|Publication number||US7075790 B2|
|Application number||US 10/900,553|
|Publication date||Jul 11, 2006|
|Filing date||Jul 27, 2004|
|Priority date||Jul 30, 2003|
|Also published as||US20050045311|
|Publication number||10900553, 900553, US 7075790 B2, US 7075790B2, US-B2-7075790, US7075790 B2, US7075790B2|
|Inventors||Chun-Chi Chen, Xue-Wen Peng, Hsieh Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou|
|Original Assignee||Hon Hai Precision Ind. Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (11), Referenced by (8), Classifications (16), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. Field of the Invention
The present invention relates to a heat dissipating device, and particularly to a heat dissipating device incorporating a clip which can readily and conveniently mount a heat sink to an electronic component.
2. Related Art
As computer technology continues to advance, electronic components such as central processing units (CPUs) of computers are being made to provide faster operational speeds and greater functional capabilities. When a CPU operates at high speed in a computer enclosure, its temperature can increase greatly. It is desirable to dissipate the generated heat quickly, for example by using a heat sink attached to the CPU in the enclosure. This allows the CPU and other electronic components in the enclosure to function within their normal operating temperature ranges, thereby assuring the quality of data management, storage and transfer. Oftentimes, a clip is required for mounting the heat sink to the CPU.
A wide variety of heat dissipating devices and clips are available in the prior art. In earlier time, a linear type of wire clip was widely used. However, in many modern applications such as when a large heat sink is used, the linear clip cannot firmly retain the heat sink against the CPU. Subsequently, wider plate-type of clips and cam-type clips were developed. For example, U.S. Pat. No. 6,061,239 discloses a cam-type clip for mounting a heat sink to an electronic component. The clip comprises an elongated resilient strap and a cam-type latch pivotally connected to a middle of the elongated strap. The elongated strap has a relatively flat center portion and is bent at each end to form two legs. The lower ends of the legs are each provided with holding means for engaging a semiconductor module so as to secure the clip and the heat sink to the module. In assembly, the two legs are required to moved outward by a user to thereby allow the two legs to enter into holes defined in the module. It is complicated and time-consuming to move the legs in assembly.
Accordingly, an object of the present invention is to provide a heat dissipating device incorporating a clip which can readily and conveniently mount a heat sink to an electronic component.
Another object of the present invention is to provide a heat dissipating device comprising a heat sink and a clip which can be pre-assembled together.
To achieve the above-mentioned objects, a heat dissipating device in accordance with a first preferred embodiment of the present invention comprises a heat sink and a pair of clips for mounting the heat sink to a retention module which surrounds an electronic component. The heat sink comprises a pair of shoulders on opposite sides thereof. Each clip comprises a strap supported on the shoulder, a lever having a cam pivotally connected to the strap, a pair of legs pivotally connected to opposite end portions of the strap, and a pair of spring fingers integrally extending from opposite ends of the strap. In assembly, the strap is downwardly pressed and feet of the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the feet the spring fingers of the clips urge the legs to return to original states from the forced states and enter the openings of the retention module. The levers are then pivoted from the vertical positions to the horizontal positions. The farthest points of the cams relative to pivot axes of the levers abut against the shoulders of the locking plates. The straps are therefore moved in a direction away from the shoulders to thereby cause the legs to firmly engage in the openings of the retention module. Simultaneously, the shoulders are pressed downwardly to thereby cause the heat sink to firmly contact the electronic component.
In a second preferred embodiment of the present invention, the strap of the clip further comprises a pair of posts, and the shoulder defines a pair of cutouts. Each post comprises a head and a neck, and each cutout comprises an entrance for extension of the head therethrough and a locking notch for locking the neck therein. The clip can be pre-assembled to the heat sink by way of the posts are locked in the locking notches. The pair of clips of the heat dissipating device are connected together by a bar connecting the levers of the clips.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of a preferred embodiment of the present invention with attached drawings, in which:
The heat dissipating device comprises a heat sink 50 and a pair of clips 10. The heat sink 50 comprises a base 52 for contacting the electronic component 65, and a plurality of parallel fins 54 extending upwardly from the base 52. A pair of locking plates 70 is attached on opposite sides of the fins 54, parallel to the fins 54. Each locking plate 70 has a shoulder 72 formed adjacent a middle portion thereof. A stopping tab 74 is stamped upwardly from the shoulder 72. The stopping tab 74 is parallel to the fins 54.
