|Publication number||US7135346 B2|
|Application number||US 10/901,870|
|Publication date||Nov 14, 2006|
|Filing date||Jul 29, 2004|
|Priority date||Jul 29, 2004|
|Also published as||US7396694, US20060024853, US20070087593|
|Publication number||10901870, 901870, US 7135346 B2, US 7135346B2, US-B2-7135346, US7135346 B2, US7135346B2|
|Inventors||Ishtiaq Ahsan, Edward P. Maciejewski|
|Original Assignee||International Business Machines Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (53), Classifications (6), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates generally to semiconductor wafers, and more particularly to polysilicon lines on such semiconductor wafers.
A semiconductor wafer typically comprises a plurality of polysilicon (“PC”) lines, which transport electrical signals. A cross sectional view taken from the top down of the PC line is known as the profile of the PC line. PC lines have a specific profile in a stable production line. An ideal PC profile is rectangular. Over time, however, the ideal, rectangular profile may drift or, in other words, change. For instance, a PC profile which began as rectangular may drift to trapezoidal in shape. Such drift is known as profile drift. Profile drift may be caused by any number of factors. For example, a machine failure in the wafer fabrication plant or a change in process conditions, such as a change in the Reactive Ion Etching (“RIE”) of the PC line, may cause profile drift.
There is one known technique for identification of profile drift in a PC line, namely visual detection. First, a semiconductor wafer comprising a plurality of PC lines is cut. In so doing, the cross sectional area of the PC line is revealed. Second, a photograph of the revealed cross sectional area of the PC line is taken. With the aid of a scanning electron microscope, a technician studies the photograph of the cross sectional area of the PC line. The photograph depicts the PC profile in the production line on a particular date. The technician notes the shape of the PC profile. A technician completes the same exercise on a later date. If the shape changes, the technician identifies a profile drift.
Visual detection has its drawbacks. Visual detection is a destructive technique. Once the wafer has been cut for visual inspection, the wafer cannot be further processed. Accordingly, visual detection wastes the resource of the wafer as well as needlessly consumes the time of the machines that created the destroyed wafer. In addition, visual inspection is time consuming for the technician. Accordingly, the technician does not visually detect each lot or even each bunch of lots. A technician randomly selects one wafer from one lot. Such lot is one lot out of hundreds of wafers and tens of lots. Because visual detection occurs with so few wafers, statistics cannot accurately be gathered regarding the profile drift of a given lot or even a given bunch of lots. Finally, visual detection is only as accurate as the visual faculties of the technician conducting the visual detection.
Therefore, there remains a need in the art for a structure and method of identifying profile drift of a PC line. Specifically, there is a need in the art for a standardized, nondestructive, statistically significant method for identifying profile drift.
These and other deficiencies in the prior art are overcome through the method of this invention.
The present invention is directed to a test structure and method that identifies a profile drift of a polysilicon line. The method comprises the step of correlating a bottom width to an average width of a cross sectional area of an instant polysilicon line. The method comprises the further step of comparing the correlation with a predetermined correlation of bottom width to average width of the cross sectional area of the polysilicon line. Finally, the method comprises identifying a profile drift whenever the instant correlation does not substantially equal the predetermined correlation.
The present invention is efficient because during manufacturing it detects profile drift in semiconductor wafers in a nondestructive manner that facilitates the generation of profile drift statistics for entire batches of semiconductor wafers. The present invention saves significant costs because the semiconductor wafer is not destroyed or compromised, but instead remains completely intact both during and after testing. In addition, the present invention accurately tests profile drift without requiring a skilled technician to laboriously evaluate individual wafer cross sections under a scanning electron microscope. The present invention facilitates the regular testing of profile drift on a scale much larger than previously possible, which in turn facilitates the generation of a profile drift statistical database with respect to entire lots of semiconductor wafers. The profile drift statistical database streamlines semiconductor wafer fabrication because profile drift can be detected and then corrected much earlier in the semiconductor wafer fabrication process than previously possible.
The features and the elements characteristic of the invention are set forth with particularity in the appended claims. The drawings are for illustration purposes only and are not drawn to scale. Furthermore, like numbers represent like features in the drawings. The invention itself, however, both as to organization and method of operation, may best be understood by reference to the detailed description which follows, taken in conjunction with the accompanying drawings, in which:
The invention will now be described by reference to the accompanying figures. In the figures, various aspects of the structures have been shown and schematically represented in a simplified manner to more clearly describe and illustrate the invention.
The present invention tests for profile drift during manufacturing in a manner that is non-destructive to the semiconductor wafer. The present invention determines profile drift by comparing PC profiles of the same PC line over time. As PC profile relates to the present invention, a PC profile is described by two measurements, namely a bottom width of a PC line measurement and an average width of a cross sectional area of a PC line measurement. The bottom width of a PC line is directly proportional to the average width of a cross sectional area of a PC line.
The present invention determines the bottom width of a PC line and the average width of the cross sectional area of a PC line through the use of two known tests, namely a capacitance test and a resistance test. The capacitance test determines the bottom width of a PC line, while the resistance test determines an average width of a cross sectional area of a PC line. A discussion of both the known capacitance and resistance tests will follow. The known capacitance test is depicted in
Prior to the present invention, it was not known that profile drift could be identified by measuring the capacitance of a PC line to calculate the bottom width of a PC line and by measuring the resistance of a PC line to calculate an average width of the cross sectional area of a PC line. Both the known capacitance and resistance tests will be described in more detail below, however first common PC profiles will be described with continued reference to
A semiconductor wafer comprises at least one PC line in a PC line array that runs over at least one silicon bed in a silicon bed array. Gate oxide separates the PC line from the silicon bed.
