US 7105102 B2
A vacuum plasma processor includes a roof structure including a dielectric window carrying (1) a semiconductor plate having a high electric conductivity so it functions as an electrode, (2) a hollow coil and (3) at least one electric shield. The shield, coil and semiconductor plate are positioned to prevent substantial coil generated electric field components from being incident on the semiconductor plate. During a first interval the coil produces an RF electromagnetic field that results in a plasma that strips photoresist from a semiconductor wafer. During a second interval the semiconductor plate and another electrode produce an RF electromagnetic field that results in a plasma that etches electric layers, underlayers and photoresist layers from the wafer.
1. A method of removing material from a workpiece in a vacuum plasma processing chamber including first and second spaced plasma excitation electrodes, one of which includes a semiconductor interposed between a magnetic field that can be derived by a plasma excitation coil and gas in the chamber, comprising removing the material during a first interval by energizing the coil so it supplies an RF ionizing electromagnetic field to the gas, the RF ionizing electromagnetic field having magnetic field components that are coupled through the semiconductor to the gas and electric field components that are coupled to the gas without being diminished by the semiconductor, the electromagnetic field having sufficient power to cause a plasma resulting from the gas to be sufficiently energetic to etch the material, removing the material during a second interval by energizing the electrodes so they capacitively supply an RF ionizing field to the gas, the capacitively supplied RF ionizing field being coupled between the electrodes to the gas and material.
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This application is a divisional of U.S. application Ser. No. 09/689,616 filed Oct. 13, 2000, which issued as U.S. Pat. No. 6,716,303 on Apr. 6, 2004.
The present invention relates generally to vacuum plasma processors using a coil and electrodes for establishing plasmas in a single processing chamber and, more particularly, to such a processor wherein the chamber includes a coil, a semiconductor electrode and a non-magnetic metal member arranged to prevent substantial electric field components the coil generates from being coupled to the semiconductor electrode. The invention also relates to a method of operating a vacuum plasma processor including a semiconductor electrode and a coil wherein fields derived from the electrode and coil establish plasmas with sufficient power to remove materials from a workpiece.
Vacuum plasma processors for processing workpieces, such as semiconductor wafers, dielectric plates and metal plates, frequently employ coils or electrodes to establish RF electromagnetic fields for exciting gases in vacuum processing chambers to an RF plasma. The coil excitation is frequently referred to as inductive, while the electrode excitation is frequently referred to as capacitive.
The capacitively and inductively coupled vacuum plasma processors are frequently employed to etch dielectric material from a semiconductor workpiece including an underlayer and a photoresist layer. The capacitive processors have an advantage over the inductive processors because the capacitive processors cause lower damage and have higher selectivity to the underlayer and photoresist layer. The inductive processors have an advantage over the capacitive processors because the inductive processors etch workpieces at a higher rate than the capacitive processors. The inductive processors have a higher oxygen dissociation rate to enable chambers to be cleaned more rapidly than can be attained by the capacitive processors.
Hybrid processors having both capacitive and inductive RF plasma excitation have been recently introduced to perform various etch applications in the capacitive mode and efficient photoresist stripping and chamber cleaning in the inductive mode. The hybrid processors can increase processing throughput and reduce processing costs because the same chamber can be used for multiple purposes without opening the chamber or moving the workpiece from chamber to chamber to perform different processes.
Collins et al., U.S. Pat. No. 6,077,384, and WO 97/08734 disclose prior art vacuum plasma processors including both inductive and capacitive coupling wherein a ceiling of a vacuum plasma processor chamber includes a high resistivity (e.g., 30 ohm-cm, i.e., a conductivity of 0.03 mho per cm, at room temperature) semiconductor window. The semiconductor window is between the processing chamber and an insulating structure carrying a flat or domed coil. The window extends from a central longitudinal axis of the chamber to a peripheral wall of the chamber. The semiconductor window must have high resistivity, i.e., low conductivity, to prevent substantial power dissipation in the semiconductor window. If the semiconductor window has a high conductivity, the electric field component of the coil electromagnetic field dissipates substantial power in the semiconductor so power necessary to achieve plasma ignition is not coupled to the gas. Collins et al. specifically states that if the semiconductor window has a high conductivity, such as a resistivity of 0.01 ohms-cms, i.e., a conductivity of 100 mhos/cm, the frequency of the RF induction field from the coil would have to be reduced to the kilohertz range or below to couple the field the coil generates through the semiconductor window.
