|Publication number||US6978406 B2|
|Application number||US 10/155,544|
|Publication date||Dec 20, 2005|
|Filing date||May 24, 2002|
|Priority date||May 24, 2002|
|Also published as||US20030221145|
|Publication number||10155544, 155544, US 6978406 B2, US 6978406B2, US-B2-6978406, US6978406 B2, US6978406B2|
|Inventors||Gayvin E Stong, Jeffrey Thomas Robertson|
|Original Assignee||Agilent Technologies, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (4), Referenced by (5), Classifications (6), Legal Events (7)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. Field of the Invention
The present invention is generally related to test circuitry, and, more particularly, to a system and method for testing memory arrays in circuitry.
2. Discussion of the Related Art
Integrated circuits (ICs) are electrical circuits comprising transistors, resistors, capacitors, and other components on a single semiconductor “chip” on which the components are interconnected to perform a variety of functions. Typical examples of ICs include, for example, microprocessors, programmable logic devices (PLDs), electrically erasable programmable read only memory (EEPROM) devices) random access memory (RAM) devices, operational amplifiers and voltage regulators. A circuit designer typically designs the IC by creating a circuit schematic indicating the electrical components and their interconnections. Often, designs are simulated by computer to verify functionality and to ensure that performance goals are satisfied.
In electrical device engineering, the design and analysis work involved in producing electronic devices is often performed using electronic computer-aided design (E-CAD) tools. As will be appreciated, electronic devices include analog, digital, mixed hardware, optical, electromechanical, and a variety of other electrical devices. The design and subsequent simulation of any circuit, very large scale integration (VLSI) chip, or other electrical device via E-CAD tools allows a circuit to be thoroughly tested and often eliminates the need for building a prototype. Thus, today's sophisticated E-CAD tools may enable the circuit manufacturer to go directly to the manufacturing stage without having to perform costly, time consuming prototyping.
In order to perform the simulation and analysis of a hardware device, E-CAD tools utilize an electronic representation of the hardware device. A “netlist” is one common representation of a hardware device that includes the circuit. As will be appreciated by those skilled in the art of hardware device design, a “netlist” is a detailed circuit specification used by logic synthesizers, circuit simulators and other circuit design optimization tools. A netlist typically comprises a list of circuit components and the interconnections between those components.
The two forms of a netlist are the flat netlist and the hierarchical netlist. Often, a netlist will contain a number of circuit “modules,” which are used repetitively throughout the larger circuit. A flat netlist will contain multiple copies of the circuit modules essentially containing no boundary differentiation between the circuit modules and other components in the device. By way of analogy, one graphical representation of a flat netlist is the schematic of the circuit device.
In contrast, a hierarchical netlist maintains only one copy of a circuit module, which may be used in multiple locations. By way of analogy, one graphical representation of a hierarchical netlist shows the basic and/or non-repetitive devices in schematic form and the more complex and/or repetitive circuit modules are represented by “black boxes.” As will be appreciated by those skilled in the art, a “black box” is a system or component where the inputs, outputs, and general function are known, but the contents of which are not shown. These “black box” representations, hereinafter called “modules,” mask the complexities therein, typically showing only input/output ports.
An IC design can be represented at different levels of abstraction, such as at the register-transfer level (RTL) and at the logic level, using a hardware description language (HDL). VHDL® and Verilog® are examples of HDL languages. At any abstraction level, an IC design is specified using behavioral or structural descriptions, or a mix of both. At the logical level, the behavioral description is specified using Boolean equations. The structural description is represented as a netlist of primitive cells. Examples of primitive cells are, among others, full-adders, logic gates, latches, and flip-flops.
Set forth above is some very basic information regarding integrated circuits and other circuit schematics that are represented in netlists. Systems are presently known that use the information provided in netlists to evaluate circuit timing and other related parameters. More specifically, systems are known that perform a timing analysis of circuits using netlist files. Although the operational specifics may vary from system to system, such systems generally operate by identifying certain critical timing paths, then evaluating the circuit to determine whether timing violations may occur through the critical paths. As is known, timing specifications may be provided to such systems by way of a configuration file.
