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Publication numberUS7208341 B2
Publication typeGrant
Application numberUS 10/855,557
Publication dateApr 24, 2007
Filing dateMay 28, 2004
Priority dateMay 30, 2003
Fee statusPaid
Also published asUS20040241904
Publication number10855557, 855557, US 7208341 B2, US 7208341B2, US-B2-7208341, US7208341 B2, US7208341B2
InventorsKwang-Tae Lee, Sung-Gue Lee, Sang-Hyuck Nam, Sung-Ho Youn, Young-Kyu Lee
Original AssigneeLg Electronics Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Method for manufacturing printed circuit board
US 7208341 B2
Abstract
A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of the exposed terminal portion with gold, and electrically connecting the pad portion and the terminal portion.
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Claims(7)
1. A method for manufacturing a printed circuit board comprising:
forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion;
forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer;
abrading the surface of the first photo solder resist layer;
printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and
forming a pad portion by plating the surface of the exposed terminal portion with gold, and electrically connecting the pad portion and the terminal portion,
wherein, in the removing the specific portions of the first photo solder resist layer, the specific portions of the first photo solder resist layer are exposed to a UV beam and then developed.
2. The method of claim 1, wherein the first and second photo solder resist layers are made of photosensitive ink.
3. The method of claim 1, wherein the first and second photo solder resist layers are made of photosensitive epoxy resin.
4. The method of claim 1, wherein, in the abrading, the surface of the first photo solder resist layer is abraded only as deep as a depth of a sinking portion formed at a specific portion of the first photo solder resist layer.
5. The method of claim 1, wherein, in the removing the specific portions of the second photo solder resist layer, the specific portions of the second photo solder resist layer are exposed to a UV beam and then developed.
6. The method of claim 1, wherein, after the pad portion is formed, the surface of the second photo solder resist layer and the surface of the pad portion are flattened.
7. The method of claim 1, wherein in the forming a pad portion step, the height of the pad portion is plated as high as a height of the second photo solder resist layer.
Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for manufacturing a printed circuit board, and particularly, to a method for manufacturing a printed circuit board capable of easily manufacturing a printed circuit board with a simple process in manufacturing a printed circuit board having a surface exposed to an outside of a product such as a memory card.

2. Description of the Background Art

In general, a printed circuit board is being used for electronic machines or products in various forms. Particularly, in case of a portable memory card having a printed circuit board exposed to an outside of a product, flatness of a surface of the printed circuit board greatly affects quality of a product.

FIG. 1 is a bottom view showing a general memory card, and FIG. 2 is a longitudinal sectional view showing a general memory card.

As shown therein, a general memory card 1 is formed such that a semiconductor element 3 is mounted at a surface of a printed circuit board 2, and a lead 4 of the semiconductor element 3 is electrically connected to a pad portion 16. An upper portion of the semiconductor element 3 is covered with a molding 5, and a cap 5 is coupled to an upper portion of the molding 5.

Since a surface of the printed circuit board 2 of the memory card 1, where the semiconductor element is not mounted, is exposed to an outside of a product, as described above, the flatness of the surface of the printed circuit board 2 greatly affects quality of a product.

Hereinafter, a method for manufacturing a conventional printed circuit board for improving flatness of a surface of a printed circuit board, will now be described.

FIGS. 3A to 3F are views showing a conventional method for manufacturing a printed circuit board.

First, as shown in FIG. 3A, in the conventional method for manufacturing a printed circuit board, inner circuit patterns 11 are formed inside an insulating material in multi-layers, and a plurality of through holes 10 a are formed at certain portions of the insulating material 10.

Then, as shown in FIG. 3B, a copper sheet 11 a is formed inside the through hole 10 a to electrically connect the inner circuit patterns 11 and an outer circuit pattern 13 to be described later.

