was measured by single point technique on a Miromeritics Digisorb Analyzer to be 102 m2/gram. The next two duplicate experiments were done with Stoddard solvent milling medium (CAS #8052-41-3). The resulting mean volume particle size was measured to be 6.835 and 5.654 microns, respectively. The surface area was correspondingly measured to be 33 and 22.6 m2/gram, respectively. SEM confirmed that the particles were not submicron.
CTF5, a highly crystalline hexagonal boron nitride powder available from Carborundum Boron Nitride, Amherst, N.Y., was selected as the raw BN material for this example. This high-fired material has a specific surface area of 7.97 m2/g and a particle size D10 of approximately 3.4 μm. Its graphitization index is >0.40.
A milling mixture comprising about 10 wt % CTF5 BN powder, about 90 wt % water, about 0 to 2 wt % polar on non-polar dispersant, and steel milling media was formulated in accordance with the details provided in the Tables that follow.
This milling mixture was then poured into a high energy Sweco Vibro-Energy Grinding Mill Model No. M18L-5 (Florence, Ky.), and milled for between about 4 and 48 hours.
The geometry and purity of the milled powder was then analyzed. The B2O3 content, specific surface area, particle diameter D10, and particle thickness Lc are provided in Tables 1 and 2.
Results for Sweco milled BN powders.
aMv is the mean diameter of the volume (average particle size).
TABLE 2 Repeat of tests in Table 1. Rohm & Hass Duramax BN 3019 BET Milling Media Media Powder Water Dispersant Surface Particle Thick- Sample Time Wt. Dia. Wt. Wt. Wt % Vol % Wt. Area Size Mv Acid B2O3 O2 ness Aspect # (hrs.) (kg) (in.) (grams) (mls) Solids Solids (grams) (m2/g) (microns) Wash Wt % Wt % (nm) Ratio AS0597 0 NA NA NA NA NA NA NA 8.1 6.11 Yes 0.14 .05 113 54 AS0599 8 5 0.5 125 1000 11% 5% 0 17.2 6.40 Yes 1.32 1.77 52 122 AS0596 24 4.5 0.125 60 600 9% 4% 0 38.3 5.03 Yes 0.77 1.34 23 216 AS0600 24 7 0.5 125 1000 11% 5% 0 36.7 5.03 Yes 0.77 1.24 24 207 AS0598 48 7.5 0.5 100 1000 9% 4% 0 58.3 4.41 Yes 0.52 1.41 15 289 Milling Time Lc Graphitization Sample # (hrs) D10b D50c D90d Mva Mne Maf Calc SAg Sdh (A)i La (A)j Index AS0597 0 3.354 5.713 9.328 6.112 3.825 5.224 1.149 2.297 160 220 0.452 AS0599 8 3.294 5.980 9.979 6.397 3.738 5.341 1.123 2.589 140 250 0.410 AS0596 24 2.647 4.694 7.828 5.033 2.866 4.205 1.427 2.007 220 320 0.352 AS0600 24 3.041 4.825 7.257 5.033 3.536 4.490 1.336 1.618 200 300 0.417 AS0598 48 2.240 4.140 6.894 4.409 2.292 3.623 1.656 1.788 200 250 0.303 aMv is the mean diameter of the volume (average particle size) bD10 = 10% of the volume is smaller than the indicated size cD50 = 50% of the volume is smaller than the indicated size dD90 = 90% of the volume is smaller than the indicated size eMn = mean number fMa = mean diameter of the area. gcalc. SA = calculated surface area - spherical particle by microtrac. hSd = standard deviation of particle size distribution iLc = thickness (see jLa = diameter (by X-ray diffraction)
Analysis of this data indicated that the Lc as reported by Hagio is not the appropriate measure of particle size, shape, and surface area. Instead, by measuring size by laser scattering and confirming by scanning electron microscopy, one can see that milling as described produces a high surface area powder by delamination of BN platelets. The increase in surface area is linearly correlated with the input of milling energy (time). The delamination milling results in a minor change in particle diameter as measured by laser scattering technique.