While there is extensive testing of designs of electronic devices in the design phase, there is also a need for testing of electronic devices after manufacture to eliminate devices having manufacturing flaws. Currently, memory arrays are tested by adding self-test circuitry which requires many additional gates or by bringing the input and outputs out to the device pins, or by wrapping test circuitry around the memory array.
Thus, a heretofore unaddressed need exists in the industry to address the aforementioned and/or other deficiencies and inadequacies.
The present invention provides chip analyzer systems and methods for testing memory arrays in circuitry. Briefly described, in architecture, one embodiment of the system includes a memory test input logic that acquires test data via a data port, a memory test enable logic and a memory test output logic.
The invention can also be viewed as providing one or more methods for testing memory arrays in circuitry. In this regard, one such method can be summarized by the following steps: (1); acquiring test data via a data port; (2) writing the test data to a memory address in the memory array; (3) reading output data from the memory address in the memory array; and (4) comparing the test data and the output data to determine if the memory address in the memory array passes a test.
The accompanying drawings incorporated in and forming a part of the specification, illustrate several aspects of the present invention, and together with the description serve to explain the principles of the invention. In the drawings:
Having summarized various aspects of the present invention, the invention will now be described in detail with reference to the drawings. While the invention will be described in connection with these drawings, there is no intent to limit it to the embodiment or embodiments disclosed therein. On the contrary, the intent is to cover all alternatives, modifications and equivalents included within the spirit and scope of the invention as protected by the appended claims.
As will be described in detail, systems and methods of the invention provide a methodology for testing memory arrays, such as for example but not limited to, latch-arrays, RAM cells and content addressable memory. A latch-array is a memory structure comprising latches arranged in a given word width with a given number of entries.
In order to make the memory array testable, memory test logic has been added to the standard memory array configuration. The first logic addition is a memory test input circuit to control the input data, which is added to an existing input latch which prevents a race condition from occurring in the memory array. The next logic addition is the memory test enable circuit that controls the enabling of write commands into the memory array. This memory test enable circuit is added so that a design tester can control when data is written into the memory array. The third addition is a memory test output circuit that captures the data being output from the memory array. These memory test circuits enable input and output circuits around the memory array to be tested, in addition to the memory array.
Moreover, these memory test circuits enable logic external to the memory array to be tested as well. By setting a chip test signal, a design tester can use the memory test output circuit to control the data that drives logic external to the memory array so that the external logic may be tested. The memory test input circuit captures data coming from the rest of the chip. This enables the remaining portions of an integrated circuit to treat the memory array as a black box for testing.
In an alternative embodiment, the memory test logic of the present invention can test the speed of a memory array. In order to test the speed of the memory array, the design tester controls the data input, the write and read addresses and a bypass signal. The memory test enable circuit controls the write enable. The write and read addresses, and the data input are controlled on the first step of multiple clock cycles, where the write enable is controlled during all of the clock cycles. The write and read addresses and input data are controlled by tracing back through the logic that feeds the signals into the memory array and setting up the input registers to that logic. A speed test of the data output is performed and the output data is captured in circuitry down stream from the memory array.
The circuitry 20 also includes a circuit input port 21 and a test port 23. The circuit input port 21 allows for data to be input from outside of circuitry 20. This data is input into the memory test input circuit 50. The memory test input circuit 50 can be, for example, but not limited to, any kind of scannable input register or latch. Data input to the memory test input circuit 50 is input into memory array 27.
The test port 23 is a bidirectional connection to the write enable register 32, memory write register and decoder 35, memory read register and decoder 39, memory test input circuit 50, memory test enable circuit 60 and memory test output circuit 70. The test port 23 allows for data to be input to circuitry 20 from logic outside of circuitry 20. The test port 23 also allows for data to be output from circuitry 20 to logic outside of circuitry 20. The test port 23 can be connected in either serial or parallel modes depending on design requirements.
