|Publication number||US7279356 B2|
|Application number||US 11/523,153|
|Publication date||Oct 9, 2007|
|Filing date||Sep 18, 2006|
|Priority date||Oct 2, 2000|
|Also published as||US6417463, US6834427, US7112880, US20020185308, US20050087868, US20070072342|
|Publication number||11523153, 523153, US 7279356 B2, US 7279356B2, US-B2-7279356, US7279356 B2, US7279356B2|
|Inventors||Bill Cornelius, Paul Baker|
|Original Assignee||Apple Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (16), Referenced by (3), Classifications (39), Legal Events (3)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a divisional of U.S. patent application Ser. No. 10/991,622, filed on Nov. 17, 2004 now U.S. Pat. No. 7,112,880, which is a continuation of U.S. patent application Ser. No. 10/140,529, filed on May 6, 2002, now issued as U.S. Pat. No. 6,834,427, which is a continuation of U.S. patent application Ser. No. 09/678,542, filed on Oct. 2, 2000, now issued as U.S. Pat. No. 6,417,463.
The present invention relates to packages for integrated circuits having ball grid arrays. More particularly, the present invention provides a ball grid array having open spaces in which vias are positioned.
Presently used to mate packages for integrated circuits with printed circuit boards, ball grid arrays (BGA's) are leadless, surface-mounted packages in which solder balls interconnects cover the bottom surface of the package in a checkerboard fashion. Typically, a mass reflow process is used to attach BGA's to printed circuit boards (PCB's), a term generally used for printed circuit configurations such as rigid or flexible, single, double, or multilayered boards that are completely processed. Integrated circuit (IC) is the term generally used for a microelectronic semiconductor device consisting of many interconnected transistors and other components. Typically, IC's are fabricated on a small rectangle called a die that is cut from a silicon wafer known as a substrate. Different areas of the substrate are “doped” with other elements to make them either “p-type” or “n-type.” Polysilicon or aluminum tracks are etched in one to three (or more) layers deposited over the substrate's surface(s). The die is then connected into a package using gold wires, which are welded to “pads,” usually found near the edge of the die.
Ball grid arrays formed on multilayer substrates typically incorporate within the BGA pattern drilled holes in laminate called vias, which connect different layers of circuitry. Typically, at least one via is positioned between two diagonal balls.
Inductance is the ability of a conductor to produce an induced voltage when cut by a magnetic flux. A conductor is a material capable of conveying an electric current. Virtually all conductors have inductance, but the amount of inductance associated with each conductor varies according to a number of factors such as type of conductive material, shape of the conductor, length of the conductor, and so forth. For example, a shorter wire has less inductance than a long wire because less conductor length cut by a magnetic flux produces less voltage. Similarly, a straight wire has less inductance than a coiled wire because the conductor concentrates more conductor length in a given area of flux.
One characteristic of inductors is that the faster the speed at which the flux changes, the more voltage is induced. The flux may take the form of a change in current. For example, alternating current (AC) circuits continually produce an induced voltage because the current is continuously changing. The faster the current changes, the higher the induced voltage, which always opposes the change in current. If current is increased, the polarity of the induced voltage opposes the increase in current, and vice versa. However, it is not necessary for the current to alternate directions. Inductance affects DC circuits whenever the value of the DC current changes, such as when a DC circuit is turned on and off.
There are four types of inductance: system inductance, self-inductance, mutual inductance, and stray inductance. System inductance is a combination of all the self inductances, mutual inductances, and stray inductances found within a circuit. Self inductance is the ability of a conductor to induce voltage in itself when the current changes. Mutual inductance typically occurs whenever two conductors are positioned closely together such that a varying flux resulting from a change in current in Conductor A cuts across and induces voltage in Conductor B. This induced voltage, in turn, generates a magnetic flux that cuts across and induces a voltage in conductor A. Because a current in one conductor can induce voltage in the adjacent conductor, the conductors are said to have mutual inductance. Stray inductance is the inductance of any wiring not included in discrete inductors, for example, traces, capacitors, Vss and Vdd balls, etc. In most cases, stray inductance is negligible. However, in high frequency circuits, where the current changes very quickly, stray inductance can have appreciable effects. To offset this appreciable effect, traces. leads, and current return path are usually kept as short as possible.