An outer circuit pattern 13 is formed at an inner circumferential surface of the through hole 10 a and the surface of the insulating material 10 so as to be electrically connected to the inner circuit pattern 11. Then, a specific portion of the outer circuit pattern 13 is exposed to light and developed to be removed.

Then, as shown in FIG. 3C, to protect the outer circuit pattern 13, a solder resist layer 14 of general ink or general resin is formed at the entire surface of the insulating material 10 and the entire surface of the outer circuit pattern 13. At this time, solder resist layer 14 is also filled in the through hole 10 a, and a sinking portion 14 a is formed at a specific portion of the solder resist layer 14 because of a groove 10 b (refer to FIG. 3B) generated by the exposure to light and a development.

The sinking portion 14 a is generated as the specific portion of the solder resist layer 14 is depressed at the groove 10 b in a process of applying solder resist layer 14 to the entire surface of the insulating material 10 and the entire surface of the outer circuit pattern 13.

Then, as shown in FIG. 3D, through an abrading process, the surface of the solder resist layer 14 is flattened.

At this time, the entire surface of the solder resist layer 14 is uniformly abraded until the sinking portion 14 a (refer to FIG. 3C) is removed, and a portion 13 a (hereinafter, referred to as terminal portion) of the outer circuit pattern 13, which is connected to a semiconductor element (not shown) is exposed.

Then, as shown in FIG. 3E, after the surface is uniformly abraded so that the terminal portion 13 a and the solder resist layer 14 are the same in height, a photo solder resist layer 15 is printed at the surface. Then, a specific portion of the photo solder resist layer 15 is exposed to light and developed to thereby expose the terminal portion 13 a covered with the photo solder resist layer 15, again.

Then, as shown in FIG. 3F a pad potion 16 is formed by gold-plating the terminal portion 13 a, and thus the pad portion 16 is electrically connected to the terminal portion 13 a. In this manner, a printed circuit board is completed.

However, the conventional method for manufacturing a printed circuit board has following problems.

In an abrading process for removing a sinking portion of the solder resist layer in order to flatten the surface of the solder resist layer, when the solder resist layer is abraded, the thickness of the terminal portion has to be finely maintained as thick as a planned measurement. However, since the printed circuit board itself is very thin, it is very difficult to perform the abrading operation, maintaining the planned measurement in an actual abrading process.

In the abrading process, if the solder resist layer is abraded too much, the thickness of the terminal portion becomes too thin as shown in FIG. 4A. In contrast, as shown in FIG. 4B, if the solder resist layer is insufficiently abraded, the solder resist layer cannot be fully abraded, and thus the terminal portion cannot be exposed to the outside. Accordingly, performance of the printed circuit board is degraded, and a mal-operation occurs.

SUMMARY OF THE INVENTION

Therefore, an object of the present invention is to provide a method for manufacturing a printed circuit board capable of improving manufacturing efficiency and a yield of a product.

Another object of the present invention is to provide a method for manufacturing a printed circuit board capable of improving performance of a printed circuit board, preventing a mal-operation and easily manufacturing a printed circuit board.

To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described herein, there is provided a method for manufacturing a printed circuit board comprising: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside again by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of the exposed terminal portion with gold, and electrically connecting the pad portion and the terminal portion.

Photosensitive ink or photosensitive epoxy resin is used for the first and second photo solder resist layer.

In the abrading process, the surface of the first photo solder resist layer is abraded just as much as a sinking portion can be removed.

The second photo solder resist layer is printed at the entire surface of the first photo solder resist.

In the step of removing the specific portions of the first photo solder resist layer and the second photo solder resist layer, the specific portions of the first photo solder resist layer and the second photo solder resist layer are exposed to a UV beam and then developed.

Through the exposure to the UV beam and the developing, a pad portion groove for forming a pad portion is formed at the specific portion of the second photo solder resist.

After the pad portion is formed, the surface of the second photo solder resist layer and the surface of the pad portion are flattened.

