|Publication number||US7215551 B2|
|Application number||US 10/956,893|
|Publication date||May 8, 2007|
|Filing date||Sep 29, 2004|
|Priority date||Sep 29, 2004|
|Also published as||US7365985, US20060067054|
|Publication number||10956893, 956893, US 7215551 B2, US 7215551B2, US-B2-7215551, US7215551 B2, US7215551B2|
|Inventors||Kuang-Yu Wang, Jim Ni, Ren-Kang Chiou|
|Original Assignee||Super Talent Electronics, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (29), Referenced by (43), Classifications (15), Legal Events (4)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This invention relates to standardized memory modules for expanding the memory capacity of personal computers and other computing systems, and more particularly to memory module assemblies that include heat-sink structures.
Heat sinks have been widely used to assist in cooling electronic components. Some microprocessors have heat sinks attached to allow for higher-frequency operation. Other components such as memory modules may also benefit from heat sinks.
Most personal computers (PC's) are shipped with sockets for memory modules so that their owners can later add additional modules, increasing the memory capacity of the PC. Other non-PC devices may also use memory modules designed for PC's. High-volume production and competition have driven module costs down dramatically, benefiting the buyer.
Memory modules are made in many different sizes and capacities, with the older 30-pin modules replaced by 72-pin, 168-pin, and other size modules. The “pins” were originally pins extending from the module's edge, but now most modules are lead-free, having metal contact pads, fingers, or leads. The modules are small in size, some being about 5.25 inches long and 1.2 or 1.7-inches high.
Conventional memory modules include a small printed-circuit board (PCB) substrate and several surface mounted components (e.g., memory devices) mounted on one or both surfaces of the PCB substrate. The PCB substrate is typically a multi-layer board with alternating laminated layers of fiberglass insulation and foil or metal interconnection layers. The contact pads (or other contact structures) are typically aligned along a bottom (connector) edge of the PCB substrate. The interconnect layers define wiring traces that provide signal paths between the surface mounted components and the contact pads. The surface mounted components (e.g., memory devices) are soldered or otherwise attached to one or both surfaces of the substrate, with each component typically including one or more integrated circuit (IC) “chips” that are packaged in inexpensive surface-mount packages such as small-outline J-leaded (SOJ) packages, plastic leaded chip carriers (PLCC's), thin small-outline packages (TSOP) or small-outline (SO) packages. The number of memory devices mounted on the PCB substrate of a memory module depends on the capacity and the data-width of the memory chips and the size of the memory module.
As processor speeds have increased, the need for faster memory has become more critical. Various bandwidth-enhancing methods and memory interfaces have been used. Memory chips have higher densities and operate at higher frequencies than before, producing more waste heat from the memory chips. Thus, a need has arisen to remove this waste heat from memory modules.
Conventional memory module assemblies typically include three components: the memory module PCBA and two metal heat-sink plates that are coupled together using one or more fasteners, such as a metal clamp. The contact between PCBA and metal heat-sink plate is usually aided by sandwiching a tape of thermal interface material (TIM) in-between. Various heat-sink plates have been designed for producing such memory module assemblies. See for example U.S. Pat. Nos. 6,362,966, 6,424,532, and 6,449,156, among others. Clamp-on heat-sink plates for memory modules are also known. For example, OCZ Technology produces a copper heat sink with wider metal bands that clip the heat sink to over the front and back surfaces of the memory module. These clip-on and clamp-on designs increase the manufacturing costs and complexity of the associated memory modules because they are difficult to incorporate into automated production lines. Further, the use of clamps or similar structures facilitates easy disassembly by users, resulting in undesirable situations. Moreover, the presence of the clamps and thermal interface material increase the overall thickness of the memory module assembly, thereby taking up valuable motherboard space.
Some memory-module heat sinks feature a closed-top design that prevents airflow in the small gaps between the heat sink and the memory module substrate. Often the entire top edge of the heat sink is closed, providing no path for air to flow under the heat sink other than back out the bottom edge, which is usually open. Sides may be open or partially open, but the sides are much smaller than the top and bottom edges of the memory module, limiting the possible air-flow.
