|Publication number||US6951980 B2|
|Application number||US 09/967,371|
|Publication date||Oct 4, 2005|
|Filing date||Sep 29, 2001|
|Priority date||Sep 29, 2001|
|Also published as||EP1298724A2, EP1298724A3, US20030062184|
|Publication number||09967371, 967371, US 6951980 B2, US 6951980B2, US-B2-6951980, US6951980 B2, US6951980B2|
|Original Assignee||Texas Instruments Incorporated|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (9), Referenced by (2), Classifications (37), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention is directed to a package for electrical devices. The present invention is especially useful in packaging electronic devices such as integrated circuits or similar electrical devices. The present invention provides a small package of increased robustness that is amenable to surface mounting in circuitry in a manner that is economical in its occupation of board space.
Prior art electrical device packages, such as dual in line packages and small outline packages, present contact structures extending from a plastic package body for providing electrical access with the electrical device that is contained within the package body. With such prior art packages, the contact structures are susceptible to bending or breaking during their manufacture or during their being assembled in circuit board arrangements for inclusion in a product. Further, the extension of the contact structures from the package body requires that the package will occupy board space that is larger than the space required for accommodating the package body alone. That is, there is a “real estate” overhead that is incurred by using such prior art packages that have extending contact structures. In today's market manufacturers are ever striving to produce smaller, more compact products. Because of the emphasis on smaller products, real estate occupied by respective components of a product is an important consideration in designing products.
The package of the present invention provides a significant advantage in creating a compact product. The package of the present invention provides a robust component that can endure the rigors of manufacturing and assembly with a significantly lesser likelihood of suffering bent or broken contact structures than is experienced by prior art package designs because the present invention does not present any extended contact structures. The package of the present invention uses less material for establishing electrical access to the electrical device contained within the package than is used with prior art packages. Contact material is often an expensive material, such as gold-plated metal or a similar material. Use of a lesser amount of contact material provides cost savings in the package of the present invention over prior art packaging structures.
A package for an electrical device having at least one connection locus for providing selected electrical access to the device includes: (a) a substrate having an accommodation site; (b) at least one electrically conductive mass arranged with the substrate in a neighboring relationship with the accommodation site; (c) at least one connection structure coupling the at least one connection locus with the at least one conductive mass when the device is situated at the accommodation site in an assembled orientation; and (d) an enclosing structure substantially enclosing the device and a portion of the substrate. The enclosing structure and the at least one conductive mass cooperate to present at least one contact structure accessible from exterior of the enclosing structure configured for effecting surface mounting of the package in a circuit.
It is, therefore, an object of the present invention to provide a package for an electrical device that is advantageous for creating a compact product.
It is a further object of the present invention to provide a package for an electrical device that presents a robust component that can endure the rigors of manufacturing and assembly with a lesser likelihood of suffering bent or broken contact structures than is experienced by prior art package designs.
It is yet a further object of the present invention to provide a package for an electrical device that is less expensive to manufacture than prior art package designs.
Further objects and features of the present invention will be apparent from the following specification and claims when considered in connection with the accompanying drawings, in which like elements are labeled using like reference numerals in the various figures, illustrating the preferred embodiments of the invention.
Package 10 is mounted with a circuit board 34 by inserting contact structures 14 within through holes 36. As mentioned earlier, through holes 36 are dimensioned to receive first portions 18 of contact structures 14 while not admitting second portions 20. By this structure, package 10 rests upon circuit board 34 substantially on seating plane 22 when assembled with circuit board 34. Through holes 36 are filled with solder or another conductive material to effect electrical connection with contact structures 14. Through holes 36 are selectively coupled with circuit traces or other circuit elements in or on circuit board 34 (not shown in
Package 50 is mounted with a circuit board 74 by affixing contact structures 54 with bonding loci, or pads, 76. Affixing may be effected using solder, conductive adhesive, or another affixing technology appropriate to establish an electrically conductive bond between a respective contact structure 54 and a respective bonding pad 76. By this structure, package 50 rests upon circuit board 74 substantially on seating plane 62 when assembled with circuit board 74. Bonding pads 76 are selectively coupled with circuit traces or other circuit elements in or on circuit board 74 (not shown in
Package body 92 is preferably a substantially solid molded body containing electrical device 110 (FIG. 10). Alternatively, package body 92 may be embodied in a shell structure that establishes a substantially enclosed atmosphere about electrical device 110, as illustrated in FIG. 9. Although not shown in detail in
Package body 132 is preferably a substantially solid molded body containing electrical device 150 (FIG. 10). In the alternative, package body 132 may be embodied in a shell structure that establishes a substantially enclosed atmosphere about electrical device 114 (FIG. 9). Although not shown in detail in
As illustrated in
Representative packaged device 221 includes a package body 214 containing an electrical device 208. Electrical device 208 rests upon a substrate 200. Contact structures 206 may embeddedly traverse substrate 200. That is, substrate 200 has a transplanar dimension having a first extremity at first side 201 and a second extremity at second side 202 (FIG. 13). Contact structures 206 may extend through substrate 200 from the first extremity of the transplanar dimension of substrate 200 at first side 201 to the second extremity of the transplanar dimension of substrate 200 at second side 202. Alternatively, contact structures 206 may have a generally U-shape and may be wrapped around an edge of substrate 200 to extend from the first extremity of the transplanar dimension of substrate 200 at first side 201 of substrate 200 to the second extremity of the transplanar dimension at second side 202 of substrate 200. In either embodiment, contact structures 206 present electrical access for selectively coupling electrical device 208 with respective contact structures 206 within body 214 using bonding wires 210, and also present electrical access for coupling contact structures 206 with circuitry upon or within circuit board 230 via mounting structures 224. In the embodiment of contact structures 206 illustrated in
Package body 214 is preferably a substantially solid molded body containing electrical device 208 (FIG. 10). In the alternative, package body 214 may be embodied in a shell structure that establishes a substantially enclosed atmosphere about electrical device 208 (FIG. 9). Although not shown in detail in
Method 300 begins with the step of providing a substantially planar substrate, as indicated by a block 302. The substrate has a first side and a second side.