To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described herein, there is provided a method for manufacturing a printed circuit board comprising: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern; abrading a surface of the first photo solder resist; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and removing the specific portions of the first and second photo solder resists layers to thereby form a pad portion groove for forming a pad portion at a specific portion of the second photo solder resist layer and simultaneously expose the terminal portion to the outside; and forming a pad portion by plating the surface of the exposed terminal portion with gold and electrically connecting the pad portion and the terminal portion.

The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a unit of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

In the drawings:

FIG. 1 is a bottom view showing a general memory card;

FIG. 2 is a longitudinal sectional view showing a general memory card;

FIGS. 3A to 3F are longitudinal sectional views that sequentially show a conventional method for manufacturing a printed circuit board;

FIG. 4A is a longitudinal sectional view showing that a thickness of a terminal portion becomes too thin since the abraded amount is excessive in an abrading process;

FIG. 4 b is a longitudinal sectional view showing that a terminal portion is not exposed to the outside since the abraded amount is insufficient, and thus a solder resist layer cannot be fully removed;

FIGS. 5A to 5G are longitudinal sectional views that sequentially show a method for manufacturing a printed circuit board in accordance with a first embodiment of the present invention; and

FIGS. 6A to 6F are longitudinal sectional views that sequentially show a method for manufacturing a printed circuit board in accordance with a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

FIGS. 5A to 5G are longitudinal sectional views that sequentially show a method for manufacturing a printed circuit board in accordance with a first embodiment of the present invention.

In the method for manufacturing a printed circuit board in accordance with the first embodiment of the present invention, as shown in FIG. 5A, inner circuit patterns 110 are formed in an insulating material 100 in multi-layers, and a plurality of through holes 100 a are formed at certain portions of the insulating material 100.

Then, as shown in FIG. 5B, a copper sheet 110 a is formed inside the through hole 100 a to electrically connect the inner circuit pattern 110 and an outer circuit pattern 130 to be described later.

An outer circuit pattern 130 is formed at an inner circumferential surface of the through hole 100 a and a surface of the insulating material 100 and electrically connected to the inner circuit pattern 110. Then, a specific portion of the outer circuit pattern 130 is exposed to light and developed to be removed.

Then, as shown in FIG. 5C, to protect the outer circuit pattern 130, a first photo solder resist layer 140 is formed at an entire surface of the insulating material 100 and an entire surface of the outer circuit pattern 130.

At this time, the first photo solder resist layer 140 is also filled in the through hole 100 a.

A sinking portion 140 a is formed at the specific portion of the first photo solder resist layer 140 by grooves 100 b formed by the exposure to light and the developing.

The sinking portion 140 a is generated as the specific portion of the first photo solder resist layer 140 is depressed by the groove 100 b in a process of applying the first photo solder resist layer 140 onto the entire surface of the insulating material 100 and the entire surface of the outer circuit pattern 130.

Then, as shown in FIG. 5D, the first photo solder resist layer 140 is exposed to a UV beam. Then, through a developing process using alkali chemicals, such as sodium carbonate, a part of the first photo solder resist layer 140 covering the surface of the terminal portion 130 a is removed to expose the terminal portion 130 a.

At this time, photosensitive ink or photosensitive epoxy resin is used for the first photo solder resist layer 140.

Then, as shown in FIG. 5E, the surface of the first photo solder resist layer 140 is flattened through an abrading process. At this time, the entire surface of the first photo solder resist layer 140 is uniformly abraded just as much as the sinking portion 140 a (refer to FIG. 5) can be removed, that is, as deep as the depth of the depression portion 140 a.

Unlike the conventional method for manufacturing a printed circuit board, in the method for manufacturing a printed circuit board in accordance with the first embodiment of the present invention, since the terminal portion 130 a is exposed to the outside by exposure to a UV beam and developing in a preceding step of an abrading process, the first photo solder resist layer 140 is abraded in the abrading process just as much as the sinking portion 140 a can be removed.