Collins et al. discloses a grounded non-magnetic metal Faraday shield and/or a powered or grounded non-magnetic metal backplane interposed between the semiconductor window and the coil. The non-magnetic metal backplane and Faraday shield include openings between turns of the coil and the semiconductor window so that the electric field component from the coil is coupled to the semiconductor window that extends continuously, in unbroken fashion, from the chamber center longitudinal axis to the chamber peripheral wall. The electric field components from the coil coupled through the Faraday shield and/or backplane have the same effect on the semiconductor window in the embodiments of
The semiconductor window, the backplane and Faraday shield are all made of non-magnetic material to couple the coil magnetic field components to the gas in the chamber to excite and/or maintain the gas in a plasma state. The non-magnetic metal backplane and Faraday shield openings in the backplane and Faraday shield reduce eddy current losses that occur in response to the magnetic field components.
The Collins et al. low conductivity semiconductor window has the disadvantage of applying a relatively low magnitude electromagnetic field to the plasma when the processor is operated in the capacitive mode. This is because the low conductivity silicon window does not have a high degree of electric field coupling to the plasma. Collins et al. state the semiconductor window is used for fluorine and polymerization scavenging from the plasma. The vast majority of the electromagnetic field etching which the Collins et al. device provides results from applying RF to an electrode on a chuck for the workpiece being processed.
It is, accordingly, an object of the present invention to provide a new and improved vacuum plasma processor apparatus and method for selectively, at different times, coupling plasma excitation electromagnetic fields derived from inductive and capacitive sources to gas in a single vacuum plasma processing chamber.
Another object of the invention is to provide a new and improved vacuum plasma processor apparatus and method wherein a single vacuum plasma processing chamber can efficiently perform many different processing steps and can be cleaned without being opened.
A further object of the invention is to provide a new and improved vacuum plasma processor apparatus and method wherein a vacuum plasma processing chamber can be operated to provide relatively high processing throughput, to reduce the cost of workpiece fabrication.
An additional object of the invention is to provide a new and improved vacuum plasma processor apparatus and method wherein a vacuum plasma processing chamber can be selectively operated to enable workpieces to be processed (1) during certain time periods at relatively high speeds and (2) at other times so workpiece damage is minimized, while providing high selectivity to underlayers and photoresist layers of wafers being processed.
Still another object of the invention is to provide a new and improved vacuum plasma processor including a chamber with a semiconductor plasma excitation electrode in close proximity to a plasma excitation coil, wherein the semiconductor electrode has a high enough conductivity to establish RF processing plasmas having sufficient field strength to process, in particular, etch, workpieces in the chamber.
Yet another object of the invention is to provide a new and improved vacuum plasma processor with a chamber including inductive and capacitive plasma excitation, wherein a semiconductor electrode, having high enough conductivity to establish an electromagnetic field of sufficient strength to process and, in particular, to etch a workpiece, is in proximity to a coil, but does not interact with electric field components of the electromagnetic field the coil generates and which are coupled to gas in the chamber.
In accordance with one aspect of the invention, a vacuum plasma processor for processing workpieces comprises a vacuum chamber having an electrode arrangement, including a semiconductor member, for ionizing gas in the chamber to a plasma. A coil outside the chamber generates an electromagnetic field for ionizing gas in the chamber to a plasma. A non-magnetic metal arrangement is interposed between the coil and the semiconductor member. The coil, non-magnetic metal arrangement and semiconductor member are positioned and arranged to prevent substantial electric field components of the electromagnetic field from being incident on the semiconductor member while enabling substantial electric and magnetic field components from the coil to be incident on the gas so the gas is ionized.
Another aspect of the invention relates to a vacuum plasma processor for processing workpieces that comprises a vacuum chamber having an electrode arrangement, including a semiconductor member, for ionizing gas in the chamber to a plasma. A coil outside the chamber generates an electromagnetic field for ionizing gas in the chamber to a plasma. A non-magnetic metal arrangement is interposed between the coil and the semiconductor member. The coil, non-magnetic metal arrangement and semiconductor member are positioned and arranged so (1) no portion of the semiconductor member is outside the interior of an inner turn of the coil, and (2) the non-magnetic metal arrangement includes a member having a periphery approximately aligned with the interior of the coil inner turn.
In first and second embodiments, the non-magnetic metal arrangement includes a member that is spaced from the semiconductor member and abuts the semiconductor member. In a third embodiment, the non-magnetic metal arrangement includes a first member abutting or adjacent the semiconductor member and a second member spaced from the semiconductor member.