Method 300 continues with identifying an accommodation site on one side of the first side and the second side of the substrate, as indicated by a block 304.
Method 300 continues with providing a plurality of electrically conductive lands arranged in a pattern about the accommodation site, as indicated by a block 306. The plurality of conductive lands are electrically accessible from the first side and from the second side of the substrate.
Method 300 continues with situating the device at the accommodation site in an assembled orientation, as indicated by a block 308.
Method 300 continues with coupling a plurality of connection structures with selected connection loci of the plurality of connection loci and with selected conductive lands of the plurality of conductive lands, as indicated by a block 310.
Method 300 concludes with installing an enclosing structure substantially enclosing the device and the one side of the substrate, as indicated by a block 312. The enclosing structure and the plurality of conductive lands cooperate to present particular conductive lands of the plurality of conductive lands electrically accessible from exterior of the enclosing structure for effecting surface mounting of the package in a circuit.
It is to be understood that, while the detailed drawings and specific examples given describe preferred embodiments of the invention, they are for the purpose of illustration only, that the apparatus and method of the invention are not limited to the precise details and conditions disclosed and that various changes may be made therein without departing from the spirit of the invention which is defined by the following claims:
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5723904||Mar 10, 1994||Mar 3, 1998||Sumitomo Electric Industries, Ltd.||Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board|
|US5729437 *||Jun 6, 1995||Mar 17, 1998||Seiko Epson Corporation||Electronic part including a thin body of molding resin|
|US5821608 *||Sep 6, 1996||Oct 13, 1998||Tessera, Inc.||Laterally situated stress/strain relieving lead for a semiconductor chip package|
|US6081029 *||Feb 4, 1999||Jun 27, 2000||Matsushita Electronics Corporation||Resin encapsulated semiconductor device having a reduced thickness and improved reliability|
|US6111306 *||Oct 6, 1997||Aug 29, 2000||Fujitsu Limited||Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same|
|US6265673||Jul 8, 1997||Jul 24, 2001||Matsushita Electric Industrial Co., Ltd.||Semiconductor element-mounting board and semiconductor device|
|US6303978 *||Jul 27, 2000||Oct 16, 2001||Motorola, Inc.||Optical semiconductor component and method of manufacture|
|US6384478 *||May 6, 1998||May 7, 2002||Conexant Systems, Inc.||Leadframe having a paddle with an isolated area|
|US20010007371||Jan 3, 2001||Jul 12, 2001||Motorola, Inc.||IC package and method of making the same|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7497696||Mar 29, 2007||Mar 3, 2009||Intel Corporation||Socket for land grid array package|
|US20080242123 *||Mar 29, 2007||Oct 2, 2008||Robert Martinson||Socket for land grid array package|
|U.S. Classification||174/535, 257/E23.188, 257/787, 257/693, 257/668, 257/E23.125, 257/676, 174/541, 257/E23.061, 257/E23.066|
|International Classification||H05K3/34, H01L23/31, H01L23/12, H01L23/498, H01L23/053, H01L23/52|
|Cooperative Classification||H01L2924/14, H01L2224/45099, H01L2924/00014, H01L2224/85399, H01L2224/05599, H01L2224/05554, H01L2924/181, H01L2224/48091, H01L24/48, H01L2224/48247, H01L2924/01079, H01L2924/01078, H01L23/3121, H01L23/053, H01L23/49805, H01L23/49861, H05K3/3442|
|European Classification||H01L23/053, H01L23/498L, H01L23/31H2, H01L23/498A|
|Sep 29, 2001||AS||Assignment|
Owner name: TEXAS INSTRUMENTS INCORPORATED, TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MATSUNAMI, AKIRA;REEL/FRAME:012225/0869
Effective date: 20010926
|Mar 20, 2009||FPAY||Fee payment|
Year of fee payment: 4
|Mar 18, 2013||FPAY||Fee payment|
Year of fee payment: 8