U.S. Pat. No. 5,688,457 to Buckmaster et al., which is hereby incorporated by reference, reports that certain foam cell nucleating agents including boron nitride, when added to thermoplastic polymers, significantly extend the maximum extrusion rate before the onset of gross melt fracture. Buckmaster teaches that such powders are preferably in the range of 0.001 to 5 wt % and have particle sizes of between about 0.5 μm to 20 μm. Buckmaster also teaches that BN particles less than 5 μm, and usually in the range of about 2-5 μm, are preferred over larger BN particles. Yip et al., “The Effect Of The Boron Nitride Type And Concentration On The Rheology And Processability Of Molten Polymers,” ANTEC 1999, Tech. Papers, 45, New York (1999) (“Yip”), which is hereby incorporated by reference, examined the effect of different BN types on such processing, and taught that: a) agglomerated powders are undesirable; b) powders having high oxygen and/or B2O3 (such as about 5 wt % O2 and 2 wt % B2O3) are undesirable; and c) powders having good dispersability are desirable.
In an effort to further understand the dynamics of BN as an extrusion aid for polymer processing, the usefulness of the powders presented in Table 3 below was examined under substantially the same extrusion line presented in Buckmaster and Yip. In particular, the affect of changing characteristics of the BN powder on the maximum shear rate at the onset of gross melt fracture (“GMF”) was studied.
Powders examined for use as an extrusion aid for polymer processing.
Microtrac Data (μm)
aAS# = analytical sample number.
bMv is the mean diameter of the volume (average particle size).
cD10 = 10% of the volume is smaller than the indicated size.
dD50 = 50% of the volume is smaller than the indicated size.
eD90 = 90% of the volume is smaller than the indicated size.
fBET = BET surface area measured on Micromeritics machine.
Analysis of Table 3 led to a number of conclusions. First, use of the high aspect ratio powder of the present invention leads to the highest shear rate before the onset of gross melt fracture. Moreover, the two powders which performed best were those which were heat treated at high temperatures. As discussed above, these high fired powders have highly ordered hexagonal lattices. The surfaces of these materials generally do not have any functional groups adhering thereon (i.e., they are chemically clean). It is possible that the cleanliness of these surfaces leads to lower friction. Therefore, when using BN as a processing aid, it is desirable to use a BN powder having a highly order hexagonal lattice.
The best performing powder, AS431, was highly delaminated. Such a thin particle has a low profile, which may be preferable if the mechanism for reducing pressure drop is die deposition. Moreover, such a low profile wall, when deposited on the die wall, may be more adherent because of reduced drag. Therefore, when using BN as a processing aid, it is desirable to use a BN powder having a high aspect ratio, such as the powders of the present invention.
High B2O3 residual content (more than about 20 ppm) may enhance particle dispersion within the melt (in the manner analogously described by Buckmaster for calcium tetraborate and organic acid salts). Of note, this finding apparently contradicts Yip's conclusion that O2/B2O2 is undesirable. Therefore, when using BN as a processing aid, it is desirable to use a BN powder having at least 0.5 wt % B2O3.
The prior art conclusion that fine particle size is important is not at all supported by Table 3.
Although the high surface area powder performed the best, the powder with the lowest surface area (CFT5) was the second best powder. Therefore, it does not appear that surface area per se is a large factor in determining the utility of a BN processing aid powder.
Therefore, high fired BN powders having a high aspect ratio and possibly a minimum B2O3 content are the most desirable polymer extrusion aids.