The dielectric window, semiconductor member, and non-magnetic metal arrangement are preferably in a roof structure of the chamber. The coil has an interior portion that is spaced from a chamber center portion so peripheral portions of the semiconductor member are inside or approximately aligned with the coil interior portion. The non-magnetic metal arrangement has peripheral portions spaced from the chamber center portion by approximately the same distance as the semiconductor member peripheral portions. When the non-magnetic metal arrangement includes first and second members respectively abutting and spaced from the semiconductor member, the first non-magnetic metal member has a periphery slightly outside the periphery of the semiconductor member and the first and second non-magnetic metal members have approximately aligned peripheries.
In one preferred embodiment, particularly adapted for use with circular workpieces, e.g., semiconductor wafers, the chamber has a circular interior wall having a first diameter and the non-magnetic metal arrangement includes a member having a circular periphery having a second diameter, while the semiconductor member has a circular periphery having a third diameter. The chamber interior wall, the non-magnetic metal member and the semiconductor member are co-axial. The first diameter is greater than the second diameter, and the second diameter is approximately equal to the third diameter. The coil is substantially co-axial with the chamber interior wall and has a substantially circular innermost turn having a diameter approximately equal to the third diameter. When the non-magnetic metal member abuts or is adjacent the semiconductor member, the second diameter is slightly greater than the third diameter. When the non-magnetic metal member is adjacent the coil, it has a diameter slightly less than the interior diameter of the coil innermost turn. When the non-magnetic metal arrangement includes first and second circular members co-axial with the chamber interior wall and the first circular member abuts or is adjacent the semiconductor member and the second circular member is adjacent the coil, the second diameter is slightly greater than the third diameter and the second circular member has a diameter slightly less than the interior diameter of the coil innermost turn.
In the preferred embodiments, the semiconductor member is a flat plate while the non-magnetic metal member(s) can be flat plates or flat rings.
The semiconductor member has a high electric conductivity, e.g., no less than 0.01 mho/cm, and preferably at least 0.1 or 1.0 mho/cm so the semiconductor member can function as an efficient electrode to produce RF electromagnetic fields that supply sufficient power to the plasma to enable the plasma to remove materials from the workpiece.
A further aspect of the invention concerns a method of removing material from a workpiece in a vacuum plasma processing chamber including first and second spaced plasma excitation electrodes, one of which includes a semiconductor interposed between a plasma excitation coil and gas in the chamber. The method comprises removing the material during a first interval by energizing the coil so it supplies an RF ionizing electromagnetic field to the gas. The RF ionizing electromagnetic field has magnetic field components that are coupled through the semiconductor to the gas and electric field components that are coupled to the gas without being intercepted by the semiconductor. The electromagnetic field has sufficient power to cause a plasma resulting from the gas to be sufficiently energetic to etch the material. The material is removed during a second interval by energizing the electrodes so they supply an RF ionizing electromagnetic field to the gas. The RF ionizing electromagnetic field is coupled between the electrodes to the gas and material.
To maximize wafer processing throughout, the chamber is preferably maintained in a vacuum state between the first and second intervals and the chamber is cleaned during a third interval by energizing the coil so it supplies an RF ionizing electromagnetic field to the gas. The electromagnetic field derived during the third interval has sufficient power to cause a plasma resulting from the gas to be sufficiently energetic to etch material deposited on interior surfaces of the chamber. The chamber is maintained in the vacuum state during the third interval, and between the first and third intervals, and between second and third intervals. The material can be a dielectric layer or a photoresist layer that is etched during the second interval or photoresist that is stripped from the workpiece during the first interval.
The above and still further objects, features and advantages of the present invention will become apparent upon consideration of the following detailed descriptions of several specific embodiments thereof, especially when taken in conjunction with the accompanying drawings.
The vacuum plasma workpiece processor of
Dielectric window 19 usually has the same thickness from its center to its periphery and a diameter exceeding the inner diameter of wall 12 so the window peripheral portion bears against the top edge of wall 12. Gaskets (not shown) seal vacuum chamber 10 in a conventional manner. The processor of
Workpiece 32 is fixedly mounted in chamber 10 to a flat horizontal surface of workpiece holder, i.e., chuck or platen, 34. Chuck 34, typically of the electrostatic type, clamps workpiece 32 in place by virtue of DC power supply 42 applying a DC potential to electrode 33 on the chuck upper face. The interior surface of wall 12, window 19, and each of plates 21 and 23, workpiece 32 and chuck 34 are concentric with center, vertically extending longitudinal axis 25 of chamber 10. Vacuum pump 28, connected to port 30 in wall 12 or via a manifold to ports in base 14, maintains the interior of chamber 10 in a vacuum condition, at a pressure that can vary in the range of about 1–1000 millitorr.