Each of these types of inductance discussed above seriously affects, and in some cases limits, the i/o speeds of integrated circuits. For example, in the case where all the bus outputs of a circuit simultaneously switch the same way, the circuit is deluged with a tidal wave of current. This current surge generates an appreciable induced voltage in the circuit's conductors. The induced voltage flowing opposite to the wave of current, reduces the amount of current flowing through the circuit, thereby slowing the rate of current flow. It is clear that faster i/o times will result if system inductance can be minimized. To minimize system inductance, various embodiments of the present invention create a void or voids by removing a ball or balls from the ball grid array, shorten the lengths of trace routing paths and the length of the return current path as much as possible, and facilitate routing of leads and traces by placing pairs of vias within a void area or areas.
The benefit of the present invention is that it provides a smaller sized package area, hence a lower manufacturing cost, while not compromising, but improving Vdd and Vss current path (e.g. return current path) inductance, which in turn, relates to i/o speed. Additionally, the present invention provides vias having a mutual inductance between + and − polarities, and provides mounting sites for capacitors that have very short routes to corresponding vias. Furthermore, the present invention maintains or enhances routability.
In a circuit board, the inductance of the return current path lies both in the package and in the main PCB that the package mounts to. The vias as referred to in this text are for connections within the main PCB. In particular, the vias for the bypass capacitors which conduct current from top to bottom of the PCB can have significant inductance. In fact, via inductance is approximately ten times (10×) the ball inductance. Because it is desirable to minimize the system inductance, not just the ball inductance, the present invention creates regions for more vias by removing balls.
In summary, problems common in the art include low mutual inductance between vias of opposite directed current flow, a shortage of routing channels, increased board size, increased cost of manufacturing, increased routing inductance, and lengthened current paths. Solutions to these and similar problems are provided by various embodiments of the present invention.
In one embodiment, a ball grid array (BGA) is positioned on one surface of a multilayer substrate. The array has a first density of balls, and a first open space therein that has a second density of balls lower than the first density of balls. A via or a pair of vias may be positioned within the first open space. In one embodiment, a ground via and a power via are combined to form a via pair. In another embodiment, capacitors are connected to the vias.
Various examples for practicing the invention, other advantages, and novel features thereof will be apparent from the following detailed description of various illustrative preferred embodiments of the invention, reference being made to the accompanying drawings.
The present invention is illustrated by way of example and not limitation in the figures of the accompanying drawings in which like references indicate similar elements.
Various preferred embodiments of the present invention are now described, reference being made to the accompanying drawings. It will be understood that the sequential steps depicted in the Figures are illustrative only, and that a BGA may be created according to various embodiments of the present invention by similar methods.
The number of vias positioned within an open space 108 is at least one, it being understood that the size of open space 108 and the size of the vias 102 positioned therein determines the approximate number of vias that can be contained within open space 108. In a preferred embodiment, at least three pairs of vias (approximately 3 power vias and 3 ground vias) are clustered within the interior of an open space 108, as shown in
The density of an open space 108 may be measured and compared to the density of a ball grid array in the following preferred manner. To start, an open area 108 is randomly selected. A first square is constructed about the selected open area 108. The dimensions of the square are such that the interior of the square entirely encompasses all of open area 108 and includes at least one row of balls slightly within and along each edge of the square. Next, a second square of the same dimensions as the first is constructed. This second square is positioned over another area of the ball grid that does not contain an open space 108, but which may contain at least one open space 110. The densities of each square are calculated by counting the number of balls within each square, and the respective densities are compared. In embodiments of the present invention, the density of the first square will be less than the density of the second.
In the embodiment of
The BGA illustrated in
For example, as shown by the direction of current flow represented in
It is understood that the illustrative groupings of two pairs of vias shown in
System inductance is further lowered in some preferred embodiments of the present invention by creating short routing lengths between the connections that link Vdd balls to Vdd vias. that link Vdd vias to the Vdd terminal of the capacitors, that link Vss balls to Vss vias, and that link Vss vias to the Vss terminal of the capacitors. In some embodiments, lowered system inductance results from linking multiple vias 102 per ball 100 and from linking multiple capacitors 124 and 126 to Vss/Vdd via pairs 107. In some embodiments, the board technology that allows the desired via placement within open spaces 108 is: 4 mil traces, 4 mil spacing between traces, and 22 mil vias. Once the ball pattern is escaped, the route pitch should increase to 10 mils. If the dielectric is made less than 4 mils, a closer trace pitch can be used.