Although the invention has been described in detail for the purpose of illustration, it is understood that such detail is solely for that purpose, and variations can be made therein by those skilled in the art without departing from the spirit and scope of the invention which is defined by the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US4107276||Jun 20, 1977||Aug 15, 1978||Elektroschmelzwerk Kempten Gmbh||Manufacture of hexagonal boron nitride|
|US4188194||Jul 1, 1977||Feb 12, 1980||General Electric Company||Direct conversion process for making cubic boron nitride from pyrolytic boron nitride|
|US4195002||Jul 27, 1978||Mar 25, 1980||International Lead Zinc Research Organization, Inc.||Water-dispersible coatings containing boron nitride for steel casting dies|
|US4514370||Jun 8, 1984||Apr 30, 1985||Tokyo Shibaura Denki Kabushiki Kaisha||Process for preparing silicon nitride powder|
|US4634640||Aug 31, 1984||Jan 6, 1987||Elektroschmelzwerk Kempten Gmbh||Dense shaped articles consisting of polycrystalline hexagonal boron nitride and process for their manufacture by isostatic hot-pressing|
|US4731311||Oct 9, 1986||Mar 15, 1988||Sanyo Electric Co., Ltd.||Electrically conductive material and secondary battery using the electrically conductive material|
|US4801445||Jun 17, 1986||Jan 31, 1989||Shiseido Company Ltd.||Cosmetic compositions containing modified powder or particulate material|
|US4863881||Sep 15, 1988||Sep 5, 1989||California Institute Of Technology||Shock consolidation of cubic boron nitride with whiskers of silicon compounds|
|US4869954||Sep 10, 1987||Sep 26, 1989||Chomerics, Inc.||Thermally conductive materials|
|US4882225||Apr 26, 1988||Nov 21, 1989||Shiseido Company Ltd.||Modified powder or particulate material|
|US4927587||Feb 28, 1989||May 22, 1990||Shin-Etsu Chemical Co., Ltd.||Method for manufacturing extrusion molded silicone insulating articles|
|US4997633||Jan 31, 1989||Mar 5, 1991||Kawasaki Steel Corporation||Water-soluble boron containing impurity reduced hexagonally crystalline boron nitride|
|US5001091||Mar 9, 1989||Mar 19, 1991||Norton Company||Readily moldable or castable ceramic powders|
|US5011870||Feb 8, 1989||Apr 30, 1991||Dow Corning Corporation||Thermally conductive organosiloxane compositions|
|US5039435||Apr 28, 1989||Aug 13, 1991||Hanano Commercial Co., Ltd.||Die-casting powdery mold releasing agent|
|US5064589||Feb 26, 1991||Nov 12, 1991||Showa Denko K.K.||Method for producing high density hexagonal boron nitride sintered article|
|US5098609||Nov 3, 1989||Mar 24, 1992||The Research Foundation Of State Univ. Of N.Y.||Stable high solids, high thermal conductivity pastes|
|US5116589||Jun 18, 1990||May 26, 1992||The United States Of America As Represented By The United States Department Of Energy||High density hexagonal boron nitride prepared by hot isostatic pressing in refractory metal containers|
|US5194480||May 24, 1991||Mar 16, 1993||W. R. Grace & Co.-Conn.||Thermally conductive elastomer|
|US5213868||Aug 13, 1991||May 25, 1993||Chomerics, Inc.||Thermally conductive interface materials and methods of using the same|
|US5229339||Nov 12, 1991||Jul 20, 1993||Norton Company||Pressure casting ceramic slurries|
|US5234712||Jun 8, 1992||Aug 10, 1993||The Dow Chemical Company||Method of making moisture resistant aluminum nitride powder and powder produced thereby|
|US5283542||Jul 2, 1992||Feb 1, 1994||Mitsubishi Denki Kabushiki Kaisha||Low-shrinkage unsaturated wet type polyester resin (B.M.C.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom|
|US5285108||Aug 21, 1992||Feb 8, 1994||Compaq Computer Corporation||Cooling system for integrated circuits|