What is needed is a memory module assembly having a protective metal heat-sink plate (shield) mounted over the surface mounted IC devices of a memory module PCBA that both serves to protect the PCBA and to dissipate heat generated by the IC devices, and is easily and inexpensively produced using automated methods.
The present invention is directed to a memory module assembly including one or more heat sink plates that are directly attached to one or more of the integrated circuits (IC) devices of a memory module printed circuit board assembly (PCBA) using an adhesive, whereby the heat-sink plates both protect the memory module PCBA and dissipate heat generated by the IC devices thereof. By directly attaching the heat-sink plates to the IC devices of the memory module PCBA, the present invention facilitates a simplified automated manufacturing method that greatly reduces overall production costs.
The memory module assembly of the present invention utilizes a memory module PCBA that is essentially identical to conventional memory modules, thus allowing the present invention to be utilized with existing electronics. That is, similar to conventional memory modules, the IC devices are surface mounted on one or both surfaces of a printed-circuit board (PCB) substrate. The PCB substrate includes metal contact pads arranged along a connector (bottom) edge, and multiple wiring traces that provide signal paths between the IC devices and the contact pads. An important aspect of the present invention is the IC devices are packaged and surface mounted on the PCB substrate such that an upper surface of each of these IC devices defines a plane that is substantially parallel to the planar PCB surface on which it is mounted, although the height of each IC device may vary. In particular, the planar upper surfaces of these IC devices are used to secure the memory module PCBA to planar underside surfaces of the heat sink plates by way of the adhesive.
According to an embodiment of the present invention, the adhesive is a heat-activated or heat-cured adhesive that is applied to either the upper surface of the one or more IC devices, or to the planar underside surfaces of the heat-sink plates. When applied, the adhesive is viscous and has a relatively low adhesion to facilitate manipulation of the cover and memory module PCBA until a desired orientation is achieved. The adhesive is then compressed between the heat-sink plate and IC devices, and is held in the compressed state using a fixture. The fixture is then passed through an oven maintained at a specified temperature (i.e., at or lower than the maximum safe operating temperature for the memory module components) to activate or cure the adhesive. In one embodiment, a heat-activated adhesive is used that exhibits a relatively low adherence prior to being heated to a high temperature (i.e., equal to or less than the maximum safe operating temperature of the memory module assembly), and the heat-activated adhesive exhibits a high adherence when subsequently cooled. In this case, subsequent removal of the heat-sink plates from the memory module PCBA requires reheating at a predetermined temperature to reflow the adhesive. In another embodiment, the heating process is used to “cure” a relatively highly thermally conductive adhesive, subsequent separation of the heat-sink plate requires the use of a chemical solvent to dissolve the heat-cured adhesive. In both cases, unauthorized tampering (i.e., removal of the heat-sink plates to access the IC devices) is rendered more difficult and easier to detect than conventional memory modules that utilize clips or fasteners. Further, the heat-cured adhesive is thin and thermally conductive to reduce thermal resistance between the IC devices and the heat-sink plates, thus facilitating a relatively high rate of heat flow from the IC devices to maintain relatively low operating temperatures. Thus, the use of heat-activated and/or heat-cured adhesive facilitates a greatly thinner memory module with heat sink and simplified assembly process whereby the heat-sink plates are secured to protect the memory module PCBA in a manner that reduces overall manufacturing costs, and prevents unauthorized tampering.
According to another embodiment of the present invention, the one or two heat-sink plates are respectively attached to the memory module PCBA solely by the adhesive attached between the cover and the one or more IC devices. Unlike conventional assemblies that utilize clips and/or fasteners to secure the heat sink covers to the memory module substrate and/or to each other, in one embodiment, the adhesive is relied upon solely to secure the cover to the memory module, thereby greatly simplifying the production process. In alternative embodiments, one or more fasteners may be utilized in addition to the adhesive to provide a more rigid connection between the memory module PCBA and the heat-sink plates.
According to yet another embodiment of the present invention, the adhesive is used to attach one or more first IC devices to an associated heat-sink plate, whereas a conventional (i.e., non-adhesive) thermal transfer material is sandwiched between one or more second IC devices and the associated heat-sink plate to provide greater (or lesser) heat flow from the second IC devices to the associated heat-sink plate. In one specific embodiment, the thermal interface material exhibits a higher thermal conductivity than the adhesive, thereby providing greater cooling to the second IC devices.