A suitable processing or chamber cleaning etchant gas that is excited to an RF plasma is supplied to the interior of chamber 10 from gas source 12 via line 24 and port 26 in the center of window 19, as well as via distribution conduit 27 in window 19 and distribution holes (not shown) in plates 21 and 23. Plasma excitation of the gas supplied to the interior of chamber 10 can be in response to an RF electromagnetic field inductively coupled to the gas in the chamber by coil 36 or in response to RF electromagnetic fields capacitively coupled by plate 23 and the electrodes of chuck 34 to the gas in the chamber.
The inductively or capacitively coupled RF field excites the gas in chamber 10 to an RF plasma that processes (e.g., etches) workpiece 32 or cleans the chamber interior. The RF electromagnetic field from coil 36 is used for high etch rate processes and chamber cleaning because it has a higher oxygen dissociation rate than the electromagnetic fields produced between plate 23 and chuck 34. The electromagnetic field plasma excitation from plate 23 causes lower workpiece damage, as well as higher selectivity to underlayers and photoresist layers on the workpieces, than the electromagnetic field excitation. In addition, the electromagnetic field excitation produced between plate 23 and chuck 34 often provides more uniform etching across the workpiece.
Because the gas in chamber 10 can be inductively or capacitively excited to a plasma at different times, the same chamber at different times can (1) etch a dielectric layer or a photoresist layer from workpiece 32 with the capacitively excited plasma and (2) strip photoresist from the same workpiece with the inductively excited plasma. These two operations can be performed without opening the chamber or moving the workpiece between chambers. In addition, the chamber can be cleaned between workpiece processing operations with the inductively excited plasma without opening the chamber. Consequently, chamber 10 has increased workpiece throughput and reduced workpiece processing costs relative to prior art processors.
The RF electromagnetic field source includes two turn, hollow, spiral, substantially planar metal coil 36, similar to the coil disclosed by Ogle, U.S. Pat. No. 4,948,458. Coil 36 is typically made of square copper tubing having a hollow interior. It is to be understood that coil 36 is not necessarily planar and can have other shapes, e.g., a dome, and that the coil does not have to be hollow. Coil 36 is mounted on or immediately above window 19 and excited by RF power source 38, usually having a fixed frequency of 13.56 MHz and a fixed amplitude envelope. Alternatively, if plate 23 is driven by an RF source, e.g., a source having a frequency of 27 MHz, the same source, through a switching arrangement (not shown), can drive coil 36 when the source is not driving plate 23. The current in coil 36 generates a large enough electromagnetic field, including electric field components and magnetic field components, in chamber 10, to excite gas in the chamber to a plasma. Coil 36 has a length that is a substantial fraction of a wavelength of the frequency of source 38, so there are substantial voltage and current variations along the coil length. The voltage variations are sufficient to enable substantial RF voltage differences to be established between adjacent portions of the two turns, e.g., along the same radius of the coil. The voltage differences between adjacent radial portions of the two turns establish substantial RF electric field components in the chamber portions below the two turns of the coil. The RF electric fields ionize gas in chamber 10 to a plasma. The coil magnetic field components include magnetic lines of flux that extend into chamber 10 parallel to chamber axis 25. The magnetic lines of flux that are parallel to axis 25 penetrate plates 21 and 23 in the center portion of chamber 10 and continue around the chamber beyond the periphery of plates 21 and 23.
Impedance matching network 40, connected between an output terminal of RF source 38 and excitation terminals of coil 36, couples the output of the RF source to the coil, such that one end terminal of the coil is connected to an ungrounded output terminal of network 40 and the other terminal of the coil is connected to one electrode of capacitor 41, the other electrode of which is grounded. Impedance matching network 40 includes variable reactances (not shown), which a controller (not shown) varies in a known manner to achieve impedance matching between source 38 and a load including coil 36 in the plasma the coil drives.
Electrode 33 of chuck 34 is excited by RF power source 44 supplying an RF voltage to impedance matching network 46, including variable reactances (not shown). Typically, source 44 generates a fixed amplitude 2 MHz wave that is superimposed on a 27 MHz fixed amplitude wave. Matching network 46 couples the output of source 44 to electrode 33. The previously mentioned controller controls the variable reactances of matching network 46 to match the impedance of source 44 to the load impedance coupled to electrode 33. The load coupled to electrode 33 is primarily plasma in chamber 10. As is well known, the RF energy that source 44 applies to electrode 33 interacts with the charged particles in the plasma to produce a DC bias on workpiece 32.
Semiconductor plate 23 can be grounded, as shown, or driven by a fixed amplitude 27 MHz voltage via a matching network (not shown). If plate 23 is driven by a 27 MHz voltage, the RF excitation for electrode 33 of chuck 34 is provided only by a 2 MHz voltage.