The data can be written upon the receipt of proper signals from the memory test enable circuit 60, which is herein defined in further detail with regard to
The other input into logic circuitry 36 is the output of the memory write register and decoder 35. The memory write register and decoder 35 receives a data signal from the memory write address 34 and the memory write clock 33. Upon receiving the proper signal from the memory write clock 33, the memory write register and decoder 35 outputs a signal into the logic circuitry 36. Upon signals being received from both the write enable register 32 and the memory write register and decoder 35, the logic circuitry 36 inputs a write signal into the memory array 27. Upon receiving this signal, an input data value may be clocked into memory array 27 from memory test input circuit 50.
Memory data may be clocked out of the memory array 27 through the memory read circuitry. The memory read circuitry includes the memory read address 37, the memory read clock 38 and the memory read register and decoder 39. Signals from both the memory read address 37 and memory read clock 38 are input into memory read register and decoder 39. Upon having a valid memory read address 37 and receiving the proper clock signal from the memory read clock 38, the memory read register and decoder 39 instructs the memory array 27 to read out a data value on line 28. The data read out from memory array 27 on line 28 is input into memory test output circuit 70. The memory test output circuit 70 is herein defined in further detail with regard to
The output from memory test output circuit 70 is via connection 29 into data selector 42. Data selector 42 also receives data directly from the circuit input port 21 via connection 22. The data selector 42 determines which data is passed on to output data 43 by the indication of the bypass signal 41. If the bypass signal 41 triggers the data selector 42 to form a bypass signal, then the data from circuit input port 21, via line 22, is output through the data selector 42 into the output data 43. This data bypass enables the input data to bypass the memory array when the same location is to be both written into and read from as well.
When the array write test signal 61 is activated, the array test multiplexer 64 selects the signal from the array test registers 62 and 63. The memory test enable circuitry 60 has array test registers 62 and 63 to enable a speed test of the memory array 27 (
The data input and write address are controlled on the first of two clock cycles. When the memory test enable circuitry 60 is set for normal operation, the array write test signal 61 indicates that the write enable signal 31 is to be used for the circuitry 20. However, if the array write test signal 61 indicates that there is to be a speed test of the memory array 27, the memory test enable circuitry 60 utilizes the array test registers 62 and 63 to control the write enable signal 31 during both clock cycles of the speed test (
The scannable register 71 captures data being read out of the memory array 27. The scannable register 71 can input data from and output data to test port 23. The scannable register 71 also allows the memory test output circuit 70 to enable logic external to the memory array 27 to be tested. By setting the chip test signal 72, the output of scannable register 71 can drive logic external to the memory array 27 through data selector 73. This allows logic external to the memory array 27 to be tested. This allows the rest of the circuitry 20 to treat the memory array 27 as a black box.
The local interface 84 can be, for example but not limited to, one or more buses or other wired or wireless connections, as is known in the art. The local interface 84 may have additional elements, which are omitted for simplicity, such as controllers, buffers (caches), drivers, repeaters, and receivers, to enable communications. Further, the local interface 84 may include address, control, and/or data connections to enable appropriate communications among the aforementioned components.
The processor 82 is a hardware device for executing software that can be stored in memory 83. The processor 82 can be virtually any custom made or commercially available processor, a central processing unit (CPU) or an auxiliary processor among several processors associated with the computer system 10, and a semiconductor based microprocessor (in the form of a microchip) or a macroprocessor. Examples of suitable commercially available microprocessors are as follows: an 80×86, Pentium, or Itanium series microprocessor from Intel Corporation, U.S.A., a PowerPC microprocessor from IBM, U.S.A., a Sparc microprocessor from Sun Microsystems, Inc, a PA-RISC series microprocessor from Hewlett-Packard Company, U.S.A., or a 68xxx series microprocessor from Motorola Corporation, U.S.A.