|US5298791||Jan 26, 1993||Mar 29, 1994||Chomerics, Inc.||Thermally conductive electrical assembly|
|US5312571||Jan 7, 1993||May 17, 1994||Norton Company||Shaped bodies and the production thereof|
|US5374036||Oct 5, 1993||Dec 20, 1994||Foseco International Limited||Metallurgical pouring vessels|
|US5466269||Nov 30, 1992||Nov 14, 1995||General Electric Company||Polycrystalline cubic boron nitride abrasive particles and abrasive tools made therefrom|
|US5466400||Oct 17, 1994||Nov 14, 1995||Norton Company||Process for drip casting silicon nitride slurries|
|US5508110||Jan 28, 1993||Apr 16, 1996||The Dow Chemical Company||Method of making moisture resistant aluminum nitride powder and powder produced thereby|
|US5510174||Apr 12, 1994||Apr 23, 1996||Chomerics, Inc.||Thermally conductive materials containing titanium diboride filler|
|US5525557||May 3, 1995||Jun 11, 1996||Norton Company||High density green bodies|
|US5528462||Jun 29, 1994||Jun 18, 1996||Pendse; Rajendra D.||Direct chip connection using demountable flip chip package|
|US5545473||Feb 14, 1994||Aug 13, 1996||W. L. Gore & Associates, Inc.||Thermally conductive interface|
|US5567353||Apr 13, 1995||Oct 22, 1996||Rohm And Haas Company||Method for dispersing ceramic material in an aqueous medium|
|US5571760||Oct 18, 1994||Nov 5, 1996||Saint-Gobain/Norton Industrial Ceramics Corporation||Silicon nitride having a high tensile strength|
|US5591034||Jul 25, 1995||Jan 7, 1997||W. L. Gore & Associates, Inc.||Thermally conductive adhesive interface|
|US5593773||Jul 23, 1993||Jan 14, 1997||Silberline Limited||Metal powder pigment|
|US5601874||Dec 27, 1995||Feb 11, 1997||The Dow Chemical Company||Method of making moisture resistant aluminum nitride powder and powder produced thereby|
|US5660917||Jul 6, 1993||Aug 26, 1997||Kabushiki Kaisha Toshiba||Thermal conductivity sheet|
|US5681883||Mar 5, 1996||Oct 28, 1997||Advanced Ceramics Corporation||Enhanced boron nitride composition and polymer based high thermal conductivity molding compound|
|US5688457||Apr 10, 1996||Nov 18, 1997||E. I. Du Pont De Nemours And Company||High speed extrusion|
|US5696041||Jan 15, 1997||Dec 9, 1997||Saint-Gobain/Norton Industrial Ceramics Corp.||High solids silicon nitride aqueous slurries|
|US5738936||Jun 27, 1996||Apr 14, 1998||W. L. Gore & Associates, Inc.||Thermally conductive polytetrafluoroethylene article|
|US5759481||Oct 25, 1996||Jun 2, 1998||Saint-Gobain/Norton Industrial Ceramics Corp.||Silicon nitride having a high tensile strength|
|US5781412||Nov 22, 1996||Jul 14, 1998||Parker-Hannifin Corporation||Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size|
|US5849316||Jun 25, 1997||Dec 15, 1998||L'oreal||Anhydrous and water resistant cosmetic compositions|
|US5854155||Jan 15, 1997||Dec 29, 1998||Denki Kagaku Kogyo Kabushiki Kaisha||Hexagonal system boron nitride powder|
|US5898009||Nov 12, 1997||Apr 27, 1999||Advanced Ceramics Corporation||High density agglomerated boron nitride particles|
|US5907474||Apr 25, 1997||May 25, 1999||Advanced Micro Devices, Inc.||Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package|
|US5908796||May 1, 1998||Jun 1, 1999||Saint-Gobain Industrial Ceramics, Inc.||Dense silicon nitride ceramic having fine grained titanium carbide|
|US5926371||Apr 25, 1997||Jul 20, 1999||Advanced Micro Devices, Inc.||Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device|
|US5950066||Jun 14, 1996||Sep 7, 1999||The Bergquist Company||Semisolid thermal interface with low flow resistance|