According to another embodiment of the present invention, the cover is provided with edge features and slots that maximize cooling of the IC devices. The cover edges are aligned along the memory module substrate along the top edge opposite the lower (connector) edge, and along the upper half of the substrate's side edges. In one or more embodiments, the top edge is spaced from the memory module PCBA to allow air to flow between the PCBA and the heat-sink plates (i.e., through small gaps between the IC devices), thereby maximizing heat transfer from the memory module during use.
The present invention relates to improvements in memory module assemblies (i.e., a memory module printed circuit board assembly (PCBA) and one or more heat-sink plates). The following description is presented to enable one of ordinary skill in the art to make and use the invention as provided in the context of a particular application and its requirements. Various modifications to the preferred embodiment will be apparent to those with skill in the art, and the general principles defined herein may be applied to other embodiments. Therefore, the present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Although generally referred to herein as memory devices, IC devices 120 and 125 may include one or more additional control IC devices, such as a processor, an application specific integrated circuit (ASIC), and/or a programmable logic device (PLD). Further in addition, to IC devices 120 and 125, additional electrical and electronic components 124 (shown in FIG. 1(A)), such as capacitors and inductors, may be included on PCB substrate 111 using known techniques.
According to an embodiment of the invention, each memory device is packaged such that its upper surface is planar (e.g., Thin Small Outline Package (TSOP)), and is maintained such that each planar upper surface is parallel to PCB substrate 111. For example, as shown in
As indicated in
According to an embodiment of the present invention, adhesive portions 150 comprise heat-activated adhesive that is applied to either upper surfaces 122/126 of one or more IC devices 120/125, or to the planar underside surfaces 134/144 of heat-sink plates 130/140. In this embodiment, the heat-activated adhesive 150 is softened (i.e., exhibits a relatively low adherence) when heated to a high temperature (i.e., equal to or less than the maximum operating temperature of the memory module assembly), and the heat-activated adhesive exhibits a high adherence when subsequently cooled. The advantage of such heat-activated adhesives is that they can be removed by heating, and thus enable reworking. In this case, subsequent removal of the heat-sink plates from the memory module PCBA requires reheating at a predetermined temperature to reflow the adhesive. Heat-activated adhesives of this type are typically produced in the form of thin film or tape can be used for IC devices that generate less heat, and the main purpose of heat-sink plates 130/140 is thus relegated to mainly protecting the IC devices. Such heat-activated adhesive material forms a thin and continuous layer between the heat-sink plate and the upper external surface of the IC devices. As the newly formed interface layer is thin and can be made substantially void-free (i.e., very few air bubbles), the thermal resistance through the adhesive layer is relatively small. The ability to rework, for example through heating, becomes an important consideration. Thermoplastic based adhesive material such as thermal bonding film (e.g., product number TBF668) produced by 3M of St. Paul Minn., or hot melt film (e.g., product number 7802) produced by Henkel Loctite Corp. (Industrial) of Rocky Hill Conn. can be used as an adhesive in this application.
While heat-activated adhesives provide an advantage in that they can be reworked by reheating, such adhesives typically exhibit relatively low thermal conductivity, thus making them less desirable in applications that require a high level of heat dissipation through the heat-sink plates.
In another embodiment, adhesive portions 150 comprise an adhesive material that is “cured” during a heating process (i.e., exhibits an initial, relatively low adherence when applied, and a relatively high adherence after being heat-cured). Such heat-cured adhesives typically exhibit relatively high thermal conductivity relative to heat-activated adhesives, and are therefore more desirable in applications that require a high level of heat dissipation through the heat-sink plates. The heat-cured adhesive material is applied in the form of paste, and is re-distributed under heat and pressure during curing to bond the IC devices and heat-sink plates together. The curing process takes place at elevated temperature, and can be expedited with the use of activator. The re-distribution process causes the adhesive material to flow and fill the void between the heat sink plate and memory surface, resulting in a thin, good contact therebetween that reduces thermal resistance from the heat source (IC device) to the heat-sink plate. A dispensing machine can be used to ensure even distribution of the adhesive material. In one embodiment, the heat-cured adhesive consists of silicone elastomer-based resin for re-workability and survivability at elevated temperature that the electronic components may encounter. Metallic fillers may be added to improve thermal conductivity. On suitable heat-cured adhesive is provided by Dow Corning (e.g., product number 3-6752). Such adhesives are removed using solvent to enable rework.