The memory 83 can include any one or combination of volatile memory elements (e.g., random access memory (RAM, such as DRAM, SRAM, etc.)) and nonvolatile memory elements (e.g., ROM, hard drive, tape, CDROM, etc.). Moreover, the memory 83 may incorporate electronic, magnetic, optical, and/or other types of storage media. Note that the memory 83 can have a distributed architecture, where various components are situated remote from one another, but can be accessed by the processor 82.
The software in memory 83 may include one or more separate programs, each of which comprises an ordered listing of executable instructions for implementing logical functions. In the example of
A non-exhaustive list of examples of suitable commercially available operating systems 88 are as follows: a Windows operating system from Microsoft Corporation, U.S.A., a Netware operating system available from Novell, Inc., U.S.A., an operating system available from IBM, Inc., U.S.A., any LINUX operating system available from many vendors or a UNIX operating system, which is available for purchase from many vendors, such as Hewlett-Packard Company, U.S.A., Sun Microsystems, Inc. and AT&T Corporation, U.S.A. The operating system 88 essentially controls the execution of other computer programs, such as the memory test analyzer 100, and provides scheduling, input-output control, file and data management, memory management, and communication control and related services.
The memory test analyzer 100 may be a source program, executable program (object code), script, or any other entity comprising a set of instructions to be performed. When a source program, then the program is usually translated via a compiler, assembler, interpreter, or the like, which may or may not be included within the memory 83, so as to operate properly in connection with the operating system 88. Furthermore, the memory test analyzer 100 can be written in object oriented programming language, which has classes of data and methods, or (b) a procedure programming language, which has routines, subroutines, and/or functions, for example but not limited to, C, C++, Pascal, BASIC, FORTRAN, COBOL, Perl, Java, and Ada.
The I/O devices 85 may include input devices, for example but not limited to, a keyboard, mouse, scanner, microphone, etc. Furthermore, the I/O devices 85 may also include output devices, for example but not limited to, a printer, display 86, etc. Finally, the I/O devices 85 may further include devices that communicate both inputs and outputs, for instance but not limited to, a modulator/demodulator (modem; for accessing another device, system, or network), a radio frequency (RF) or other transceiver, a telephonic interface, a bridge, a router, etc. The computer system 81 also includes chip interface 87 for use in communicating data with an IC chip. This chip interface 87 enables computer system 81 to access IC chips to be tested.
If the computer system 81 is a PC, workstation, or the like, the software in the memory 83 may further include a basic input output system (BIOS) (omitted for simplicity). The BIOS is a set of essential software routines that initialize and test hardware at startup, start the operating system 88, and support the transfer of data among the hardware devices. The BIOS is stored in ROM so that the BIOS can be executed when the computer system 81 is activated.
When the computer system 81 is in operation, the processor 82 is configured to execute software stored within the memory 83, to communicate data to and from the memory 83 and to generally control operations of the computer 81 pursuant to the software. The memory test analyzer 100, and the operating system 88 are read, in whole or in part, by the processor 82, perhaps buffered within the processor 82, and then executed.
When the memory test analyzer 100, is implemented in software, as is shown in
In the context of this document, a “computer-readable medium” can be any means that can store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. The computer readable medium can be, for example but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, device, or propagation medium. More specific examples (a nonexhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic) having one or more wires, a portable computer diskette (magnetic), a random access memory (RAM) (electronic), a read-only memory (ROM) (electronic), an erasable programmable read-only memory (EPROM, EEPROM, or Flash memory) (electronic), an optical fiber (optical), and a portable compact disc read-only memory (CDROM) (optical). Note that the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
In an alternative embodiment, the memory test analyzer 100 is implemented in hardware. The memory test analyzer 100 can be implemented with any one or a combination of the following technologies, which are each well known in the art: a discrete logic circuit(s) having logic gates for implementing logic functions upon data signals, an application specific integrated circuit (ASIC) having appropriate combinational logic gates, a programmable gate array(s) (PGA), a field programmable gate array (FPGA), etc.