|US5981641||Aug 8, 1997||Nov 9, 1999||Shin-Etsu Chemical Co., Ltd.||Heat conductive silicone composition, heat conductive material and heat conductive silicone grease|
|US5985228||Dec 22, 1992||Nov 16, 1999||General Electric Company||Method for controlling the particle size distribution in the production of multicrystalline cubic boron nitride|
|US6048511||Jan 5, 1999||Apr 11, 2000||Advanced Ceramics Corporation||Method for forming high density boron nitride and high density agglomerated boron nitride particles|
|US6110527||May 24, 1994||Aug 29, 2000||General Electric Company||Silicon carbide composite with metal nitride coated fiber reinforcement|
|US6158894||Jul 28, 1999||Dec 12, 2000||Saint-Gobain Ceramics & Plastics, Inc.||All ceramic bearing|
|US6162849||Jan 11, 1999||Dec 19, 2000||Ferro Corporation||Thermally conductive thermoplastic|
|US6168859||May 29, 1998||Jan 2, 2001||The Dow Chemical Company||Filler powder comprising a partially coated alumina powder and process to make the filler powder|
|US6255376||Jul 27, 1998||Jul 3, 2001||Kyocera Corporation||Thermally conductive compound and semiconductor device using the same|
|US6284817||Feb 29, 2000||Sep 4, 2001||Loctite Corporation||Conductive, resin-based compositions|
|US6319602||Aug 6, 1997||Nov 20, 2001||Otsuka Kagaku Kabushiki Kaisha||Boron nitride and process for preparing the same|
|US6541111||Sep 27, 2001||Apr 1, 2003||Otsuka Kagaku Kabushiki Kaisha||Process for producing boron nitride|
|US6548152||Apr 9, 2001||Apr 15, 2003||Matsushita Electric Industrial Co., Ltd.||Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same|
|US6660241 *||Apr 26, 2001||Dec 9, 2003||Saint-Gobain Ceramics & Plastics, Inc.||Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof|
|US6764975 *||Nov 28, 2000||Jul 20, 2004||Saint-Gobain Ceramics & Plastics, Inc.||Method for making high thermal diffusivity boron nitride powders|
|DE3917726A1||May 31, 1989||Jul 19, 1990||Hanano Commercial Co Ltd||Formentrennmittel fuer druckgussverfahren|
|EP0279769A2||Feb 17, 1988||Aug 24, 1988||Rogers Corporation||Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material|
|EP0432007A1||Nov 23, 1990||Jun 12, 1991||Rhone-Poulenc Chimie||Monodisperse hexagonal boron nitride having high purity with respect to metals and oxygen and its preparation process|
|EP0939066A1||Feb 16, 1998||Sep 1, 1999||Advanced Ceramics Corporation||Method for forming high density boron nitride and high density agglomerated boron nitride particles|
|EP0982391A1||Dec 15, 1998||Mar 1, 2000||Shin-Etsu Chemical Co., Ltd.||Aluminium nitride powder and thermally conductive grease composition using the same|
|GB2301818A||Title not available|
|JPH115907A||Title not available|
|JPH04321506A||Title not available|
|JPH07157369A||Title not available|
|JPH09151324A||Title not available|
|JPH10204300A||Title not available|
|JPH11134944A||Title not available|
|1||"Silicones & Silicon-Containing Polymers," Petrarch Systems Silanes and Silicones: Silicon Compounds Register & Review (1987).|
|2||Carborundum Boron Nitride Data Sheet, "Cosmetic Grade Boron Nitride Powders" (Jun. 1998).|
|3||Hagio et al., "Sintering of the Mechanochemically Activated Powders of Hexagonal Boron Nitride," J. Am. Ceram. Soc., 72(8): 1482-84 (1989).|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7914886||Nov 21, 2008||Mar 29, 2011||Saint-Gobain Ceramics & Plastics, Inc.||Structural component comprising boron nitride agglomerated powder|
|US8169767||Feb 23, 2011||May 1, 2012||Saint-Gobain Ceramics & Plastics, Inc.||Boron nitride agglomerated powder and devices comprising the powder|
|US8206729 *||Oct 31, 2006||Jun 26, 2012||Momentive Performance Materials Inc.||Compositions for topical applications comprising boron nitride|