In other words, an ultraviolet beam is radiated to the first photo solder resist layer 140, and then, a part of the first photo solder resist layer 140 covering the surface of the terminal portion 130 a is removed through the developing operation to expose the terminal portion 130 a, first. Then, the surface of the first photo solder resist layer 140 is abraded just as much as a second photo solder resist layer 150 can be printed at the surface of the first photo solder resist layer 140.

In this manner, the surface of the first photo solder resist layer 140 is adequately abraded with the thickness of the terminal portion 130 a always constantly maintained. Accordingly, there can be prevented the problems of the conventional art, such as a terminal portion having a thickness thinner than a planned measurement due to the excessively-abraded first photo solder resist layer or a terminal portion which cannot be exposed to the outside due to insufficiently-abraded first photo solder resist layer.

Then, as shown in FIG. 5F, a second photo solder resist layer 150 is printed at the entire surface of the first photo solder resist layer 140. Then, a specific portion of the second photo solder resist layer 150, that is, a portion covering the terminal portion 130 a is exposed to a UV beam and developed, thereby forming a pad portion groove 150 a. Accordingly, the terminal portion 130 a is exposed to the outside, again.

Then, as shown in FIG. 5G, a surface of the exposed terminal portion 130 a is plated with gold to form a pad portion 160 as high as the height of the second photo resist layer 150, and the pad portion 160 and the terminal portion 130 a are electrically connected. In this manner, the printed circuit board is completed.

As so far described, in the first embodiment of the present invention, in a preceding step of an abrading process, a first photo solder resist layer 140 of photosensitive ink or photosensitive resin material is formed at the surface of the insulating material and the surface of an outer circuit pattern, and then, a part of first photo solder resist layer 140 covering the surface of the terminal potion 130 a is removed through the exposure to a UV beam and the developing, so that the terminal portion 130 a is exposed, first. Accordingly, a thickness of the terminal portion can be always constantly maintained.

In the method for manufacturing a printed circuit board in accordance with a second embodiment of the present invention, as shown in FIG. 6A, inner circuit patterns 210 are formed in an insulating material 200 in multi-layers, a plurality of through holes 200 a are formed at certain portions of the insulating material 200.

Then, as shown in FIG. 6B, a copper sheet 210 a is formed inside the through hole 200 a to electrically connect the inner circuit pattern 210 and an outer circuit pattern 230 to be described later.

An outer circuit pattern 230 is formed at an inner circumferential surface of the through hole 200 a and a surface of the insulating material 200 and electrically connected to the inner circuit pattern 210. Then, a specific portion of the outer circuit pattern 230 is exposed to light and developed to be removed.

Then, as shown in FIG. 6C, to protect the outer circuit pattern 230, a first photo solder resist layer 240 is formed at an entire surface of the insulating material and an entire surface of the outer circuit pattern 230.

At this time, the first photo solder resist layer 240 is also filled in the through hole 200 a. A sinking portion 240 a is formed at a specific portion of the first photo solder resist layer 240 by a groove 200 b formed by the exposure to light and the developing.

The sinking portion 240 a is generated as the specific portion of the first photo solder resist layer 240 is depressed in a process of applying the first photo solder resist layer 240 onto the entire surface of the insulating material and the entire surface of the first photo solder resist layer 240.

A process for manufacturing a printed circuit board in FIGS. 6A to 6C is the same as that of FIGS. 5A to 5C.

Then, as shown in FIG. 6D, the surface of the first photo solder resist layer 240 is flattened through an abrading process. At this time, the entire surface of the first photo solder resist layer 240 is uniformly abraded just as much as the sinking portion 240 a (refer to FIG. 6) can be removed, that is, as deep as the depth of the depression portion 240 a.