As shown in
As shown, data is scanned into memory test input circuit 50, a memory address is scanned into the memory write register and decoder 35, and the write enable signal 31 is scanned into write enable register 32. In the preferred embodiment, data is scanned into the circuitry described above using the test port 23 (
At step 105, the memory read address is scanned into the memory read register and decoder 39 using the test port 23. The data at the memory read address is then read from the memory array 27 into the scannable register 71 (
At step 107, the memory test analyzer 100 determines if the data input into memory array 27 is different (i.e. a fault is detected), from the data read from memory array 27, via the scannable register 71 and test port 23. If no fault is determined at step 107, the memory test analyzer 100 proceeds to step 112 to determine if there are more memory addresses to be tested. However, if a fault is detected at step 107, then the memory test analyzer 100 proceeds to indicate that the memory location has fault. At step 111, the memory test analyzer 100 marks the memory status at the memory address decoded at step 103 as having a fault. The memory test analyzer 100 records the memory address having the fault and then determines if there are more memory addresses to be tested at step 112.
At step 112, the memory test analyzer 100 determines if there are more memory addresses to be tested. If it is determined that there are more memory addresses to be tested, then the memory test analyzer 100 returns to repeat steps 102–112. However, if it is determined at step 112 that there are no more memory addresses to be tested, the memory test analyzer 100 then exits at step 119.
The foregoing description is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obvious modifications or variations are possible in light of the above teachings. In this regard, the embodiment or embodiments discussed were chosen and described to provide the best illustration of the principles of the invention and its practical application to thereby enable one of ordinary skill in the art to utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. All such modifications and variations are within the scope of the invention as determined by the appended claims when interpreted in accordance with the breadth to which they are fairly and legally entitled.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US6550023 *||Oct 19, 1998||Apr 15, 2003||Hewlett Packard Development Company, L.P.||On-the-fly memory testing and automatic generation of bitmaps|
|US6574762 *||Mar 31, 2000||Jun 3, 2003||Lsi Logic Corporation||Use of a scan chain for configuration of BIST unit operation|
|US6643807 *||Aug 1, 2000||Nov 4, 2003||International Business Machines Corporation||Array-built-in-self-test (ABIST) for efficient, fast, bitmapping of large embedded arrays in manufacturing test|
|US6769081 *||Aug 30, 2000||Jul 27, 2004||Sun Microsystems, Inc.||Reconfigurable built-in self-test engine for testing a reconfigurable memory|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8161333 *||Apr 17, 2012||Fujitsu Limited||Information processing system|
|US20050149792 *||Jan 7, 2005||Jul 7, 2005||Fujitsu Limited||Semiconductor device and method for testing the same|
|US20070168775 *||Aug 3, 2005||Jul 19, 2007||Texas Instruments Incorporated||Programmable Memory Test Controller|
|US20100169726 *||Nov 6, 2009||Jul 1, 2010||Fujitsu Limited||Information processing system|
|US20110296259 *||Dec 1, 2011||International Business Machines Corporation||Testing memory arrays and logic with abist circuitry|
|Cooperative Classification||G11C2029/0405, G11C29/56, G11C2029/5604|
|Aug 27, 2002||AS||Assignment|
Owner name: AGILENT TECHNOLOGIES, INC., COLORADO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:STONG, GAYVIN E.;ROBERTSON, JEFFREY THOMAS;REEL/FRAME:013229/0314
Effective date: 20020522
|Feb 22, 2006||AS||Assignment|
Owner name: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD., SINGAPORE
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:AGILENT TECHNOLOGIES, INC.;REEL/FRAME:017207/0020
Effective date: 20051201
|Feb 24, 2009||CC||Certificate of correction|
|Jun 29, 2009||REMI||Maintenance fee reminder mailed|
|Dec 20, 2009||LAPS||Lapse for failure to pay maintenance fees|
|Feb 9, 2010||FP||Expired due to failure to pay maintenance fee|
Effective date: 20091220
|May 6, 2016||AS||Assignment|
Owner name: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 017207 FRAME 0020. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT;ASSIGNOR:AGILENT TECHNOLOGIES, INC.;REEL/FRAME:038633/0001
Effective date: 20051201