|US8476206||Jul 2, 2012||Jul 2, 2013||Ajay P. Malshe||Nanoparticle macro-compositions|
|US8486870||Jul 2, 2012||Jul 16, 2013||Ajay P. Malshe||Textured surfaces to enhance nano-lubrication|
|US8663665 *||Oct 31, 2006||Mar 4, 2014||Momentive Performance Materials Inc.||Anti-chafing compositions comprising boron nitride|
|US8796392||Dec 10, 2012||Aug 5, 2014||Ticona Llc||Low temperature injection molding of polyarylene sulfide compositions|
|US8834739||Oct 19, 2011||Sep 16, 2014||The Boeing Company||Boron nitride nano-platelete based materials|
|US8852487||Dec 10, 2012||Oct 7, 2014||Ticona Llc||Injection molding of polyarylene sulfide compositions|
|US8921286||Jun 13, 2013||Dec 30, 2014||Nanomech, Inc.||Textured surfaces to enhance nano-lubrication|
|US8946333||Mar 14, 2013||Feb 3, 2015||Momentive Performance Materials Inc.||Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics|
|US9079801||Jun 30, 2011||Jul 14, 2015||Momentive Performance Materials Inc.||Boron nitride particles of spherical geometry and process of making|
|US9080036||Dec 10, 2012||Jul 14, 2015||Ticona Llc||Nucleating system for polyarylene sulfide compositions|
|US9127142||Aug 4, 2014||Sep 8, 2015||Ticona Llc||Low temperature injection molding of polyarylene sulfide compositions|
|US9359575||May 31, 2013||Jun 7, 2016||Nanomech, Inc.||Nanoparticle macro-compositions|
|US9434870||Dec 24, 2014||Sep 6, 2016||Momentive Performance Materials Inc.||Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics|
|US9499766||Jun 19, 2013||Nov 22, 2016||Board Of Trustees Of The University Of Arkansas||Nanoparticle compositions and methods for making and using the same|
|US20070205706 *||Jan 2, 2007||Sep 6, 2007||General Electric Company||Optical Substrate Comprising Boron Nitride Particles|
|US20070207102 *||Oct 31, 2006||Sep 6, 2007||General Electric Company||Compositions for Topical Applications Comprising Boron Nitride|
|US20080311206 *||Oct 31, 2006||Dec 18, 2008||General Electric Company||Anti-Chafing Compositions Comprising Boron Nitride|
|US20090071695 *||Nov 21, 2008||Mar 19, 2009||Saint-Gobain Ceramics & Plastics, Inc.||Boron nitride agglomerated powder|
|US20130338606 *||Aug 16, 2013||Dec 19, 2013||Momentive Performance Materials Inc.||Self-lubricating pharmaceutical syringe stoppers|
|USRE45803||Aug 17, 2009||Nov 17, 2015||Saint-Gobain Ceramics & Plastics, Inc.||High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them|
|USRE45923||Nov 3, 2005||Mar 15, 2016||Saint-Gobain Ceramics & Plastics, Inc.||High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them|
|EP3115404A1||Jul 8, 2015||Jan 11, 2017||Covestro Deutschland AG||Thermoplastic composition containing boron nitride hybrid material|
|EP3115405A1||Jul 8, 2015||Jan 11, 2017||Covestro Deutschland AG||Boron nitride containing thermoplastic composition|
|WO2014055258A1||Sep 19, 2013||Apr 10, 2014||Momentive Performance Materials Inc.||Compositions comprising exfoliated boron nitride and method for forming such compositions|
|U.S. Classification||106/287.3, 428/704, 428/402|
|International Classification||C08L101/00, C08K3/38, B29C47/00, C01B21/064|
|Cooperative Classification||C01P2002/04, C01P2004/54, B29C47/0004, C01P2002/60, C01P2004/03, Y10T428/2993, C01B21/0648, C01P2006/12, C01P2006/80, Y10T428/2916, C01P2004/20, C01B21/064, B29C47/0011, C01P2002/77, C01P2004/61, Y10T428/2927, Y10T428/2982|
|European Classification||B29C47/00B, C01B21/064, C01B21/064T|
|Apr 6, 2009||FPAY||Fee payment|
Year of fee payment: 4
|Mar 8, 2013||FPAY||Fee payment|
Year of fee payment: 8