Then, as shown in FIG. 6E, a second photo solder resist layer 250 is printed at the entire surface of the first photo solder resist layer 240. Then, specific portions of the first and second photo solder resist layers, portions covering the terminal portion 230 a, are exposed to a UV beam and developed, thereby forming a pad portion groove 250 a. Accordingly, the terminal portion 230 a is exposed to the outside.

Then, as shown in FIG. 6F, a surface of the exposed terminal portion 230 a is plated with gold to form a pad portion 260 as high as the height of the second photo resist layer 250, and the pad portion 260 and the terminal portion 230 a are electrically connected. In this manner, the printed circuit board is completed.

As so far described, in the second embodiment of the present invention, the second photo solder resist layer 250 is printed at the surface of the first photo solder resist layer 240, and specific portions of first photo solder resist layer 240 and the second photo solder resist layer 250 are removed together through exposure to a UV beam and developing to expose the terminal portion 230 a. Accordingly, the thickness of the terminal portion 230 can be always constantly maintained.

As so far described, by the present invention, a printed circuit board can be more easily manufactured to thereby improve manufacturing efficiency, a yield, performance and quality of a product can be manufactured.

As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, unless otherwise specified, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the metes and bounds of the claims, or equivalence of such metes and bounds are therefore intended to be embraced by the appended claims.

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Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7660129 *Jan 30, 2008Feb 9, 2010Yuuji MinotaPrinted circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board
US8198550 *Mar 27, 2009Jun 12, 2012Samsung Electro-Mechanics Co., Ltd.Printed circuit board and method of manufacturing the same
US8206892Jul 14, 2010Jun 26, 2012State Of OregonSolution processed thin films and laminates, devices comprising such thin films and laminates, and method for their use and manufacture
US8318407Sep 30, 2008Nov 27, 2012State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State UniversitySolution processed thin films and laminates, devices comprising such thin films and laminates, and method for their use and manufacture
US8415000Apr 9, 2013Inpria CorporationPatterned inorganic layers, radiation based patterning compositions and corresponding methods
US8624132 *May 17, 2011Jan 7, 2014Ibiden Co., Ltd.Printed wiring board
US8832935Nov 23, 2010Sep 16, 2014Ibiden Co., Ltd.Method of manufacturing a printed wiring board
US20110214915 *Sep 8, 2011Ibiden Co., Ltd.Printed wiring board
US20120222299 *Sep 6, 2012Samsung Electro-Mechanics Co., Ltd.Method of manufacturing a printed circuit board
EP2392969A2May 30, 2011Dec 7, 2011Inpria CorporationPatterned inorganic layers, radiation based patterning compositions and corresponding methods
WO2012129532A1Mar 23, 2012Sep 27, 2012Andelman Marc DPolarized electrode for flow-through capacitive deionization
Classifications
U.S. Classification438/106, 438/618, 438/622
International ClassificationH01L21/4763, H05K3/24, H01L21/48, H05K3/28, H05K3/46
Cooperative ClassificationH05K2201/09881, H05K3/243, H05K3/28, H05K2201/0959, H05K2203/0577, H05K2203/025, Y10T29/49155
European ClassificationH05K3/28
Legal Events
DateCodeEventDescription
May 28, 2004ASAssignment
Owner name: LG ELECTRONICS INC., KOREA, REPUBLIC OF
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, KWANG-TAE;LEE, SUNG-GUE;NAM, SANG-HYUCK;AND OTHERS;REEL/FRAME:015416/0740
Effective date: 20040524
Apr 22, 2010ASAssignment
Owner name: LG ELECTRONICS INC.,KOREA, REPUBLIC OF
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LG ELECTRONICS INC.;REEL/FRAME:024272/0606
Effective date: 20100415
Owner name: LG INNOTEK CO., LTD.,KOREA, REPUBLIC OF
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LG ELECTRONICS INC.;REEL/FRAME:024272/0606
Effective date: 20100415
Sep 20, 2010FPAYFee payment
Year of fee payment: 4
Oct 7, 2014FPAYFee payment
Year of fee payment: 8