Although heat-activated and heat-cured adhesive materials provide superior connection between the heat-sink plates and memory module PCBA, it is also possible to use other types of adhesives in the manner described herein to provide suitable connections. Therefore, unless otherwise specified in the appended claims, the term “adhesive portion” is intended to include any non-corrosive adhesive that can reliably connect the heat-sink plates and memory module PCBAs described herein.
In addition, although the present invention is described above with certain benefits associated with attaching heat-sink plates 130 and 140 to memory module PCBA 110 solely by adhesive portions 150, in some embodiments an optional fastener (e.g., a screw 160, rivet or clamp, which is shown in dashed lines in
Referring to the top of
According to a specific embodiment of the present invention, the thus-assembled structure is then secured into a fixture (640) and then subjected to a heating process to activate/cure the adhesive portions 110 (650). A simplified fixture 700 suitable for this heating process is illustrated in
The embodiment described above with reference to
Although the embodiments above include heat-sink plates that extend above the upper edge of the associated memory module PCBA, other embodiments are also possible.
In accordance with another aspect of the present invention, memory module assembly 100D further includes at least one thermal interface material portion (e.g., thermal grease, pad, film) 170 that is sandwiched between planar underside surface 134 and upper surface of at least one second IC device 120-D2 (corresponding second IC devices provided on lower surface 113, not shown, also include thermal interface material portions). According to the present embodiment, thermal interface material portions 170 differ from adhesive portions 150 in that they have a relatively high thermal conductivity, and do not provide adhesion between the IC devices and heat-sink plates. Thus, thermal interface material portions 170 are formed over IC devices 120-D2 that generate a relatively high amount of heat during operation, whereas adhesive portions 150 are formed over IC devices 120-D1 that generate a relatively low amount of heat during operation. The thermal interface material may be provided in the form of thermal grease (Vantec Thermal Paste) or thermally conductive adhesive (Dow Corning 3-6752 thermal conductive compound) that is sandwiched between second IC devices 120-D2 and heat-sink plate 130 in a manner similar to that described above with reference to adhesive portions 150. Such thermal interface material is replaced after each re-work.
Several other embodiments are contemplated by the inventors. For example the heat sink may be made from a variety of heat-conducting materials such as aluminum, aluminum alloy, copper, brass, bronze, stainless steel, etc.
In addition to adhesive, rivets and/or other fasteners could be used to connect the covers to the memory module substrate. For example, small nuts and bolts, or screws and nuts could be used. These fasteners provided secure and fixed attachment rather than wobbly or temporary attachment. Holes for these fasteners can be added to the memory module substrate. These fastener holes are not normally present in a standard memory module.
Two, three or four DRAM chips could be stacked together at each chip location on the memory module. Some memories may have more than one chip select (CS) input, and some combination of these chip selects could be used to select the DRAM chips.
The number of DRAM chips, capacitors, buffers, and other components on each side of the substrate can be varied. Wide or narrow DRAM chips of one, two, four, eight or more bits in width may be substituted. Other kinds of Integrated Circuits (IC's) or chips can be mounted on the substrate too, such as an address or bank decoder, a parity generator, an error detector, and/or a serial programmable device (SPD) for identifying the memory module.
Memory modules produced in accordance with the present invention may use improved DRAM's such as synchronous DRAM (SDRAM), double data rate (DDR) SDRAM, second-generation double data rate (DDR2) SDRAM, Rambus DRAM (RDRAM), direct Rambus DRAM (DRDRAM) or synchronous-pipelined DRAM (SPDRAM). Memory modules produced in accordance with the present invention may also include SIMM, and FB-DIMM type memory modules. As an alternative to DRAM's, other memory types (SRAM, ROM, EPROM) could be used. Flash memories using electrically-erasable programmable read-only memory (EEPROM) technology, or some other technologies (ferro-electric FRAM, magnetic or magneto-resistive MRAM, etc.) could be used by the memory modules.
