|Publication number||US7161249 B2|
|Application number||US 10/196,299|
|Publication date||Jan 9, 2007|
|Filing date||Jul 15, 2002|
|Priority date||Aug 27, 2001|
|Also published as||US20030038374|
|Publication number||10196299, 196299, US 7161249 B2, US 7161249B2, US-B2-7161249, US7161249 B2, US7161249B2|
|Inventors||Jong Bo Shim, Han Seob Hyun|
|Original Assignee||Samsung Electronics Co., Ltd.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (16), Referenced by (23), Classifications (52), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present invention relates to a semiconductor packaging technology, and more particularly to a multi-chip package (MCP) with a spacer.
It has long been desired to provide low-cost semiconductor chip packages that are lighter, smaller, with higher speed, multi-function, and improved reliability. In order to satisfy this goal, a multi-chip packaging technique has been developed. The multi-chip package comprises identical or various types of plural chips being assembled into one single unit package. Compared to using plural packages, where each package comprises only a single chip, the multi-chip package has the advantages of miniaturization, low weight and high mounting density.
These multi-chip packages are classified into two types, i.e., a vertical-stacking type and a parallel-aligning type. The former reduces mounting area, while the latter simplifies the manufacturing process and reduces package thickness. In order to achieve miniaturization and low weight, the vertical-stacking type has been more commonly used in multi-chip packages. One conventional vertical-stacking type of the multi-chip package is described below.
The conventional multi-chip package comprises plural semiconductor chips, thereby achieving higher electrical performance and higher integration at a low-cost. Further, the area-arrayed external connection terminals of the multi-chip package satisfy the trend of ever-increasing numbers of input/output pins.
However, in the conventional multi-chip package structure, there are limits to the type and size of the chips. That is, it is difficult to stack the upper chip in an edge pad type on the lower chip in a center pad type. Also, it is difficult to stack plural center pad type chips.
Further, since the chip requires a bonding area on its surface for wire-bonding, as chips are stacked upward, the size of the upper chip should be reduced to provide the necessary bonding area. If the upper chip is bigger in size than the lower chip, the chip pads of the lower chip may be covered by the upper chip, thereby preventing wire-bonding between the chip pads of the lower chip and the bonding pads of the substrate.
Moreover, with the conventional multi-chip package structure, it is difficult to effectively control the length of the wire loop of the bonding wires.
For these reasons, it is desirable to provide a multi-chip package comprising plural chips of various types and sizes, and to provide for chips of varying sizes to be mounted above each other.
Accordingly, one embodiment of the present invention provides a multi-chip package including a substrate, a spacer and a first chip attached to the substrate surface, and a second chip mounted on the spacer.
In another embodiment of the present invention, multiple spacers are mounted on the substrate surface. In this embodiment, the plurality of spacers are formed on two opposite edges of the first chip. Alternatively, the plurality of spacers are formed along all four edges of the first chip.
In yet another embodiment of the present invention, a third chip is mounted on the second chip.
The benefits of these and other embodiments, which are described below, include providing for a more flexible approach to vertical-stacking type chip packages, decreasing the height of the wire loop used to connect the chip pads to the bond pads on the substrate surface, maximizing the stability of the loops of the bonding wires by decreasing the height of the wire loop, determining a maximum height of the wire loop of the first chip with the spacers, and reducing the total height of the multi-chip package.
These and other features and advantages of the present invention will be readily understood with reference to the following detailed description thereof provided in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and, in which:
Embodiments of the present invention will be described below with reference to the accompanying drawings.
First bonding pads 21 are formed on the substrate 20 at four outer edges adjacent the first chip 11. Second bonding pads 23 are formed on the substrate 20 at two opposite outer edges from the second chip 13. Ball land patterns 25 are formed on the bottom surface of the substrate 20. The first bonding pads 21 and the second bonding pads 23 are electrically connected to the ball land pads 25 by circuit patterns (not shown) or via holes (not shown) within the substrate 20.
The spacers 45 are formed on or attached to the substrate 20 between the first bonding pads 21 and the second bonding pads 23. The spacer 45 may be made of metal, epoxy resin, photo sensitive resist (PSR), or elastomer and has a greater thickness than that of the first chip 11. For example, when using copper (Cu) to make the spacer 45, the spacer 45 may be formed by etching a Cu metal plate attached to the substrate 20 or by directly attaching a Cu spacer in a predetermined shape to the substrate 20.