In the embodiment illustratively shown in
It is important to place two bypass capacitors per Vdd ball as shown on the example layout placement template, because the dual capacitors lower the equivalent series inductance. Moreover, connections from the vias 102 to the capacitors 124 and 126 should be a direct path with as wide and as short of traces as constraints allow. One constraint is that eight internal routes are required between each “10 via pattern,” as shown in
The invention has been described in detail with reference to particular illustrative embodiments. It is understood that variations and modifications of the invention can be effected within the spirit and scope of the invention and as defined in the appended claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US5261153||Apr 6, 1992||Nov 16, 1993||Zycon Corporation||In situ method for forming a capacitive PCB|
|US5490040 *||Dec 22, 1993||Feb 6, 1996||International Business Machines Corporation||Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array|
|US5637920||Oct 4, 1995||Jun 10, 1997||Lsi Logic Corporation||High contact density ball grid array package for flip-chips|
|US5686699||Dec 4, 1996||Nov 11, 1997||Acc Microelectronics Corporation||Semiconductor board providing high signal pin utilization|
|US5717245||Mar 24, 1995||Feb 10, 1998||Plessey Semiconductors Limited||Ball grid array arrangement|
|US5796169||Nov 19, 1996||Aug 18, 1998||International Business Machines Corporation||Structurally reinforced ball grid array semiconductor package and systems|
|US5939782||Mar 3, 1998||Aug 17, 1999||Sun Microsystems, Inc.||Package construction for integrated circuit chip with bypass capacitor|
|US5982633||Aug 20, 1997||Nov 9, 1999||Compaq Computer Corporation||Opposed ball grid array mounting|
|US6057596||Oct 19, 1998||May 2, 2000||Silicon Integrated Systems Corp.||Chip carrier having a specific power join distribution structure|
|US6114769||Jul 18, 1997||Sep 5, 2000||Mcms, Inc.||Solder paste brick|
|US6160308||Mar 9, 2000||Dec 12, 2000||Kabushiki Kaisha Toshiba||Semiconductor device|
|US6207476||Jun 10, 1999||Mar 27, 2001||Vlsi Technology, Inc.||Methods of packaging an integrated circuit and methods of forming an integrated circuit package|
|US6235997||Jun 17, 1998||May 22, 2001||Fujitsu Limited||LSI package with equal length transmission Lines|
|US6285560 *||Sep 20, 1999||Sep 4, 2001||Texas Instruments Incorporated||Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified|
|US6512680||Sep 15, 1998||Jan 28, 2003||Canon Kabushiki Kaisha||Semiconductor package|
|US6689634 *||Sep 22, 1999||Feb 10, 2004||Texas Instruments Incorporated||Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7834466 *||Dec 17, 2007||Nov 16, 2010||Freescale Semiconductor, Inc.||Semiconductor die with die pad pattern|
|US20090152718 *||Dec 17, 2007||Jun 18, 2009||Wenzel Robert J||Structure with die pad pattern|
|US20110090662 *||Oct 15, 2010||Apr 21, 2011||Samsung Electronics Co. Ltd.||Method and apparatus for improving power noise of ball grid array package|
|U.S. Classification||438/106, 438/612, 257/780, 257/E23.079, 438/613, 257/E23.02, 257/737, 257/E23.069, 257/735|
|International Classification||H01L23/498, H05K1/02, H05K1/11, H01L21/00, H01L21/44|
|Cooperative Classification||H01L2924/00014, H01L2224/45144, Y10T29/4913, H01L23/49838, H01L2924/01079, H05K2201/10734, H05K1/0231, Y10T29/49222, H01L2223/6616, H05K2201/09227, H05K1/114, H01L23/49816, Y10T29/49144, H01L2924/15173, H01L2224/16, H05K2201/10545, H01L23/49827, Y10T29/49165, H01L23/50|
|European Classification||H01L23/498C4, H01L23/498E, H01L23/498G, H05K1/11C2B, H05K1/02C2E2, H01L23/50|
|May 7, 2007||AS||Assignment|
Owner name: APPLE INC., CALIFORNIA
Free format text: CHANGE OF NAME;ASSIGNOR:APPLE COMPUTER, INC., A CALIFORNIA CORPORATION;REEL/FRAME:019281/0694
Effective date: 20070109
Owner name: APPLE INC.,CALIFORNIA
Free format text: CHANGE OF NAME;ASSIGNOR:APPLE COMPUTER, INC., A CALIFORNIA CORPORATION;REEL/FRAME:019281/0694
Effective date: 20070109
|Mar 10, 2011||FPAY||Fee payment|
Year of fee payment: 4
|Mar 25, 2015||FPAY||Fee payment|
Year of fee payment: 8