Terms such as “upper edge”, “side edge”, “lower edge”, “front surface”, “back surface” and “underside surface” are arbitrarily assigned as shown in the figures and each term could refer to either surface of the module and/or heat-sink structure. Vias of through-holes may provide electrical connection between the surfaces or intermediate layers. These through-holes could be filled in holes or metal traces between layers rather than open holes, and can also be formed during the PCB processing as an integral part of the PCB. Various alternatives in geometries of the heat-sink plates and memory modules could be substituted.
The invention could be used to stack other kinds of memory chips than DRAM, such as SRAM and flash memories, etc. The invention could be applied to other kinds of modules besides memory modules, and could be used for stacking other kinds of chips such as buffers, registers, latches, processing arrays, etc.
The electrical assignment of functions or signals to the contact pads (“pins”) located along the lower edge of the module, is usually determined by an industry standard-setting committee, such as JEDEC. JEDEC specifies the order of the pins and the size of the module to allow for interchangeability of modules with sockets. Redundant power and ground pins are usually assigned symmetric positions to avoid reversing the power and ground supplies if the module is inserted backwards. DRAM chips are usually connected to a data pin as close to the chip as possible to minimize wiring lengths and signal delays. Older 72-pin modules are being replaced by 168-pin and larger modules. Multi-layer printed circuit board (PCB) substrates can share the power and ground planes with signal traces to reduce the number of layers used from eight layers to six layers or even four layers. Many other configurations are possible.
The foregoing description of the embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the invention be limited not by this detailed description, but rather by the claims appended hereto.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US4606962 *||May 31, 1985||Aug 19, 1986||Minnesota Mining And Manufacturing Company||Electrically and thermally conductive adhesive transfer tape|
|US5109318 *||May 7, 1990||Apr 28, 1992||International Business Machines Corporation||Pluggable electronic circuit package assembly with snap together heat sink housing|
|US5313097||Nov 16, 1992||May 17, 1994||International Business Machines, Corp.||High density memory module|
|US5475563||Oct 27, 1994||Dec 12, 1995||Compaq Computer Corporation||PCMCIA card heat removal apparatus and methods|
|US5661339 *||Jul 11, 1994||Aug 26, 1997||Clayton; James E.||Thin multichip module|
|US5731633 *||Oct 18, 1993||Mar 24, 1998||Gary W. Hamilton||Thin multichip module|
|US5751553 *||Jun 7, 1995||May 12, 1998||Clayton; James E.||Thin multichip module including a connector frame socket having first and second apertures|
|US5793609||Jul 22, 1996||Aug 11, 1998||Compaq Computer Corporation||PCMCIA card heat removal apparatus and methods|
|US5892660 *||Aug 29, 1996||Apr 6, 1999||Micron Technology, Inc.||Single in line memory module adapter|
|US6049975 *||May 12, 1998||Apr 18, 2000||Clayton; James E.||Method of forming a thin multichip module|
|US6091145 *||May 11, 1998||Jul 18, 2000||Clayton; James E.||Thin multichip module including a connector frame socket|
|US6232659 *||Jul 12, 2000||May 15, 2001||James E. Clayton||Thin multichip module|
|US6353538 *||May 13, 1999||Mar 5, 2002||Intel Corporation||Protective cover and packaging for multi-chip memory modules|
|US6362965 *||Dec 14, 2000||Mar 26, 2002||Intel Corporation||Clamping heat sinks to circuit boards over processors|
|US6362966 *||May 13, 1999||Mar 26, 2002||Intel Corporation||Protective cover and packaging for multi-chip memory modules|