Metal plate 21 is connected to ground or a source of the 27 MHz voltage to distribute the ground or RF voltage to semiconductor plate 23, which electrically and mechanically contacts plate 21. Metal plate 21 can also float, i.e., be connected to no voltage source terminal, in which case semiconductor plate 23 also floats and is decoupled from a power supply terminal.
When chamber 10 operates in the inductive plasma excitation mode, i.e., coil 36 is energized, sources 38 and 44 are energized and metal plate 21 is grounded, connected to a non-zero volt AC or DC power supply terminal, or floats. When chamber 10 operates in the capacitive plasma excitation mode, ground or voltage at a frequency of 27 MHz is applied to metal plate 21, and source 44 remains energized, but source 38 is de-energized while switch 51 connects the opposite terminals of coil 36 together and to ground. Hence, coil 36 cannot produce an electromagnetic field and has no influence on the electromagnetic field between semiconductor plate 23 and the electrodes in chuck 34 when chamber 10 operates in the capacitive plasma excitation mode. In both modes, sources 42 and 44 drive electrode 33 of chuck 34.
To provide optimum processing of workpiece 32, e.g., to obtain maximum etch uniformity and a desired etch profile on the workpiece under the many processing circumstances encountered in both the capacitive and inductive plasma excitation modes, the distance between workpiece 32 and semiconductor plate 23, as well as coil 36, can be varied. To this end, output shaft 35 of motor 37 sealingly extends through base 14 and is drivingly connected to chuck 34 to translate the chuck and workpiece 32 clamped to the chuck up and down, toward and away from roof 18 and the fixed structures forming the roof.
Semiconductor plate 23 has an electrical conductivity of at least 0.01 mho/cm, a result which can be achieved by forming the plate from silicon having high dopant concentrations or from other suitable semiconductors; the conductivities of semiconductor plate 23 can be 0.1 or 1.00 mho/cm or greater. The high conductivity of semiconductor plate 23 enables a large electromagnetic field to be established between first and second parallel plate electrodes respectively formed by plate 23 and electrode 33. The electromagnetic field between plate 23 and electrode 33 has sufficient power to ionize the gas in the volume between the semiconductor plate and workpiece 36 to a plasma with a sufficient number of charge particles to provide efficient, uniform etching of the workpiece. This is in contrast with the Collins et al. references wherein the maximum conductivity of the semiconductor window is 0.03 mho/cm, i.e., a resistivity of 30 ohm-cm. In Collins et al., the RF electromagnetic field generated by the semiconductor window is sufficient only to provide polymerization and fluorine scavenging.
The high conductivity of semiconductor plate 23 in the present invention is possible because of the geometry, i.e., position and arrangement, of metal plate 21, semiconductor plate 23 and coil 36. These elements are arranged so there are: (1) no substantial electric field components coupled from coil 36 to semi-conductor plate 23, and (2) substantial electric and magnetic field components coupled from coil 36 to the gas in chamber 10. The electric and magnetic field components of the electromagnetic field that coil 36 generates are coupled to the gas in chamber 10 to form and maintain the plasma. Because metal plate 21 and semiconductor plate 23 are non-magnetic, the magnetic field components of the electromagnetic field that coil 19 generates is coupled to the gas in the chamber 10 to maintain the plasma. The electric field component that coil 19 generates is coupled to the gas in chamber 10 from the turns of the coil that are beyond the periphery of metal plate 21, that functions as an electrostatic shield to decouple the coil electric field components from semiconductor plate 23.
In accordance with another embodiment illustrated in
When chamber 10 is operated in the capacitive mode, RF source 38 and matching network 40 drive semiconductor plate 23 to the exclusion of coil 36; when chamber 10 is operated in the inductive mode, source 38 and network 40 drive coil 36 to the exclusion of plate 23. To these ends, the power output terminal of network 40 is selectively coupled via switch 54 to semiconductor plate 23 or coil 36. In the embodiment of
In the embodiment of
The plots of
The plot of
The electron density distribution plot of
Metal layer 101 can be connected to an RF or DC source, or can float when the chamber of
When the chamber of
The electron density distribution plot of
According to a further modification illustrated in
The electric field and power dissipation distributions plots of
According to a further embodiment of the invention, as illustrated in
The roof structure of
According to a further embodiment of the invention, illustrated in
The roof structure of
The results achieved by the present invention are to be contrasted to the situation wherein no electric shield plate is interposed between coil 36 and semiconductor plate 23.
While there have been described and illustrated specific embodiments of the invention, it will be clear that variations in the details of the embodiments specifically illustrated and described may be made without departing from the true spirit and scope of the invention as defined in the appended claims.