The first chip 11 is electrically connected to the substrate 20 by bonding gold (Au) bumps 15 on the chip pads 12 of the first chip 11 to the corresponding first bonding pads 21 with first bonding wires 35. The second chip 13 is electrically connected to the substrate 20 by bonding gold (Au) bumps 16 on the second chip pads 14 of the second chip 13 to the corresponding second bonding pads 23 with second bonding wires 37. The first bonding wires 35 are formed below the second chip 13, and the maximum height of the wire loop of the first bonding wires 35 is determined by the height of spacers 45.
Herein, the reverse bonding method is used, that is, the first or second bonding wires 35 or 37, respectively, are bonded to the first or second bonding pads 21 or 23, respectively, by the ball bonding, and bonded to the gold bumps 15 or 16, respectively, of the chip pads 12 or 14, respectively by stitch bonding. Therefore, the height of the wire loop of the first and second bonding wires 35 and 37, respectively, is reduced, thereby minimizing the height of the space between the first chip 11 and the second chip 13, and minimizing the thickness of the spacer 45. Moreover, the reverse bonding method also reduces the total thickness of the package.
The first chip 11, the second chip 13, the first and second bonding wires 35 and 37, respectively, and the spacers 45 on the substrate 20 are encapsulated with an encapsulant such as an epoxy molding resin, thereby forming a package body 41. Solder balls 43 are formed on the corresponding ball land pads 25 and serve as external connection terminals. A solder resist 27 is provided under substrate 20 and next to ball land pads 25.
In the first embodiment of the present invention, the first chip 11 has a much smaller size than that of the second chip 13. The maximum height of wire loop of the first bonding wires 35 is determined by the height of spacers 45. In the multi-chip package 10, the first bonding pads 21 are formed on the substrate 20 within the perimeter of the second chip 13 and more closely to the first chip 11, thereby reducing the length of wire loop of the first bonding wire 35, and the total width of the package. A manufacturing process of the multi-chip package 10 is described below.
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As shown in
The multi-chip package of the present invention may comprise various types of chips and other modifications of the spacers and several embodiments of the multi-chip package are described below.
The multi-chip package of the present invention may employ both edge and center pad types of chips.
In accordance with the present invention, the multi-chip package comprises plural chips, each having various sizes. Since the maximum height of wire loop of the bonding wires of the lowermost chip, that is, the first chip, is determined by the height of the spacers, the multi-chip package of the present invention may comprise the center and/or edge bond pad types of chips. Also, the chip pads may be formed on four and/or two edges of the active surface of any of the chips. Particularly, in the case where the first and second chips are all edge pad types, the multi-chip package of the present invention maximizes the stability of the loop of the bonding wire since the height of the wire loop is reduced, and reduces the total height of the package.
Further, by achieving the wire bonding of the lower first chip within the perimeter of the upper second chip, the length of the bonding wire is reduced, thereby reducing the total width of the package. Moreover, the reverse bonding method minimizes the thickness of the spacer, thereby reducing the total thickness of the package.
In the drawings and specification, there have been disclosed typical other embodiments of this invention and although specific terms are employed, they are used in a generic and descriptive sense only and not for purpose of limitation, the scope of this invention being set forth in the following claims.
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|U.S. Classification||257/777, 257/778, 257/E25.013, 257/782, 438/108, 257/723, 257/686, 438/118, 257/783, 438/109|
|International Classification||H01L25/065, H01L25/07, H01L25/18, H01L29/40, H01L23/31, H01L23/48, H01L23/52, H01L25/04|
|Cooperative Classification||H01L2924/10162, H01L2924/10161, H01L2224/48499, H01L2224/48479, H01L2224/85399, H01L2924/00014, H01L2224/05599, H01L2224/45099, H01L2924/181, H01L2224/05554, H01L2924/07802, H01L24/48, H01L24/49, H01L2224/49171, H01L2224/48091, H01L2225/0651, H01L2224/48471, H01L25/0657, H01L2924/15311, H01L2224/48465, H01L2924/14, H01L2224/48095, H01L2224/73265, H01L2924/01079, H01L2224/32145, H01L23/3128, H01L2225/06586, H01L2224/48227, H01L2225/06575, H01L2224/32225, H01L2924/01029, H01L2224/8314|
|European Classification||H01L25/065S, H01L23/31H2B|
|Jul 15, 2002||AS||Assignment|
Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SHIM, JONG BO;HYUN, HAN SEOB;REEL/FRAME:013115/0427
Effective date: 20020208
|Jun 25, 2010||FPAY||Fee payment|
Year of fee payment: 4
|Jun 25, 2014||FPAY||Fee payment|
Year of fee payment: 8