|US6377460 *||May 30, 2000||Apr 23, 2002||Infineon Technologies Ag||Electronic circuit having a flexible intermediate layer between electronic components and a heat sink|
|US6424532 *||Jun 14, 1999||Jul 23, 2002||Nec Corporation||Heat sink and memory module with heat sink|
|US6449156 *||Sep 12, 2001||Sep 10, 2002||Samsung Electronics Co., Ltd.||Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof|
|US6661661 *||Jan 7, 2002||Dec 9, 2003||International Business Machines Corporation||Common heatsink for multiple chips and modules|
|US6781848 *||May 22, 2003||Aug 24, 2004||Micron Technology, Inc.||Single-piece molded module housing|
|US7023700 *||Dec 24, 2003||Apr 4, 2006||Super Talent Electronics, Inc.||Heat sink riveted to memory module with upper slots and open bottom edge for air flow|
|US7079396 *||Jun 14, 2004||Jul 18, 2006||Sun Microsystems, Inc.||Memory module cooling|
|US7106595 *||Sep 15, 2004||Sep 12, 2006||International Business Machines Corporation||Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board|
|US20020001180 *||Jun 14, 1999||Jan 3, 2002||Masashi Kawamura||Heat sink and memory module with heat sink|
|US20020079117 *||Dec 27, 2000||Jun 27, 2002||International Business Machines Corporation||Capping structure for electronics package undergoing compressive socket actuation|
|US20030193788 *||May 22, 2003||Oct 16, 2003||Farnworth Warren M.||Single-piece molded module housing|
|US20050276021 *||Jun 14, 2004||Dec 15, 2005||Sun Microsystems, Inc.||Memory module cooling|
|US20060056154 *||Sep 15, 2004||Mar 16, 2006||International Business Machines Corporation||Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board|
|JP2000251463A *||Title not available|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7349219 *||May 15, 2006||Mar 25, 2008||Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.||Memory module assembly including a clip for mounting a heat sink thereon|
|US7382617 *||Sep 19, 2006||Jun 3, 2008||Nanya Technology Corporation||Heat sink assembly|
|US7393226 *||Mar 7, 2007||Jul 1, 2008||Microelectronics Assembly Technologies, Inc.||Thin multichip flex-module|
|US7394149 *||Mar 7, 2007||Jul 1, 2008||Microelectronics Assembly Technologies, Inc.||Thin multichip flex-module|
|US7429788 *||Mar 7, 2007||Sep 30, 2008||Microelectronics Assembly Technologies, Inc.||Thin multichip flex-module|
|US7520781 *||Mar 7, 2007||Apr 21, 2009||Microelectronics Assembly Technologies||Thin multichip flex-module|
|US7679913||Jun 23, 2007||Mar 16, 2010||Ming-Yang Hsieh||Memory module assembly and heat sink thereof|
|US7738252 *||Jan 9, 2007||Jun 15, 2010||Ocz Technology, Group, Inc.||Method and apparatus for thermal management of computer memory modules|
|US7745952 *||Feb 21, 2006||Jun 29, 2010||Hitachi Industrial Equipment Systems Co., Ltd.||Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink|
|US7911798 *||Mar 22, 2011||Chih-I Chang||Memory heat sink device provided with a larger heat dissipating area|
|US7957134 *||Apr 10, 2007||Jun 7, 2011||Hewlett-Packard Development Company, L.P.||System and method having evaporative cooling for memory|
|US8018723 *||Sep 13, 2011||Netlist, Inc.||Heat dissipation for electronic modules|
|US8033836||Oct 11, 2011||Netlist, Inc.||Circuit with flexible portion|
|US8248805 *||Sep 24, 2009||Aug 21, 2012||International Business Machines Corporation||System to improve an in-line memory module|
|US8421214||Oct 10, 2007||Apr 16, 2013||Vishay General Semiconductor Llc||Semiconductor device and method for manufacturing a semiconductor device|
|US8705239||Aug 8, 2011||Apr 22, 2014||Netlist, Inc.||Heat dissipation for electronic modules|
|US8864500||Oct 16, 2012||Oct 21, 2014||Netlist, Inc.||Electronic module with flexible portion|
|US8865526||Apr 10, 2013||Oct 21, 2014||Vishay General Semiconductor Llc||Semiconductor device and method for manufacturing a semiconductor device|