Referring also to
Each leg 30 comprises a main body 32 and an handle 34 connected with a top end of the main body 32. A hook 38 is formed on a bottom portion of the main body 32 corresponding to a respective opening 64 of the retention module 60. The hook 38 has a slant bottom surface. A pair of pivots 36 is formed on opposite sides of an upper portion of the main body 32. The pivots 36 are received in the corresponding through holes 28 of the strap 20 thereby pivotably attaching the leg 30 to the strap 20. The spring fingers 26 are located between the corresponding main body 32 and handle 34 with free ends of the spring fingers 26 abutting against an outside of the main body 32 (See
The lever 40 comprises a cam 42 formed on one end thereof, and an extension portion 44 extending from the cam 42. A pair of projections 46 is formed on opposite sides of the cam 42. A pair of protrusions 48 is formed on opposite sides of an end portion of the extension portion 44. The cam 42 is extended through the groove 22. The projections 46 are received in the corresponding through apertures 24 of the strap 20, thereby pivotably attaching the lever 40 to the strap 20.
In disassembly, the lever 40 is pivoted from the horizontal position to the vertical position. The handles 34 of the legs 30 are then pressed toward the feet 62. The main bodies 32 of the legs 30 are therefore pivoted away from the feet 62 to release the hooks 38 from the openings 64 of the feet 62. The clip 10 is then readily taken away from the retention module 60.
As an alternative of the first preferred embodiment of the present invention, the levers 40 of the clips 10 can be connected with each other by a bar. As an alternative of the second preferred embodiment of the present invention, the two clips 10′ can also be separate.
In the present invention, the hooks 38 of the clips 10, 10′ each have a slant bottom surface. When the straps 20, 20′ of the clips 10, 10′ are downwardly pressed the legs 30 are pivoted outwardly from the original states to the forced states. When the hooks 38 arrive the openings 64 of the retention module 60 the hooks 38 will enter the openings 64 under the action of the spring fingers 26. In the mounting process, the legs 30 of the clips 10, 10′ do not require additional action of a user.
It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
|Cited Patent||Filing date||Publication date||Applicant||Title|
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|US6082440||Feb 6, 1998||Jul 4, 2000||Thermalloy, Incorporated||Heat dissipation system having releasable attachment assembly|
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|US6318452 *||Jul 10, 2000||Nov 20, 2001||Foxconn Precision - Components Co., Ltd.||Clip for heat sink|
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|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7218520 *||Aug 31, 2004||May 15, 2007||Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.||Retainer for heat sink|
|US7403394 *||Mar 28, 2006||Jul 22, 2008||Inventec Corporation||Heatsink locking device|
|US7480146||Mar 26, 2007||Jan 20, 2009||Newisys, Inc.||Heat sink mounting systems and methods|
|US8526800||Dec 18, 2009||Sep 3, 2013||Whirlpool Corporation||Glass-ceramic cooktop and method of assembling the same|
|US20050237720 *||Aug 31, 2004||Oct 27, 2005||Hon Hai Precision Industry Co., Ltd.||Retainer for heat sink|
|US20070230129 *||Mar 28, 2006||Oct 4, 2007||Inventec Corporation||Heatsink locking device|
|US20080239677 *||Mar 26, 2007||Oct 2, 2008||Coleman Richard A||Heat Sink Mounting Systems and Methods|
|US20110150439 *||Dec 18, 2009||Jun 23, 2011||Whirlpool Corporation||Glass-ceramic cooktop and method of assembling the same|
|U.S. Classification||361/704, 165/185, 174/16.3, 257/E23.099, 257/727, 257/E23.086, 165/80.3, 257/718|
|International Classification||H01L23/40, H01L23/467, H05K7/20|
|Cooperative Classification||H01L2924/0002, H01L23/4093, H01L23/467|
|European Classification||H01L23/40S, H01L23/467|
|Jul 27, 2004||AS||Assignment|
Owner name: HON HAI PRECISION IND. CO., LTD., TAIWAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, CHUN-CHI;PENG, XUE-WEN;LEE, HSIEH KUN;AND OTHERS;REEL/FRAME:015636/0031
Effective date: 20040329
|Feb 15, 2010||REMI||Maintenance fee reminder mailed|
|Jul 11, 2010||LAPS||Lapse for failure to pay maintenance fees|
|Aug 31, 2010||FP||Expired due to failure to pay maintenance fee|
Effective date: 20100711