Case 2 in
In case 1, the width of the PC profile is wider at the bottom than at the top of the PC profile. Because the bottom width is wider than the top width, the bottom width will not equal the average width of the cross sectional area. Such is shown in case 1, because the line that indicates the bottom width of the PC profile, L, does not overlap the line that indicates the average width of the cross sectional area of the PC profile, W1. Instead, the length of line that indicates the bottom width of the PC profile, L, is longer than the length of line that indicates the average width of the PC profile, W1. Second,.
Similar to case 1, case 3 in
Profile drift is recognized by comparing a predetermined and an instant correlation of bottom width of a PC line versus average width of a cross sectional area of a PC line. If the PC line began with an ideal PC shape as shown in case 2, but with time drifted to a non-ideal PC shape as shown in case 1, the predetermined correlation would correlate the bottom width to the average width of the cross sectional area of the ideal PC shape in case 2 while the instant correlation would correlate the bottom width to the average width of the cross sectional of the non-ideal PC shape in case 1. In such case, the predetermined correlation of bottom width to average width of the cross sectional area would be equal, while the instant correlation of bottom width to average width would be unequal. Similarly, if the PC line begins with a trapezoidal PC shape as shown in case 1, but with time drifts to a trapezoidal PC shape as shown in case 3, the predetermined correlation would correlate the bottom width to the average width of the cross sectional area of the non-ideal PC shape in case 1 while the instant correlation would correlate the bottom width to the average width of the cross sectional of the ideal PC shape in case 2. It should be understood that the PC profiles illustrated in
Referring now to
In accordance with the capacitive test structure of
Each PC line 110 a,b in the PC array 110 is drawn with equal widths. Therefore, if the capacitance between a PC line over the silicon and the silicon is measured, Cline, and further if the total width and number of the silicon beds, Wrx and Nrx respectively, and the total number of the PC lines, Nline, is known, the normalized capacitance of the PC lines separated from the silicon by gate oxide, Cgate, can be calculated according to the following formula:
C gate=(C line)/(N line *N rx *W rx) Eq. 1
As mentioned above, the bottom width of a PC line, Lpoly, is a function is a function of the normalized capacitance of the PC line, Cgate, which in turn, is a function of the measured capacitance of the PC line, Cline. Lpoly is further a function of plate capacitance, Cplate
Once both the Cgate and Cplate
Lpoly=C gate /C plate
R PC =V/I Eq. 4
Because both voltage, V, and current, I, are known, equation 4 can be solved for the resistance of the PC line, RPC. As mentioned above the average width of a cross sectional area of a PC line, Wpc is a function of the resistance of the PC line, RPC. Accordingly, average width of the cross sectional area of a PC line can be calculated according to the following formula:
R PC=(P pc /H pc)*(L pc /W pc) Eq. 5
Since the length of the PC line, Lpc is large, its value is accurately known. Accordingly, normalizing the resistance of a PC line, RPC, by the resistivity-to-height ratio of the PC lines Ppc/Hpc determines the average width of the cross sectional area of the PC lines Wpc.
In order to determine the resistivity-to-height ratio of the PC lines Ppc/Hpc, use of a large plate resistor is made. It is assumed that the resistivity-to-height ratio of the PC lines Ppc/Hpc of the PC lines equals the resistivity-to-height ratio Ppc/Hpc of the large plate resistor. The resistivity-to-height ratio Ppc/Hpc of the large plate resistor can be calculated according to the following formula:
R 1=(P pc /H pc)*(L p /W p) Eq. 6
It can be seen from equation 6 that, by measuring Rl, a reasonable value of the resistivity-to-height ratio of the large plate capacitor Ppc/Hpc can be found. Accordingly, equation 5 can be resolved for the average width of the cross sectional area of the PC line, Wpc. Because the shape of a PC profile is seldom a perfect rectangle, the width obtained by this methodology is an average width of the cross sectional area of the PC line.
The bottom width of the PC line is measured in accordance with the present invention by shorting metal pads 520 b, 520 c, 520 d, and 520 e together. Then the capacitance between metal pad 520 a and metal pads 520 b, 520 c, 520 d, and 520 e is measured. Such capacitance represents the capacitance between the silicon 530 and the PC line 510 over the silicon 530. As discussed above, the bottom width of a PC line is a function of the normalized capacitance of the PC line.
The average width of the cross sectional area of the PC line is measured in accordance with the present invention by forcing current between metal pads 520 b and 520 d and measuring the voltage drop between metal pads 520 c and 520 e. At this time, metal pad 520 a is grounded. The gate oxide insulator ensures that there is a negligible current contribution from pad 520 a to impact the resistance measurement. Because the length of the PC line in the array 510 is fairly large compared to the width of the PC line, it is more immune to process variations and hence its quantity can be known with accuracy. As discussed above, the average width of a cross sectional area of the PC line is a function of the resistance of the PC line. More specifically, the resistance is a function of the average cross sectional area of the middle section of the middle PC line 510 covered by the OP level (silicide block mask) 560 in
While the present invention has been particularly described in conjunction with a specific preferred embodiment and other alternative embodiments, it is evident that numerous alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. It is therefore intended that the appended claims embrace all such alternatives, modifications and variations as falling within the true scope and spirit of the present invention.
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|U.S. Classification||438/18, 438/14|
|International Classification||H01L21/66, H01L21/26|
|Jul 29, 2004||AS||Assignment|
Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:AHSAN, ISHTIAQ;MACIEJEWSKI, EDWARD P.;REEL/FRAME:015641/0308
Effective date: 20040722
|Jun 21, 2010||REMI||Maintenance fee reminder mailed|
|Nov 14, 2010||LAPS||Lapse for failure to pay maintenance fees|
|Jan 4, 2011||FP||Expired due to failure to pay maintenance fee|
Effective date: 20101114