|US9220185 *||May 12, 2011||Dec 22, 2015||Thomson Licensing||Set-top box having dissipating thermal loads|
|US9223167||Jun 26, 2013||Dec 29, 2015||Apple Inc.||Liquid crystal switching barrier thermal control|
|US9232681 *||Jul 3, 2014||Jan 5, 2016||Hewlett Packard Enterprise Development Lp||Multi-chip socket|
|US9245820 *||Feb 4, 2011||Jan 26, 2016||International Business Machines Corporation||Liquid DIMM cooling device|
|US20060146497 *||Dec 30, 2004||Jul 6, 2006||Intel Corporation||Heat exchanger for memory modules|
|US20060232942 *||Feb 21, 2006||Oct 19, 2006||Hitachi Industrial Equipment Systems Co., Ltd||Electric circuit module as well as power converter and vehicle-mounted electric system that include the module|
|US20070159789 *||Jan 9, 2007||Jul 12, 2007||Ocz Technology Group, Inc.||Method and apparatus for thermal management of computer memory modules|
|US20070165382 *||Sep 19, 2006||Jul 19, 2007||Nanya Technology Corporation||Heat sink assembly|
|US20070206360 *||Mar 3, 2006||Sep 6, 2007||Ying-Hsiu Chu||Structure of heat-dispersing protective shell for memory|
|US20070212919 *||Mar 7, 2007||Sep 13, 2007||Clayton James E||Thin multichip flex-module|
|US20070263360 *||May 15, 2006||Nov 15, 2007||Foxconn Technology Co., Ltd.||Memory module assembly including a clip for mounting a heat sink thereon|
|US20080024997 *||Jul 28, 2006||Jan 31, 2008||Apple Computer, Inc.||Staggered memory layout for improved cooling in reduced height enclosure|
|US20080186685 *||Jan 11, 2008||Aug 7, 2008||Samsung Electronics Co., Ltd.||Printed circuit board and semiconductor memory module using the same|
|US20080251911 *||Apr 10, 2007||Oct 16, 2008||Farnsworth Arthur K||System and method having evaporative cooling for memory|
|US20080266807 *||Apr 27, 2007||Oct 30, 2008||Cray Inc.||Electronic assembly with emi shielding heat sink|
|US20080278916 *||Jun 23, 2007||Nov 13, 2008||Ming-Yang Hsieh||Memory Module Assembly and Heat Sink thereof|
|US20090096078 *||Oct 10, 2007||Apr 16, 2009||Vishay General Semiconductor Llc||Semiconductor device and method for manufacturing a semiconductor device|
|US20090122481 *||Oct 29, 2008||May 14, 2009||Chih-I Chang||Memory heat sink device provided with extra heat sink area|
|US20090129026 *||Nov 14, 2008||May 21, 2009||Samsung Electronics Co., Ltd.||Heat sink for semiconductor device and semiconductor module assembly including the heat sink|
|US20110069456 *||Mar 24, 2011||International Business Machines Corporation||System to improve an in-line memory module|
|US20110310565 *||Dec 22, 2011||Fih (Hong Kong) Limited||Heat sink for memory module|
|US20130027870 *||Feb 4, 2011||Jan 31, 2013||International Business Machines Corporation||Liquid dimm cooling device|
|US20130063895 *||May 12, 2011||Mar 14, 2013||Thomson Licensing||Set-top box having dissipating thermal loads|
|US20140315435 *||Jul 3, 2014||Oct 23, 2014||Hewlett-Packard Development Company, L.P.||Multi-chip socket|
|WO2009049188A1 *||Oct 10, 2008||Apr 16, 2009||Vishay General Semiconductor, Llc||Semiconductor device and method for manufacturing a semiconductor device|
|U.S. Classification||361/707, 257/E23.087, 257/E23.103, 257/E25.023, 257/707|
|International Classification||H05K7/20, H01L23/36|
|Cooperative Classification||H05K7/20509, H01L23/42, H01L25/105, H01L2924/0002, H01L23/3672|
|European Classification||H01L23/42, H01L23/367F, H05K7/20F6|
|Sep 29, 2004||AS||Assignment|
Owner name: SUPER TALENT ELECTRONICS, INC., CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, KUANG-YU;NI, JIM;CHIOU, REN-KANG;REEL/FRAME:015865/0896
Effective date: 20040928
|Nov 8, 2010||FPAY||Fee payment|
Year of fee payment: 4
|Mar 27, 2014||AS||Assignment|
Owner name: SUPER TALENT TECHNOLOGY, CORP., CALIFORNIA
Effective date: 20050124
Free format text: CHANGE OF NAME;ASSIGNOR:SUPER TALENT ELECTRONIC, INC.;REEL/FRAME:032547/0613
|Nov 5, 2014||FPAY||Fee payment|
Year of fee payment: 8